LP3917RL-Q/NOPB [TI]

CDMA Cellular Phone Power Management Unit 49-DSBGA;
LP3917RL-Q/NOPB
型号: LP3917RL-Q/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

CDMA Cellular Phone Power Management Unit 49-DSBGA

CD
文件: 总8页 (文件大小:156K)
中文:  中文翻译
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LP3917  
www.ti.com  
SNVS425A DECEMBER 2006REVISED MARCH 2007  
LP3917 CDMA Cellular Phone Power Management Unit  
Check for Samples: LP3917  
1
FEATURES  
Thermal Shutdown with Early Warning Alarm  
Very Low Sleep Mode Current  
2
Two High Efficiency Synchronous Magnetic  
Buck Regulators, IOUT 800 mA and 600 mA  
Battery Voltage Monitor Output  
High Efficiency PFM Mode @ Low IOUT  
Auto Mode PFM/PWM Switch  
Interrupt Request for Reducing SW Polling  
Ultra Small 3.5x3.5 mm Micro SMDxt 49 Bump  
Package  
Low Inductance 2.2 uH @ 2 MHz Clock  
9 Low Noise LDOs  
APPLICATIONS  
3 x 300 mA  
5 x 150 mA  
1 x 80 mA  
CDMA Handsets  
Please contact NSC Sales for a full datasheet  
for the device.  
SW Controllable LDO Outputs  
USB 2.0 Compatible Transceiver (12 Mbps)  
DESCRIPTION  
LP3917 is a complete Power Management Unit designed for CDMA cellular phones. LP3917 PMU contains 9 low  
noise low dropout voltage regulators, 2 buck regulators, an USB Transceiver, two comparators and a high speed  
serial interface to program on/off conditions and output voltages of individual regulators, and to read status  
information of the PMU.  
Buck regulators have an automatic switch to PFM mode at low load conditions allowing very good efficiency also  
at low output currents.  
LDO regulators provide very low noise, 35 uV typ, ideally suited for supplying voltage to RF section.  
Two comparators can be used for detecting external accessories like ear plug etc.  
LP3917 can use interrupt for alerting BB processor of status changes instead of using inefficient status polling.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Table 1. Key Specifications  
VALUE  
UNIT  
Input Voltage Range  
3.0–5.5  
V
170 mV typ Dropout Voltage on LDOs @ 300 mA  
2% (typ) Output Voltage accuracy on LDOs  
Noise on LDOs  
35  
µV  
Buck regulators with 3% (typ)  
Accuracy and up to 90% efficiency  
800/600  
mA  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006–2007, Texas Instruments Incorporated  
LP3917  
SNVS425A DECEMBER 2006REVISED MARCH 2007  
www.ti.com  
SYSTEM DIAGRAM  
Power Domains of  
Baseband  
Support  
2 x DC/DC  
9 x LDO  
Processor  
I/O  
Interface  
of  
Baseband  
Processor  
Memory  
RF  
Control  
USB Transceiver  
2 x Comparator  
Peripheral Devices  
Connector  
LP3917  
2
Submit Documentation Feedback  
Copyright © 2006–2007, Texas Instruments Incorporated  
Product Folder Links: LP3917  
LP3917  
www.ti.com  
SNVS425A DECEMBER 2006REVISED MARCH 2007  
TYPICAL APPLICATION DIAGRAM  
V
BATT  
0.1 mF  
Battery  
10 mF  
10 mF  
V
BATT  
MSMC  
1.375V/1.875V  
@800 mA  
SEL1  
SW_B1  
LDO1  
Voltage  
Monitor  
Voltage  
Reference  
Thermal  
Shutdown  
MSMP  
1.8/1.875/2.6V  
@300 mA  
2.2 mH  
R1  
LDO1  
4.7 mF  
Buck  
Regulator  
#1  
C1  
FB_B1  
V
10 mF  
BATT  
R2  
GND_B1  
SEL2  
UVLO  
LDO2  
LDO2  
LCD  
V
BATT  
VIN_BUCK  
2.6/2.8/2.85V  
@300 mA  
4.7 mF  
10 mF  
RX_EN  
LDO3  
MSME  
1.8V  
@600 mA  
FB_B2  
Buck  
Regulator  
#2  
LDO3  
LDO4  
RX/SYNTH  
2.85V  
@150 mA  
2.2 mH  
SW_B2  
GND_B2  
2.2 mF  
LP3917  
10 mF  
MSMA  
2.6V  
@150 mA  
LDO4  
2.2 mF  
V
BATT  
TCXO_EN  
LDO5  
B2_EN  
LDO1  
LDO5  
LDO6  
TCXO  
2.85V  
@80 mA  
1 mF  
LDO1  
V
BATT  
1.5k  
10k  
1.5k  
TX  
2.85V  
@150 mA  
LDO6  
IRQ_N  
SDA  
O/D output  
O/D output  
2.2 mF  
LDO7 UIM  
SCL  
LDO7  
LDO8  
LDO9  
2.85V  
Serial  
Interface  
and  
PON_N  
@150 mA  
2.2 mF  
PS_HOLD  
RESET_N  
VIBRA  
LDO8  
Control  
2.85V  
V
BAT  
@150 mA  
HF_PWR  
PWR_ON  
2.2 mF  
T
CAM/KP  
2.85V  
LDO9  
@300 mA  
200k Options S, M  
500k Options Q, QL, N, NL  
200k  
4.7 mF  
1.5k  
LDO1  
V
V
BATT  
LDO1  
LDO1  
VBUS  
CMP1  
CMP2  
+
-
VTRM  
USB  
Transceiver  
PGM  
REF  
BATT  
SUSPEND  
1 mF  
1 mF  
-
+
V1.6  
Copyright © 2006–2007, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Links: LP3917  
LP3917  
SNVS425A DECEMBER 2006REVISED MARCH 2007  
www.ti.com  
DEVICE PIN DIAGRAM  
GND_  
B1  
PS_  
HOLD  
LDO3  
LDO1  
RX_EN  
SCL  
LDO2  
LDO4  
SEL1  
CREF  
BMON  
SEL2  
7
TCXO_  
EN  
SW_B1  
VIN1  
FB_B1  
B2_EN  
FB_B2  
VM  
6
VIN_  
BUCK  
LDO5  
CMP1  
INP1  
IRQ_N  
GNDD  
PON_N  
5
SUS  
PEND  
SW_B2  
LDO6  
SDA  
4
GND_  
B2  
RESET  
_N  
LDO7  
INP2  
RCV  
3
VIN  
BATT  
HF_  
PWR  
VTRM  
D+  
LDO8  
CMP2  
OE_N  
VP  
2
PWR_  
ON  
LDO9  
VIN2  
GNDA  
VBUS  
D-  
1
A
B
C
D
E
F
G
Figure 1. TOP VIEW  
PACKAGE MARKING INFORMATION  
XY = 2 Digit Date Code  
TT = Die Traceability  
XYTT  
V0x  
V0x = LP3917 Product ID  
= Pin 1A  
4
Submit Documentation Feedback  
Copyright © 2006–2007, Texas Instruments Incorporated  
Product Folder Links: LP3917  
PACKAGE OPTION ADDENDUM  
www.ti.com  
29-Aug-2015  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
LP3917RL-M/NOPB  
LP3917RL-N/NOPB  
LP3917RL-Q/NOPB  
LP3917RL-S/NOPB  
LP3917RLX-M/NOPB  
LP3917RLX-N/NOPB  
LP3917RLX-Q/NOPB  
LP3917RLX-S/NOPB  
ACTIVE  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
YPG  
49  
49  
49  
49  
49  
49  
49  
49  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
V05  
V03  
V04  
V01  
V05  
V03  
V04  
V01  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
YPG  
YPG  
YPG  
YPG  
YPG  
YPG  
YPG  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
29-Aug-2015  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
MECHANICAL DATA  
YPG0049
D
0.650±0.075  
E
RLA49XXX (Rev B)  
4214898/A  
12/12  
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.  
B. This drawing is subject to change without notice.  
NOTES:  
www.ti.com  
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