LP3997MM-3.3/NOPB [TI]

具有电源正常指示和使能功能的 250mA、低压降稳压器 | DGK | 8 | -40 to 125;
LP3997MM-3.3/NOPB
型号: LP3997MM-3.3/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有电源正常指示和使能功能的 250mA、低压降稳压器 | DGK | 8 | -40 to 125

光电二极管 输出元件 稳压器 调节器
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LP3997  
www.ti.com  
SNVS272B MAY 2004REVISED MAY 2013  
Micropower 250-mA CMOS LDO Regulator With Error Flag and Power-On-Reset  
Check for Samples: LP3997  
1
FEATURES  
DESCRIPTION  
The LP3997 regulator is designed to meet the  
requirements of portable, battery-powered systems,  
providing accurate output voltage, low noise, and low  
quiescent current. The LP3997 provides 3.3V output  
at up to 250mA load current. The chip architecture is  
capable of providing output voltages as low as 0.8V.  
When switched in shutdown mode, the power  
consumption is virtually zero.  
2
Low 140-mV Dropout at 250-mA Load  
Stable With Ceramic Capacitor.  
Low Noise With Bypass Capacitor  
Less Than 80 µA Typical IQ at 250 mA  
Virtually Zero IQ (Disabled)  
Thermal and Short Circuit Protection  
(1)  
3.3-V Output  
The LP3997 is designed to be stable with space  
saving ceramic output capacitor as small as 1µF.  
(2)  
8-Lead VSSOP Package  
The LP3997 also includes an out-of-regulation error  
flag. When the output is more than 5% below its  
nominal voltage, the error flag sets to low. If a  
capacitor is connected to device’s delay pin, a  
delayed power-on reset signal will be generated.  
APPLICATIONS  
Portable Consumer Electronics  
Cellular Handsets  
Laptop and Palm Computers  
PDAs  
Digital Cameras  
(1) For other voltage options, contact your TI sales office  
(2) For other package options, contact your TI sales office.  
Typical Application Circuit  
4
5
V
V
IN  
V
OUT  
IN  
V
OUT  
6
8
2
SENSE  
ERROR  
SD  
Enable  
470k  
LP3997  
7
Error/POR  
DELAY  
1
C
BYP  
GND  
3
0.1 mF  
2.2 mF  
0.1 mF  
2.2 mF  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004–2013, Texas Instruments Incorporated  
LP3997  
SNVS272B MAY 2004REVISED MAY 2013  
www.ti.com  
Functional Block Diagram  
V
IN  
-
V
OUT  
+
SENSE  
ON  
SD  
RFB2  
RFB1  
POR  
OFF  
2.2 mA  
0.5V  
ERROR  
6 MW  
1.2V  
+
-
V
REF  
GND  
C
DELAY  
BYP  
Pin Descriptions  
Pin No.  
Name  
Description  
1
CBYP  
Noise bypass pin. For low noise applications a 0.1µF or larger ceramic capacitor should be connected from  
this pin to ground. This will also improve PSSR.  
2
DELAY  
A capacitor connected from this pin to ground will allow a delayed power-on-reset signal at the ERROR (pin  
7) output. See Applications Information.  
3
4
5
6
GND  
VIN  
Ground pin. Local ground for CBYP ,CIN, COUT and CDELAY  
.
Input supply pin. Connect CIN between this pin and GND.  
VOUT  
SENSE  
Output voltage, Connect COUT between this pin and ground.  
Connect this pin to VOUT (pin 5). For best performance the connection should be made as close to the load  
as possible.  
7
8
ERROR  
SD  
This open drain output is an error flag output which goes low when VOUT drops 5% below its nominal  
voltage. This pin also provides a power-on-reset signal if a capacitor is connected to the DELAY pin.  
Shutdown. Disables the regulator when less than 0.4V is applied. Enables the regulator when greater than  
0.9V. The Shutdown pin is pulled down internally by a 6Mresistor.  
Connection Diagram  
C
1
2
3
4
8
7
6
5
BYP  
SD  
DELAY  
GND  
ERROR  
SENSE  
V
V
IN  
OUT  
8-Lead VSSOP  
Package Number DGK  
2
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LP3997  
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SNVS272B MAY 2004REVISED MAY 2013  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Absolute Maximum Ratings(1) (2)(3)  
Input Voltage  
-0.3 to 6.5V  
-0.3 to (VIN + 0.3V) with 6.5V (max)  
-0.3 to (VIN + 0.3V) with 6.5V (max)  
150°C  
Output Voltage  
SD Input Voltage  
Junction Temperature  
Lead/Pad Temp.  
VSSOP  
260°C  
-65 to 150°C  
Internally Limited(4)  
2KV  
Storage Temperature  
Continuous Power Dissipation  
Human Body Model(5)  
Machine Model  
Human Body Model(5)  
All Pins Except CBYP  
CBYP Pin  
200V  
ESD  
1KV  
Machine Model  
100V  
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the  
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test  
conditions, see the Electrical Characteristics tables.  
(2) All Voltages are with respect to the potential at the GND pin.  
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.  
(4) Internal thermal shutdown circuitry protects the device from permanent damage.  
(5) The human body model is 100pF discharged through a 1.5kresistor into each pin. The machine model is a 200pF capacitor  
discharged directly into each pin.  
Operating Ratings(1)  
Input Voltage  
2V to 6V  
-40°C to 125°C  
-40°C to 85°C  
Junction Temperature  
Ambient Temperature TA Range(2)  
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the  
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test  
conditions, see the Electrical Characteristics tables.  
(2) The maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op) = 125°C), the  
maximum power dissipation of the device in the application (PD(max)), and the junction to ambient thermal resistance of the part/package  
in the application (θJA), as given by the following equation: TA(max) = TJ(max-op) - (θJA × PD(max)).  
Thermal Properties(1)  
Junction To Ambient Thermal Resistance(2), θJA (VSSOP)  
210°C/W  
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the  
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test  
conditions, see the Electrical Characteristics tables.  
(2) Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power  
dissipation is possible, special care must be paid to thermal dissipation issues in board design.  
Copyright © 2004–2013, Texas Instruments Incorporated  
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SNVS272B MAY 2004REVISED MAY 2013  
www.ti.com  
Electrical Characteristics  
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.  
Typical values and limits appearing in normal type apply for TJ = 27°C. Limits appearing in boldface type apply over the full  
(1)  
temperature range for operation, 40 to +125°C.  
Limit  
Symbol  
Parameter  
Test Conditions  
Typ  
Unit  
Min  
2
Max  
6
VIN  
Input Voltage  
V
ΔVOUT  
Output Voltage Tolerance  
Line Regulation Error  
Over full line and load regulation  
-1.5  
-3  
+1.5  
+3  
%
VIN = (VOUT(NOM) + 1.0V) to 6.0V,  
IOUT = 1mA  
0.02  
0.3  
%/V  
Load Regulation Error  
Dropout Voltage(2)  
Load Current  
IOUT = 1mA to 250mA  
IOUT = 250mA  
20  
80  
µV/mA  
mV  
VDO  
ILOAD  
IQ  
140  
400  
(3) (4)  
See  
0
µA  
Quiescent Current  
SD = 950mV, IOUT = 0mA  
SD = 950mV, IOUT = 250mA  
SD = 0.4V  
55  
80  
100  
150  
0.5  
µA  
0.01  
600  
(5)  
ISC  
Short Circuit Current Limit  
Maximum Output Current  
See  
1000  
mA  
mA  
IOUT  
PSRR  
250  
Power Supply Rejection Ratio CBYP = 0.1µF  
f = 1kHz, IOUT  
1mA to 150mA  
=
61  
55  
61  
39  
f = 10kHz, IOUT  
150mA  
=
dB  
Without CBYP  
f = 1kHz, IOUT  
1mA to 150mA  
=
f = 10kHz, IOUT  
150mA  
=
w/o CBYP  
180  
100  
150  
10  
BW = 10Hz to 100kHz,  
VIN = VOUT(nom) +1V  
en  
Output noise Voltage(4)  
Thermal Shutdown  
µVRMS  
°C  
CBYP = 0.1µF  
TSHUTDOWN  
Temperature  
Hysteresis  
Shutdown Control Characteristics  
ISD  
Maximum Input Current at SD SD = 0.0V  
0.01  
1
µA  
Input  
(6)  
SD = 6V  
VIL  
VIH  
Low Input Threshold  
High Input Threshold  
VIN = 2V to 6V  
VIN = 2V to 6V  
0.4  
V
V
0.95  
Error Flag Characteristics  
VTH  
Power Good Trip Threshold  
VIN Rising  
95  
2.5  
0.1  
91  
99  
%VOUT  
%VOUT  
VHYST  
VOL  
Hysteresis  
VIN Rising or Falling  
ISINK = 2mA  
ErrorError OutputOutput low  
Voltage  
0.4  
V
IOFF  
Error Output High Leakage  
Delay Pin Current Source  
ERROR = VOUT(NOM)  
VOUT > 95% VOUT(NOM)  
10  
2000  
nA  
µA  
IDELAY  
2.2  
1.2  
3
(1) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production at TJ = 25°C or correlated  
using Statistical Quality Control methods. Operation over the temperature specification is ensured by correlating the electrical  
characteristics to process and temperature variations and applying statistical process control.  
(2) Dropout voltage is defined as the voltage difference between input and output when the output voltage drops 100mV below its nominal  
value.  
(3) The device maintains the regulated output voltage without the load.  
(4) This electrical specification is ensured by design.  
(5) Short circuit current is measured on the input supply line at the point when the short circuit condition reduces the output voltage to 5% of  
its nominal value.  
(6) SD Pin has 6Mtypical, resistor connected to GND.  
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LP3997  
www.ti.com  
SNVS272B MAY 2004REVISED MAY 2013  
Electrical Characteristics (continued)  
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.  
Typical values and limits appearing in normal type apply for TJ = 27°C. Limits appearing in boldface type apply over the full  
(1)  
temperature range for operation, 40 to +125°C.  
Limit  
Symbol  
Parameter  
Test Conditions  
Typ  
Unit  
Min  
Max  
250  
Timing Characteristics  
(7)  
tON  
Turn On Time  
To 95% Level  
w/o CBYP  
150  
2
µs  
CBYP = 0.1µF  
w/o CBYP  
ms  
Transient  
Response  
Line Transient Response  
Trise = Tfall = 30µs(7)  
40  
4
mV  
(pk - pk)  
|δVOUT  
|
δVIN = 600mV  
CBYP = 0.1µF  
Load Transient Response  
|δVOUT  
Trise = Tfall = 1µs(7)  
IOUT = 1mA to 150mA  
70  
80  
mV  
|
(7) This electrical specification is ensured by design.  
Output Capacitor, Recommended Specifications  
Limit  
Symbol  
Parameter  
Output Capacitor  
Conditions  
Typ  
Unit  
Min  
0.7  
5
Max  
Co  
Capacitance(1)  
ESR  
2.2  
µF  
500  
mΩ  
(1) The capacitor tolerance should be 30% or better over temperature. The full operating conditions for the application should be considered  
when selecting a suitable capacitor to ensure that the minimum value of capacitance is always met. Recommended capacitor type is  
X7R. However, dependent on application, X5R, Y5V, and Z5U can also be used. (See capacitor characteristics section in Applications  
Information).  
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LP3997  
SNVS272B MAY 2004REVISED MAY 2013  
www.ti.com  
Typical Performance Characteristics.  
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.  
Typical values and limits appearing in normal type apply for TJ = 27°C. Limits appearing in boldface type apply over the full  
temperature range for operation, 40 to +125°C.  
Output Voltage Change vs Temperature  
Ground Current vs Load Current  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
3.00  
T
A
= 125oC  
2.00  
1.00  
T
= -40oC  
A
0.00  
T
A
= 25oC  
-1.00  
-2.00  
-3.00  
0
50  
100  
150  
200  
250  
-50 -25  
0
25  
TEMPERATURE (oC)  
Ground Current vs VIN. ILOAD = 0mA  
50  
75 100 125  
LOAD CURRENT (mA)  
Ground Current vs VIN. ILOAD = 1mA  
120  
110  
100  
90  
120  
110  
100  
90  
80  
80  
T
= 25oC  
T
= 25oC  
A
A
70  
70  
= 85oC  
T
= 85oC  
A
T
A
60  
60  
50  
50  
40  
40  
T
= -40oC  
T
= -40oC  
A
A
30  
30  
20  
20  
3.5  
4
4.5  
5
5.5  
6
3.5  
4
4.5  
5
5.5  
6
V
V
IN  
Ground Current vs VININ. ILOAD = 250mA  
Dropout Voltage vs Load Current  
120  
200  
180  
160  
140  
120  
100  
80  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
T
A
= 25oC  
T
A
= 85oC  
T
= 125oC  
A
T
A
= -40oC  
T
= -40oC  
A
60  
40  
T
A
= 25oC  
20  
0
3.5  
4
4.5  
5
5.5  
6
0
50  
100  
150  
200  
250  
V
IN  
LOAD CURRENT (mA)  
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SNVS272B MAY 2004REVISED MAY 2013  
Typical Performance Characteristics. (continued)  
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.  
Typical values and limits appearing in normal type apply for TJ = 27°C. Limits appearing in boldface type apply over the full  
temperature range for operation, 40 to +125°C.  
Line Transient  
Line Transient  
4.9  
4.3  
4.9  
4.3  
CIN = COUT = 2.2 mF  
CIN = COUT = 2.2 mF  
CBYP = 0.1 mF  
CBYP = 0  
IL = 1 to 250 mA  
IL = 1 to 250 mA  
TIME (100 ms/DIV)  
Load Transient (No CBYP  
TIME (100 ms/DIV)  
Enable Start-up Time  
= 0  
)
C
BYP  
C
IN  
= C  
= 2.2 mF  
OUT  
I
L
= 1 mA  
250  
1
TIME (500 ms/DIV)  
Enable Start-up Time  
TIME (100 ms/DIV)  
Short Circuit Current  
C
BYP  
= 0.1 mF  
V
IN  
= 4.3V  
I
L
= 1 mA  
2.0  
1.5  
1.0  
0.5  
0
TIME (500 ms/DIV)  
TIME (50 ms/DIV)  
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Typical Performance Characteristics. (continued)  
Unless otherwise noted, SD = 950mV, VIN = VOUT + 1.0V, CIN = 2.2 µF, IOUT = 1 mA, COUT = 2.2 µF and CBYP = 0.1 µF.  
Typical values and limits appearing in normal type apply for TJ = 27°C. Limits appearing in boldface type apply over the full  
temperature range for operation, 40 to +125°C.  
Power Supply Rejection Ratio  
Noise Spectrum  
10  
1
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
C
= 0.1 mF  
BYP  
I
= 150 mA  
C
BYP  
= 0  
OUT  
I
= 1 mA  
OUT  
C
= 0.1 mF  
BYP  
0.1  
0.01  
0.1  
1
10  
100  
100  
1k  
10k  
100k  
1M  
FREQUENCY (kHz)  
FREQUENCY (kHz)  
Turn-On Sequence  
Turn-Off Sequence  
CDELAY = 0.1 mF  
CBYP = 0  
VIN 2V/DIV  
VIN 2V/DIV  
CDELAY = 0.1 mF  
CBYP = 0  
ILOAD = 250 mA  
ILOAD = 250 mA  
VOUT 2V/DIV  
VOUT 2V/DIV  
CDELAY 2V/DIV  
CDELAY 2V/DIV  
ERROR 2V/DIV  
ERROR 2V/DIV  
TIME (20 ms/DIV)  
TIME (50 ms/DIV)  
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Applications Information  
External Capacitors  
In common with most regulators, the LP3997 requires the inclusion of external capacitors.  
VIN  
An input capacitor is required for stability. It is recommended that a minimum of 1.0µF capacitor is connected  
between the LP3997 input pin and ground (this capacitance value may be increased without limit).  
This capacitor must be located a distance of not more than 1cm from the input pin and returned to a clean  
analog ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.  
Important: To ensure stable operation it is essential that good PCB design practices are employed to minimize  
ground impedance and keep input inductance low. If these conditions cannot be met, or if long wire leads are  
used to connect the battery or other power source to the LP3997, then it is recommended to increase the input  
capacitor to at least 2.2µF. Also, tantalum capacitors can suffer catastrophic failures due to surge current when  
connected to a low-impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is  
used at the input, it must be ensured by the manufacturer to have a surge current rating sufficient for the  
application.  
There are no requirements for the ESR (Equivalent Series Resistance) on the input capacitor, but tolerance and  
temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain  
1.0µF over the entire operating temperature range.  
VOUT  
VOUT is the output voltage of the regulator. Connect capacitance (minimum 1.0µF) to ground from this pin. To  
ensure stability the capacitor must meet the minimum value for capacitance and have an ESR in the range 5m  
to 500m. Ceramic X7R types are recommended. If an output capacitor larger than 4.7µF is fitted then checks  
on in-rush current, transient performance and stability, should be made.  
SENSE  
SENSE is used to sense the output voltage. Connect sense to VOUT  
SHUTDOWN  
SD controls the turning on and off of the LP3997. VOUT is ensured to be on when the voltage on the SD pin is  
greater than 0.95V. VOUT is ensured to be off when the voltage on the SD pin is less than 0.4V.  
ERROR  
ERROR is an open drain output which is set low when VOUT is more than 5% below its nominal value. An  
external pull up resistor is required on this pin. When a capacitor is connected from DELAY to GROUND, the  
error signal is delayed (see DELAY section). This delayed error signal can be used as the power-on reset signal  
for the application system. The ERROR pin is disconnected when not used.  
DELAY  
A capacitor from DELAY to GROUND sets the time delay for ERROR changing from low to high state. The delay  
time is set by the following formula.  
C DELAY  
VTH(DELAY)  
X
t DELAY  
=
I DELAY  
VTH(DELAY) is nominally 1.2V.  
The DELAY pin should be open circuit if not used.  
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CBYP  
For low noise application, connect a high frequency ceramic capacitor from CBYP to ground, A 0.01µF to 0.1µF  
X5R or X7R is recommended. This capacitor is connected directly to high impedance node in the band gap  
reference circuit. Any significant loading on this node will cause a change in the regulated output voltage. For this  
reason, DC leakage current from this pin must be kept as low as possible for best output voltage accuracy.  
CAPACITOR CHARACTERISTICS  
In common with most regulators, the LP3997 requires external capacitors for regulator stability. The LP3997 is  
specifically designed for portable applications requiring minimum board space and can use capacitors in the  
range 1µF to 4.7µF.These capacitors must be correctly selected for good performance. Ceramic capacitors are  
the smallest, least expensive and have the lowest ESR values (which makes them best for eliminating high  
frequency noise). The ESR of a typical 1µF ceramic capacitor is in the range of 20 mto 40 m, which easily  
meets the ESR requirement for stability by the LP3997.These capacitors must be correctly selected to ensure  
good performance of the LP3997.  
For both input and output capacitors careful interpretation of the capacitor specification is required to ensure  
correct device operation. The capacitor value can change greatly dependant on the conditions of operation and  
capacitor type.  
In particular the output capacitor selection should take account of all the capacitor parameters to ensure that the  
specification is met within the application. Capacitance value can vary with DC bias conditions as well as  
temperature and frequency of operation. Capacitor values will also show some decrease over time due to aging.  
The capacitor parameters are also dependant on the particular case size with smaller sizes giving poorer  
performance figures in general. As an example Figure 1 shows a typical graph showing a comparison of  
capacitor case sizes in a Capacitance versus DC Bias plot. As shown in the graph, as a result of the DC Bias  
condition, the capacitance value may drop below the minimum capacitance value given in the recommended  
capacitor table (0.7µF in this case). Note that the graph shows the capacitance out of spec for the 0402 case  
size capacitor at higher bias voltages. It is therefore recommended that the capacitor manufacturers’  
specifications for the nominal value capacitor are consulted for all conditions as some capacitor sizes (e.g. 0402)  
may not be suitable in the actual application.  
0603, 10V, X5R  
100%  
80%  
60%  
0402, 6.3V, X5R  
40%  
20%  
0
1.0  
2.0  
3.0  
4.0  
5.0  
DC BIAS (V)  
Figure 1. Capacitance versus DC Bias Plot  
The value of ceramic capacitors can vary with temperature. The capacitor type X7R, which operates over a  
temperature range of -55°C to +125°C, will only vary the capacitance to within ±15%. The capacitor type X5R  
has a similar tolerance over a reduced temperature range of -55°C to +85°C. Most large value ceramic  
capacitors, larger than 1µF are manufactured with Z5U or Y5V temperature characteristics. Their capacitance  
can drop by more than 50% as the temperature goes from 25°C to 85°C. Therefore X7R is recommended over  
Z5U and Y5V in applications where the ambient temperature will change significantly above or below 25°C.  
Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more  
expensive when comparing equivalent capacitance and voltage ratings in the 1µF to 4.7µF range.  
10  
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Product Folder Links: LP3997  
 
LP3997  
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SNVS272B MAY 2004REVISED MAY 2013  
Another important consideration is that tantalum capacitors have higher ESR values than equivalent size  
ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the  
stable range, it would have to be larger in capacitance (which means bigger and more costly ) than a ceramic  
capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about  
2:1 as the temperature goes from 25°C down to -40°C, so some guard band must be allowed.  
Copyright © 2004–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
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LP3997  
SNVS272B MAY 2004REVISED MAY 2013  
www.ti.com  
REVISION HISTORY  
Changes from Revision A (May 2013) to Revision B  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 11  
12  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LP3997MM-3.3/NOPB  
ACTIVE  
VSSOP  
DGK  
8
1000 RoHS & Green  
SN  
Level-1-260C-UNLIM  
-40 to 125  
SAKB  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
21-Oct-2021  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LP3997MM-3.3/NOPB  
VSSOP  
DGK  
8
1000  
178.0  
12.4  
5.3  
3.4  
1.4  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
21-Oct-2021  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
VSSOP DGK  
SPQ  
Length (mm) Width (mm) Height (mm)  
208.0 191.0 35.0  
LP3997MM-3.3/NOPB  
8
1000  
Pack Materials-Page 2  
IMPORTANT NOTICE AND DISCLAIMER  
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE  
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”  
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, regulatory or other requirements.  
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an  
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license  
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you  
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these  
resources.  
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with  
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Copyright © 2021, Texas Instruments Incorporated  

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