LP3999ITL-2.4/NOPB [TI]
具有使能功能的 150mA、低噪声、低压降稳压器 | YZR | 5 | -40 to 125;
| 型号： | LP3999ITL-2.4/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有使能功能的 150mA、低噪声、低压降稳压器 | YZR | 5 | -40 to 125 输出元件 稳压器 调节器 |
| 文件： | 总19页 (文件大小：594K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LP3999
www.ti.com
SNVS207E –JUNE 2003–REVISED MAY 2013
LP3999 Low Noise 150mA Voltage Regulator for RF/Analog Applications
Check for Samples: LP3999
1
FEATURES
APPLICATIONS
2
•
•
•
•
•
•
5 pin DSBGA Package
•
•
•
•
•
•
GSM Portable Phones
Stable with Ceramic Capacitor
Logic Controlled Enable
CDMA Cellular Handsets
Wideband CDMA Cellular Handsets
Bluetooth Devices
Fast Turn-on
Thermal-overload and short-circuit protection
Portable Information Appliances
Handheld MP3 Devices
−40 to +125°C junction temperature range for
operation
DESCRIPTION
KEY SPECIFICATIONS
The LP3999 regulator is designed to meet the
requirements of portable wireless battery-powered
applications and will provide an accurate output
voltage with low noise and low quiescent current.
Ideally suited for powering RF/Analog devices this
device will also be used to meet more general circuit
requirements.
•
•
•
2.5V to 6.0V Input Range
Accurate Output Voltage; ±75mV / 2%
60 mV Typical Dropout with 150 mA Load. Vout
> 2.5V
•
Virtually Zero Quiescent Current when
Disabled
For battery powered applications the low dropout and
low ground current provided by the device allows the
lifetime of the battery to be maximized.The inclusion
of an Enable(disable) control can be used by the
system to further extend the battery lifetime by
reducing the power consumption to virtually zero.
Should the application require a device with an active
disable function please refer to device LP3995.
•
•
•
•
10 μVrms Output Noise Over 10Hz to 100kHz
Stable with a 1 μF Output Capacitor
Ensured 150 mA Output Current
Fast Turn-on Time; 140 μs (Typ.)
The LP3999 also features internal protection against
short-circuit
conditions.
currents
and
over-temperature
Typical Application Circuit
LP3999
C3
V
V
IN
IN
C1
A3
V
1.0 mF
OUT
1.0 uF
A1
Enable Control,
Active high
C
Load
BYPASS
V
EN
GND
B2
10 nF
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2013, Texas Instruments Incorporated
LP3999
SNVS207E –JUNE 2003–REVISED MAY 2013
www.ti.com
DESCRIPTION (CONTINUED)
The LP3999 is designed to be stable with small 1.0 µF ceramic capacitors. The small outline of the LP3999
DSBGA package with the required ceramic capacitors can realize a system application within minimal board
area.
Performance is specified for a −40°C to +125°C temperature range.
The device is available in DSBGA package. For other package options contact your local TI sales office.
The device is available in fixed output voltages in the ranges of 1.5V to 3.3V. For availability, please contact your
local TI sales office.
Block Diagram
V
V
OUT
IN
Vref
+
-
V
EN
R
R
1
Fast Turn-
on
C
BYPASS
2
Over Current
Thermal Protn.
GND
PIN DESCRIPTIONS
Pin No.
Symbol
Name and Function
A1
VEN
Enable Input; Disables the Regulator when ≤ 0.4V.
Enables the regulator when ≥ 0.9V
B2
C1
C3
A3
GND
VOUT
Common Ground
Voltage output. Connect this output to the load circuit.
Voltage Supply Input
VIN
CBYPASS
Bypass Capacitor connection.
Connect a 0.01 µF capacitor for noise reduction.
Connection Diagram
CBYPASS
A3
VIN
C3
VIN
C3
CBYPASS
A3
A1
B2
C1
C1
B2
A1
VEN
GND
GND
VEN
V
OUT
V
OUT
Top View
Bottom View
5 Bump DSBGA Package
See Package Number YZR0005
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SNVS207E –JUNE 2003–REVISED MAY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)(2)
Orderable Device
LP399ITL-1.5/NOPB
LP399ITLX-1.5/NOPB
LP399ITL-1.8/NOPB
LP399ITLX-1.8/NOPB
LP399ITL-1.875/NOPB
LP399ITLX-1.875/NOPB
LP399ITL-2.4/NOPB
LP399ITLX-2.4/NOPB
LP399ITL-2.5/NOPB
LP399ITLX-2.5/NOPB
LP399ITL-2.8/NOPB
LP399ITLX-2.8/NOPB
LP399ITL-3.3/NOPB
LP399ITLX-3.3/NOPB
Output Voltage (V)
1.5
1.8
1.875
2.4
2.5
2.8
3.3
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(1) (2)(3)
Absolute Maximum Ratings
Input Voltage (VIN
)
−0.3 to 6.5V
Output Voltage
−0.3 to (VIN + 0.3V)
to 6.5V (max)
Enable Input Voltage
Junction Temperature
Lead/Pad Temperature(4)
DSBGA
−0.3 to 6.5V
150°C
260°C
−65 to +150°C
Internally limited
Storage Temperature
Continuous Power Dissipation(5)
(6)
ESD
Human Body Model
Machine Model
2 kV
200V
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pin.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for
availability and specifications.
(4) For further information on these packages please refer to application notes AN-1112 Micro SMD Package Wafer Level Chip Scale
Package SNVA009.
(5) Internal Thermal shutdown circuitry protects the device from permanent damage.
(6) The human body is 100 pF discharge through 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin.
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(1)
Operating Ratings
Input Voltage (VIN
)
2.5 to 6.0V
0 to 6.0V
Enable Input Voltage
Junction Temperature
Ambient Temperature Range(2)
−40 to +125°C
-40 to 85°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to
be derated. Maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op)), the
maximum power dissipation (PD(max)), and the junction to ambient thermal resistance in the application (θJA). This relationship is given
by:
TA(max) = TJ(max-op) − (PD(max) × θJA).
Thermal Properties(1)
Junction to Ambient Thermal Resistance
θJA (DSBGA pkg.)
255°C/W
(1) Junction to ambient thermal resistance is highly dependant on the application and board layout. In applications where high thermal
dissipation is possible, special care must be paid to thermal issues in the board design.
Electrical Characteristics
Unless otherwise noted, VEN = 1.5, VIN = VOUT(NOM) + 1.0V, CIN = 1 µF, IOUT = 1 mA, COUT = 1 µF, CBP = 0.01 µF. Typical
values and limits appearing in normal type apply for TJ = 25°C. Limits appearing in boldface type apply over the full
(1) (2)
temperature range for operation, −40 to +125°C.
Limit
Symbol
Parameter
Conditions
Typical
Units
Min
Max
VIN
Input Voltage
2.5
6.0
V
DEVICE OUTPUT: 1.5 ≤ VOUT < 1.8V
ΔVOUT
Output Voltage Tolerance
Line Regulation Error
IOUT = 1 mA
−50
50
mV
-75
75
VIN = (VOUT(NOM)+1.0V) to 6.0V,
IOUT = 1 mA
−3.5
3.5
75
mV/V
Load Regulation Error
Power Supply Rejection Ratio(3)
IOUT = 1 mA to 150 mA
f = 1 kHz, IOUT = 1 mA
f = 10 kHz, IOUT = 1 mA
10
58
58
µV/mA
PSRR
dB
DEVICE OUTPUT: 1.8 ≤ VOUT < 2.5V
ΔVOUT
Output Voltage Tolerance
IOUT = 1 mA
-50
50
mV
−75
75
Line Regulation Error
VIN = (VOUT(NOM)+1.0V) to 6.0V,
IOUT = 1 mA
−2.5
2.5
75
mV/V
Load Regulation Error
Power Supply Rejection Ratio(3)
IOUT = 1 mA to 150 mA
f = 1 kHz, IOUT = 1 mA
f = 10 kHz, IOUT = 1 mA
10
60
60
µV/mA
PSRR
dB
DEVICE OUTPUT: 2.5 ≤ VOUT ≤ 3.3V
ΔVOUT
Output Voltage Tolerance
IOUT = 1 mA
-2
2
% of
VOUT(NOM)
−3
3
Line Regulation Error
Load Regulation Error
VIN = (VOUT(NOM)+1.0V) to 6.0V,
IOUT = 1 mA
−0.1
0.1
%/V
IOUT = 1 mA to 150 mA
0.0004
0.002
%/mA
(1) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production at TJ = 25°C or correlated
using Statistical Quality Control methods. Operation over the temperature specification is ensured by correlating the electrical
characteristics to process and temperature variations and applying statistical process control.
(2) VOUT(NOM) is the stated output voltage option for the device.
(3) This electrical specification is ensured by design.
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Electrical Characteristics (continued)
Unless otherwise noted, VEN = 1.5, VIN = VOUT(NOM) + 1.0V, CIN = 1 µF, IOUT = 1 mA, COUT = 1 µF, CBP = 0.01 µF. Typical
values and limits appearing in normal type apply for TJ = 25°C. Limits appearing in boldface type apply over the full
(1) (2)
temperature range for operation, −40 to +125°C.
Limit
Symbol
VDO
Parameter
Dropout Voltage
Power Supply Rejection Ratio(3)
Conditions
IOUT = 1 mA
Typical
Units
mV
Min
Max
2
0.4
60
60
50
IOUT = 150 mA
100
PSRR
f = 1 kHz, IOUT = 1 mA
f = 10 kHz, IOUT = 1 mA
dB
FULL VOUT RANGE
ILOAD Load Current
IQ
(3)
See (4) and
0
µA
µA
Quiescent Current
VEN = 1.5V, IOUT = 0 mA
VEN = 1.5V, IOUT = 150 mA
VEN = 0.4V
85
140
150
200
1.5
0.003
450
ISC
EN
Short Circuit Current Limit
Output Noise Voltage(3)
mA
BW = 10 Hz to 100 kHz,
VIN = 4.2V, No Load
10
30
µVrms
°C
BW = 10 Hz to 100 kHz,
VIN = 4.2V, 1mA Load
TSHUTDOWN
Thermal Shutdown
Temperature
Hysteresis
160
20
ENABLE CONTROL CHARACTERISTICS
IEN
Maximum Input Current at VEN
Input
VEN = 0.0V and VIN = 6.0V
0.001
µA
VIL
VIH
Low Input Threshold
High Input Threshold
0.4
V
V
0.9
TIMING CHARACTERISTICS
(5)
(6)
TON
Turn On Time
To 95% Level
140
µs
(4) The device maintains the regulated output voltage without load.
(5) This electrical specification is ensured by design.
(6) Time from VEN = 0.9V to VOUT = 95% (VOUT(NOM)
)
Recommended Output Capacitor
Limit
Symbol
COUT
Parameter
Output Capacitor
Conditions
Typical
Units
Min
0.70
5
Max
(1)
Capacitance
ESR
1.0
µF
500
mΩ
(1) The capacitor tolerance should be 30% or better over temperature. Recommended capacitor type is X7R however dependant on
application X5R,Y5V and Z5U can also be used.
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SNVS207E –JUNE 2003–REVISED MAY 2013
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INPUT TEST SIGNALS
30 us
30 us
600 mV
VIN = VOUT(NOM) + 1V
600 us
4.6 ms
Figure 1. Line Transient Response Input Test Signal
50 mV
VIN = VOUT(NOM) + 1V
Figure 2. PSRR Input Test Signal
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SNVS207E –JUNE 2003–REVISED MAY 2013
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise specified, CIN = COUT = 1.0 µF Ceramic, VIN = VOUT + 1.0V, TA = 25°C, Enable pin is tied to VIN.
Output Voltage Change vs Temperature
Ground Current vs Load Current (1.8V VOUT)
Figure 3.
Figure 4.
Ground Current vs VIN @ 25°C
Ground Current vs VIN @125°C
Figure 5.
Figure 6.
Ground Current vs VIN @ -40°C
Short Circuit Current
Figure 7.
Figure 8.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified, CIN = COUT = 1.0 µF Ceramic, VIN = VOUT + 1.0V, TA = 25°C, Enable pin is tied to VIN.
Line Transient Response (1.8V VOUT
)
Line Transient Response (1.5V VOUT)
Figure 9.
Ripple Rejection (1.8V VOUT
Figure 10.
Ripple Rejection (1.5V VOUT
)
)
Figure 11.
Enable Start-Up Time (VOUT = 1.8V)
Figure 12.
Enable Start-Up Time (VOUT = 1.8V)
Figure 13.
Figure 14.
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SNVS207E –JUNE 2003–REVISED MAY 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified, CIN = COUT = 1.0 µF Ceramic, VIN = VOUT + 1.0V, TA = 25°C, Enable pin is tied to VIN.
Enable Start-Up Time (VOUT = 1.5V)
Enable Start-Up Time (VOUT = 1.5V)
Figure 15.
Figure 16.
Load Transient Response (VOUT = 1.8V)
Load Transient Response (VOUT = 1.5V)
Figure 17.
Figure 18.
Output Noise Density VIN = 4.2V VOUT = 2.5V)
Figure 19.
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APPLICATION HINTS
POWER DISSIPATION AND DEVICE OPERATION
The permissible power dissipation for any package is a measure of the capability of the device to pass heat from
the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus the power
dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces
between the die and ambient air.
(1)
Re-stating the equation given in
in the electrical specification section, the allowable power dissipation for the
device in a given package can be calculated:
(1)
With a θJA = 255°C/W, the device in the DSBGA package returns a value of 392 mW with a maximum junction
temperature of 125°C.
The actual power dissipation across the device can be represented by the following equation:
PD = (VIN − VOUT) x IOUT
.
(2)
This establishes the relationship between the power dissipation allowed due to thermal consideration, the voltage
drop across the device, and the continuous current capability of the device. These two equations should be used
to determine the optimum operating conditions for the device in the application.
EXTERNAL CAPACITORS
In common with most regulators, the LP3999 requires external capacitors to ensure stable operation. The
LP3999 is specifically designed for portable applications requiring minimum board space and smallest
components. These capacitors must be correctly selected for good performance.
INPUT CAPACITOR
An input capacitor is required for stability. It is recommended that a 1.0 µF capacitor be connected between the
LP3999 input pin and ground (this capacitance value may be increased without limit).
This capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean
analogue ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.
Important: Tantalum capacitors can suffer catastrophic failures due to surge current when connected to a low-
impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the input,
it must be ensured by the manufacturer to have a surge current rating sufficient for the application.
There are no requirements for the ESR (Equivalent Series Resistance) on the input capacitor, but tolerance and
temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain ≅
1.0 µF over the entire operating temperature range.
OUTPUT CAPACITOR
The LP3999 is designed specifically to work with very small ceramic output capacitors. A ceramic capacitor
(dielectric types Z5U, Y5V or X7R) in the 1.0 [to 10 µF] range, and with ESR between 5 mΩ to 500 mΩ, is
suitable in the LP3999 application circuit.
For this device the output capacitor should be connected between the VOUT pin and ground.
It may also be possible to use tantalum or film capacitors at the device output, VOUT, but these are not as
attractive for reasons of size and cost (see the section CAPACITOR CHARACTERISTICS).
The output capacitor must meet the requirement for the minimum value of capacitance and also have an ESR
value that is within the range 5 mΩ to 500 mΩ for stability.
(1) In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to
be derated. Maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op)), the
maximum power dissipation (PD(max)), and the junction to ambient thermal resistance in the application (θJA). This relationship is given
by:
TA(max) = TJ(max-op) − (PD(max) × θJA).
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NO-LOAD STABILITY
The LP3999 will remain stable and in regulation with no external load. This is an important consideration in some
circuits, for example CMOS RAM keep-alive applications.
CAPACITOR CHARACTERISTICS
The LP3999 is designed to work with ceramic capacitors on the output to take advantage of the benefits they
offer. For capacitance values in the range of 1 µF to 4.7 µF, ceramic capacitors are the smallest, least expensive
and have the lowest ESR values, thus making them best for eliminating high frequency noise. The ESR of a
typical 1 µF ceramic capacitor is in the range of 20 mΩ to 40 mΩ, which easily meets the ESR requirement for
stability for the LP3999.
The temperature performance of ceramic capacitors varies by type. Most large value ceramic capacitors (≥ 2.2
µF) are manufactured with Z5U or Y5V temperature characteristics, which results in the capacitance dropping by
more than 50% as the temperature goes from 25°C to 85°C.
A better choice for temperature coefficient in a ceramic capacitor is X7R. This type of capacitor is the most stable
and holds the capacitance within ±15% over the temperature range. Tantalum capacitors are less desirable than
ceramic for use as output capacitors because they are more expensive when comparing equivalent capacitance
and voltage ratings in the 1 µF to 4.7 µF range.
Another important consideration is that tantalum capacitors have higher ESR values than equivalent size
ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the
stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic
capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about
2:1 as the temperature goes from 25°C down to −40°C, so some guard band must be allowed.
NOISE BYPASS CAPACITOR
A bypass capacitor should be connected between the CBYPASS pin and ground to significantly reduce the noise at
the regulator output. This device pin connects directly to a high impedance node within the bandgap reference
circuitry. Any significant loading on this node will cause a change on the regulated output voltage. For this
reason, DC leakage current through this pin must be kept as low as possible for best output voltage accuracy.
The use of a 0.01µF bypass capacitor is strongly recommended to prevent overshoot on the output during start-
up.
The types of capacitors best suited for the noise bypass capacitor are ceramic and film. High quality ceramic
capacitors with NPO or COG dielectric typically have very low leakage. Polypropolene and polycarbonate film
capacitors are available in small surface-mount packages and typically have extremely low leakage current.
Unlike many other LDO’s, the addition of a noise reduction capacitor does not effect the transient response of the
device.
ENABLE OPERATION
The LP3999 may be switched ON or OFF by a logic input at the ENABLE pin, VEN. A high voltage at this pin will
turn the device on. When the enable pin is low, the regulator output is off and the device typically consumes 3
nA. If the application does not require the shutdown feature, the VEN pin should be tied to VIN to keep the
regulator output permanently on. To ensure proper operation, the signal source used to drive the VEN input must
be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical
Characteristics section under VIL and VIH.
FAST TURN ON
Fast turn-on is ensured by control circuitry within the reference block allowing a very fast ramp of the output
voltage to reach the target voltage. There is no active turn-off on this device. Refer to LP3995 for a similar device
with active turn-off.
DSBGA MOUNTING
The DSBGA package requires specific mounting techniques which are detailed in TI's AN-1112 Application
Report (SNVA009).
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Referring to the section Surface Mount Assembly Considerations, it should be noted that the pad style which
must be used with the 5 pin package is NSMD (non-solder mask defined) type.
For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the
DSBGA device.
DSBGA LIGHT SENSITIVITY
Exposing the DSBGA device to direct sunlight will cause incorrect operation of the device. Light sources such as
halogen lamps can affect electrical performance if they are situated in proximity to the device.
Light with wavelengths in the red and infra-red part of the spectrum have the most detrimental effect thus the
fluorescent lighting used inside most buildings has very little effect on performance. Tests carried out on a
DSBGA test board showed a negligible effect on the regulated output voltage when brought within 1 cm of a
fluorescent lamp. A deviation of less than 0.1% from nominal output voltage was observed.
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REVISION HISTORY
Changes from Revision D (May 2013) to Revision E
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 12
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LP3999ITL-1.8/NOPB
LP3999ITL-2.4/NOPB
LP3999ITL-2.5/NOPB
LP3999ITL-3.3/NOPB
LP3999ITLX-1.8/NOPB
LP3999ITLX-2.5/NOPB
LP3999ITLX-2.8/NOPB
LP3999ITLX-3.3/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YZR
YZR
YZR
YZR
YZR
YZR
YZR
YZR
5
5
5
5
5
5
5
5
250
250
250
250
RoHS & Green
RoHS & Green
RoHS & Green
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
9
9
9
9
9
9
9
9
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LP3999ITL-1.8/NOPB
LP3999ITL-2.4/NOPB
LP3999ITL-2.5/NOPB
LP3999ITL-3.3/NOPB
DSBGA
DSBGA
DSBGA
DSBGA
YZR
YZR
YZR
YZR
YZR
YZR
YZR
YZR
5
5
5
5
5
5
5
5
250
250
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
1.09
1.09
1.09
1.09
1.09
1.09
1.09
1.09
1.55
1.55
1.55
1.55
1.55
1.55
1.55
1.55
0.76
0.76
0.76
0.76
0.76
0.76
0.76
0.76
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
250
250
LP3999ITLX-1.8/NOPB DSBGA
LP3999ITLX-2.5/NOPB DSBGA
LP3999ITLX-2.8/NOPB DSBGA
LP3999ITLX-3.3/NOPB DSBGA
3000
3000
3000
3000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LP3999ITL-1.8/NOPB
LP3999ITL-2.4/NOPB
LP3999ITL-2.5/NOPB
LP3999ITL-3.3/NOPB
LP3999ITLX-1.8/NOPB
LP3999ITLX-2.5/NOPB
LP3999ITLX-2.8/NOPB
LP3999ITLX-3.3/NOPB
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YZR
YZR
YZR
YZR
YZR
YZR
YZR
YZR
5
5
5
5
5
5
5
5
250
250
208.0
208.0
208.0
208.0
208.0
208.0
208.0
208.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
191.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
250
250
3000
3000
3000
3000
Pack Materials-Page 2
MECHANICAL DATA
YZR0005xxx
D
0.600±0.075
E
TLA05XXX (Rev C)
D: Max = 1.502 mm, Min =1.441 mm
E: Max = 1.045 mm, Min =0.984 mm
4215043/A
12/12
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
NOTES:
www.ti.com
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