LP5951MFX-2.0 [TI]

LP5951 Micropower, 150mA Low-Dropout CMOS Voltage Regulator; LP5951微器,150mA低压降CMOS电压稳压器
LP5951MFX-2.0
型号: LP5951MFX-2.0
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LP5951 Micropower, 150mA Low-Dropout CMOS Voltage Regulator
LP5951微器,150mA低压降CMOS电压稳压器

稳压器
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LP5951  
www.ti.com  
SNVS345F JUNE 2006REVISED MAY 2013  
LP5951 Micropower, 150mA Low-Dropout CMOS Voltage Regulator  
Check for Samples: LP5951  
1
FEATURES  
DESCRIPTION  
The LP5951 regulator is designed to meet the  
requirements of portable, battery-powered systems  
2
Excellent Line Transient Response: ±2mV typ.  
Excellent PSRR: -60dB at 1kHz typ.  
Low Quiescent Current of 29µA typ.  
1.8 to 5.5V Input Voltage Range  
providing  
a regulated output voltage and low  
quiescent current. When switched to shutdown mode  
via a logic signal at the Enable pin, the power  
consumption is reduced to virtually zero.  
Small SC70-5 and SOT-23-5 Packages  
Fast Turn-on Time of 30µs typ.  
The LP5951 is designed to be stable with small 1µF  
ceramic capacitors.  
Typ. < 1nA Quiescent Current in Shutdown  
Ensured 150mA Output Current  
The LP5951 also features internal protection against  
short-circuit  
conditions.  
currents  
and  
over-temperature  
Output Voltage Range: 1.3V to 3.7V  
Logic Controlled Enable 0.4V/0.9V  
Performance is specified for a -40°C to 125°C  
temperature range.  
Good Load Transient Response of 50mVpp  
typ.  
The device is available in SOT-23-5 and SC70-5  
package.  
Thermal-overload and Short-circuit Protection  
-40°C to +125°C Junction Temperature Range  
The device is available in fixed output voltages in the  
range of 1.3V to 3.7V. For availability, please contact  
your local TI sales office.  
APPLICATIONS  
General Purpose  
Typical Application Circuit  
LP5951  
1
3
V
V
IN  
IN  
5
4
V
OUT  
NC  
1 mF  
1 mF  
Load  
Enable Control,  
active high  
V
EN  
GND  
2
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006–2013, Texas Instruments Incorporated  
LP5951  
SNVS345F JUNE 2006REVISED MAY 2013  
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Connection Diagram  
Vout  
5
NC  
4
Vout  
5
NC  
4
1
Vin  
2
GND  
3
EN  
1
Vin  
2
GND  
3
EN  
Figure 1. 5-Lead SOT-23 Package – Top View  
See Package Number DBV  
Figure 2. 5-Lead SC70 Package – Top View  
See Package Number DCK  
PIN DESCRIPTIONS  
Pin Number Pin Name  
Description  
1
2
3
4
5
VIN  
Input Voltage. Input range: 1.8V to 5.5V  
Ground  
GND  
EN  
Enable pin logic input: Low = shutdown, High = normal operation. This pin should not be left floating.  
NC  
No internal connection  
VOUT  
Regulated output voltage  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Absolute Maximum Ratings(1)(2)  
VIN pin: Voltage to GND  
-0.3V to 6.5V  
EN pin: Voltage to GND  
-0.3V to (VIN+0.3V) with 6.5V max  
Continuous Power Dissipation(3)  
Internally Limited  
150°C  
Junction Temperature (TJ-MAX  
Storage Temperature Range  
)
-65°C to + 150°C  
240°C  
Package Peak Reflow Temperature (10-20 sec.)  
Package Peak Reflow Temperature (Pb-free, 10-20 sec.)  
260°C  
ESD Rating(4)  
Human Body Model:  
Machine Model  
2.0kV  
200V  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under  
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits  
and associated test conditions, see the Electrical Characteristics tables.  
(2) All voltages are with respect to the potential at the GND pin.  
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and  
disengages at TJ = 140°C (typ.).  
(4) The Human body model is a 100pF capacitor discharged through a 1.5kresistor into each pin. The machine model is a 200pF  
capacitor discharged directly into each pin. (MIL-STD-883 3015.7)  
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Operating Ratings(1)(2)  
Input Voltage Range (VIN  
)
1.8V to 5.5V  
0 to (VIN + 0.3V)  
-40°C to + 125°C  
VEN Input Voltage  
Junction Temperature (TJ) Range  
Ambient Temperature (TA) Range  
(3)  
See  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under  
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits  
and associated test conditions, see the Electrical Characteristics tables.  
(2) All voltages are with respect to the potential at the GND pin.  
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may  
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP  
=
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the  
part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).  
Thermal Properties  
(1)  
Junction-to-Ambient Thermal Resistance (θJA  
)
SOT-23-5 Package  
220°C/W  
415°C/W  
SC70-5 Package  
(1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power  
dissipation exists, special attention must be paid to thermal dissipation issues in board design.  
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Electrical Characteristics(1) (2)  
Typical values and limits appearing in standard typeface are for TA = 25°C. Limits appearing in boldface type apply over the  
full operating temperature range: -40°C TJ +125°C. Unless otherwise noted, VIN = VOUT(NOM) + 1V, CIN = 1µF, COUT = 1µF,  
VEN = 0.9V.  
Symbol  
Parameter  
Condition  
Typ  
Limit  
Units  
Min  
1.8  
Max  
5.5  
VIN  
Input Voltage  
VIN VOUT(NOM) + VDO  
V
IOUT = 1mA  
-2.0  
-3.5  
2.0  
3.5  
%
%
Output Voltage Tolerance  
Line Regulation Error  
-30°C TJ +125°C  
VIN = VOUT(NOM) + 1V to 5.5V  
IOUT = 1mA  
0.1  
%/V  
ΔVOUT  
Load Regulation Error  
IOUT = 1mA to 150mA  
IOUT = 150mA  
-0.01  
%/mA  
VDO  
Output Voltage Dropout  
(3)  
VOUT 2.5V  
250  
350  
mV  
mV  
VOUT < 2.5V  
200  
IQ  
Quiescent Current  
VEN = 0.9V, ILOAD = 0  
VEN = 0.9V, ILOAD = 150mA  
VEN = 0V  
29  
33  
0.005  
55  
70  
1
µA  
µA  
µA  
ISC  
Output Current  
(short circuit)  
VIN = VOUT(NOM) + 1V  
400  
150  
mA  
PSRR  
Power Supply  
Rejection Ratio  
Sine modulated VIN  
f = 100Hz  
60  
60  
50  
dB  
dB  
dB  
f = 1kHz  
f = 10kHz  
EN  
Output Noise  
BW = 10Hz - 100kHz  
125  
160  
20  
µVRMS  
°C  
TSD  
Thermal Shutdown  
Temperature Hysteresis  
°C  
(1) All voltages are with respect to the potential at the GND pin.  
(2) Min and Max limits are ensured by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most likely  
norm.  
(3) Dropout voltage is defined as the input to output voltage differential at which the output voltage falls to 100mV below the nominal output  
voltage. This specification does not apply for output voltages below 1.8V.  
Enable Control Characteristics  
Symbol  
Parameter  
Conditions  
Typical  
Limit  
Units  
Min  
-1  
Max  
1
IEN  
Maximum Input Current at 0V VEN VIN, VIN = 5.5V  
VEN Input  
µA  
V
VIL  
VIH  
Low Input Threshold  
(shutdown)  
VIN = 1.8..5.5V  
VIN = 1.8..5.5V  
0.4  
High Input Threshold  
(enable)  
0.9  
V
Transient Characteristics  
Symbol  
Parameter  
Conditions  
Typical  
Limit  
Units  
Min  
Max  
ΔVOUT  
ΔVOUT  
Dynamic Line Transient VIN = VOUT(NOM) + 1V to  
VOUT(NOM) + 1V + 0.6V in 30µs, no load  
±2  
mV  
Dynamic Load  
Transient  
IOUT = 0mA to 150mA in 10µs  
-30  
20  
-50  
40  
mV  
mV  
mV  
mV  
IOUT = 150mA to 0mA in 10µs  
IOUT = 1mA to 150mA in 1µs  
IOUT = 150mA to 1mA in 1µs  
ΔVOUT  
Overshoot on Startup  
Turn on time  
Nominal conditions  
IOUT = 1mA  
10  
30  
mV  
µs  
TON  
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Output Capacitor, Recommended Specification  
(1)  
Symbol  
Parameter  
Conditions  
Value  
Limit  
Units  
Min  
Max  
(2)  
Capacitance  
IOUT = 150mA, VIN = 5.0V  
1.0  
0.7  
47  
µF  
COUT  
Output Capacitance  
ESR  
0.003  
0.300  
(1) Min and Max limits are ensured by design  
(2) The capacitor tolerance should be 30% or better over temperature. The full operating conditions for the application should be considered  
when selecting a suitable capacitor to ensure that the minimum value of capacitance is always met. Recommended capacitor type is  
X7R. However, dependent on application, X5R, Y5V, and Z5U can also be used. The shown minimum limit represents real minimum  
capacitance, including all tolerances and must be maintained over temperature and dc bias voltage (See capacitor section in  
Applications Hints)  
Output Current Derating  
Maximum Load Current vs VIN - VOUT, TA = 85°C, VOUT = 1.5V  
Block Diagram  
V
IN  
LDO Core  
and  
Bias  
V
OUT  
Generator  
Reference  
Enable  
Controller  
EN  
Over  
Current and  
Thermal  
Protection  
GND  
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Typical Performance Characteristics  
Unless otherwise specified, CIN = 1µF ceramic, COUT = 1µF ceramic, VIN = VOUT(NOM) + 1V, TA = 25°C, Enable pin is tied to VIN.  
Load Transient Response  
Load Transient Response  
LP5951-3.3  
LP5951-1.3  
C
C
= 1.0 µF  
C , C  
IN OUT  
= 1.0 µF  
IN  
= 1.5 µF  
OUT  
150  
0
150  
0
TIME (50 µs/DIV)  
TIME (50 µs/DIV)  
Figure 3.  
Figure 4.  
Line Transient Response  
Line Transient Response  
LP5951-3.3  
LP5951-1.3  
C
C
= 1.0 µF  
C
, C = 1.0 µF  
IN  
IN OUT  
= 1.5 µF  
OUT  
4.9  
4.3  
2.9  
2.3  
I
= 150 mA  
L
I
= 150 mA  
L
TIME (100 µs/DIV)  
TIME (100 µs/DIV)  
Figure 5.  
Figure 6.  
Enable Start-up Time  
Enable Start-up Time  
I
= 150 mA  
L
I
= 150 mA  
LP5951-3.3  
L
LP5951-1.3  
TIME (10 µs/DIV)  
TIME (10 µs/DIV)  
Figure 7.  
Figure 8.  
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Typical Performance Characteristics (continued)  
Unless otherwise specified, CIN = 1µF ceramic, COUT = 1µF ceramic, VIN = VOUT(NOM) + 1V, TA = 25°C, Enable pin is tied to VIN.  
Output Voltage Change  
Ground Current  
vs  
vs  
Temperature  
VIN  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
-0.2  
-0.4  
40.0  
38.0  
36.0  
LP5951-1.3  
I
= 1 mA  
LP5951-1.3  
I
= 1 mA  
L
L
T
A
= 125oC  
34.0  
32.0  
30.0  
T
A
= 25oC  
28.0  
26.0  
24.0  
22.0  
20.0  
18.0  
T
A
= -40oC  
-40 -20  
0
20 40 60 80 100 120  
TEMPERATURE (oC)  
1.5 2.0 2.5 3.0  
4.0 4.5  
5.5  
3.5  
(V)  
5.0  
V
IN  
Figure 9.  
Figure 10.  
Power Supply Rejection Ratio  
0
-20  
-40  
-60  
-80  
LP5951-3.3  
V
I
= 3.8V,  
IN  
= 1 mA  
L
V
I
= 5.5V,  
IN  
= 1 mA  
L
V
I
= 3.8V,  
IN  
V
I
= 5.5V,  
IN  
= 0 mA  
L
= 0 mA  
L
10  
100  
1k  
10k  
100k  
1M  
FREQUENCY (Hz)  
Figure 11.  
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APPLICATION HINTS  
POWER DISSIPATION AND DEVICE OPERATION  
The permissible power dissipation for any package is a measure of the capability of the device to pass heat from  
the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus the power  
dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces  
between the die and ambient air.  
As stated (see below(1)) in the electrical specification section, the allowable power dissipation for the device in a  
given package can be calculated using the equation:  
PD = (TJ(MAX) - TA) / θJA  
(1)  
With a θJA = 220°C/W, the device in the SOT-23-5 package returns a value of 454 mW with a maximum junction  
temperature of 125°C at TA of 25°C.  
The actual power dissipation across the device can be estimated by the following equation:  
PD (VIN - VOUT) * IOUT  
(2)  
This establishes the relationship between the power dissipation allowed due to thermal consideration, the voltage  
drop across the device, and the continuous current capability of the device. These two equations should be used  
to determine the optimum operating conditions for the device in the application.  
EXTERNAL CAPACITORS  
As is common with most regulators, the LP5951 requires external capacitors to ensure stable operation. The  
LP5951 is specifically designed for portable applications requiring minimum board space and the smallest size  
components. These capacitors must be correctly selected for good performance.  
INPUT CAPACITOR  
An input capacitor is required for stability. It is recommended that a 1.0µF capacitor be connected between the  
LP5951 input pin and ground (this capacitance value may be increased without limit).  
This capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean  
analogue ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.  
Important: Tantalum capacitors can suffer catastrophic failures due to surge current when connected to a low-  
impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the input,  
it must be ensured by the manufacturer to have a surge current rating sufficient for the application.  
There are no requirements for the ESR (Equivalent Series Resistance) on the input capacitor, but tolerance and  
temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain  
0.7µF over the entire operating temperature range.  
OUTPUT CAPACITOR  
The LP5951 is designed specifically to work with very small ceramic output capacitors. A ceramic capacitor  
(dielectric types X7R, Z5U, or Y5V) in the 1.0µF range (up to 47µF) and with ESR between 3 mto 500 mis  
suitable in the LP5951 application circuit.  
This capacitor must be located a distance of not more than 1cm from the VOUT pin and returned to a clean  
analogue ground.  
It is also possible to use tantalum or film capacitors at the device output, VOUT, but these are not as attractive for  
reasons of size and cost (see the section CAPACITOR CHARACTERISTICS).  
(1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may  
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP  
=
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the  
part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).  
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CAPACITOR CHARACTERISTICS  
The LP5951 is designed to work with ceramic capacitors on the output to take advantage of the benefits they  
offer. For capacitance values in the range of 1µF to 4.7µF, ceramic capacitors are the smallest, least expensive  
and have the lowest ESR values, thus making them best for eliminating high frequency noise. The ESR of a  
typical 1µF ceramic capacitor is in the range of 3mto 40m, which easily meets the ESR requirement for  
stability for the LP5951.  
For both input and output capacitors, careful interpretation of the capacitor specification is required to ensure  
correct device operation. The capacitor value can change greatly, depending on the operating conditions and  
capacitor type.  
In particular, the output capacitor selection should take account of all the capacitor parameters, to ensure that the  
specification is met within the application. The capacitance can vary with DC bias conditions as well as  
temperature and frequency of operation. Capacitor values will also show some decrease over time due to aging.  
The capacitor parameters are also dependant on the particular case size, with smaller sizes giving poorer  
performance figures in general. As an example, Figure 12 shows a typical graph comparing different capacitor  
case sizes in a Capacitance vs. DC Bias plot. As shown in the graph, increasing the DC Bias condition can result  
in the capacitance value falling below the minimum value given in the recommended capacitor specifications  
table (0.7µF in this case). Note that the graph shows the capacitance out of spec for the 0402 case size  
capacitor at higher bias voltages. It is therefore recommended that the capacitor manufacturers’ specifications for  
the nominal value capacitor are consulted for all conditions, as some capacitor sizes (e.g. 0402) may not be  
suitable in the actual application.  
0603, 10V, X5R  
100%  
80%  
60%  
0402, 6.3V, X5R  
40%  
20%  
0
1.0  
2.0  
3.0  
4.0  
5.0  
DC BIAS (V)  
Figure 12. Graph Showing A Typical Variation In Capacitance vs DC Bias  
The ceramic capacitor’s capacitance can vary with temperature. The capacitor type X7R, which operates over a  
temperature range of -55°C to +125°C, will only vary the capacitance to within ±15%. The capacitor type X5R  
has a similar tolerance over a reduced temperature range of -55°C to +85°C. Many large value ceramic  
capacitors, larger than 1µF are manufactured with Z5U or Y5V temperature characteristics. Their capacitance  
can drop by more than 50% as the temperature varies from 25°C to 85°C. Therefore X7R is recommended over  
Z5U and Y5V in applications where the ambient temperature will change significantly above or below 25°C.  
Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more  
expensive when comparing equivalent capacitance and voltage ratings in the 1µF to 4.7µF range.  
Another important consideration is that tantalum capacitors have higher ESR values than equivalent size  
ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the  
stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic  
capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about  
2:1 as the temperature goes from 25°C down to -40°C, so some guard band must be allowed.  
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NO-LOAD STABILITY  
The LP5951 will remain stable and in regulation with no external load. This is an important consideration in some  
circuits, for example CMOS RAM keep-alive applications.  
ENABLE OPERATION  
The LP5951 may be switched ON or OFF by a logic input at the Enable pin, VEN. A logic high at this pin will turn  
the device on. When the enable pin is low, the regulator output is off and the device typically consumes 5nA.  
If the application does not require the Enable switching feature, the VEN pin should be tied to VIN to keep the  
regulator output permanently on.  
To ensure proper operation, the signal source used to drive the VEN input must be able to swing above and  
below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under Enable  
Control Characteristics, VIL and VIH.  
FAST TURN OFF AND ON  
The controlled switch-off feature of the device provides a fast turn off by discharging the output capacitor via an  
internal FET device. This discharge is current limited by the RDSon of this switch.  
Fast turn-on is ensured by an optimized architecture allowing a very fast ramp of the output voltage to reach the  
target voltage.  
SHORT-CIRCUIT PROTECTION  
The LP5951 is short circuit protected and in the event of a peak over-current condition, the output current  
through the PMOS will be limited.  
If the over-current condition exists for a longer time, the average power dissipation will increase depending on  
the input to output voltage difference until the thermal shutdown circuitry will turn off the PMOS.  
Please refer to the Thermal Properties section for power dissipation calculations.  
THERMAL-OVERLOAD PROTECTION  
Thermal-Overload Protection limits the total power dissipation in the LP5951. When the junction temperature  
exceeds TJ = 160°C typ., the shutdown logic is triggered and the PMOS is turned off, allowing the device to cool  
down. After the junction temperature dropped by 20°C (temperature hysteresis), the PMOS is activated again.  
This results in a pulsed output voltage during continuous thermal-overload conditions.  
The Thermal-Overload Protection is designed to protect the LP5951 in the event of a fault condition. For normal,  
continuous operation, do not exceed the absolute maximum junction temperature rating of TJ = +150°C (see  
Absolute Maximum Ratings).  
REVERSE CURRENT PATH  
The internal PFET pass device in LP5951 has an inherent parasitic body diode. During normal operation, the  
input voltage is higher than the output voltage and the parasitic diode is reverse biased. However, if the output is  
pulled above the input in an application, then current flows from the output to the input as the parasitic diode gets  
forward biased. The output can be pulled above the input as long as the current in the parasitic diode is limited to  
50mA.  
For currents above this limit an external Schottky diode must be connected from VOUT to VIN (cathode on VIN,  
anode on VOUT).  
EVALUATION BOARDS  
For availability of evaluation boards, see the LP5951 product folder. For information regarding evaluation boards,  
see the TI AN-1486 Application Report (SNVA169).  
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SUGGESTED CAPACITORS AND THEIR SUPPLIERS  
Capacitance / µF  
Model  
Vendor  
TDK  
Type  
Case Size / Inch (mm)  
1.0  
1.0  
C1608X5R1A105K  
C1005X5R1A105K  
Ceramic, X5R  
Ceramic, X5R  
0603 (1608)  
0402 (1005)  
TDK  
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SNVS345F JUNE 2006REVISED MAY 2013  
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REVISION HISTORY  
Changes from Revision E (April 2013) to Revision F  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 11  
12  
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Copyright © 2006–2013, Texas Instruments Incorporated  
Product Folder Links: LP5951  
PACKAGE OPTION ADDENDUM  
www.ti.com  
2-May-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
LP5951MF-1.3  
ACTIVE  
SOT-23  
SOT-23  
DBV  
5
5
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKRB  
LP5951MF-1.3/NOPB  
ACTIVE  
DBV  
1000  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LKRB  
LP5951MF-1.5  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKAB  
LKAB  
LP5951MF-1.5/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MF-1.8  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKBB  
LKBB  
LP5951MF-1.8/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MF-2.0  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKCB  
LKCB  
LP5951MF-2.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MF-2.5  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKEB  
LKEB  
LP5951MF-2.5/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MF-2.8  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKFB  
LKFB  
LP5951MF-2.8/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MF-3.0  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKGB  
LKGB  
LP5951MF-3.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MF-3.3  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKHB  
LKHB  
LP5951MF-3.3/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MFX-1.3  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKRB  
LKRB  
LP5951MFX-1.3/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MFX-1.5  
ACTIVE  
SOT-23  
DBV  
5
3000  
TBD  
Call TI  
Call TI  
-40 to 125  
LKAB  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
2-May-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
LP5951MFX-1.5/NOPB  
ACTIVE  
SOT-23  
DBV  
5
3000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
LKAB  
LP5951MFX-1.8  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKBB  
LKBB  
LP5951MFX-1.8/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MFX-2.0  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKCB  
LKCB  
LP5951MFX-2.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MFX-2.5  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKEB  
LKEB  
LP5951MFX-2.5/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MFX-2.8  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKFB  
LKFB  
LP5951MFX-2.8/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MFX-3.0  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKGB  
LKGB  
LP5951MFX-3.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MFX-3.3  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LKHB  
LKHB  
LP5951MFX-3.3/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MG-1.3  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L23  
L23  
LP5951MG-1.3/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MG-1.5  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L2B  
L2B  
LP5951MG-1.5/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MG-1.8  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
L3B  
L3B  
LP5951MG-1.8/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
2-May-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
LP5951MG-2.0  
ACTIVE  
SC70  
SC70  
DCK  
5
5
1000  
TBD  
Call TI  
CU SN  
Call TI  
L4B  
L4B  
LP5951MG-2.0/NOPB  
ACTIVE  
DCK  
1000  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MG-2.5  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
L5B  
L5B  
LP5951MG-2.5/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MG-2.8  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
L6B  
L6B  
LP5951MG-2.8/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MG-3.0  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
L7B  
L7B  
LP5951MG-3.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MG-3.3  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
LAB  
LAB  
LP5951MG-3.3/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MG-3.7/NOPB  
ACTIVE  
SC70  
DCK  
5
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
L44  
LP5951MGX-1.3  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L23  
L23  
LP5951MGX-1.3/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MGX-1.5  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L2B  
L2B  
LP5951MGX-1.5/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MGX-1.8  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
L3B  
L3B  
LP5951MGX-1.8/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MGX-2.0  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
L4B  
L4B  
LP5951MGX-2.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
2-May-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
LP5951MGX-2.5  
ACTIVE  
SC70  
SC70  
DCK  
5
5
3000  
TBD  
Call TI  
CU SN  
Call TI  
L5B  
L5B  
LP5951MGX-2.5/NOPB  
ACTIVE  
DCK  
3000  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MGX-2.8  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
L6B  
L6B  
LP5951MGX-2.8/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MGX-3.0  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
L7B  
L7B  
LP5951MGX-3.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MGX-3.3  
ACTIVE  
ACTIVE  
SC70  
SC70  
DCK  
DCK  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
LAB  
LAB  
LP5951MGX-3.3/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP5951MGX-3.7/NOPB  
ACTIVE  
SC70  
DCK  
5
3000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
L44  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 4  
PACKAGE OPTION ADDENDUM  
www.ti.com  
2-May-2013  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 5  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-May-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LP5951MF-1.3  
LP5951MF-1.3/NOPB  
LP5951MF-1.5  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
3000  
3000  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
LP5951MF-1.5/NOPB  
LP5951MF-1.8  
LP5951MF-1.8/NOPB  
LP5951MF-2.0  
LP5951MF-2.0/NOPB  
LP5951MF-2.5  
LP5951MF-2.5/NOPB  
LP5951MF-2.8  
LP5951MF-2.8/NOPB  
LP5951MF-3.0  
LP5951MF-3.0/NOPB  
LP5951MF-3.3  
LP5951MF-3.3/NOPB  
LP5951MFX-1.3  
LP5951MFX-1.3/NOPB SOT-23  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-May-2013  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LP5951MFX-1.5  
LP5951MFX-1.5/NOPB SOT-23  
LP5951MFX-1.8 SOT-23  
LP5951MFX-1.8/NOPB SOT-23  
LP5951MFX-2.0 SOT-23  
LP5951MFX-2.0/NOPB SOT-23  
LP5951MFX-2.5 SOT-23  
LP5951MFX-2.5/NOPB SOT-23  
LP5951MFX-2.8 SOT-23  
LP5951MFX-2.8/NOPB SOT-23  
LP5951MFX-3.0 SOT-23  
LP5951MFX-3.0/NOPB SOT-23  
LP5951MFX-3.3 SOT-23  
LP5951MFX-3.3/NOPB SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
3.2  
3.2  
3.2  
3.2  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
1.2  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
LP5951MG-1.3  
LP5951MG-1.3/NOPB  
LP5951MG-1.5  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.25  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
2.45  
LP5951MG-1.5/NOPB  
LP5951MG-1.8  
LP5951MG-1.8/NOPB  
LP5951MG-2.0  
LP5951MG-2.0/NOPB  
LP5951MG-2.5  
LP5951MG-2.5/NOPB  
LP5951MG-2.8  
LP5951MG-2.8/NOPB  
LP5951MG-3.0  
LP5951MG-3.0/NOPB  
LP5951MG-3.3  
LP5951MG-3.3/NOPB  
LP5951MG-3.7/NOPB  
LP5951MGX-1.3  
LP5951MGX-1.3/NOPB  
LP5951MGX-1.5  
LP5951MGX-1.5/NOPB  
LP5951MGX-1.8  
LP5951MGX-1.8/NOPB  
LP5951MGX-2.0  
LP5951MGX-2.0/NOPB  
LP5951MGX-2.5  
LP5951MGX-2.5/NOPB  
LP5951MGX-2.8  
LP5951MGX-2.8/NOPB  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-May-2013  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LP5951MGX-3.0  
LP5951MGX-3.0/NOPB  
LP5951MGX-3.3  
SC70  
SC70  
SC70  
SC70  
SC70  
DCK  
DCK  
DCK  
DCK  
DCK  
5
5
5
5
5
3000  
3000  
3000  
3000  
3000  
178.0  
178.0  
178.0  
178.0  
178.0  
8.4  
8.4  
8.4  
8.4  
8.4  
2.25  
2.25  
2.25  
2.25  
2.25  
2.45  
2.45  
2.45  
2.45  
2.45  
1.2  
1.2  
1.2  
1.2  
1.2  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
LP5951MGX-3.3/NOPB  
LP5951MGX-3.7/NOPB  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LP5951MF-1.3  
LP5951MF-1.3/NOPB  
LP5951MF-1.5  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
LP5951MF-1.5/NOPB  
LP5951MF-1.8  
LP5951MF-1.8/NOPB  
LP5951MF-2.0  
LP5951MF-2.0/NOPB  
LP5951MF-2.5  
LP5951MF-2.5/NOPB  
LP5951MF-2.8  
LP5951MF-2.8/NOPB  
Pack Materials-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-May-2013  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LP5951MF-3.0  
LP5951MF-3.0/NOPB  
LP5951MF-3.3  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SC70  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
LP5951MF-3.3/NOPB  
LP5951MFX-1.3  
LP5951MFX-1.3/NOPB  
LP5951MFX-1.5  
LP5951MFX-1.5/NOPB  
LP5951MFX-1.8  
LP5951MFX-1.8/NOPB  
LP5951MFX-2.0  
LP5951MFX-2.0/NOPB  
LP5951MFX-2.5  
LP5951MFX-2.5/NOPB  
LP5951MFX-2.8  
LP5951MFX-2.8/NOPB  
LP5951MFX-3.0  
LP5951MFX-3.0/NOPB  
LP5951MFX-3.3  
LP5951MFX-3.3/NOPB  
LP5951MG-1.3  
LP5951MG-1.3/NOPB  
LP5951MG-1.5  
SC70  
SC70  
LP5951MG-1.5/NOPB  
LP5951MG-1.8  
SC70  
SC70  
LP5951MG-1.8/NOPB  
LP5951MG-2.0  
SC70  
SC70  
LP5951MG-2.0/NOPB  
LP5951MG-2.5  
SC70  
SC70  
LP5951MG-2.5/NOPB  
LP5951MG-2.8  
SC70  
SC70  
LP5951MG-2.8/NOPB  
LP5951MG-3.0  
SC70  
SC70  
LP5951MG-3.0/NOPB  
LP5951MG-3.3  
SC70  
SC70  
LP5951MG-3.3/NOPB  
LP5951MG-3.7/NOPB  
LP5951MGX-1.3  
SC70  
SC70  
SC70  
LP5951MGX-1.3/NOPB  
LP5951MGX-1.5  
SC70  
SC70  
LP5951MGX-1.5/NOPB  
LP5951MGX-1.8  
SC70  
SC70  
LP5951MGX-1.8/NOPB  
LP5951MGX-2.0  
SC70  
SC70  
Pack Materials-Page 4  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-May-2013  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LP5951MGX-2.0/NOPB  
LP5951MGX-2.5  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
SC70  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
DCK  
5
5
5
5
5
5
5
5
5
5
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
LP5951MGX-2.5/NOPB  
LP5951MGX-2.8  
LP5951MGX-2.8/NOPB  
LP5951MGX-3.0  
LP5951MGX-3.0/NOPB  
LP5951MGX-3.3  
LP5951MGX-3.3/NOPB  
LP5951MGX-3.7/NOPB  
Pack Materials-Page 5  
IMPORTANT NOTICE  
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www.ti.com/audio  
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www.ti.com/clocks  
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