LP8543SQX [TI]

SMBus/I2C Controlled WLED Driver for Medium-Sized LCD Backlight; 的SMBus / I2C控制的WLED驱动器,用于中型LCD背光
LP8543SQX
型号: LP8543SQX
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

SMBus/I2C Controlled WLED Driver for Medium-Sized LCD Backlight
的SMBus / I2C控制的WLED驱动器,用于中型LCD背光

驱动器 CD
文件: 总36页 (文件大小:650K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LP8543  
LP8543 SMBus/I2C Controlled WLED Driver for Medium-Sized LCD Backlight  
Literature Number: SNVS604C  
November 14, 2011  
LP8543  
SMBus/I2C Controlled WLED Driver for Medium-Sized LCD  
Backlight  
General Description  
Features  
The LP8543 is a white LED driver with integrated boost con-  
verter. It has 7 adjustable current sinks which can be con-  
trolled by SMBus or I2C-compatible serial interface, PWM  
input and Ambient Light Sensor (ALS).  
High-voltage DC/DC boost converter with integrated FET  
5.5V to 22V input voltage range to support 2x, 3x and 4x  
Li-Ion batteries.  
PWM phase shift control with adaptive boost output to  
increase efficiency compared to conventional boost  
converters topologies  
The boost converter has adaptive output voltage control  
based on the LED driver voltages. This feature minimizes the  
power consumption by adjusting the voltage to lowest suffi-  
cient level in all conditions. Phase Shift PWM dimming offers  
further power saving especially when there is poor matching  
in the forward voltages of the LED strings. Boost voltage can  
also be controlled through the SMBus/I2C.  
PWM brightness control for single wire control and stand-  
alone use  
Digital Ambient light sensor interface with user-  
programmed ambient light to backlight brightness curve  
Easy-to-use EEPROM calibration for current, intensity and  
ambient light response setting  
Internal EEPROM stores the data for backlight brightness and  
ambient light sensor calibration. Brightness can be calibrated  
during the backlight unit production so that all units produce  
the same brightness. EEPROM also stores the coefficients  
for the LED control equations and the default LED current  
value. LED current has 8–bit adjustment from 0 to 60 mA.  
Seven LED drivers with LED fault (short/open) detection  
Eight-bit LED current control  
Internal thermal protection and backlight safety dimming  
feature  
Two wire, SMBus/ I2C-compatible control interface  
The LP8543 has several safety and diagnostic features. Low-  
input voltage detection turns the chip off if the system gets  
stuck and battery fully discharges. Input voltage detection  
threshold is adjustable for different battery configurations.  
Thermal regulation reduces backlight brightness above a set  
temperature. LED fault detection reports open or LED short  
fault. Boost over-current fault detection protects the chip in  
case of over-current event.  
Low-input voltage detection and shutdown  
Minimum number of external components  
LLP 24-pin package, 4 x 4 x 0.8 mm  
Applications  
Medium sized (>10 inches) LCD Display Backlight  
LP8543 is available in the LLP 24-pin package.  
LED Lighting  
Typical Application  
30085870  
© 2011 Texas Instruments Incorporated  
300858  
www.ti.com  
Typical Application, Using 7 Outputs for Display1  
30085871  
Typical Application, Stand-Alone Mode  
30085869  
www.ti.com  
2
Connection Diagrams and Package Mark Information  
24–pin Leadless Leadframe Package (LLP)  
4.0 x 4.0 x 0.8mm, 0.5 mm pitch  
NS Package Number SQA24A  
30085872  
30085875  
Bottom View  
Top View  
Package Mark  
30085896  
Package Mark - Top View  
U = Fab  
Z = Assembly  
XY = 2–Digit Date Code  
TT = Die Traceability  
L8543SQ = Product Identification  
Ordering Information  
Order Number  
Spec/flow  
Package Marking  
Supplied As  
4500 units, Tape-and-Reel  
LP8543SQX  
HFLF  
L8543SQ  
3
www.ti.com  
Pin Descriptions  
Pin #  
Name  
GND_SW  
PWM  
Type  
Description  
1
2
3
G
I
Boost ground  
PWM dimming input. This pin must be connected to GND if not used.  
Serial interface mode selection: IF_SEL= Low for I2C-compatible interface and  
IF_SEL=High for SMBus interface.  
IF_SEL  
I
4
5
EN  
I
I
Enable input pin  
ALSI  
Ambient light sensor frequency input pin. This pin must be connected to GND if ALS is  
not used.  
6
ALSO  
FAULT  
VDDIO  
O
OD  
P
Ambient light sensor enable output  
7
Fault indication output  
Digital IO reference voltage 1.65V to 5.5V. Needed in SMBus/I2C and stand alone mode.  
8
9
GND_S  
SCLK  
SDA  
G
I
Signal ground  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
Serial clock. This pin must be connected to GND if not used.  
Serial data. This pin must be connected to GND if not used.  
Current sink output  
I/O  
A
OUT1  
OUT2  
OUT3  
GND_L  
OUT4  
OUT5  
OUT6  
OUT7  
ADR  
A
Current sink output  
A
Current sink output  
G
A
Ground for current sink outputs  
Current sink output  
A
Current sink output. Can be left floating if not used.  
Current sink output. Can be left floating if not used.  
Current sink output. Can be left floating if not used.  
A
A
I
Serial interface address selection. See serial interface chapter for details. This pin must  
be connected to GND if not used.  
21  
22  
23  
24  
FB  
VLDO  
VIN  
A
A
P
A
Boost feedback input  
LDO output voltage. 470 nF capacitor should be connected to this pin.  
Input power supply 5.5V to 22V  
Boost switch  
SW  
A: Analog Pin, G: Ground Pin, P: Power Pin, I: Input Pin, I/O: Input/Output Pin, O: Output Pin, OD: Open Drain Pin  
www.ti.com  
4
Operating Ratings (Note 1, Note 2)  
Absolute Maximum Ratings (Note 1, Note  
2)  
Input Voltage Range VIN  
VDDIO  
5.5 to 22.0V  
1.65 to 5V  
0 to 40V  
−40°C to +125°C  
If Military/Aerospace specified devices are required,  
please contact the Texas Instruments Sales Office/  
Distributors for availability and specifications.  
V (OUT1...OUT7, SW, FB)  
Junction Temperature (TJ) Range  
Ambient Temperature (TA) Range  
VIN  
-0.3V to +24.0V  
-0.3V to +6.0V  
-0.3V to +6.0V  
(Note 6)  
−40°C to +85°C  
VDDIO, VLDO  
Voltage on Logic Pins (PWM, ADR  
EN, IF_SEL, ALSO, ALSI)  
Thermal Properties  
Junction-to-Ambient Thermal  
Resistance (θJA), SQA Package  
(Note 7)  
Voltage on Logic Pins (SCLK, SDA,  
FAULT)  
-0.3V to VDDIO  
35 - 50°C/W  
V (OUT1...OUT7 SW, FB)  
Continuous Power Dissipation  
-0.3V to +44.0V  
Internally Limited  
(Note 3)  
Junction Temperature (TJ-MAX  
)
125°C  
-65°C to +150°C  
(Note 4)  
Storage Temperature Range  
Maximum Lead Temperature  
(Soldering)  
ESD Rating  
Human Body Model:  
Machine Model:  
(Note 5)  
2 kV  
OUT7: 150V  
All other pins : 200V  
Electrical Characteristics (Note 2, Note 8)  
Limits in standard typeface are for TA = 25°C. Limits in boldface type apply over the full operating ambient temperature range  
(−40°C < TA < +85°C). Unless otherwise specified: VIN = 12.0V, VDDIO = 2.8V, CVLDO = 470 nF, L1 = 15 μH, CIN = 10 μF, COUT  
4.7 μF. (Note 9)  
=
Symbol  
Parameter  
Condition  
Internal LDO disabled  
EN=L and PWM=L  
Min  
Typ  
Max  
1
Units  
Standby supply current  
μA  
IIN  
Normal mode supply current  
LDO enabled, boost enabled, no current  
going through LED outputs  
3.5  
mA  
fOSC  
Internal Oscillator Frequency  
Accuracy  
-4  
-7  
4
7
%
VLDO  
ILDO  
Internal LDO Voltage  
4.5  
5.0  
5.5  
V
Internal LDO External Loading  
5.0  
mA  
Boost Converter Electrical Characteristics  
Symbol  
RDS-ON  
VMAX  
Parameter  
Condition  
Min  
Typ  
Max  
Units  
Switch ON resistance  
ISW = 0.5A  
0.12  
38  
Boost maximum output voltage  
V
400  
180  
Maximum Continuous Load  
Current  
VIN 12V, VOUT = 38V  
ILOAD  
fSW  
mA  
VIN = 5.5V, VOUT = 38V  
Switching Frequency  
BOOST_FREQ_SEL = 0  
BOOST_FREQ_SEL = 1  
625  
1250  
kHz  
VBOOST = 38V  
VBOOST < 38V  
VBOOST + 1.6V  
VBOOST + 4V  
VOV  
Over-voltage protection voltage  
V
tPULSE  
tDELAY  
Switch pulse minimum width  
Startup delay  
no load  
50  
2
ns  
EN_STANDALONE = 1, PWM input  
active, EN is set from low to high  
ms  
5
www.ti.com  
Symbol  
Parameter  
Condition  
Min  
Typ  
Max  
Units  
tSTARTUP Startup time  
(Note 10)  
8
ms  
IMAX_SEL[1:0] = 00  
IMAX_SEL[1:0] = 01  
IMAX_SEL[1:0] = 10  
IMAX_SEL[1:0] = 11  
0.9  
1.4  
2.0  
2.5  
IMAX  
SW pin current limit  
A
LED Driver Electrical Characteristics  
Symbol  
ILEAKAGE  
IMAX  
Parameter  
Condition  
Min  
-1  
Typ  
Max  
1
Units  
µA  
Outputs OUT1 to OUT7 (Voltage on pins  
40V)  
Leakage current  
Maximum Source Current  
Outputs OUT1 to OUT7  
60  
mA  
%
Output current accuracy  
-3  
-4  
3
4
IOUT  
Output current set to 20 mA  
(Note 11)  
IMATCH  
IMATCH  
1.5  
Matching OUT1-7 (Note 11)  
Matching OUT1-6 (Note 11)  
Output current set to 20 mA  
Output current set to 20 mA  
fPWM_OUT 4883 Hz  
0.8  
0.5  
10  
9
%
%
1.35  
PWMRES  
PWM output resolution  
bit  
fPWM_OUT = 9766Hz  
fPWM_OUT = 19531Hz  
8
PWM_FREQ[2:0] = 000b  
Min LED Switching Frequency PSPWM_FREQ[1:0] = 00b,  
PWM_MODE = 0  
-4%  
-7%  
4%  
7%  
229  
fLED  
Hz  
PWM_FREQ[2:0] = 111b,  
Max LED Switching Frequency PSPWM_FREQ[1:0] = 11b,  
PWM_MODE = 0  
-4%  
-7%  
4%  
7%  
19531  
270  
330  
Output current set to 20 mA  
Saturation voltage (Note 12)  
200  
300  
VSAT  
mV  
400  
540  
Output current set to 60 mA  
Ambient Light Sensor Interface Characteristics  
Symbol  
Parameter  
ALS Frequency Range  
ALS Duty Cycle  
Condition  
Min  
0.2  
40  
Typ  
Max  
2000  
60  
Units  
kHz  
%
fALS  
tCONV  
Conversion Time  
500  
ms  
PWM Interface Characteristics  
Symbol  
Parameter  
Condition  
Min  
Typ  
Max  
Units  
fPWM  
PWM Frequency Range  
0.1  
25  
kHz  
PWM input low time for turn off, stand-alone  
mode, slope disabled  
50  
tSTBY  
tPULSE  
Turn Off Delay  
ms  
ns  
PWM Input Pulse Width  
200  
fPWM_IN < 4.5 kHz  
fPWM_IN = 20 kHz  
10  
8
PWMRES  
PWM input resolution  
bit  
www.ti.com  
6
Under-Voltage Protection  
Symbol  
Parameter  
Condition  
UVLO_THR = 1, falling  
Min  
2.55  
2.62  
5.11  
5.38  
Typ  
2.70  
2.76  
5.40  
5.70  
Max  
2.94  
3.00  
5.68  
5.98  
Units  
UVLO_THR = 1, rising  
UVLO_THR = 0, falling  
UVLO_THR = 0, rising  
VUVLO  
UVLO Threshold Voltage  
V
Logic Interface Characteristics  
Symbol  
Logic Input PWM  
Parameter  
Condition  
Min  
Typ  
Max  
0.4  
Units  
VIL  
VIH  
II  
Input Low Level  
V
V
2.2  
Input High Level  
Input Current  
-1.0  
1.0  
0.4  
µA  
Logic Input EN  
VIL  
VIH  
II  
Input Low Level  
Input High Level  
Input Current  
V
V
1.2  
-1.0  
1.0  
µA  
Logic Input SCLK, SDA, ADR, ALSI, IF_SEL  
VIL  
VIH  
II  
0.2xVDDIO  
1.0  
Input Low Level  
Input High Level  
Input Current  
V
V
0.8xVDDIO  
-1.0  
µA  
Logic Outputs SDA, FAULT  
VOL  
IL  
IOUT = 3 mA (pull-up current)  
VOUT = 2.8V  
0.3  
0.3  
0.5  
1.0  
Output Low Level  
V
-1.0  
Output Leakage Current  
µA  
Logic Output ALSO  
VOL  
VOH  
IL  
IOUT = 3 mA (pull-up current)  
IOUT = –3 mA (pull-up current)  
VOUT = 2.8V  
0.5  
1.0  
Output Low Level  
V
V
VLDO - 0.5V VLDO - 0.3V  
Output High Level  
-1.0  
Output Leakage Current  
µA  
I2C Serial Bus Timing Parameters (SDA, SCLK) (Note 13)  
Limit  
Symbol  
Parameter  
Units  
Min  
Max  
fSCLK  
1
Clock Frequency  
400  
kHz  
µs  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
µs  
Hold Time (repeated) START Condition  
Clock Low Time  
0.6  
1.3  
2
3
Clock High Time  
600  
4
Setup Time for a Repeated START Condition  
Data Hold Time  
600  
5
50  
6
Data Setup Time  
100  
7
Rise Time of SDA and SCL  
Fall Time of SDA and SCL  
20+0.1Cb  
15+0.1Cb  
600  
300  
300  
8
9
Set-up Time for STOP condition  
Bus Free Time between a STOP and a START Condition  
10  
1.3  
Capacitive Load for Each Bus Line  
Load of 1 pF corresponds to 1 ns.  
Cb  
10  
200  
ns  
7
www.ti.com  
30085898  
SMBus Timing Parameters (SDA, SCLK) (Note 13, Note 14)  
Limit  
Units  
Symbol  
Parameter  
Min  
10  
Max  
fSCLK  
1
Clock Frequency  
100  
kHz  
µs  
µs  
µs  
µs  
ns  
ns  
ns  
ns  
µs  
µs  
Hold Time (repeated) START Condition  
Clock Low Time  
4.0  
4.7  
4.0  
4.7  
300  
250  
2
3
Clock High Time  
50  
4
Setup Time for a Repeated START Condition  
Data Hold Time  
5
6
Data Setup Time  
7
Rise Time of SDA and SCL  
Fall Time of SDA and SCL  
1000  
300  
8
9
Set-up Time for STOP condition  
Bus Free Time between a STOP and a START Condition  
4.0  
4.7  
10  
Capacitive Load for Each Bus Line  
Load of 1 pF corresponds to 1 ns.  
Cb  
10  
200  
ns  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation  
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,  
see the Electrical Characteristics tables.  
Note 2: All voltages are with respect to the potential at the GND pins.  
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and disengages at TJ  
= 130°C (typ.).  
Note 4: For detailed soldering specifications and information, please refer to Texas Instruments AN1187: Leadless Leadframe Package (LLP).  
Note 5: The Human body model is a 100 pF capacitor discharged through a 1.5 kresistor into each pin. The machine model is a 200 pF capacitor discharged  
directly into each pin. MIL-STD-883 3015.7  
Note 6: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be  
derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power  
dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the  
following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).  
Note 7: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,  
special care must be paid to thermal dissipation issues in board design.  
Note 8: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.  
Note 9: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.  
Note 10: Start-up time is measured from the moment boost is activated until the VOUT crosses 90% of its target value.  
Note 11: Output Current Accuracy is the difference between the actual value of the output current and programmed value of this current. Matching is the maximum  
difference from the average. For the constant current sinks on the part (OUT1 to OUT7), the following are determined: the maximum output current (MAX), the  
minimum output current (MIN), and the average output current of all outputs (AVG). Two matching numbers are calculated: (MAX-AVG)/AVG and (AVG-MIN/  
AVG). The largest number of the two (worst case) is considered the matching figure. The typical specification provided is the most likely norm of the matching  
figure for all parts. Note that some manufacturers have different definitions in use.  
Note 12: Saturation voltage is defined as the voltage when the LED current has dropped 10% from the value measured at 2V.  
Note 13: Guaranteed by design. VDDIO = 1.65V to 5.5V.  
Note 14: The switching characteristics of the LP8543 fully meets or exceeds the published System Management Bus (SMBus) Specification Version 2.0.  
www.ti.com  
8
 
 
 
 
 
 
 
 
 
 
 
 
 
 
Typical Performance Characteristics  
Unless otherwise specified: VBATT = 12.0V, CVLDO = 470 nF, L1 = 15 μH, CIN = 10 μF, COUT = 4.7 μF  
LED Drive Efficiency, fLED = 19.5 kHz, PSPWM enabled  
Boost Converter Efficiency  
30085825  
30085819  
Boost Maximum Output Current at VBOOST = 38V  
Battery Current  
30085828  
30085827  
Boost Converter Typical Waveforms  
VBOOST = 38V, IOUT = 50 mA  
Boost Line Transient Response  
30085830  
30085829  
9
www.ti.com  
Typical Waveforms in PSPWM Mode, fLED = 4.2 kHz  
Typical Waveforms in Normal PWM Mode, fLED = 4.2 kHz  
30085831  
30085832  
www.ti.com  
10  
Functional Overview  
The LP8543 is a high-voltage LED driver for medium-sized  
LCD backlight applications. It includes 38V boost converter,  
7 current sink outputs for the backlight and an interface for  
digital Ambient Light Sensor (ALS). LP8543 can be controlled  
through SMBus or I2C serial interface or PWM input. Light-to-  
frequency type ambient light sensor can be directly connected  
to LP8543 and the sensor response vs. LED brightness curve  
can be programmed in the on-chip EEPROM memory.  
3. INDIVIDUALLY CONTROLLED LED STRING FOR  
BACKSIDE DISPLAY BACKLIGHT  
OUT7 string can be either used for main backlight or for  
possible back side sub display. Separate control allows  
dimming through I2C interface and reduces extra  
components or ICs in display module.  
4. LED FAULT DETECTION  
LED fault detection enables higher yield in display  
manufacturing process and also makes possible to  
monitor backlight faults during normal operation. Fault  
test detects both open circuit (string with unconnected or  
open circuit LED) and short circuit of 2 or more shorted  
LEDs. Single LED short can also be detected if the  
amount of LEDs per string and/or the VF variation are  
sufficiently low. Threshold levels are EEPROM  
programmable. Fault information is available in the  
status register and in the open drain active low FAULT  
output.  
LP8543 differs from conventional LED drivers due to fol-  
lowing advanced features.  
1. PHASE SHIFT PWM FEATURE  
LP8543 supports a state-of-the-art feature called Phase  
Shift PWM (PSPWM). Key advantages of the PSPWM is  
improved power efficiency when there is variation in the  
forward voltages amongst the LED strings. Due to an  
unmatched LED VF there is a random difference in each  
string forward voltage. PSPWM optimizes the boost  
converter output voltage by turning off LED outputs  
periodically. The lower the brightness, the more strings  
can be simultaneously off. When the strings with higher  
forward voltages are turned off, the boost voltage is  
automatically lowered thereby improving efficiency. The  
second benefit of PSPWM control is that it will make the  
boost and battery loading more constant. In other words,  
the peak current needed from the battery is greatly  
reduced beause not all LED outputs are simultaneously  
on.  
5. LED PWM TEMPERATURE REGULATION  
This feature will decrease the effect of high temperature  
LED lifetime reduction. LP8543 reduces output PWM of  
the LEDs at high temperatures and prevents overheating  
of the device and LEDs. Temperature threshold can be  
programmed to EEPROM.  
6. AMBIENT LIGHT SENSOR INTERFACE WITH USER  
PROGRAMMABLE CONTROL CURVE  
Ambient light sensing reduces power consumption and it  
allows natural backlight in any ambient light condition.  
Programmability allows display manufacturer and even  
end user to control sensor to backlight control loop. By  
integrating this feature LP8543 reduces external  
component count, wiring and complexity of the design.  
LP8543 supports digital light-to-frequency type sensors.  
Prescaler and compensation curve can be programmed  
in to the EEPROM.  
2. PROGRAMMABLE OUTPUT STRINGS  
Programmability helps display manufacturers to fit  
LP8543 to several sizes of displays. The number of  
output strings in use is a parameter in EEPROM and can  
be fixed during the manufacturing process of displays.  
Based on the configuration the device will automatically  
adjust the phase Shift PWM function for a given number  
of output strings. LP8543 supports of minimum of 4  
strings and a maximum of 7 strings. In this datasheet ,  
strings 1 through 6 are classified as Display1, and string  
7 is classified as Display2.  
11  
www.ti.com  
cycle of this input signal to calculate the output PWM  
value. Input PWM frequency can vary from 100 Hz to 25  
kHz. Based on the configuration selected, this external  
PWM control can linearly reduce the brightness from the  
value set by the Brightness Register. This external PWM  
control can also be used as the only control for LP8543.  
In this case, when PWM input is permanently low, the  
chip is turned off. When there is signal in PWM input, the  
chip turns on and adjusts brightness according to PWM  
signal duty cycle. In addition, PSPWM can also be used  
in this mode.  
Brightness Control Methods  
1. CURRENT CONTROL  
The 8-bit LED current default value is read from  
EEPROM when the chip is activated. Current value can  
be used for fine tuning the backlight brightness between  
panels. This current setting can be overridden by a  
register write from the serial interface. Current control  
range is from 0 to 60 mA with 0.23 mA step. This fine  
grained current control gives backlight manufacturer  
possibility to adapt different LED bins in one product and  
maintain the full PWM control range. There are separate  
controls for both Display1 and Display2.  
4. AMBIENT LIGHT SENSING  
External ambient light sensor can be used for controlling  
the brightness of the LEDs. Light-to- Frequency type light  
sensor can be connected to ALSI input in LP8543 for  
ambient light compensation. Transfer curve coefficients  
for response setting are stored in EEPROM. LP8543 has  
an enable output, ALSO to activate the light sensor  
(active high/low, programmed to EEPROM). Light sensor  
supply voltage can be taken from the 5V regulator in  
LP8543. Ambient light control is possible for Display1  
(4-7 outputs).  
2. INTERNAL PWM CONTROL  
The basic brightness control is register based 8-bit PWM  
control. There is a piecewise linear transfer curve from  
register value to LED PWM value and the curve  
coefficients are stored in the EEPROM. This makes  
possible to calibrate the 100% brightness and the  
dimming behavior. LED PWM frequency is selectable  
from 229 Hz to 19.5 kHz. In addition PSPWM can be  
used.  
3. EXTERNAL PWM CONTROL  
An external PWM signal can be used to set the  
brightness of the display. LP8543 measures the duty  
www.ti.com  
12  
Calibration  
Energy Efficiency  
LP8543 has an internal EEPROM to store different control  
parameters which allows calibrating the backlight brightness  
at various brightness settings so that every display has ex-  
actly the same brightness and several LP8543 circuits can be  
used in the same display if needed.  
The voltage across the LED drivers is constantly monitored  
and boost voltage is adjusted to minimum sufficient voltage  
when adaptive boost mode is selected. Inductive boost con-  
verter maintains good efficiency over wide input and output  
operating voltage ranges. The boost output has over voltage  
protection limiting the maximum output to 38V. The boost is  
internally compensated and the output voltage can be either  
controlled with 5-bit register value or automatically adjusted  
based on the LED driver voltages.  
Programming the EEPROM is easy. User needs to write the  
data in the shadow RAM memory and give the EEPROM write  
command. On-chip boost converter produces the needed  
erase and program voltages, no external voltages other than  
normal input voltage are required.  
LP8543 has an internal 5V LDO with low current consump-  
tion. The 5V LDO can supply 5 mA current for external devices  
like ALS (Ambient Light Sensor). LDO is switched off in stand-  
by mode. The internal LDO is used for powering internal  
blocks as well; therefore the 470 nF CVLDO capacitor must be  
used even if external load is not used.  
Calibration in backlight or display production can be done ac-  
cording to the flowchart below  
Serial Communication  
LP8543 supports two serial protocols: SMBus and I2C.  
IF_SEL input is used to determine the selection. SMBus in-  
terface is selected when IF_SEL is high and I2C is selected  
when IF_SEL is low.  
30085803  
13  
www.ti.com  
Block Diagram  
30085874  
www.ti.com  
14  
LED Driver Control  
BASIC OPERATION  
Principle of the LED driver control is shown in the following  
figure:  
30085804  
Principle of the LED Control Methods  
LED CURRENT CONTROL  
LP8543 is designed to be flexible to support backlighting  
needs for the main display as well as lighting needs of a sub  
display (also for e.g. keyboard lighting or status LED) when  
required. In addition, a variety of PWM options are supported  
to drive the backlight LED strings. Various configurations that  
are supported using a set of programmable internal registers  
and EEPROM are described below. Both the register map  
and the EEPROM memory map are listed at the end of this  
datasheet.  
Two 8-bit EEPROM registers, Display1 current and Dis-  
play2 current (addresses B0H and B1H) hold the default  
LED string current for the Display1 and Display2 groups re-  
spectively. The default values are read from EEPROM when  
the chip is activated. When required the LED current can be  
adjusted also in the registers Display1 and Display2 cur-  
rent (addresses 05H and 06H). Use of this register is enabled  
by setting bit 1 in Config2 register. Default value for <CUR-  
RENT SEL> bit is 0, which means that current values in  
EEPROM are used. Current control range is linear from 0 to  
60 A with 0.23 mA step. Factory default current for Display1  
and Display2 is 20 mA.  
OUTPUT GROUPING  
LP8543 features a total of 7 strings (OUT1-OUT7), which can  
be arranged into 2 groups (Display1 and Display2). Display1  
refers to backlighting for main display and Display2 refers to  
lighting for a sub display. Number of outputs used for Display1  
can be defined using EEPROM register bits, as shown in the  
table below. LP8543 supports a minimum of 4 strings and a  
maximum of 7 strings for Display1. Outputs must be used in  
order starting from OUT1. Unused outputs can be left open.  
When needed OUT7 can be configured for Display2 and it has  
its own current and PWM control registers for independent  
control. EEPROM default factory setting is 6 outputs for Dis-  
play1 and OUT7 for Display2.  
LED ON/OFF CONTROL  
LED strings can be activated with 100% PWM by writing  
<DRV[7:0]> bits high. All these controls are in Direct con-  
trol register.  
PWM CONTROL SELECTION  
PWM control of the LED strings can be established through  
4 combinations of user configurable options as shown in the  
table below. <PM_MD> and <PWM_SEL> bits are part of  
Config1 Register.  
TABLE 1. Output Configurations  
Default setting is external PWM input signal. Each of the op-  
tion is explained in the following sections.  
OUTPUT_CONF[1:0]  
Outputs for  
Display1  
Outputs for  
Display2  
00  
01  
10  
11  
OUT1-OUT4  
OUT1-OUT5  
OUT1-OUT6  
OUT1-OUT7  
OUT7  
OUT7  
OUT7  
-
15  
www.ti.com  
TABLE 2. PWM Control Selection  
PWM_MD PWM_SEL  
PWM source  
1
1
PWM input (Direct control)  
PWM input pin (Duty cycle  
based), default  
0
1
1
0
Brightness register  
PWM input pin (Duty cycle  
0
0
based) and Brightness register  
In addition Ambient light sensor (when used) and on-chip  
temperature regulation also influence the output PWM con-  
trol. This is described later.  
A. Direct PWM Input Control  
Display1 group can be directly controlled with external PWM  
signal (bypassing all the PWM logic) by setting <PWM_MD>  
and <PWM_SEL> bits high. Outputs will be active when the  
PWM input pin is high, and when the input is low the outputs  
will be off. Input PWM frequency can vary from 100 Hz to 25  
kHz. Display2 is not controlled with this signal.  
30085821  
Three-Segment Transfer Curve Example  
D. PWM Pin and Register Control  
Note: In this mode, Ambient Light sensor and PSPWM  
scheme do not influence the output PWM.  
In this mode, PWM control pin can linearly reduce the bright-  
ness of Display1 from the value set by the Brightness Register  
and Ambient Light sensor. Same controls can be used as in  
brightness register based PWM control. Output PWM fre-  
quency is set by EEPROM registers. This mode is compatible  
with Intel DPST (Display Power Saving Technology).  
B. PWM Input Pin Control (Duty Cycle-based)  
An external PWM signal can be used to set the brightness of  
the Display1 group. LP8543 measures the duty cycle of this  
input signal to calculate the output PWM value. Input PWM  
frequency can vary from 100 Hz to 25 kHz. Output PWM fre-  
quency is set by EEPROM registers.  
STAND ALONE MODE  
Note: In this mode, Ambient Light compensation and PSPWM  
scheme can be also used.  
LP8543 can be set to operate in stand alone mode, where  
LP8543 operates without I2C / SMBus and EN and PWM input  
pins are the only controls for the device. To enable stand-  
alone mode, EEPROM bit <EN_STANDALONE> must be set  
to 1 in register B4h. In this mode PWM pin sets the brightness  
and with EN pin the backlight can be turned on. When PWM  
or EN input pin is permanently low, the chip is turned off. Turn  
off time is typically 50 ms. When there is signal in PWM input  
and EN is high, the chip turns on and adjusts brightness ac-  
cording to PWM signal duty cycle. All settings needed for  
operation like LED current, number of LEDs etc. are obtained  
from EEPROM. If only one signal control is needed, the EN  
and PWM pin can be tied together and PWM signal can be  
connected to this. Stand alone mode is useful in applications  
where I2C or SMBus control is not possible or available to use.  
C. PWM Control Using Brightness Register  
Generation of PWM for LED strings can be based on Bright-  
ness register value. For Display1 group, this scheme is en-  
abled when <PWM_SEL> bit is set to 0 and <PWM_MD> is  
set to 1. Display2 group has the brightness register control  
enabled by default. Two separate 8-bit registers Displ1  
brightness and Displ2 brightness store the brightness val-  
ues for Display1 and Display2 respectively. For Display1, this  
8-bit brightness value from the register is converted to 10-bit  
LED PWM value using a three-part piecewise linear transfer  
curve as shown below. This makes it possible to calibrate the  
100% brightness and the dimming behavior. The curve coef-  
ficients are stored in the EEPROM and are user pro-  
grammable if needed. The LED PWM frequency is set by  
EEPROM register.  
AMBIENT LIGHT COMPENSATION  
LP8543 supports an external ambient light sensor to control  
the backlight brightness (Display1) and its usage is controlled  
with two bits in the Config2 register, namely <ALSO_EN>  
and <ALSO_CALC_EN>. <ALSO_EN> bit controls enabling/  
disabling of the sensor itself, and <ALSO_CALC_EN> bit de-  
termines whether the ALS measurement data will be used by  
an external processor (Host) or by LP8543’s internal control  
logic to control the brightness.  
Note: In this mode, Ambient Light compensation and PSPWM  
scheme can be also used.  
If <ALSO_EN> bit is 1 the ALSO output pin is set high and the  
input frequency measuring is enabled. Frequency is mea-  
sured for 500 ms, and the result is divided with 10-bit  
prescaler (defined in EEPROM), resulting in a 10-bit value.  
This 10-bit result can be read from ALS MSB and ALS LSB  
registers. ALS MSB register must be read first followed by  
ALS LSB register. If ALS_CALC_EN bit is set to 0, then the  
measurement data is not used by LP8543’s internal PWM  
logic but left for the host to adjust the brightness.  
On the other hand if the ALS_CALC_EN bit is set to 1, ALS  
measurement result will control backlight brightness in all but  
direct external PWM control mode. The measured ALS value  
www.ti.com  
16  
is converted to PWM value using a three segment linear  
curve. The calculated PWM value is used as a multiplier for  
the LED PWM value obtained from brightness register, PWM  
input pin or combination of both depending which mode is  
selected. The conversion curve parameters are stored in  
EEPROM memory. Conversion curve is similar as in PWM  
control.  
Phase shift frequency can either be the same as the PWM  
frequency or a lower frequency can be selected with  
<PHASE_SHIFT_FREQ[1:0]> EEPROM bits. At highest 19.5  
kHz PSPWM frequency, the boost will use a constant voltage  
based on the highest VF string because of timing constraints  
of the high PWM frequency. PSPWM is enabled by default,  
but it can be disabled by setting <DISABLE_PS> EEPROM  
bit to 1.  
Smoothing filter is used to prevent rapid changes. Smoothing  
filter has EEPROM programmable slopes from 0 to 2s. The  
slope defines the time it takes to change brightness from one  
value to next. Slope control can be also used to smooth  
changes to backlight brightness caused by other PWM con-  
trols (brightness register or external PWM input).  
Two PSPWM modes are available. PSPWM mode is selected  
with <PWM_MODE> EEPROM bit. Difference between  
modes is in the PWM frequencies available. PWM and PSP-  
WM frequency settings are shown in Table 4.  
Number of strings simultaneously on in PSPWM mode with  
different PWM values and different output configurations is  
shown in the following diagram.  
TABLE 3. Slope Selections  
SLOPE_SEL[1:0]  
Slope  
130 ms  
0.5s  
00  
01  
10  
11  
1.0s  
2s  
ALSO output can be used as GPO if not used for ALS control.  
ALSO pin state is then controlled with <ALSO_EN> register  
bit.  
PHASE SHIFT PWM (PSPWM)  
PSPWM improves the system efficiency by optimizing the  
boost converter voltage on a cycle by cycle basis instead of  
maintaining a constant voltage based on the highest VF string.  
PSPWM scheme can be used for Display1 group. Phase shift  
PWM control principle is illustrated in the picture below using  
an example of 6 string implementation and 41.7% brightness  
setting. In a 6-string implementation, each of the string sup-  
ports a maximum of 16.67% (1/6) of the total backlight bright-  
ness. The brightness set value in this example is 41.7%.  
Hence two strings are fully on (2 x 16.67% = 33.33%) and one  
string is 50% on (0.5 x 16.67% = 8.34%). This pattern of two  
100% and one 50% strings is then cycled through all 6 output  
strings. After 6 cycles the brightness value is changed to  
83.33%, resulting in 5 LEDs fully on (5 x 16.67%).  
30085806  
Number of Simultaneously Active Strings  
30085805  
Principle of the PSPWM Operation  
17  
www.ti.com  
TABLE 4. PSPWM Frequency Selection in EEPROM Registers (N = number of strings used)  
PWM_MODE = 0 PWM_MODE = 1  
PWM Frequency Shift Frequency Output Frequency Output Frequency Shift Frequency  
PWM_FREQ[2:0] +  
PSPWM_FREQ[1:0]  
(Hz)  
(Hz)  
(Hz)  
(Hz)  
(Hz)  
00000  
00001  
00010  
00011  
00100  
00101  
00110  
00111  
01000  
01001  
01010  
01011  
01100  
01101  
01110  
01111  
10000  
10001  
10010  
10011  
10100  
10101  
10110  
10111  
11000  
11001  
11010  
11011  
11100  
11101  
11110  
11111  
992  
992  
992/N  
229  
229 x N  
992  
496  
496/N  
305  
305 x N  
992  
248  
248/N  
381  
381 x N  
992  
124  
124/N  
458  
458 x N  
1526  
1526  
1526  
1526  
1983  
1983  
1983  
1983  
2441  
2441  
2441  
2441  
2974  
2974  
2974  
2974  
3965  
3965  
3965  
3965  
4883  
4883  
4883  
4883  
19531  
19531  
19531  
19531  
1526  
763  
1526/N  
763/N  
534  
534 x N  
610  
610 x N  
382  
382/N  
687  
687 x N  
191  
191/N  
763  
763 x N  
1983  
993  
1983/N  
993/N  
839  
839 x N  
916  
916 x N  
496  
496/N  
992  
992 x N  
248  
248/N  
1068  
1144  
1221  
1297  
1373  
1450  
1526  
1602  
1678  
1755  
1831  
1908  
1983  
2060  
2671  
3203  
3737  
4270  
4808  
9766  
19531  
1068 x N  
1144 x N  
1221 x N  
1297 x N  
1373 x N  
1450 x N  
1526 x N  
1602 x N  
1678 x N  
1755 x N  
1831 x N  
1908 x N  
1983 x N  
2060 x N  
2671 x N  
3203 x N  
3737 x N  
4270 x N  
4808 x N  
9766 x N  
19531 x N  
2441  
1221  
610  
2441/N  
1221/N  
610/N  
305  
305/N  
2974  
1487  
744  
2974/N  
1487/N  
744/N  
372  
372/N  
3965  
1983  
991  
3965/N  
1983/N  
991/N  
496  
496/N  
4883  
2441  
1221  
610  
4883/N  
2441/N  
1221/N  
610/N  
19531  
9766  
4883  
2441  
19531/N  
9766/N  
4883/N  
2441/N  
www.ti.com  
18  
 
TABLE 5. PWM Frequencies with Phase Shift Disabled  
PWM_MODE = 0  
PWM_MODE = 1  
PWM_FREQ[2:0] +  
PSPWM_FREQ[1:0]  
PWM Frequency (Hz)  
Output Frequency (Hz)  
00000  
00001  
00010  
00011  
00100  
00101  
00110  
00111  
01000  
01001  
01010  
01011  
01100  
01101  
01110  
01111  
10000  
10001  
10010  
10011  
10100  
10101  
10110  
10111  
11000  
11001  
11010  
11011  
11100  
11101  
11110  
11111  
992  
992  
229  
305  
992  
381  
992  
458  
1526  
1526  
1526  
1526  
1983  
1983  
1983  
1983  
2441  
2441  
2441  
2441  
2974  
2974  
2974  
2974  
3965  
3965  
3965  
3965  
4883  
4883  
4883  
4883  
19531  
19531  
19531  
19531  
534  
610  
687  
763  
839  
916  
992  
1068  
1144  
1221  
1297  
1373  
1450  
1526  
1602  
1678  
1755  
1831  
1908  
1983  
2060  
2671  
3203  
3737  
4270  
4808  
9766  
19531  
19  
www.ti.com  
Device Thermal Regulation  
LP8543 has an internal temperature sensor which can be  
used to measure the junction temperature of the device and  
protect the device from overheating. During thermal regula-  
tion, LED PWM is reduced by 4% of full scale per °C whenever  
the temperature threshold is reached. I.e., with 100% PWM  
value the PWM goes to 0% 25°C above threshold tempera-  
ture. With lower PWM start value 0% is reached earlier.  
Temperature regulation is enabled automatically when the  
chip is enabled. 11-bit temperature value can be read from  
Temp MSB and Temp LSB registers, MSB should be read  
first. Temperature limit can be programmed in EEPROM as  
shown in the following table.  
TABLE 6. Over Temperature Limit Settings  
TEMP_LIM[1:0]  
Over Temperature Limit (ºC)  
00  
01  
10  
11  
100  
110  
120  
130  
30085823  
Internal Temperature Sensor Readings  
www.ti.com  
20  
BBh) have only NVM and SRAM. Other EEPROM cells have  
also EEPROM registers. For the cells which have also EEP-  
ROM registers, the changes made to SRAM does not take  
effect until update command is sent. This is done by setting  
EE_UPDATE and EE_READ bits to 1. After an update, these  
bits must be set back to 0. For EEPROM bits which do not  
have registers, changes take effect immediately.  
EEPROM  
EEPROM memory stores various parameters for chip control.  
The 256 bit EEPROM memory is organized as 32 x 8 bits. The  
EEPROM structure consists of a SRAM front end and the  
Non-volatile memory (NVM). SRAM data can be read and  
written through the serial interface. To erase and write NVM,  
separate commands need to be sent. Erase and Write volt-  
ages are generated on-chip, no other voltages than normal  
input voltage are required. A complete EEPROM memory  
map is shown in the chapter LP8543 EEPROM Memory Map.  
At startup the values in NVM part of the EEPROM is loaded  
to SRAM and to EEPROM registers. User can also load val-  
ues from NVM to SRAM and EEPROM registers by writing  
EE_READ to 1.  
EEPROM structure is described in the figure below. User has  
read and write access to SRAM part of the EEPROM directly  
through I2C / SMBus when PWM calculation is not enabled;  
i.e., <BL_CTL> = 0 and external PWM pin = low. To see  
whether the EEPROM can be accessed user can read  
<EE_READY> bit. ALS and brightness coefficient curves (ad-  
dress A0h – Afh) and empty EEPROM cells (address B4h –  
To write SRAM values to NVM user needs to first erase EEP-  
ROM and the program it. This is done by first writing  
EE_ERASE to 1 and then 0. At this point NVM is erased. To  
burn new values to NVM, user needs to write EE_PROG to 1  
and then 0. The LP8543 generates the needed erase and  
write voltage from boost output voltage.  
30085839  
EEPROM Memory Control and Usage Principle  
21  
www.ti.com  
automatically based on LED driver saturation. In adaptive  
mode the boost output voltage control steps are 0.25V. En-  
abling the adaptive mode is done with <BOOST_AUTO> bit  
in Boost Control register. If boost is started with adaptive  
mode enabled (default) then the initial voltage value is defined  
with EEPROM bits at address 29H in order to eliminate long  
iteration time when the chip is started. If adaptive mode is  
enabled after boost startup, then the boost will use register  
07H values as initial voltage value. The output voltage control  
changes the resistor divider in the feedback loop. The follow-  
ing figure shows the boost topology with the protection cir-  
cuitry.  
Boost Converter  
OPERATION  
The LP8543 boost DC/DC converter generates a 10…38V  
supply voltage for the LEDs from 5.5…22V input voltage. The  
output voltage is controlled with a 5-bit register in 1V steps.  
The converter is a magnetic switching PWM mode DC/DC  
converter with a current limit. The topology of the magnetic  
boost converter is called CPM (current programmed mode)  
control, where the inductor current is measured and con-  
trolled with the feedback. Switching frequency is selectable  
between 625 kHz and 1.25 MHz with EEPROM bit  
<BOOST_FREQ>. Boost is enabled with <EN_BOOST> bit.  
User can program the output voltage of the boost converter  
or use adaptive mode where boost output voltage is adjusted  
30085840  
PROTECTION  
TABLE 7. Boost Output Voltage Controls  
Four different protection schemes are implemented:  
VPROG[4:0]  
Voltage (typical)  
1. Over-voltage protection limit changes dynamically based  
on output voltage setting  
Bin  
Dec  
Volts  
10  
11  
12  
13  
14  
...  
00000  
00001  
00010  
00011  
00100  
...  
0
1
Over-voltage protection limit changes dynamically  
based on output voltage setting.  
2
Keeps the output below breakdown voltage.  
Prevents boost operation if battery voltage is much  
higher than desired output.  
3
4
2. SW current limiting, limits the maximum inductor current.  
...  
27  
28  
3. Over-current protection enables fault flag and shuts  
down boost converter in over-current condition.  
11011  
11100  
37  
38  
4. Duty cycle limiting.  
ADAPTIVE BOOST CONTROL  
MANUAL OUTPUT VOLTAGE CONTROL  
Adaptive boost control function adjusts the boost voltage to  
the minimum sufficient voltage for proper LED driver opera-  
tion. When PSPWM is used the output voltage can be adjust-  
ed for every phase shift step separately except in 19.5 kHz  
PSPWM mode due to timing constraints. To enable PSPWM  
to each phase, the <BOOST_MODE> EEPROM bit must be  
0. This enables power saving when strings have mismatch in  
VF voltages. The correct voltage for each string is stored and  
used in predicting when the boost has to start increasing volt-  
age for the next step. The boost setup time can be defined  
with two EEPROM bits. Principle of the boost voltage adjust-  
ment with PSPWM is illustrated below. If higher PWM value  
is used then more strings are on at the same time, and voltage  
is adjusted based on highest VF on simultaneously active  
strings.  
User can control the boost output voltage with Boost_out-  
put (07H) register when adaptive mode is disabled; i.e.,  
<BOOST_AUTO> = 0.  
www.ti.com  
22  
30085842  
Normal Operation, High PWM Value  
If one LED driver voltage is below Low, boost voltage will be  
increased. This is seen in the following figure.  
30085841  
Boost Adaptive Voltage Control for 5–String PSPWM  
When adaptive boost mode is selected the voltages across  
the LED drivers are constantly monitored. There are three  
voltage thresholds used, Low, Mid and High. Low and High  
thresholds are adjustable with 3 EEPROM bits. Low threshold  
range is from 0.5V to 2.25V and High threshold range is from  
3 to 10V. Mid threshold is set 0.5V above Low threshold.  
Threshold levels are listed in the table below. Adjustability is  
provided to enable adaptation to different conditions. If there  
is a lot of variation between LED string VF, then higher thresh-  
old levels must be used to avoid false fault indications. If there  
is low variation between LED string VF, then lower thresholds  
are recommended to maintain good efficiency. Fault detec-  
tion chapter describes how these thresholds are used also for  
fault detection.  
30085843  
Boost voltage too Low  
TABLE 8. LED Voltage Comparator Thresholds  
If all driver voltages are above Mid threshold (or any of the  
voltages in PSPWM adaptation mode and with low PWM val-  
ue), boost voltage will be lowered. Decision is always based  
on number of strings active at the same time. In the illustra-  
tions 6 outputs are active, which basically means close to  
100% PWM value with PSPWM.  
EEPROM bits  
Threshold (V)  
LED_FAULT_THR[5:3]  
(HIGH comparator)  
DRV_HEADR_CTRL[2:0]  
(LOW comparator)  
Low  
High  
Mid  
000  
001  
010  
011  
100  
101  
110  
111  
0.50  
0.75  
1.00  
1.25  
1.50  
1.75  
2.00  
2.25  
3
4
5
6
Low + 0.5V  
7
8
9
10  
If only one string is on at a time (Brightness value lower than  
100% divided by number of strings) the voltage for each string  
is adjusted so that the voltage across the driver will fall be-  
tween Low and Mid threshold. If more strings are on at the  
same time (high PWM value, or PSPWM not used) the situ-  
ation looks like in the following diagram. In this diagram 6  
outputs are on at the same time. In normal operation voltages  
across all LED driver outputs are between high and low  
threshold.  
30085844  
Boost voltage too High  
23  
www.ti.com  
Fault Detection  
LP8543 has fault detection for LED fault, low-battery voltage,  
overcurrent and thermal shutdown. The open drain output pin  
(FAULT) can be used to indicate occurred fault. The cause  
for the fault can be read from status register. Refreshing the  
<BL_CTL> bit high will reset the fault register and fault pin  
state.  
LED FAULT DETECTION  
There are two methods of detecting the LED fault. First  
method is based on measuring the voltage on LED driver pins  
(analog fault detection) and another is based on adaptive  
boost voltage hopping between strings (digital fault detec-  
tion). The used fault detection mode is selected in EEPROM  
as well as the threshold levels. <FAULT_SEL[1:0]> bits se-  
lects the used mode as follows:  
30085845  
Open Fault  
TABLE 9. LED Fault Mode Selection  
If one or more LEDs are shorted, this causes the voltage to  
rise in this LED driver output pin above the high threshold.  
This causes short fault detection as seen in the following fig-  
ure:  
FAULT_SEL[1:0]  
Fault mode  
No fault detection  
00  
Analog fault detection based on  
LED driver voltage  
01  
10  
11  
Digital fault detection based on  
boost voltage hopping  
Both analog and digital fault  
detection  
Two fault detection methods are used to detect faults in dif-  
ferent conditions. Analog detection works better with high  
PWM values (in PSPWM mode) where many strings are ac-  
tive at a same time. It does not work when only one string is  
active at a time, because it is based on comparing driver volt-  
ages on strings active simultaneously. Digital fault detection  
is used to complement this case.  
Digital fault detection works better with low PWM values,  
where not all strings are on at the same time. Digital short  
detection works only with cases where one string is active at  
the same time.  
30085846  
Short Fault  
DIGITAL FAULT DETECTION  
With digital fault detection the voltage hopping between LED  
strings is monitored in PSPWM mode. In normal PWM mode  
or with high PWM values with PSPWM mode this does not  
apply.  
ANALOG FAULT DETECTION  
When analog fault detection mode is selected, the voltages  
across the LED drivers are constantly monitored. The same  
threshold levels (Low, Mid and High) are used for fault detec-  
tion to adjust the boost voltage.  
If there’s open in one of the LED strings, the LED driver output  
pin will drop to 0V. When this happens the boost will try to  
increase the voltage to get enough headroom for the driver.  
When the voltage for one string reaches maximum voltage  
(38V) and the difference between consecutive LED strings is  
higher than set threshold level an open LED fault is detected.  
If all voltages are close to 38V then the threshold condition is  
not met and no fault is detected. If the LED output is shorted  
to GND it will be detected same way. Open fault detection is  
seen in the following figure:  
If one of the LED strings has an open fault (LED driver output  
pin has no contact to LED string), the output pin voltage drops  
to 0V. When this happens the boost voltage will be adjusted  
higher to get enough headroom, but at some point the voltage  
for all other strings will rise over the high threshold. In this  
case the LP8543 detects open fault, and adjusts the boost  
voltage based on other LED strings needs, i.e., the faulty LED  
string voltage is not used anymore for adjusting boost output  
voltage. If the LED driver output pin is shorted to GND the  
fault detection works exactly the same. This situation with 6  
LEDs active at the same time is illustrated in the following  
diagram:  
www.ti.com  
24  
fault does not cause the FAULT pin to be pulled down uless  
chip is reset by setting EN pin low and high again. The faults  
will be seen in the register however. If LED fault is detected,  
the string which created the fault is no longer used for adjust-  
ing the boost voltage. Otherwise the LP8543 operates as  
normally.  
Note: Due to the nature of fault detection it is possible to gen-  
erate false faults during startup etc. conditions. Therefore  
when fault is detected it is recommended to read the fault/  
status register twice to make sure that the first fault is real. If  
the second reading gives the same result then the fault is real.  
30085847  
UNDER-VOLTAGE DETECTION  
Digital Open Fault Detection  
LP8543 has detection for too low VIN voltage. Threshold level  
for the voltage is set with EEPROM register bits as seen in  
the following table:  
If there is one or more LEDs shorted in one string, the boost  
will drop the voltage for this string. When the difference be-  
tween consecutive LED strings is higher than set threshold  
level a short LED fault is detected. This is described in the  
following figure:  
TABLE 11. Under-Voltage Detection Thresholds  
UVLO_THR  
Threshold (V)  
0
1
6
3
Under voltage detection is always on. When under voltage is  
detected the LED outputs and boost will shutdown, Fault pin  
will be pulled down (open drain output) and corresponding  
fault bit is set in status register. Fault can be reset by reading  
the status register. LEDs and boost will start again when the  
voltage has increased above the threshold level. Hysteresis  
is implemented to threshold level to avoid continuous trigger-  
ing of fault when threshold is reached.  
30085848  
Digital Short Fault Detection  
Note: Due to the nature of fault detection it is possible to gen-  
erate false faults during startup etc. conditions. Therefore  
when fault is detected it is recommended to read the fault/  
status register twice to make sure that the first fault is real. If  
the second reading gives the same result then the fault is real.  
Threshold level is programmed to EEPROM as shown in the  
following table. Threshold level adjustability is provided to al-  
low adaptation to different LED VF used in the application.  
TABLE 10. Digital LED Fault Detection Thresholds  
OVER-CURRENT DETECTION  
DIG_COMP[1:0]  
Threshold Voltage (V)  
LP8543 has detection for too high loading on the boost con-  
verter. When over current fault is detected the LP8543 will  
shut down and set the fault flag.  
00  
01  
10  
11  
3
5
7
9
THERMAL SHUTDOWN  
If the LP8543 reaches thermal shutdown temperature  
(150°C) the LED outputs and boost will shut down to protect  
it from damage. Also the fault pin will be pulled down to indi-  
cate the fault state. Device will activate again when temper-  
ature drops below 130°C.  
When Fault is detected the FAULT pin will be pulled down  
(open drain output), and corresponding status register bit is  
set. To clear the fault user must read the status register.  
Note: LED fault output signal is generated only once for cer-  
tain fault type. If, for example, open fault occurs, new open  
25  
www.ti.com  
SMBus/I2C Compatible Serial Bus  
Interface  
INTERFACE BUS OVERVIEW  
The SMBus/I2C-compatible synchronous serial interface pro-  
vides access to the programmable functions and registers on  
the device. This protocol uses a two-wire interface for bidi-  
rectional communications between the IC's connected to the  
bus. The two interface lines are the Serial Data Line (SDA),  
and the Serial Clock Line (SCL / SCLK). These lines should  
be connected to a positive supply, via a pull-up resistor and  
remain HIGH even when the bus is idle.  
Every device on the bus is assigned a unique address and  
acts as either a Master or a Slave depending on whether it  
generates or receives the serial clock (SCLK). LP8543 is al-  
ways a slave device.  
30085820  
DATA TRANSACTIONS  
Start and Stop  
One data bit is transferred during each clock pulse. Data is  
sampled during the high state of the serial clock (SCL). Con-  
sequently, throughout the clock’s high period, the data should  
remain stable. Any changes on the SDA line during the high  
state of the SCLK and in the middle of a transaction, aborts  
the current transaction. New data should be sent during the  
low SCLK state. This protocol permits a single data line to  
transfer both command/control information and data using the  
synchronous serial clock.  
The Master device on the bus always generates the Start and  
Stop Conditions (control codes). After a Start Condition is  
generated, the bus is considered busy and it retains this sta-  
tus until a certain time after a Stop Condition is generated. A  
high-to-low transition of the data line (SDA) while the clock  
(SCLK) is high indicates a Start Condition. A low-to-high tran-  
sition of the SDA line while the SCLK is high indicates a Stop  
Condition.  
30085849  
Bit Transfer  
30085850  
Each data transaction is composed of a Start Condition, a  
number of byte transfers (set by the software) and a Stop  
Condition to terminate the transaction. Every byte written to  
the SDA bus must be 8 bits long and is transferred with the  
most significant bit first. After each byte, an Acknowledge sig-  
nal must follow. The following sections provide further details  
of this process.  
Start and Stop Conditions  
In addition to the first Start Condition, a repeated Start Con-  
dition can be generated in the middle of a transaction. This  
allows another device to be accessed, or a register read cycle.  
ACKNOWLEDGE CYCLE  
The Acknowledge Cycle consists of two signals: the acknowl-  
edge clock pulse the master sends with each byte transferred,  
and the acknowledge signal sent by the receiving device.  
The master generates the acknowledge clock pulse on the  
ninth clock pulse of the byte transfer. The transmitter releases  
the SDA line (permits it to go high) to allow the receiver to  
send the acknowledge signal. The receiver must pull down  
the SDA line during the acknowledge clock pulse and ensure  
that SDA remains low during the high period of the clock  
pulse, thus signaling the correct reception of the last data byte  
and its readiness to receive the next byte.  
ACKNOWLEDGE AFTER EVERY BYTE” RULE  
The master generates an acknowledge clock pulse after each  
byte transfer. The receiver sends an acknowledge signal after  
every byte received.  
www.ti.com  
26  
There is one exception to the “acknowledge after every byte”  
rule. When the master is the receiver, it must indicate to the  
transmitter an end of data by not-acknowledging (“negative  
acknowledge”) the last byte clocked out of the slave. This  
“negative acknowledge” still includes the acknowledge clock  
pulse (generated by the master), but the SDA line is not pulled  
down.  
Control Register Read Cycle  
Master device generates a start condition.  
Master device sends slave address (7 bits) and the data  
direction bit (r/w = 0).  
Slave device sends acknowledge signal if the slave  
address is correct.  
Master sends control register address (8 bits).  
Slave sends acknowledge signal.  
Master device generates repeated start condition.  
Master sends the slave address (7 bits) and the data  
direction bit (r/w = 1).  
ADDRESSING TRANSFER FORMATS  
Each device on the bus has a unique slave address. The  
LP8543 operates as a slave device with the 7-bit address  
combined with data direction bit. Slave address is pin-se-  
lectable as follows:  
Slave sends acknowledge signal if the slave address is  
correct.  
TABLE 12. Address Selection  
Slave sends data byte from addressed register.  
Slave Address  
Write (8 bits)  
Slave Address Read  
(8 bits)  
If the master device sends acknowledge signal, the control  
register address will be incremented by one. Slave device  
sends data byte from addressed register.  
ADR  
0
1
01011000 (58H)  
01011010 (5AH)  
01011001 (59H)  
01011011 (5BH)  
Read cycle ends when the master does not generate  
acknowledge signal after data byte and generates stop  
condition.  
Before any data is transmitted, the master transmits the ad-  
dress of the slave being addressed. The slave device should  
send an acknowledge signal on the SDA line, once it recog-  
nizes its address.  
TABLE 13. Data Read and Write Cycles  
Address Mode  
The slave address is the first seven bits after a Start Condi-  
tion. The direction of the data transfer (R/W) depends on the  
bit sent after the slave address — the eighth bit.  
<Start Condition>  
<Slave Address><r/w = 0>[Ack]  
<Register Addr.>[Ack]  
When the slave address is sent, each device in the system  
compares this slave address with its own. If there is a match,  
the device considers itself addressed and sends an acknowl-  
edge signal. Depending upon the state of the R/W bit (1:read,  
0:write), the device acts as a transmitter or a receiver.  
<Repeated Start Condition>  
Data Read  
<Slave Address><r/w = 1>[Ack]  
[Register Data]<Ack or NAck>  
… additional reads from subsequent  
register address possible  
I2C Chip Address  
<Stop Condition>  
<Start Condition>  
<Slave Address><r/w=’0’>[Ack]  
<Register Addr.>[Ack]  
<Register Data>[Ack]  
Data Write  
… additional writes to subsequent  
register address possible  
<Stop Condition>  
30085851  
Control Register Write Cycle  
<>Data from master [ ] Data from slave  
Master device generates start condition.  
Master device sends slave address (7 bits) and the data  
direction bit (r/w = 0).  
Slave device sends acknowledge signal if the slave  
address is correct.  
Master sends control register address (8 bits).  
Slave sends acknowledge signal.  
Master sends data byte to be written to the addressed  
register.  
Slave sends acknowledge signal.  
If master will send further data bytes the control register  
address will be incremented by one after acknowledge  
signal.  
Write cycle ends when the master creates stop condition.  
27  
www.ti.com  
Register Read and Write Detail  
30085894  
30085895  
www.ti.com  
28  
Recommended External Components  
Inductor Selection  
As a result the inductor should be selected according to the  
ISAT. A more conservative and recommended approach is to  
choose an inductor that has a saturation current rating greater  
than the maximum current limit of 0.9...2.5A (programmed to  
EEPROM). Maximum current limit needed for the application  
can be approximated with calculations above. A 15 μH induc-  
tor with a saturation current rating of 2.5A is recommended  
for most applications. The inductor’s resistance should be  
less than 300 mfor good efficiency. For high efficiency  
choose an inductor with high frequency core material such as  
ferrite to reduce core losses. To minimize radiated noise, use  
shielded core inductor. Inductor should be placed as close to  
the SW pin and the IC as possible. Special care should be  
used when designing the PCB layout to minimize radiated  
noise and to get good performance from the boost converter.  
A 15 µH shielded inductor is suggested for LP8543 boost  
converter. Inductor maximum current can be calculated from  
the equations below.  
OUTPUT CAPACITOR  
• IRIPPLE: Average to peak inductor current  
• IOUTMAX: Maximum load current  
A ceramic capacitor with 50V voltage rating or higher is rec-  
ommended for the output capacitor. The DC-bias effect can  
reduce the effective capacitance by up to 80%, which needs  
to be considered in capacitance value selection. For light  
loads (<100 mA) 4.7 µF capacitor is sufficient. For maximum  
output voltage/current 10 µF capacitor (4 uF effective capac-  
itance @ 38V) is recommended to reduce the output ripple.  
Small 33 pF capacitor is recommended to use in parallel with  
the output capacitor to suppress high frequency noise.  
• VIN: Maximum input voltage in application  
• L: Min inductor value including worst case tolerances  
• f: Minimum switching frequency  
• VOUT: Output voltage  
Example using above equations:  
VIN = 12V  
VOUT = 38V  
IOUT = 400 mA  
L = 15 µH − 20% = 12 µH  
f = 1.25 MHz  
LDO CAPACITOR  
A 470 nF ceramic capacitor with 10V voltage rating is recom-  
mended for the LDO capacitor.  
ISAT = 1.6A  
OUTPUT DIODE  
A schottky diode should be used for the output diode. Peak  
repetitive current should be greater than inductor peak current  
(0.9...2.5A) to ensure reliable operation. Average current rat-  
ing should be greater than the maximum output current.  
Schottky diodes with a low forward drop and fast switching  
speeds are ideal for increasing efficiency in portable applica-  
tions. Choose a reverse breakdown voltage of the Schottky  
diode significantly larger (~60V) than the output voltage. Do  
not use ordinary rectifier diodes, since slow switching speeds  
and long recovery times cause the efficiency and the load  
regulation to suffer.  
AMBIENT LIGHT SENSOR  
LP8543 uses light-to-frequency type ambient light sensor.  
Suitable frequency range for ALS is 200 Hz to 2 MHz.  
29  
www.ti.com  
www.ti.com  
30  
31  
www.ti.com  
www.ti.com  
32  
Physical Dimensions inches (millimeters) unless otherwise noted  
SQA24A: LLP-24, 0.5mm pitch, no pullback  
33  
www.ti.com  
Notes  
TI/NATIONAL INTERIM IMPORTANT NOTICE  
Texas Instruments has purchased National Semiconductor. As of Monday, September 26th, and until further notice, products sold or  
advertised under the National Semiconductor name or logo, and information, support and interactions concerning such products, remain  
subject to the preexisting National Semiconductor standard terms and conditions of sale, terms of use of website, and Notices (and/or  
terms previously agreed in writing with National Semiconductor, where applicable) and are not subject to any differing terms and notices  
applicable to other TI components, sales or websites. To the extent information on official TI and National websites and business social  
networking media, etc., pertains to both TI and National-branded products, both companies' instructions, warnings and limitations in the  
above-referenced terms of use apply.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Applications  
Communications and Telecom  
Computers and Peripherals  
Audio  
www.ti.com/audio  
amplifier.ti.com  
www.ti.com/communications  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
dataconverter.ti.com Consumer Electronics  
www.dlp.com  
dsp.ti.com  
Energy and Lighting  
Industrial  
www.ti.com/industrial  
www.ti.com/medical  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
Medical  
Security  
www.ti.com/security  
Logic  
Space, Avionics and Defense  
www.ti.com/space-avionics-  
defense  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Transportation and Automotive www.ti.com/automotive  
microcontroller.ti.com Video and Imaging  
www.ti-rfid.com Wireless  
www.ti.com/video  
www.ti.com/wireless-apps  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
TI E2E Community Home Page e2e.ti.com  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright© 2011 Texas Instruments Incorporated  
www.ti.com  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Audio  
Applications  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
www.ti.com/security  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
Medical  
Security  
Logic  
Space, Avionics and Defense www.ti.com/space-avionics-defense  
Transportation and Automotive www.ti.com/automotive  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
microcontroller.ti.com  
www.ti-rfid.com  
Video and Imaging  
www.ti.com/video  
OMAP Mobile Processors www.ti.com/omap  
Wireless Connectivity www.ti.com/wirelessconnectivity  
TI E2E Community Home Page  
e2e.ti.com  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2011, Texas Instruments Incorporated  

相关型号:

LP8543SQX/NOPB

适用于中型 LCD 背光的 SMBus/I2C 控制型 WLED 驱动器 | RTW | 24 | -30 to 85
TI

LP8545

High-Efficiency LED Backlight Driver for Notebooks
TI

LP8545SQ/NOPB

适用于笔记本电脑的六通道高效 LED 背光驱动器,具有灵活的外部/内部 FET 控制 | RTW | 24
TI

LP8545SQE/NOPB

Six channel high-efficiency LED backlight driver for notebooks with flexible ext/int FET control 24-WQFN -30 to 85
TI

LP8545SQX

High-Efficiency LED Backlight Driver for Notebooks
TI

LP8545SQX/NOPB

适用于笔记本电脑的六通道高效 LED 背光驱动器,具有灵活的外部/内部 FET 控制 | RTW | 24 | -30 to 85
TI

LP8550

High-Efficiency LED Backlight Driver for Notebooks
TI

LP8550TLE/NOPB

用于笔记本电脑的高效 LED 背光驱动器 | YZR | 25 | -30 to 85
TI

LP8550TLX-A/NOPB

用于笔记本电脑的高效 LED 背光驱动器 | YZR | 25
TI

LP8550TLX/NOPB

用于笔记本电脑的高效 LED 背光驱动器 | YZR | 25 | -30 to 85
TI

LP8551

High-Efficiency LED Backlight Driver for Notebooks
TI

LP8551TLE/NOPB

适用于笔记本电脑的四通道高效 LED 背光驱动器,具有 VDDIO PWM 逻辑电平 | YZR | 25
TI