MAX202 [TI]
5-V DUAL RS-232 LINE DRIVER/RECEIVER WITH +-15KV ESD PROTECTION; 5 - V双RS - 232线路驱动器/接收器， + - 15KV ESD保护
| 型号： | MAX202 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 5-V DUAL RS-232 LINE DRIVER/RECEIVER WITH +-15KV ESD PROTECTION |
| 文件： | 总14页 (文件大小：319K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀ ꢁꢂ ꢃ ꢄꢃ
ꢅ ꢆꢇ ꢈꢉꢁ ꢊ ꢋꢌ ꢆꢃꢍ ꢃ ꢊ ꢎꢏꢐ ꢈꢋꢎ ꢇꢐ ꢋꢑꢋꢐ ꢒꢐ ꢎ ꢇ ꢐꢋ
ꢓ ꢎꢔ ꢕ ꢖ ꢅ ꢆꢗ ꢇ ꢐꢌ ꢈ ꢘꢋ ꢙ ꢔꢐ ꢒꢔ ꢎꢙ ꢏ
SLLS576D − JULY 2003 − REVISED JANUARY 2004
D, DW, N, OR PW PACKAGE
(TOP VIEW)
D
D
D
D
D
D
ESD Protection for RS-232 Bus Pins
15-kV − Human-Body Model
−
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
C1+
V+
V
CC
15 GND
1
2
3
4
5
6
7
8
16
Operates at 5-V V
Supply
CC
14
13
12
11
10
9
C1−
C2+
C2−
V−
DOUT1
RIN1
Operates Up To 120 kbit/s
ROUT1
DIN1
External Capacitors . . . 4 × 0.1 µF
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DOUT2
RIN2
DIN2
ROUT2
D
Applications
− Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
description/ordering information
The MAX202 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with
15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication
controller and the serial-port connector. The charge pump and four small external capacitors allow operation
from a single 5-V supply. The device operates at data signaling rates up to 120 kbit/s and a maximum of 30-V/µs
driver output slew rate.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP (N)
SOIC (D)
Tube of 25
Tube of 40
Reel of 2500
Tube of 40
Reel of 2000
Tube of 90
Reel of 2000
Tube of 25
Tube of 40
Reel of 2500
Tube of 40
Reel of 2000
Tube of 90
Reel of 2000
MAX202CN
MAX202C
MAX202CD
MAX202C
MAX202C
MAX202CDR
MAX202CDW
MAX202CDWR
MAX202CPW
MAX202CPWR
MAX202IN
0°C to 70°C
SOIC (DW)
TSSOP (PW)
PDIP (N)
MAX202C
MAX202I
MAX202ID
SOIC (D)
MAX202I
MAX202I
MAX202I
MAX202IDR
MAX202IDW
MAX202IDWR
MAX202IPW
MAX202IPWR
−40°C to 85°C
SOIC (DW)
TSSOP (PW)
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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1
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SLLS576D − JULY 2003 − REVISED JANUARY 2004
Function Tables
EACH DRIVER
INPUT
OUTPUT
D
D
OUT
IN
L
H
H
L
H = high level, L = low
level
EACH RECEIVER
INPUT
OUTPUT
R
R
OUT
IN
L
H
H
L
Open
H
H = high level, L = low
level, Open
disconnected
=
input
or
connected driver off
logic diagram (positive logic)
11
14
7
DIN1
DIN2
DOUT1
DOUT2
RIN1
10
12
9
13
8
ROUT1
ROUT2
RIN2
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢃ
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ꢓ ꢎꢔ ꢕ ꢖ ꢅ ꢆꢗ ꢇ ꢐꢌ ꢈ ꢘꢋꢙ ꢔꢐ ꢒ ꢔꢎ ꢙ ꢏ
SLLS576D − JULY 2003 − REVISED JANUARY 2004
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Positive charge pump voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Negative charge pump voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −14 V to 0.3 V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
CC
− 0.3 V to 14 V
CC
Input voltage range, V : Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V+ + 0.3 V
I
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
Output voltage range, V : Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V− − 0.3 V to V+ + 0.3 V
O
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V
+ 0.3 V
CC
Short-circuit duration: D
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
OUT
Package thermal impedance, θ (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 57°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 4)
MIN NOM
MAX
UNIT
Supply voltage
4.5
2
5
5.5
V
V
V
V
V
Driver high-level input voltage
Driver low-level input voltage
Driver input voltage
D
D
D
IH
IN
IN
IN
0.8
5.5
30
70
85
IL
0
−30
0
V
I
V
Receiver input voltage
MAX202C
MAX202I
T
A
Operating free-air temperature
°C
−40
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 5 V 0.5 V.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
‡
PARAMETER
TEST CONDITIONS
No load, = 5 V
MIN TYP
MAX
UNIT
I
Supply current
V
8
15
mA
CC
CC
‡
All typical values are at V
= 5 V, and T = 25°C.
A
CC
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 5 V 0.5 V.
CC
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLLS576D − JULY 2003 − REVISED JANUARY 2004
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
V
V
V
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
D
D
at R = 3 kΩ to GND,
D
D
= GND
5
9
OH
OUT
OUT
L
IN
IN
at R = 3 kΩ to GND,
= V
CC
−5
−9
15
V
OL
L
I
I
I
V = V
I CC
200
µA
µA
IH
V at 0 V
I
−15 −200
10 60
IL
‡
Short-circuit output current
Output resistance
V
V
= 5.5 V,
V
O
= 0 V
mA
OS
CC
r
, V+, and V− = 0 V,
V
O
=
2 V
300
W
o
CC
†
‡
All typical values are at V
CC
= 5 V, and T = 25°C.
A
Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 5 V 0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
C
One D
= 50 to1000 pF, = 3 kΩ to 7 kΩ,
R
L
L
Maximum data rate
120
kbit/s
switching,
= 2500 pF,
See Figure 1
R = 3 kΩ,
L
OUT
Propagation delay time,
low- to high-level output
C
L
t
t
t
2
2
µs
µs
PLH (D)
PHL (D)
sk(p)
All drivers loaded,
See Figure 1
Propagation delay time,
high- to low-level output
C
= 2500 pF,
R
L
= 3 kΩ,
See Figure 1
L
All drivers loaded,
C
= 150 pF to 2500 pF,
R
L
= 3 kΩ to 7 kΩ,
L
§
Pulse skew
300
6
ns
See Figure 2
R = 3 kΩ to 7 kΩ,
L
Slew rate, transition region
(see Figure 1)
C
= 50 pF to 1000 pF,
= 5 V
L
SR(tr)
3
30
V/µs
V
CC
†
§
All typical values are at V
CC
= 5 V, and T = 25°C.
A
Pulse skew is defined as |t
− t | of each channel of the same device.
PLH PHL
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 5 V 0.5 V.
CC
ESD protection
PIN
TEST CONDITIONS
TYP
UNIT
D
, R
OUT IN
Human-Body Model
15
kV
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢃ
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ꢓ ꢎꢔ ꢕ ꢖ ꢅ ꢆꢗ ꢇ ꢐꢌ ꢈ ꢘꢋꢙ ꢔꢐ ꢒ ꢔꢎ ꢙ ꢏ
SLLS576D − JULY 2003 − REVISED JANUARY 2004
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
†
PARAMETER
High-level output voltage
TEST CONDITIONS
= −1 mA
MIN
TYP
V −0.4 V
CC
MAX
UNIT
V
V
OH
V
OL
V
IT+
V
IT−
V
hys
I
I
3.5V
OH
Low-level output voltage
= 1.6 mA
0.4
2.4
V
OL
Positive-going input threshold voltage
Negative-going input threshold voltage
V
= 5 V,
= 5 V,
T
= 25°C
= 25°C
1.7
1.2
0.5
5
V
CC
CC
A
V
T
A
0.8
0.2
3
V
Input hysteresis (V
− V
)
1
7
V
IT+
IT−
r
Input resistance
V = 3 V to 25 V
kW
i
I
†
All typical values are at V
CC
= 5 V, and T = 25°C.
A
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 5 V 0.5 V.
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 3)
†
PARAMETER
TEST CONDITIONS
C = 150 pF
MIN TYP
MAX
10
UNIT
µs
t
t
t
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
0.5
0.5
PLH (R)
PHL (R)
sk(p)
L
C = 150 pF
L
10
µs
‡
Pulse skew
300
ns
†
‡
All typical values are at V
Pulse skew is defined as |t
= 5 V, and T = 25°C.
A
PLH PHL
CC
− t
| of each channel of the same device.
= 5 V 0.5 V.
NOTE 4: Test conditions are C1−C4 = 0.1 µF, at V
CC
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
C
PHL (D)
PLH (D)
L
R
(see Note A)
L
V
OH
OL
3 V
−3 V
3 V
−3 V
Output
V
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
PHL (D)
PLH (D)
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
5
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SLLS576D − JULY 2003 − REVISED JANUARY 2004
PARAMETER MEASUREMENT INFORMATION
3 V
RS-232
Output
1.5 V
1.5 V
Input
0 V
Generator
(see Note B)
50 Ω
C
t
t
L
PHL (D)
PLH (D)
R
(see Note A)
L
V
OH
OL
50%
50%
Output
V
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A.
C
includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PLH (R)
PHL (R)
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢓ ꢎꢔ ꢕ ꢖ ꢅ ꢆꢗ ꢇ ꢐꢌ ꢈ ꢘꢋꢙ ꢔꢐ ꢒ ꢔꢎ ꢙ ꢏ
SLLS576D − JULY 2003 − REVISED JANUARY 2004
APPLICATION INFORMATION
1
2
3
4
16
15
V
C1+
V+
CC
+
−
C
BYPASS
= 0.1 µF
C1
0.1 µF,
6.3 V
+
−
†
GND
C3
+
−
0.1 µF,
16 V
14
13
C1−
C2+
C2−
DOUT1
RIN1
5 kΩ
C2
0.1 µF,
16 V
+
−
5
6
7
12
11
ROUT1
DIN1
V−
C4
0.1 µF,
16 V
−
+
10
9
DOUT2
DIN2
8
RIN2
ROUT2
5 kΩ
†
C3 can be connected to V
or GND.
NOTES: A. Resistor values shown are nominal.
CC
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
Figure 4. Typical Operating Circuit and Capacitor Values
7
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ꢁ
ꢇ
ꢂ
ꢈ
ꢕ
ꢃ
ꢉ
ꢄ
ꢃ
ꢁ
ꢖ
ꢅ
ꢆ
ꢊ
ꢋ
ꢌ
ꢆ
ꢐ
ꢃ
ꢌ
ꢍ
ꢃ
ꢈ
ꢊ
ꢘ
ꢎ
ꢋ
ꢏ
ꢙ
ꢐ
ꢈ
ꢋ
ꢒ
ꢎ
ꢇ
ꢔ
ꢐ
ꢋ
ꢏ
ꢑ
ꢋ
ꢐꢒ
ꢐ
ꢎ
ꢇ
ꢐ
ꢋ
ꢓ
ꢎ
ꢔ
ꢅꢆ
ꢗꢇ
ꢔꢐ
ꢎ
ꢙ
SLLS576D − JULY 2003 − REVISED JANUARY 2004
APPLICATION INFORMATION
capacitor selection
The capacitor type used for C1−C4 is not critical for proper operation. The MAX202 requires 0.1-µF capacitors,
although capacitors up to 10 µF can be used without harm. Ceramic dielectrics are suggested for the 0.1-µF
capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does
not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×)
nominal value. The capacitors’ effective series resistance (ESR), which usually rises at low temperatures,
influences the amount of ripple on V+ and V−.
Use larger capacitors (up to 10 µF) to reduce the output impedance at V+ and V−.
Bypass V
charge pumps, decouple V
capacitors (C1−C4).
to ground with at least 0.1 µF. In applications sensitive to power-supply noise generated by the
CC
to ground with a capacitor the same size as (or larger than) the charge-pump
CC
ESD protection
TI MAX202 devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of 15-kV when powered down.
ESD test conditions
Stringent ESD testing is performed by TI, based on various conditions and procedures. Please contact TI for
a reliability report that documents test setup, methodology, and results.
Human-Body Model (HBM)
The HBM of ESD testing is shown in Figure 5. Figure 6 shows the current waveform that is generated during
a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage of
concern, and subsequently discharged into the device under test (DUT) through a 1.5-kΩ resistor.
R
D
1.5 kΩ
C
+
−
S
DUT
V
HBM
100 pF
Figure 5. HBM ESD Test Circuit
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢃ
ꢅ ꢆꢇ ꢈꢉꢁ ꢊ ꢋꢌꢆ ꢃꢍ ꢃ ꢊ ꢎꢏꢐ ꢈꢋꢎ ꢇꢐ ꢋꢑꢋ ꢐꢒ ꢐ ꢎꢇ ꢐ ꢋ
ꢓ ꢎꢔ ꢕ ꢖ ꢅ ꢆꢗ ꢇ ꢐꢌ ꢈ ꢘꢋꢙ ꢔꢐ ꢒ ꢔꢎ ꢙ ꢏ
SLLS576D − JULY 2003 − REVISED JANUARY 2004
APPLICATION INFORMATION
1.5
V
= 2 kV
HBM
DUT = 10-V, 1-Ω Zener Diode
|
1.0
0.5
0.0
0
50
100
150
200
Time – ns
Figure 6. Typical HBM Current Waveform
Machine Model (MM)
The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the
MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of
manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC
board assembly, the MM test no longer is as pertinent to the RS-232 pins.
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
PACKAGING INFORMATION
Orderable Device
MAX202CD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
16
40
2500
40
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
MAX202CDR
MAX202CDW
MAX202CDWR
MAX202CPW
MAX202CPWR
MAX202ID
SOIC
SOIC
D
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
DW
DW
PW
PW
D
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SOIC
2000
90
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
TSSOP
TSSOP
SOIC
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
2000
40
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
MAX202IDR
SOIC
D
2500
40
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
MAX202IDW
MAX202IDWR
MAX202IPW
MAX202IPWR
SOIC
DW
DW
PW
PW
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SOIC
2000
90
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
TSSOP
TSSOP
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
2000
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
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Use of such information may require a license from a third party under the patents or other intellectual property
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Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
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Amplifiers
amplifier.ti.com
www.ti.com/audio
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dataconverter.ti.com
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dsp.ti.com
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www.ti.com/broadband
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interface.ti.com
logic.ti.com
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Copyright 2005, Texas Instruments Incorporated
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