MAX211CDW [TI]
5-V MULTICHANNEL RS-232 LINE DRIVER / RECEIVER WITH +-15-KV ESD PROTECTION; 5 -V多通道RS - 232线路驱动器/接收器，具有±15 - kV ESD保护
| 型号： | MAX211CDW |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 5-V MULTICHANNEL RS-232 LINE DRIVER / RECEIVER WITH +-15-KV ESD PROTECTION |
| 文件： | 总16页 (文件大小：291K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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ꢅ ꢆꢇ ꢀ ꢈꢉꢊ ꢋꢌꢍ ꢁꢎꢎꢏꢉ ꢐꢑ ꢆꢃꢒ ꢃ ꢉ ꢋꢎꢏ ꢓꢐꢋ ꢇꢏ ꢐꢔꢐꢏ ꢌꢏ ꢋ ꢇ ꢏꢐ
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SLLS567E − MAY 2003 − REVISED JANUARY 2004
DB OR DW PACKAGE
(TOP VIEW)
D
D
D
D
D
D
RS-232 Bus-Pin ESD Protection Exceeds
15 kV Using Human-Body Model (HBM)
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DOUT3
DOUT1
DOUT2
RIN2
DOUT4
RIN3
ROUT3
SHDN
EN
2
Operates at 5-V V
Supply
CC
3
4
Four Drivers and Five Receivers
Operates Up To 120 kbit/s
5
ROUT2
DIN2
6
RIN4
ROUT4
DIN4
DIN3
ROUT5
RIN5
V−
Low Supply Current in Shutdown
Mode . . . 1 µA Typical
External Capacitors . . . 4 × 0.1 µF
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
7
DIN1
ROUT1
RIN1
8
D
9
10
11
12
13
14
D
GND
V
CC
C1+
V+
C1−
D
Applications
C2−
C2+
− Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
description/ordering information
The MAX211 device consists of four line drivers, five line receivers, and a dual charge-pump circuit with
15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication
controller and the serial-port connector. The charge pump and four small external capacitors allow operation
from a single 5-V supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/µs
driver output slew rate.
The MAX211 has both shutdown (SHDN) and enable control (EN). In shutdown mode, the charge pumps are
turned off, V+ is pulled down to V , V− is pulled to GND, and the transmitter outputs are disabled. This
CC
reduces supply current typically to 1 µA. EN is used to put the receiver outputs into the high-impedance state
to allow wired-OR connection of two RS-232 ports. It has no effect on the RS-232 drivers or the charge pumps.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
Tube of 20
Reel of 1000
Tube of 50
Reel of 2000
Tube of 20
Reel of 1000
Tube of 50
Reel of 2000
MAX211CDW
MAX211CDWR
MAX211CDB
MAX211CDBR
MAX211IDW
MAX211IDWR
MAX211IDB
SOIC (DW)
SSOP (DB)
SOIC (DW)
SSOP (DB)
MAX211C
0°C to 70°C
MAX211C
MAX211I
MAX211I
−40°C to 85°C
MAX211IDBR
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃꢄꢄ
ꢅꢆ ꢇ ꢀ ꢈꢉꢊ ꢋ ꢌ ꢍꢁ ꢎ ꢎꢏꢉ ꢐꢑ ꢆꢃ ꢒ ꢃ ꢉꢋ ꢎ ꢏ ꢓꢐ ꢋ ꢇꢏ ꢐꢔꢐꢏ ꢌꢏꢋ ꢇꢏꢐ
ꢕꢋ ꢊ ꢍ ꢄ ꢅꢆ ꢖꢇ ꢏꢑ ꢓ ꢗ ꢐꢘ ꢊꢏ ꢌꢊꢋ ꢘ ꢎ
SLLS567E − MAY 2003 − REVISED JANUARY 2004
Function Tables
INPUTS
DRIVER
RECEIVER
DEVICE STATUS
SHDN
EN
L
L
L
H
X
All active
All active
Z
All active
Normal operation
Normal operation
Shutdown
Z
Z
H
X = don’t care, Z = high impedance
EACH DRIVER
OUTPUT
INPUTS
DRIVER STATUS
DOUT
DIN
SHDN
L
H
X
L
L
H
L
Normal operation
Powered off
H
Z
X = don’t care, Z = high impedance
EACH RECEIVER
INPUTS
OUTPUT
ROUT
RECEIVER STATUS
RIN
EN
L
L
H
X
H
L
Normal operation
Powered off
L
H
Z
X = don’t care, Z = high impedance
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLLS567E − MAY 2003 − REVISED JANUARY 2004
logic diagram (positive logic)
7
2
3
1
DIN1
DIN2
DIN3
DIN4
DOUT1
DOUT2
DOUT3
DOUT4
6
TTL/CMOS
Inputs
RS-232
Outputs
20
21
28
25
SHDN
RIN1
8
9
4
ROUT1
ROUT2
ROUT3
5
RIN2
RIN3
26
27
RS-232
Inputs
TTL/CMOS
Outputs
22
23
18
ROUT4
RIN4
RIN5
19
24
ROUT5
EN
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃꢄꢄ
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ꢕꢋ ꢊ ꢍ ꢄ ꢅꢆ ꢖꢇ ꢏꢑ ꢓ ꢗ ꢐꢘ ꢊꢏ ꢌꢊꢋ ꢘ ꢎ
SLLS567E − MAY 2003 − REVISED JANUARY 2004
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Positive charge pump voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Negative charge pump voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −14 V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
CC
− 0.3 V to 14 V
CC
Input voltage range, V : Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V+ + 0.3 V
I
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
Output voltage range, V : Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V− − 0.3 V to V+ + 0.3 V
O
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V
+ 0.3 V
CC
Short-circuit duration: DOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Package thermal impedance, θ (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
JA
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 4)
MIN NOM
MAX
UNIT
Supply voltage
4.5
2
5
5.5
V
Driver high-level input voltage
Control high-level input voltage
Driver and control low-level input voltage
Driver and control input voltage
Receiver input voltage
DIN
V
V
V
V
IH
EN, SHDN
2.4
DIN, EN, SHDN
DIN, EN, SHDN
0.8
5.5
30
70
85
IL
0
−30
0
V
I
V
MAX211C
MAX211I
T
A
Operating free-air temperature
°C
−40
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 5 V 0.5 V.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
‡
PARAMETER
TEST CONDITIONS
See Figure 6
See Figure 1
MIN TYP
MAX
20
UNIT
mA
I
Supply current
Shutdown supply current
All typical values are at V = 5 V, and T = 25°C.
No load,
= 25°C,
14
1
CC
T
A
10
µA
‡
CC
A
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 5 V 0.5 V.
CC
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLLS567E − MAY 2003 − REVISED JANUARY 2004
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
†
PARAMETER
TEST CONDITIONS
DOUT at R = 3 kΩ to GND
MIN TYP
MAX
UNIT
V
V
V
High-level output voltage
Low-level output voltage
5
9
OH
L
DOUT at R = 3 kΩ to GND
−5
−9
15
3
V
OL
L
Driver high-level input current
Control high-level input current
Driver low-level input current
Control low-level input current
DIN = V
CC
200
10
I
IH
µA
µA
EN, SHDN = V
CC
DIN = 0 V
−15 −200
I
I
IL
EN, SHDN = 0 V
−3
10
−10
60
‡
Short-circuit output current
Output resistance
V
V
= 5.5 V,
V
V
= 0 V
mA
OS
CC
O
r
, V+, and V− = 0 V,
=
2 V
300
W
o
CC
O
†
‡
All typical values are at V
CC
= 5 V, and T = 25°C.
A
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 5 V 0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
C
= 50 pF to 1000 pF, = 3 kΩ to 7 kΩ,
R
L
L
Maximum data rate
120
kbit/s
One DOUT switching,
See Figure 2
R = 3 kΩ,
L
Propagation delay time,
low- to high-level output
C
= 2500 pF,
L
t
t
t
2
2
µs
µs
PLH (D)
PHL (D)
sk(p)
All drivers loaded,
See Figure 2
Propagation delay time,
high- to low-level output
C
= 2500 pF,
R
L
= 3 kΩ,
See Figure 2
L
All drivers loaded,
C
= 150 pF to 2500 pF,
R
L
= 3 kΩ to 7 kΩ,
L
§
Pulse skew
300
6
ns
See Figure 3
R = 3 kΩ to 7 kΩ,
L
Slew rate, transition region
(see Figure 2)
C
= 50 pF to 1000 pF,
= 5 V
L
SR(tr)
3
30
V/µs
V
CC
†
§
All typical values are at V
CC
= 5 V, and T = 25°C.
A
Pulse skew is defined as |t
− t | of each channel of the same device.
PLH PHL
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 5 V 0.5 V.
CC
ESD protection
PIN
TEST CONDITIONS
TYP
UNIT
D
, R
OUT IN
Human-Body Model
15
kV
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃꢄꢄ
ꢅꢆ ꢇ ꢀ ꢈꢉꢊ ꢋ ꢌ ꢍꢁ ꢎ ꢎꢏꢉ ꢐꢑ ꢆꢃ ꢒ ꢃ ꢉꢋ ꢎ ꢏ ꢓꢐ ꢋ ꢇꢏ ꢐꢔꢐꢏ ꢌꢏꢋ ꢇꢏꢐ
ꢕꢋ ꢊ ꢍ ꢄ ꢅꢆ ꢖꢇ ꢏꢑ ꢓ ꢗ ꢐꢘ ꢊꢏ ꢌꢊꢋ ꢘ ꢎ
SLLS567E − MAY 2003 − REVISED JANUARY 2004
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
†
PARAMETER
High-level output voltage
TEST CONDITIONS
= −1 mA
MIN
TYP
MAX
UNIT
V
V
OH
V
OL
V
IT+
V
IT−
V
hys
I
I
3.5
V −0.4V
CC
OH
Low-level output voltage
= 1.6 mA
0.4
2.4
V
OL
Positive-going input threshold voltage
Negative-going input threshold voltage
V
= 5 V,
= 5 V,
T
= 25°C
= 25°C
1.7
1.2
0.5
5
V
CC
CC
A
V
T
A
0.8
0.2
3
V
Input hysteresis (V
− V
)
1
7
V
IT+
IT−
r
Input resistance
V
= 5 V,
T = 25°C
A
kW
µA
i
CC
Output leakage current
EN = V
CC
,
0 ≤ ROUT ≤ V
CC
0.05
10
†
All typical values are at V = 5 V, and T = 25°C.
CC
A
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 5 V 0.5 V.
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
10
UNIT
µs
t
t
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
C = 150 pF,
See Figure 4
See Figure 4
0.5
0.5
PLH (R)
L
C = 150 pF,
10
µs
PHL (R)
L
C = 150 pF,
L
R
= 1 kΩ,
L
t
Output enable time
Output disable time
600
ns
en
See Figure 5
C = 150 pF,
L
See Figure 5
R
= 1 kΩ,
L
t
t
200
300
ns
ns
dis
‡
Pulse skew
See Figure 3
sk(p)
†
‡
All typical values are at V
CC
= 5 V, and T = 25°C.
A
Pulse skew is defined as |t
− t | of each channel of the same device.
PLH PHL
NOTE 4: Test conditions are C1−C4 = 0.1 µF, at V
= 5 V 0.5 V.
CC
6
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SLLS567E − MAY 2003 − REVISED JANUARY 2004
PARAMETER MEASUREMENT INFORMATION
I
SHDN
0.1 µF
−
+
5.5 V
0.1 µF
+
−
V
CC
V+
V−
C1+
+
−
0.1 µF
0.1 µF
0.1 µF
−
+
C1−
C2+
+
−
C2−
DIN
V
CC
400 kΩ
DOUT
5.5 V
3 kΩ
D1 to D4
RIN
ROUT
EN
+5.5 V
5 kΩ
0-V or 5.5-V Drive
R1 to R5
5.5 V
SHDN
GND
Figure 1. Shutdown Current Test Circuit
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢕꢋ ꢊ ꢍ ꢄ ꢅꢆ ꢖꢇ ꢏꢑ ꢓ ꢗ ꢐꢘ ꢊꢏ ꢌꢊꢋ ꢘ ꢎ
SLLS567E − MAY 2003 − REVISED JANUARY 2004
PARAMETER MEASUREMENT INFORMATION
0 V
SHDN
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
PLH (D)
C
PHL (D)
L
R
(see Note A)
L
V
OH
OL
3 V
−3 V
3 V
−3 V
Output
V
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
PHL (D)
PLH (D)
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Slew Rate and Propagation Delay Times
0 V
SHDN
3 V
RS-232
Output
1.5 V
1.5 V
Input
t
0 V
Generator
(see Note B)
50 Ω
C
t
L
PLH (D)
PHL (D)
R
(see Note A)
L
V
OH
OL
50%
50%
Output
V
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A.
C
includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Driver Pulse Skew
0 V
SHDN
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PLH (R)
PHL (R)
C
L
(see Note A)
V
OH
0 V
EN
50%
50%
Output
V
OL
TEST CIRCUIT
C includes probe and jig capacitance.
L
VOLTAGE WAVEFORMS
NOTES: A.
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 4. Receiver Propagation Delay Times
8
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ꢕ ꢋꢊ ꢍ ꢄ ꢅ ꢆꢖ ꢇ ꢏꢑ ꢓ ꢗꢐ ꢘ ꢊꢏ ꢌꢊ ꢋꢘ ꢎ
SLLS567E − MAY 2003 − REVISED JANUARY 2004
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
1.5 V
1.5 V
V
CC
S1
GND
0 V
SHDN
Input
t
t
PHZ
PZH
(S1 at GND)
(S1 at GND)
R
L
Output
− 0.1 V
V
OH
3 V or 0 V
Output
V
OH
3.5 V
C
L
(see Note A)
EN
t
t
PLZ
CC
PZL
(S1 at V
(S1 at V
)
)
CC
Generator
50 Ω
(see Note B)
V
OL
+ 0.1 V
Output
0.8 V
V
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
C.
D.
t
t
and t
and t
are the same as t
.
dis
PLZ
PZL
PHZ
PZH
are the same as t
.
en
Figure 5. Receiver Enable and Disable Times
9
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ꢅꢆ ꢇ ꢀ ꢈꢉꢊ ꢋ ꢌ ꢍꢁ ꢎ ꢎꢏꢉ ꢐꢑ ꢆꢃ ꢒ ꢃ ꢉꢋ ꢎ ꢏ ꢓꢐ ꢋ ꢇꢏ ꢐꢔꢐꢏ ꢌꢏꢋ ꢇꢏꢐ
ꢕꢋ ꢊ ꢍ ꢄ ꢅꢆ ꢖꢇ ꢏꢑ ꢓ ꢗ ꢐꢘ ꢊꢏ ꢌꢊꢋ ꢘ ꢎ
SLLS567E − MAY 2003 − REVISED JANUARY 2004
APPLICATION INFORMATION
28
27
1
DOUT4
RIN3
DOUT3
2
DOUT1
3
5 kΩ
DOUT2
4
RIN2
26
25
ROUT3
SHDN
5 kΩ
24
23
5
6
EN
ROUT2
DIN2
RIN4
5 V
5 kΩ
400 kΩ
22
ROUT4
5 V
5 V
400 kΩ
7
8
DIN1
400 kΩ
21
20
DIN4
ROUT1
9
5 V
RIN1
GND
10
5 kΩ
400 kΩ
C
−
DIN3
BYPASS
= 0.1µF
+
19
18
11
ROUT5
V
V
CC
CC
−
+
†
=
C3
RIN5
0.1 µF
12
13
C1+
V+
6.3 V
C4 =
0.1 µF
16 V
5 kΩ
17
16
V−
−
+
+
−
C1 =
0.1 µF
6.3 V
14
C1−
C2−
C2 =
0.1 µF
16 V
−
+
15
C2+
†
C3 can be connected to V
or GND.
CC
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
Figure 6. Typical Operating Circuit and Capacitor Values
10
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ꢕ ꢋꢊ ꢍ ꢄ ꢅ ꢆꢖ ꢇ ꢏꢑ ꢓ ꢗꢐ ꢘ ꢊꢏ ꢌꢊ ꢋꢘ ꢎ
SLLS567E − MAY 2003 − REVISED JANUARY 2004
APPLICATION INFORMATION
capacitor selection
The capacitor type used for C1−C4 is not critical for proper operation. The MAX211 requires 0.1-µF capacitors,
although capacitors up to 10 µF can be used without harm. Ceramic dielectrics are suggested for the 0.1-µF
capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does
not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×)
nominal value. The capacitors’ effective series resistance (ESR), which usually rises at low temperatures,
influences the amount of ripple on V+ and V−.
Use larger capacitors (up to 10 µF) to reduce the output impedance at V+ and V−.
Bypass V
charge pumps, decouple V
capacitors (C1−C4).
to ground with at least 0.1 µF. In applications sensitive to power-supply noise generated by the
CC
to ground with a capacitor the same size as (or larger than) the charge-pump
CC
electrostatic discharge (ESD) protection
Texas Instruments MAX211 devices have standard ESD protection structures incorporated on the pins to
protect against electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus
pins (driver outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD
structures were designed to successfully protect these bus pins against ESD discharge of 15 kV when powered
down.
ESD test conditions
ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for
a reliability report that documents test setup, methodology, and results.
Human-Body Model
The Human-Body Model (HBM) of ESD testing is shown in Figure 7. Figure 8 shows the current waveform that
is generated during a discharge into a low impedance. The model consists of a 100-pF capacitor charged to
the ESD voltage of concern and subsequently discharged into the DUT through a 1.5-kΩ resistor.
R
D
1.5 kΩ
+
−
100 pF
C
DUT
V
HBM
S
Figure 7. HBM ESD Test Circuit
11
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ꢅꢆ ꢇ ꢀ ꢈꢉꢊ ꢋ ꢌ ꢍꢁ ꢎ ꢎꢏꢉ ꢐꢑ ꢆꢃ ꢒ ꢃ ꢉꢋ ꢎ ꢏ ꢓꢐ ꢋ ꢇꢏ ꢐꢔꢐꢏ ꢌꢏꢋ ꢇꢏꢐ
ꢕꢋ ꢊ ꢍ ꢄ ꢅꢆ ꢖꢇ ꢏꢑ ꢓ ꢗ ꢐꢘ ꢊꢏ ꢌꢊꢋ ꢘ ꢎ
SLLS567E − MAY 2003 − REVISED JANUARY 2004
APPLICATION INFORMATION
1.5
V
= 2 kV
HBM
DUT = 10 V, 1-Ω Zener Diode
1.0
0.5
0.0
0
50
100
Time − ns
150
200
Figure 8. Typical HBM Current Waveform
Machine Model
The Machine Model (MM) ESD test applies to all pins, using a 200-pF capacitor with no discharge resistance.
The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and
assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins.
However, after PC board assembly, the MM test no longer is as pertinent to the RS-232 pins.
12
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PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
PACKAGING INFORMATION
Orderable Device
MAX211CDB
MAX211CDBR
MAX211CDW
MAX211CDWR
MAX211IDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
28
28
28
28
28
28
28
28
50
2000
20
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SSOP
SOIC
SOIC
SSOP
SSOP
SOIC
SOIC
DB
DW
DW
DB
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
1000
50
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
MAX211IDBR
MAX211IDW
DB
2000
20
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
DW
DW
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
MAX211IDWR
1000
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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