MAX3222ECPWG4 [TI]
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION; 3V至5.5V多通道RS - 232线路驱动器/接收器，具有± 15 kV ESD保护
| 型号： | MAX3222ECPWG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION |
| 文件： | 总17页 (文件大小：396K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAX3222E
www.ti.com.......................................................................................................................................... SLLS708A –JANUARY 2006–REVISED SEPTEMBER 2009
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
Check for Samples: MAX3222E
The device meets the requirements of TIA/EIA-232-F
and provides the electrical interface between an
1
FEATURES
•
ESD Protection for RS-232 Bus Pins
asynchronous communication controller and the
serial-port connector. The charge pump and four
small external capacitors allow operation from a
single 3-V to 5.5-V supply. The device operates at
typical data signaling rates up to 500 kbit/s and a
maximum of 30-V/μs driver output slew rate.
–
–
–
±15-kV Human-Body Model (HBM)
±8-kV IEC61000-4-2, Contact Discharge
±15-kV IEC61000-4-2, Air-Gap Discharge
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
DB, DW, OR PW PACKAGE
(TOP VIEW)
•
•
•
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply
Operates up to 500 kbit/s
Two Drivers and Two Receivers
Low Standby Current . . . 1 μA Typ
External Capacitors . . . 4 × 0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
EN
C1+
1
20 PWRDOWN
2
19
18
17
16
15
14
13
12
11
V
CC
3
V+
GND
DOUT1
RIN1
ROUT1
NC
4
C1−
5
C2+
Alternative High-Speed Pin-Compatible Device
(1 Mbit/s) for SNx5C3222E
6
C2−
7
V−
8
DOUT2
RIN2
ROUT2
DIN1
DIN2
NC
APPLICATIONS
9
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
10
NC − No internal connection
DESCRIPTION/ORDERING INFORMATION
The MAX3222E consists of two line drivers, two line
receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins,
including GND).
The MAX3222E can be placed in the power-down mode by setting the power-down (PWRDOWN) input low,
which draws only 1 μA from the power supply. When the device is powered down, the receivers remain active
while the drivers are placed in the high-impedance state. Also, during power down, the onboard charge pump is
disabled; V+ is lowered to VCC, and V– is raised toward GND. Receiver outputs also can be placed in the
high-impedance state by setting enable (EN) high.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
MAX3222E
SLLS708A –JANUARY 2006–REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com
ORDERING INFORMATION
(1) (2)
TA
PACKAGE
ORDERABLE PART NUMBER
MAX3222ECDW
MAX3222ECDWR
MAX3222ECDB
TOP-SIDE MARKING
MAX3222EC
Tube of 25
SOIC – DW
SSOP – DB
TSSOP – PW
SOIC – DW
SSOP – DB
TSSOP – PW
Reel of 2000
Tube of 70
0°C to 70°C
MP222EC
MP222EC
MAX3222EI
MP222EI
Reel of 2000
Tube of 70
MAX3222ECDBR
MAX3222ECPW
MAX3222ECPWR
MAX3222EIDW
Reel of 2000
Tube of 25
Reel of 2000
Tube of 70
MAX3222EIDWR
MAX3222EIDB
–40°C to 85°C
Reel of 2000
Tube of 70
MAX3222EIDBR
MAX3222EIPW
MP222EI
Reel of 2000
MAX3222EIPWR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Table 1. FUNCTION TABLES
XXX
EACH DRIVER(1)
INPUTS
PWRDOWN
OUTPUT
DOUT
DIN
X
L
H
H
Z
H
L
L
H
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
Table 2. EACH RECEIVER(1)
INPUTS
OUTPUT
ROUT
RIN
L
EN
L
H
L
H
L
X
H
L
Z
H
Open
(1) H = high level, L = low level, X = irrelevant,
Z = high impedance (off),
Open = input disconnected or connected driver off
2
Submit Documentation Feedback
Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3222E
MAX3222E
www.ti.com.......................................................................................................................................... SLLS708A –JANUARY 2006–REVISED SEPTEMBER 2009
LOGIC DIAGRAM (POSITIVE LOGIC)
13
17
8
DIN1
DOUT1
DOUT2
12
20
DIN2
Powerdown
PWRDOWN
1
EN
15
16
ROUT1
RIN1
RIN2
5 kW
10
9
ROUT2
5 kW
Pin numbers are for the DB, DW, and PW packages.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
0.3
MAX UNIT
VCC
V+
Supply voltage range(2)
Positive-output supply voltage range(2)
Negative-output supply voltage range(2)
6
V
V
V
V
7
V–
–7
V+ – V– Supply voltage difference(2)
13
Driver (EN, PWRDOWN)
Receiver
–0.3
–25
6
25
VI
Input voltage range
Output voltage range
V
V
Driver
–13.2
–0.3
13.2
VO
Receiver
VCC + 0.3
70
DB package
DW package
PW package
θJA
Package thermal impedance(3) (4)
58 °C/W
83
TJ
Operating virtual junction temperature
Storage temperature range
150
150
°C
°C
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Copyright © 2006–2009, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): MAX3222E
MAX3222E
SLLS708A –JANUARY 2006–REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com
RECOMMENDED OPERATING CONDITIONS(1)
See Figure 5
MIN NOM MAX UNIT
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
3
4.5
2
3.3
5
3.6
5.5
Supply voltage
V
V
VIH
Driver and control high-level input voltage
DIN, EN, PWRDOWN
2.4
VIL
VI
Driver and control low-level input voltage
Driver and control input voltage
Receiver input voltage
DIN, EN, PWRDOWN
DIN, EN, PWRDOWN
0.8
5.5
25
70
85
V
V
V
0
–25
0
VI
MAX3222EC
MAX3222EI
TA
Operating free-air temperature
°C
–40
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
ELECTRICAL CHARACTERISTICS(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
(2)
PARAMETER
Input leakage current (EN, PWRDOWN)
Supply current
TEST CONDITIONS
MIN TYP
MAX
UNIT
II
±0.01
±1
μA
mA
μA
No load, PWRDOWN at VCC
No load, PWRDOWN at GND
0.3
1
1
ICC
Supply current (powered off)
10
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
4
Submit Documentation Feedback
Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3222E
MAX3222E
www.ti.com.......................................................................................................................................... SLLS708A –JANUARY 2006–REVISED SEPTEMBER 2009
DRIVER SECTION
abc
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
TYP
PARAMETER
TEST CONDITIONS
MIN
MAX UNIT
(2)
VOH
VOL
IIH
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
DOUT at RL = 3 kΩ to GND,
DIN = GND
DIN = VCC
5
5.4
–5.4
V
V
DOUT at RL = 3 kΩ to GND,
VI = VCC
–5
±0.01
±0.01
±1
±1
μA
μA
IIL
VI at GND
VCC = 3.6 V
IOS
ro
Short-circuit output current(3)
Output resistance
VO = 0 V
±35
±60
mA
VCC = 5.5 V
VCC, V+, and V– = 0 V,
VO = ±2 V
300
10M
Ω
VCC = 3 V to 3.6 V,
VO = ±12 V
±25
±25
IOZ
Output leakage current
PWRDOWN = GND
μA
VCC = 4.5 V to 5.5 V,
VO = ±10 V
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
(2)
PARAMETER
TEST CONDITIONS
MIN TYP
MAX UNIT
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ,
See Figure 1
Maximum data rate
250
500
300
kbit/s
CL = 150 pF to 2500 pF,
See Figure 2
RL = 3 kΩ to 7 kΩ,
tsk(p)
Pulse skew(3)
ns
Slew rate,
transition region
(see Figure 1)
CL = 150 pF to 1000 pF
CL = 150 pF to 2500 pF
6
4
30
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
SR(tr)
V/μs
30
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
TYP UNIT
Human-Body Model (HBM)
±15
Driver outputs (DOUTx)
IEC61000-4-2, Air-Gap Discharge
IEC61000-4-2, Contact Discharge
±15
±8
kV
Copyright © 2006–2009, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): MAX3222E
MAX3222E
SLLS708A –JANUARY 2006–REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com
RECEIVER SECTION
abc
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
(2)
PARAMETER
TEST CONDITIONS
IOH = –1 mA
IOL = 1.6 mA
VCC = 3.3 V
MIN
TYP
MAX UNIT
VOH
VOL
High-level output voltage
VCC – 0.6
VCC – 0.1
V
Low-level output voltage
0.4
2.4
2.4
V
1.5
1.8
VIT+
Positive-going input threshold voltage
V
VCC = 5 V
VCC = 3.3 V
0.6
0.8
1.2
VIT–
Negative-going input threshold voltage
V
VCC = 5 V
1.5
Vhys
IOZ
ri
Input hysteresis (VIT+ – VIT–
Output leakage current
Input resistance
)
0.3
V
EN = 1
±0.05
5
±10
7
μA
kΩ
VI = ±3 V to ±25 V
3
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(2)
PARAMETER
TEST CONDITIONS
TYP
UNIT
ns
tPLH Propagation delay time, low- to high-level output
tPHL Propagation delay time, high- to low-level output
CL = 150 pF, See Figure 3
300
300
200
200
300
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ, See Figure 4
CL = 150 pF, RL = 3 kΩ, See Figure 4
See Figure 3
ns
ten
Output enable time
Output disable time
ns
tdis
ns
tsk(p) Pulse skew(3)
ns
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
TYP UNIT
Human-Body Model (HBM)
±15
Receiver inputs (RINx)
IEC61000-4-2, Air-Gap Discharge
IEC61000-4-2, Contact Discharge
±15
±8
kV
6
Submit Documentation Feedback
Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3222E
MAX3222E
www.ti.com.......................................................................................................................................... SLLS708A –JANUARY 2006–REVISED SEPTEMBER 2009
PARAMETER MEASUREMENT INFORMATION
3 V
Input
1.5 V
1.5 V
RS-232
Output
0 V
Generator
(see Note B)
50 Ω
C
L
t
R
L
t
TLH
THL
(see Note A)
3 V
PWRDOWN
V
V
OH
3 V
−3 V
3 V
−3 V
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
THL
TLH
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
t
PLH
PHL
R
L
(see Note A)
V
V
OH
3 V
PWRDOWN
50%
50%
Output
OL
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
EN
0 V
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PLH
PHL
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
Copyright © 2006–2009, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): MAX3222E
MAX3222E
SLLS708A –JANUARY 2006–REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
3 V
0 V
V
CC
GND
Input
1.5 V
1.5 V
S1
R
L
t
t
PZH
PHZ
S1 at GND)
(S1 at GND)
3 V or 0 V
Output
V
OH
C
L
Output
50%
(see Note A)
EN
0.3 V
0.3 V
t
PLZ
Generator
(see Note B)
(S1 at V
)
CC
50 Ω
Output
50%
V
OL
t
PZL
(S1 at V )
CC
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 4. Receiver Enable and Disable Times
8
Submit Documentation Feedback
Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3222E
MAX3222E
www.ti.com.......................................................................................................................................... SLLS708A –JANUARY 2006–REVISED SEPTEMBER 2009
APPLICATION INFORMATION
1
20
EN
Powerdown
PWRDOWN
2
19
18
V
C1+
V+
CC
+
−
C
BYPASS
= 0.1 µF
+
−
3
4
5
6
7
GND
C1
+
−
†
C3
17
16
DOUT1
RIN1
C1−
C2+
C2−
V−
5 kW
+
−
C2
C4
15
14
13
12
11
ROUT1
NC
−
+
8
9
DOUT2
DIN1
DIN2
NC
RIN2
5 kW
10
ROUT2
†
C3 can be connected to V or GND.
CC
NOTES: A. Resistor values shown are nominal.
B. NC − No internal connection
C. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
V
CC
vs CAPACITOR VALUES
V
C1
C2, C3, and C4
0.1 µF
CC
0.1 µF
0.047 µF
0.1 µF
3.3 V " 0.3 V
5 V " 0.5 V
3 V to 5.5 V
0.33 µF
0.47 µF
Figure 5. Typical Operating Circuit and Capacitor Values
Copyright © 2006–2009, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s): MAX3222E
PACKAGE OPTION ADDENDUM
www.ti.com
16-Jun-2009
PACKAGING INFORMATION
Orderable Device
MAX3222ECDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3222ECDBG4
MAX3222ECDBR
MAX3222ECDBRG4
MAX3222ECDW
MAX3222ECDWG4
MAX3222ECDWR
MAX3222ECDWRG4
MAX3222ECPW
SSOP
SSOP
SSOP
SOIC
DB
DB
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
PW
PW
PW
PW
DB
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
SSOP
SOIC
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3222ECPWG4
MAX3222ECPWR
MAX3222ECPWRG4
MAX3222EIDB
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3222EIDBG4
MAX3222EIDBR
MAX3222EIDBRG4
MAX3222EIDW
DB
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
PW
PW
PW
PW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3222EIDWG4
MAX3222EIDWR
MAX3222EIDWRG4
MAX3222EIPW
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3222EIPWG4
MAX3222EIPWR
MAX3222EIPWRG4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Jun-2009
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Apr-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
MAX3222ECDBR
MAX3222ECDWR
MAX3222ECPWR
MAX3222EIDBR
MAX3222EIDWR
MAX3222EIPWR
SSOP
SOIC
DB
DW
PW
DB
20
20
20
20
20
20
2000
2000
2000
2000
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
16.4
24.4
16.4
16.4
24.4
16.4
8.2
10.8
6.95
8.2
7.5
13.0
7.1
2.5
2.7
1.6
2.5
2.7
1.6
12.0
12.0
8.0
16.0
24.0
16.0
16.0
24.0
16.0
Q1
Q1
Q1
Q1
Q1
Q1
TSSOP
SSOP
SOIC
7.5
12.0
12.0
8.0
DW
PW
10.8
6.95
13.0
7.1
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Apr-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
MAX3222ECDBR
MAX3222ECDWR
MAX3222ECPWR
MAX3222EIDBR
MAX3222EIDWR
MAX3222EIPWR
SSOP
SOIC
DB
DW
PW
DB
20
20
20
20
20
20
2000
2000
2000
2000
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
41.0
33.0
33.0
41.0
33.0
TSSOP
SSOP
SOIC
DW
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
Automotive
www.ti.com/automotive
www.ti.com/communications
Communications and
Telecom
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Consumer Electronics
Energy
www.ti.com/consumer-apps
www.ti.com/energy
Logic
Industrial
www.ti.com/industrial
Power Mgmt
Microcontrollers
RFID
power.ti.com
Medical
www.ti.com/medical
microcontroller.ti.com
www.ti-rfid.com
Security
www.ti.com/security
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
相关型号：
MAX3222ECTP
【15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers
MAXIM
MAX3222ECTP+
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers
MAXIM
MAX3222ECUP
【15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers
MAXIM
MAX3222ECUP+
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers
MAXIM
MAX3222ECUP+T
Line Transceiver, 2 Func, 2 Driver, 2 Rcvr, BICMOS, PDSO20, 4.40 MM, LEAD FREE, MO-153AC, TSSOP-20
MAXIM
MAX3222ECWN+
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers
MAXIM
©2020 ICPDF网 联系我们和版权申明