MAX3232IDBE4 [TI]
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/ RECEIVER WITH +-15-kV ESD PROTECTION; 3V至5.5V多通道RS - 232线路驱动器/接收器，具有±15 - kV ESD保护
| 型号： | MAX3232IDBE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/ RECEIVER WITH +-15-kV ESD PROTECTION |
| 文件： | 总18页 (文件大小：608K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀ ꢁꢂ ꢃ ꢄꢃ ꢄ
ꢃ ꢅꢆ ꢇ ꢈ ꢉ ꢊꢉ ꢅꢆ ꢀ ꢋꢌꢇ ꢍꢎꢏ ꢁꢐꢐꢑꢌ ꢒꢓ ꢅꢄꢃ ꢄ ꢌ ꢍꢐꢑ ꢔꢒꢍ ꢆꢑ ꢒꢕꢒꢑ ꢎꢑ ꢍ ꢆ ꢑꢒ
ꢖ ꢍꢇ ꢏ ꢗ ꢉ ꢅꢘ ꢆ ꢑꢓ ꢔ ꢙꢒꢈ ꢇꢑ ꢎ ꢇꢍ ꢈ ꢐ
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
D, DB, DW, OR PW PACKAGE
(TOP VIEW)
D
D
D
D
D
D
D
D
D
RS-232 Bus-Pin ESD Protection Exceeds
15 kV Using Human-Body Model (HBM)
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
C1+
V+
V
CC
15 GND
1
2
3
4
5
6
7
8
16
Operates With 3-V to 5.5-V V Supply
CC
14
13
12
11
10
9
C1−
C2+
C2−
V−
DOUT1
RIN1
Operates Up To 250 kbit/s
ROUT1
DIN1
Two Drivers and Two Receivers
Low Supply Current . . . 300 µA Typical
External Capacitors . . . 4 × 0.1 µF
DOUT2
RIN2
DIN2
ROUT2
Accepts 5-V Logic Input With 3.3-V Supply
Alternative High-Speed Pin-Compatible
Device (1 Mbit/s)
− SNx5C3232
D
Applications
− Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
description/ordering information
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
Tube of 40
MAX3232CD
SOIC (D)
MAX3232C
Reel of 2500
Tube of 40
MAX3232CDR
MAX3232CDW
MAX3232CDWR
MAX3232CDB
MAX3232CDBR
MAX3232CPW
MAX3232CPWR
MAX3232ID
SOIC (DW)
SSOP (DB)
TSSOP (PW)
SOIC (D)
MAX3232C
MA3232C
MA3232C
MAX3232I
MAX3232I
MB3232I
Reel of 2000
Tube of 80
−0°C to 70°C
Reel of 2000
Tube of 90
Reel of 2000
Tube of 40
Reel of 2500
Tube of 40
MAX3232IDR
MAX3232IDW
MAX3232IDWR
MAX3232IDB
MAX3232IDBR
MAX3232IPW
MAX3232IPWR
SOIC (DW)
SSOP (DB)
TSSOP (PW)
Reel of 2000
Tube of 80
−40°C to 85°C
Reel of 2000
Tube of 90
MB3232I
Reel of 2000
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃꢄ ꢃ ꢄ
ꢃꢅ ꢆ ꢇꢈ ꢉ ꢊ ꢉꢅꢆ ꢀ ꢋꢌꢇꢍ ꢎ ꢏꢁ ꢐꢐꢑ ꢌ ꢒꢓ ꢅꢄ ꢃ ꢄ ꢌ ꢍꢐꢑ ꢔꢒꢍ ꢆꢑ ꢒꢕꢒꢑ ꢎꢑꢍ ꢆꢑꢒ
ꢖꢍ ꢇ ꢏ ꢗ ꢉꢅ ꢘꢆ ꢑꢓ ꢔ ꢙ ꢒꢈ ꢇꢑ ꢎꢇꢍ ꢈꢐ
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
description/ordering information (continued)
The MAX3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with
15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication
controller and the serial-port connector. The charge pump and four small external capacitors allow operation
from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum
of 30-V/µs driver output slew rate.
Function Tables
EACH DRIVER
INPUT
DIN
OUTPUT
DOUT
L
H
L
H
H = high level, L = low
level
EACH RECEIVER
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
H = high level, L = low
level, Open
disconnected
=
input
or
connected driver off
logic diagram (positive logic)
11
10
12
9
14
7
DIN1
DIN2
DOUT1
DOUT2
RIN1
13
8
ROUT1
ROUT2
RIN2
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢃ ꢄ
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SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
CC
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, V : Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
I
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V
Output voltage range, V : Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V
O
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V
+ 0.3 V
CC
Package thermal impedance, θ (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 57°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 4)
MIN NOM
MAX
3.6
UNIT
V
V
V
V
= 3.3 V
= 5 V
3
4.5
2
3.3
5
CC
CC
CC
CC
Supply voltage
V
5.5
= 3.3 V
= 5 V
V
V
Driver high-level input voltage
DIN
V
V
IH
2.4
Driver low-level input voltage
Driver input voltage
DIN
DIN
0.8
5.5
25
70
85
IL
0
−25
0
V
I
V
Receiver input voltage
MAX3232C
MAX3232I
T
A
Operating free-air temperature
°C
−40
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.
CC
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
‡
PARAMETER
TEST CONDITIONS
No load, = 3.3 V or 5 V
MIN TYP
MAX
UNIT
I
Supply current
V
0.3
1
mA
CC
CC
‡
All typical values are at V
= 3.3 V or V = 5 V, and T = 25°C.
CC A
CC
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V
CC
= 5 V 0.5 V.
CC
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃꢄ ꢃ ꢄ
ꢃꢅ ꢆ ꢇꢈ ꢉ ꢊ ꢉꢅꢆ ꢀ ꢋꢌꢇꢍ ꢎ ꢏꢁ ꢐꢐꢑ ꢌ ꢒꢓ ꢅꢄ ꢃ ꢄ ꢌ ꢍꢐꢑ ꢔꢒꢍ ꢆꢑ ꢒꢕꢒꢑ ꢎꢑꢍ ꢆꢑꢒ
ꢖꢍ ꢇ ꢏ ꢗ ꢉꢅ ꢘꢆ ꢑꢓ ꢔ ꢙ ꢒꢈ ꢇꢑ ꢎꢇꢍ ꢈꢐ
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
†
PARAMETER
TEST CONDITIONS
DOUT at R = 3 kΩ to GND, DIN = GND
DIN = V
MIN TYP
MAX
UNIT
V
V
V
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
5
5.4
−5.4
0.01
0.01
OH
L
DOUT at R = 3 kΩ to GND,
−5
V
OL
L
CC
I
IH
V = V
I CC
1
µA
µA
I
IL
V at GND
I
1
V
CC
V
CC
V
CC
= 3.6 V,
V
O
V
O
V
O
= 0 V
‡
I
Short-circuit output current
Output resistance
35
60
mA
OS
= 5.5 V,
= 0 V
2 V
r
, V+, and V− = 0 V,
=
300
10M
W
o
†
‡
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
C
= 1000 pF,
R
L
= 3 kΩ,
See Figure 1
L
Maximum data rate
150
250
300
kbit/s
One DOUT switching,
R
= 3 kΩ to 7 kΩ,
L
§
t
Pulse skew
C
= 150 pF to 2500 pF
ns
sk(p)
L
L
See Figure 2
C
C
= 150 pF to 1000 pF
6
4
30
30
Slew rate, transition region
(see Figure 1)
R
V
= 3 kΩ to 7 kΩ,
= 3.3 V
L
L
SR(tr)
V/µs
= 150 pF to 2500 pF
CC
†
§
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
Pulse skew is defined as |t
− t
| of each channel of the same device.
PLH PHL
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.
CC
CC
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢃ ꢄ
ꢃ ꢅꢆ ꢇ ꢈ ꢉ ꢊꢉ ꢅꢆ ꢀ ꢋꢌꢇ ꢍꢎꢏ ꢁꢐꢐꢑ ꢌ ꢒꢓ ꢅꢄꢃ ꢄ ꢌ ꢍꢐꢑ ꢔꢒꢍ ꢆꢑ ꢒꢕꢒꢑ ꢎꢑ ꢍ ꢆ ꢑꢒ
ꢖ ꢍꢇ ꢏ ꢗ ꢉ ꢅꢘ ꢆ ꢑꢓ ꢔ ꢙꢒꢈ ꢇꢑ ꢎ ꢇꢍ ꢈ ꢐ
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
†
PARAMETER
High-level output voltage
Low-level output voltage
TEST CONDITIONS
= −1 mA
MIN
−0.6V
TYP
V −0.1 V
CC
MAX
UNIT
V
V
V
I
I
V
CC
OH
OH
= 1.6 mA
0.4
2.4
2.4
V
OL
OL
V
V
V
V
= 3.3 V
= 5 V
1.5
CC
CC
CC
CC
V
IT+
Positive-going input threshold voltage
Negative-going input threshold voltage
V
V
1.8
1.2
1.5
0.3
5
= 3.3 V
= 5 V
0.6
0.8
V
V
IT−
Input hysteresis (V
Input resistance
− V
)
V
hys
IT+
IT−
r
V = 3 V to 25 V
3
7
kW
i
I
†
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.
CC
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 3)
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
ns
t
t
t
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
300
300
300
PLH
PHL
sk(p)
C = 150 pF
L
ns
‡
Pulse skew
ns
†
‡
All typical values are at V
Pulse skew is defined as |t
= 3.3 V or V = 5 V, and T = 25°C.
CC A
CC
− t
| of each channel of the same device.
PLH PHL
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 5 V 0.5 V.
CC
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
C
THL
TLH
L
R
(see Note A)
L
V
OH
OL
3 V
−3 V
3 V
Output
TLH
−3 V
V
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
THL
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃꢄ ꢃ ꢄ
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ꢖꢍ ꢇ ꢏ ꢗ ꢉꢅ ꢘꢆ ꢑꢓ ꢔ ꢙ ꢒꢈ ꢇꢑ ꢎꢇꢍ ꢈꢐ
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
RS-232
Output
1.5 V
1.5 V
Input
Generator
(see Note B)
50 Ω
C
t
t
L
PHL
PLH
R
(see Note A)
L
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A.
C
includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PLH
PHL
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢃ ꢄ
ꢃ ꢅꢆ ꢇ ꢈ ꢉ ꢊꢉ ꢅꢆ ꢀ ꢋꢌꢇ ꢍꢎꢏ ꢁꢐꢐꢑ ꢌ ꢒꢓ ꢅꢄꢃ ꢄ ꢌ ꢍꢐꢑ ꢔꢒꢍ ꢆꢑ ꢒꢕꢒꢑ ꢎꢑ ꢍ ꢆ ꢑꢒ
ꢖ ꢍꢇ ꢏ ꢗ ꢉ ꢅꢘ ꢆ ꢑꢓ ꢔ ꢙꢒꢈ ꢇꢑ ꢎ ꢇꢍ ꢈ ꢐ
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
APPLICATION INFORMATION
1
2
3
4
16
V
C1+
V+
CC
+
−
C
BYPASS
= 0.1µF
+
−
15
14
GND
C1
+
†
C3
−
DOUT1
C1−
C2+
C2−
13
RIN1
+
−
5 kΩ
C2
5
6
7
12
11
ROUT1
DIN1
V−
−
+
C4
10
9
DOUT2
RIN2
DIN2
8
ROUT2
5 kΩ
†
C3 can be connected to V
or GND.
NOTES: A. Resistor values shown are nominal.
CC
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
V
CC
vs CAPACITOR VALUES
V
CC
C1
C2, C3, C4
3.3 V 0.3 V
5 V 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 4. Typical Operating Circuit and Capacitor Values
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
14-Aug-2009
PACKAGING INFORMATION
Orderable Device
MAX3232CD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232CDB
SSOP
SSOP
SSOP
SSOP
SSOP
SSOP
SOIC
DB
DB
DB
DB
DB
DB
D
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232CDBE4
MAX3232CDBG4
MAX3232CDBR
MAX3232CDBRE4
MAX3232CDBRG4
MAX3232CDE4
MAX3232CDG4
MAX3232CDR
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232CDRE4
MAX3232CDRG4
MAX3232CDW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
DW
DW
DW
PW
PW
PW
PW
PW
PW
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232CDWG4
MAX3232CDWR
MAX3232CDWRG4
MAX3232CPW
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232CPWE4
MAX3232CPWG4
MAX3232CPWR
MAX3232CPWRE4
MAX3232CPWRG4
MAX3232ID
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232IDB
SSOP
SSOP
DB
DB
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232IDBE4
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Aug-2009
Orderable Device
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
MAX3232IDBG4
MAX3232IDBR
MAX3232IDBRE4
MAX3232IDBRG4
MAX3232IDE4
SSOP
DB
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
SSOP
SSOP
SOIC
DB
DB
DB
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232IDG4
MAX3232IDR
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232IDRE4
MAX3232IDRG4
MAX3232IDW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
DW
DW
DW
DW
DW
PW
PW
PW
PW
PW
PW
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232IDWE4
MAX3232IDWG4
MAX3232IDWR
MAX3232IDWRE4
MAX3232IDWRG4
MAX3232IPW
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3232IPWE4
MAX3232IPWG4
MAX3232IPWR
MAX3232IPWRE4
MAX3232IPWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
14-Aug-2009
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MAX3232 :
Enhanced Product: MAX3232-EP
•
NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Aug-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
MAX3232CDBR
MAX3232CDR
MAX3232CDWR
MAX3232CPWR
MAX3232IDBR
MAX3232IDR
SSOP
SOIC
DB
D
16
16
16
16
16
16
16
16
2000
2500
2000
2000
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
12.4
16.4
16.4
16.4
12.4
8.2
6.5
6.6
2.5
2.1
2.7
1.6
2.5
2.1
2.7
1.6
12.0
8.0
16.0
16.0
16.0
12.0
16.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
10.3
SOIC
DW
PW
DB
D
10.75 10.7
12.0
8.0
TSSOP
SSOP
SOIC
7.0
8.2
6.5
5.6
6.6
12.0
8.0
10.3
MAX3232IDWR
MAX3232IPWR
SOIC
DW
PW
10.75 10.7
7.0 5.6
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Aug-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
MAX3232CDBR
MAX3232CDR
MAX3232CDWR
MAX3232CPWR
MAX3232IDBR
MAX3232IDR
SSOP
SOIC
DB
D
16
16
16
16
16
16
16
16
2000
2500
2000
2000
2000
2500
2000
2000
346.0
333.2
346.0
346.0
346.0
333.2
346.0
346.0
346.0
345.9
346.0
346.0
346.0
345.9
346.0
346.0
33.0
28.6
33.0
29.0
33.0
28.6
33.0
29.0
SOIC
DW
PW
DB
D
TSSOP
SSOP
SOIC
MAX3232IDWR
MAX3232IPWR
SOIC
DW
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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