MAX3232MDBREP [TI]

具有 +/-15kV ESD 保护的增强性产品 3V 至 5.5V 250kbps RS-232 线路驱动器/接收器 | DB | 16 | -55 to 125;
MAX3232MDBREP
型号: MAX3232MDBREP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有 +/-15kV ESD 保护的增强性产品 3V 至 5.5V 250kbps RS-232 线路驱动器/接收器 | DB | 16 | -55 to 125

驱动 线路驱动器或接收器 驱动程序和接口
文件: 总14页 (文件大小:533K)
中文:  中文翻译
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MAX3232-EP  
www.ti.com......................................................................................................................................................... SGLS337AAPRIL 2006REVISED MARCH 2009  
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER  
WITH ±15-kV ESD PROTECTION  
1
FEATURES  
APPLICATIONS  
Battery-Powered Systems, PDAs, Notebooks,  
Laptops, Palmtop PCs, and Hand-Held  
Equipment  
RS-232 Bus-Pin ESD Protection Exceeds  
±15 kV Using Human-Body Model (HBM)  
Meets or Exceeds the Requirements of  
TIA/EIA-232-F and ITU v.28 Standards  
DB OR PW PACKAGE  
(TOP VIEW)  
Operates With 3-V to 5.5-V VCC Supply  
Operates Up To 250 kbit/s  
C1+  
V+  
VCC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
Two Drivers and Two Receivers  
GND  
Low Supply Current . . . 300 µA Typical  
External Capacitors . . . 4 × 0.1 µF  
Accepts 5-V Logic Input With 3.3-V Supply  
C1−  
DOUT1  
RIN1  
C2+  
C2−  
ROUT1  
DIN1  
V−  
Alternative High-Speed Pin-Compatible Device  
(1 Mbit/s)  
DOUT2  
RIN2  
DIN2  
ROUT2  
SNx5C3232  
SUPPORTS DEFENSE, AEROSPACE,  
AND MEDICAL APPLICATIONS  
Controlled Baseline  
One Assembly/Test Site  
One Fabrication Site  
Available in Military (–55°C/125°C)  
Temperature Range(1)  
Extended Product Life Cycle  
Extended Product-Change Notification  
Product Traceability  
(1) Additional temperature ranges are available - contact factory  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
Reel of 2000  
Reel of 2000  
ORDERABLE PART NUMBER  
MAX3232MDBREP  
TOP-SIDE MARKING  
SSOP (DB)  
–55°C to 125°C  
MB3232M  
TSSOP(PW)  
MAX3232MPWREP  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
DESCRIPTION  
The MAX3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV  
ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of  
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the  
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to  
5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver  
output slew rate.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006–2009, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
MAX3232-EP  
SGLS337AAPRIL 2006REVISED MARCH 2009......................................................................................................................................................... www.ti.com  
FUNCTION TABLE  
EACH DRIVER  
OUTPUT DOUT  
EACH RECEIVER  
INPUT DIN  
INPUT RIN  
OUTPUT ROUT  
L
H
L
L
H
H
L
H
Open  
H
H = high level, L = low level, Open = input disconnected or connected driver off  
LOGIC DIAGRAM (POSITIVE LOGIC)  
11  
10  
12  
9
14  
7
DIN1  
DOUT1  
DOUT2  
RIN1  
DIN2  
ROUT1  
ROUT2  
13  
8
RIN2  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature range (unless otherwise noted)  
VALUE  
–0.3 to 6  
–0.3 to 7  
0.3 to –7  
13  
UNIT  
V
VCC  
Supply voltage range(1)  
V+  
Positive output supply voltage range(1)  
Negative output supply voltage range(1)  
Supply voltage difference(1)  
Input voltage range  
V
V–  
V
V+ – V–  
V
Drivers  
–0.3 to 6  
–25 to 25  
–13.2 to 13.2  
–0.3 to VCC + 0.3  
82  
V
VI  
Receivers  
Drivers  
V
Output voltage range  
V
VO  
Receivers  
V
θJA  
Package thermal impedance(2)  
DB package  
PW package  
°C/W  
°C/W  
°C  
°C  
108  
TJ  
Operating virtual junction temperature  
Storage temperature range  
150  
Tstg  
–65 to 150  
(1) All voltages are with respect to network GND.  
(2) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient  
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.  
RECOMMENDED OPERATING CONDITIONS (see (1)and Figure 4)  
MIN  
3
NOM  
3.3  
5
MAX UNIT  
VCC = 3.3 V  
VCC = 5 V  
VCC = 3.3 V  
VCC = 5 V  
3.6  
V
Supply voltage  
4.5  
2
5.5  
VIH  
VIL  
Driver high-level input voltage  
Driver low-level input voltage  
DIN  
DIN  
V
2.4  
0.8  
V
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ±0.5 V.  
Submit Documentation Feedback  
2
Copyright © 2006–2009, Texas Instruments Incorporated  
Product Folder Link(s): MAX3232-EP  
MAX3232-EP  
www.ti.com......................................................................................................................................................... SGLS337AAPRIL 2006REVISED MARCH 2009  
RECOMMENDED OPERATING CONDITIONS (see and Figure 4) (continued)  
MIN  
NOM  
MAX UNIT  
Driver input voltage  
DIN  
0
5.5  
V
VI  
Receiver input voltage  
Operating free-air temperature  
–25  
-55  
25  
TA  
MAX3232M  
125  
°C  
ELECTRICAL CHARACTERISTICS  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see (1)and  
Figure 4)  
PARAMETER  
Supply current  
TEST CONDITIONS  
No load, VCC = 3.3 V or 5 V  
MIN TYP(2)  
MAX UNIT  
mA  
ICC  
0.3  
2
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ±0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
Copyright © 2006–2009, Texas Instruments Incorporated  
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3
Product Folder Link(s): MAX3232-EP  
MAX3232-EP  
SGLS337AAPRIL 2006REVISED MARCH 2009......................................................................................................................................................... www.ti.com  
DRIVER SECTION  
ELECTRICAL CHARACTERISTICS  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see (1)and  
Figure 4)  
PARAMETER  
High-level output voltage  
Low-level output voltage  
High-level input current  
Low-level input current  
TEST CONDITIONS  
DOUT at RL = 3 kto GND, DIN = GND  
DOUT at RL = 3 kto GND, DIN = VCC  
VI = VCC  
MIN TYP(2)  
MAX UNIT  
VOH  
VOL  
IIH  
5
5.4  
–5.4  
V
V
–5  
±0.01  
±0.01  
±1  
±1  
µA  
µA  
IIL  
VI at GND  
VCC = 3.6 V,  
VO = 0 V  
VO = 0 V  
VO = ±2 V  
(3)  
IOS  
ro  
Short-circuit output current  
Output resistance  
±35  
±60  
mA  
VCC = 5.5 V,  
VCC, V+, and V– = 0 V,  
300  
10M  
Ω
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ±0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one  
output should be shorted at a time.  
SWITCHING CHARACTERISTICS  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see (1)and  
Figure 4)  
PARAMETER  
TEST CONDITIONS  
MIN TYP(2)  
MAX UNIT  
CL = 1000 pF,  
One DOUT switching,  
RL = 3 k,  
See Figure 1  
Maximum data rate  
150  
250  
300  
kbit/s  
RL = 3 kto 7 k,  
See Figure 2  
tsk(p)  
Pulse skew(1)  
CL = 150 pF to 2500 pF  
ns  
CL = 150 pF to 1000 pF  
CL = 150 pF to 2500 pF  
6
4
30  
Slew rate, transition region (see RL = 3 kto 7 k,  
Figure 1) VCC = 3.3 V  
SR(tr)  
V/µs  
30  
(1) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one  
output should be shorted at a time.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.  
4
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Copyright © 2006–2009, Texas Instruments Incorporated  
Product Folder Link(s): MAX3232-EP  
MAX3232-EP  
www.ti.com......................................................................................................................................................... SGLS337AAPRIL 2006REVISED MARCH 2009  
RECEIVER SECTION  
ELECTRICAL CHARACTERISTICS  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted (see (1)and Figure 4)  
PARAMETER  
High-level output voltage  
Low-level output voltage  
TEST CONDITIONS  
IOH = -1 mA  
MIN  
TYP(2)  
MAX  
UNIT  
V
VOH  
VOL  
VCC–0.6  
VCC–0.1  
IOL = 1.6 mA  
VCC = 3.3 V  
VCC = 5 V  
0.4  
2.4  
2.4  
V
1.5  
1.8  
1.2  
1.5  
0.3  
5
VIT+  
Positive-going input threshold voltage  
Negative-going input threshold voltage  
V
V
VCC = 3.3 V  
VCC = 5 V  
0.6  
0.8  
VIT–  
Vhys  
ri  
Input hysteresis (VIT+ – VIT–  
)
V
Input resistance  
VI = ±3 V to ±25 V  
3
8
kΩ  
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ±0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C.  
SWITCHING CHARACTERISTICS  
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted (see (1)and Figure 3)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP(2)  
300  
MAX  
UNIT  
ns  
tPLH  
tPHL  
tsk(p)  
Propagation delay time, low- to high-level output  
Propagation delay time, high- to low-level output  
Pulse skew(3)  
CL = 150 pF  
300  
ns  
300  
ns  
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ±0.5 V.  
(2) All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C.  
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.  
PARMETER MEASUREMENT INFORMATION  
3 V  
0 V  
Input  
1.5 V  
1.5 V  
RS-232  
Output  
Generator  
(see Note B)  
50  
t
t
C
L
THL  
TLH  
R
L
(see Note A)  
V
V
OH  
3 V  
−3 V  
3 V  
Output  
TLH  
−3 V  
OL  
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
6 V  
or t  
SR(tr) +  
t
THL  
Figure 1. Driver Slew Rate  
3 V  
0 V  
RS-232  
Input  
1.5 V  
1.5 V  
Output  
Generator  
(see Note B)  
50  
C
L
t
t
PLH  
PHL  
R
L
(see Note A)  
V
V
OH  
50%  
50%  
Output  
OL  
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
A. CL includes probe and jig capacitance.  
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.  
Figure 2. Driver Pulse Skew  
Copyright © 2006–2009, Texas Instruments Incorporated  
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5
Product Folder Link(s): MAX3232-EP  
MAX3232-EP  
SGLS337AAPRIL 2006REVISED MARCH 2009......................................................................................................................................................... www.ti.com  
PARMETER MEASUREMENT INFORMATION (continued)  
3 V  
Input  
1.5 V  
1.5 V  
−3 V  
Output  
Generator  
(see Note B)  
50  
t
t
PLH  
PHL  
C
L
(see Note A)  
V
V
OH  
50%  
50%  
Output  
OL  
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
A. CL includes probe and jig capacitance.  
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.  
Figure 3. Receiver Propagation Delay Times  
6
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Copyright © 2006–2009, Texas Instruments Incorporated  
Product Folder Link(s): MAX3232-EP  
MAX3232-EP  
www.ti.com......................................................................................................................................................... SGLS337AAPRIL 2006REVISED MARCH 2009  
APPLICATION INFORMATION  
1
2
3
4
16  
V
CC  
C1+  
V+  
+
C
BYPASS  
= 0.1µF  
+
15  
14  
GND  
C1  
+
A
C3  
DOUT1  
C1−  
C2+  
C2−  
13  
RIN1  
+
5 kΩ  
C2  
5
6
12  
11  
ROUT1  
DIN1  
V−  
+
C4  
7
8
10  
9
DOUT2  
RIN2  
DIN2  
ROUT2  
5 kΩ  
V
CC  
vs CAPACITOR VALUES  
V
CC  
C1  
C2, C3, C4  
3.3 V ± 0.3 V  
5 V ± 0.5 V  
3 V to 5.5 V  
0.1 µF  
0.047 µF  
0.1 µF  
0.1 µF  
0.33 µF  
0.47 µF  
A. C3 can be connected to VCC or GND.  
B. Resistor values shown are nominal.  
C. Nonpolarized ceramic capacitros are acceptable. If polarized tantalum or electrolytic capacitors are used, they should  
be connected as shown.  
Figure 4. Typical Operating Circuit and Capacitor Values  
Copyright © 2006–2009, Texas Instruments Incorporated  
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Product Folder Link(s): MAX3232-EP  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Mar-2009  
PACKAGING INFORMATION  
Orderable Device  
MAX3232MDBREP  
MAX3232MPWREP  
V62/06623-01XE  
V62/06623-01YE  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SSOP  
DB  
16  
16  
16  
16  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
SSOP  
PW  
DB  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
PW  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF MAX3232-EP :  
Catalog: MAX3232  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
MAX3232MDBREP  
MAX3232MPWREP  
SSOP  
DB  
16  
16  
2000  
2000  
330.0  
330.0  
16.4  
12.4  
8.2  
6.9  
6.6  
5.6  
2.5  
1.6  
12.0  
8.0  
16.0  
12.0  
Q1  
Q1  
TSSOP  
PW  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
MAX3232MDBREP  
MAX3232MPWREP  
SSOP  
DB  
16  
16  
2000  
2000  
367.0  
367.0  
367.0  
367.0  
38.0  
35.0  
TSSOP  
PW  
Pack Materials-Page 2  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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