MAX3318ECDB [TI]
2.5-V 460-kbps RS-232 TRANSCEIVER WITH 【15-kV ESD PROTECTION; 2.5 V 460 - kbps的RS - 232 【 15 kV ESD保护收发器型号: | MAX3318ECDB |
厂家: | TEXAS INSTRUMENTS |
描述: | 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 【15-kV ESD PROTECTION |
文件: | 总18页 (文件大小:167K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MAX3318E
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS741–JUNE 2006
FEATURES
DB OR PW PACKAGE
(TOP VIEW)
•
ESD Protection for RS-232 I/O Pins
– ±15 kV (Human-Body Model)
READY
C1+
1
2
3
4
5
6
7
8
9
10
20 FORCEOFF
– ±8 kV (IEC 61000-4-2, Contact Discharge)
– ±15 kV (IEC 61000-4-2, Air-Gap Discharge)
300-µA Operating Supply Current
19
18
17
16
15
14
13
12
11
V
GND
CC
V+
•
•
C1−
C2+
DOUT1
RIN1
1-µA Low-Power Standby (With Receivers
Active) Mode
C2−
ROUT1
FORCEON
DIN1
V−
•
•
•
Designed to Transmit at a Data Rate of
460 kbps
DOUT2
RIN2
ROUT2
DIN2
INVALID
Auto-Power-Down Plus Option Features
Flexible Power-Saving Mode
Operates From a Single 2.25-V to 3-V VCC
Supply
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Cellular Phones
Notebooks
Hand-Held Equipment
Pagers
DESCRIPTION/ORDERING INFORMATION
The MAX3318E is
a dual-driver, dual-receiver, RS-232-compatible transceiver. The device features
auto-power-down plus and enhanced electrostatic discharge (ESD) protection integrated into the chip. Driver
output and receiver input are protected to ±15 kV using the IEC 61000-4-2 Air-Gap Discharge method, ±8 kV
using the IEC 61000-4-2 Contact Discharge method, and ±15 kV using the Human-Body Model (HBM).
The device operates at a data rate of 460 kbps. The transceiver has a proprietary low-dropout driver output
stage, enabling RS-232-compatible operation from a 2.25-V to 3-V supply with a dual charge pump. The charge
pump requires only four 0.1-µF capacitors and features a logic-level output (READY) that asserts when the
charge pump is regulating and the device is ready to begin transmitting.
The MAX3318E achieves a 1-µA supply current using the auto-power-down feature. This device automatically
enters a low-power power-down mode when the RS-232 cable is disconnected or the drivers of the connected
peripherals are inactive for more than 30 s. The device turns on again when it senses a valid transition at any
driver or receiver input. Auto power down saves power without changes to the existing BIOS or operating
system.
This device is available in two space-saving packages: 20-pin SSOP and 20-pin TSSOP.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
MAX3318E
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS741–JUNE 2006
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
Tube of 70
MAX3318ECDB
MAX3318ECDBR
MAX3318ECPW
MAX3318ECPWR
MAX3318EIDB
SSOP – DB
TSSOP – PW
SSOP – DB
TSSOP – PW
MP318EC
Reel of 2000
Tube of 70
–0°C to 70°C
MP318EC
MP318EI
MP318EI
Reel of 2000
Tube of 70
Reel of 2000
Tube of 70
MAX3318EIDBR
MAX3318EIPW
MAX3318EIPWR
–40°C to 85°C
Reel of 2000
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
ABC
DETAILED DESCRIPTION
Flexible control options for power management are featured when the serial port and driver inputs are inactive.
The auto-power-down plus feature functions when FORCEON is low and FORCEOFF is high. During this mode
of operation, if the device does not sense valid signal transitions on all receiver and driver inputs for
approximately 30 s, the built-in charge pump and drivers are powered down, reducing the supply current to
1 µA. By disconnecting the serial port or placing the peripheral drivers off, auto-power-down plus can be
disabled when FORCEON and FORCEOFF are high. With auto-power-down plus enabled, the device activates
automatically when a valid signal is applied to any receiver or driver input. INVALID is high (valid data) if any
receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less
than 30 µs (typical number). INVALID is low (invalid data) if all receiver input voltage are between –0.3 V and
0.3 V for more than 30 µs (typical number).
2
Submit Documentation Feedback
MAX3318E
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS741–JUNE 2006
FUNCTION TABLE(1)
INPUT CONDITIONS
OUTPUT STATES
VALID
RS-232
LEVEL
RECEIVER
OR DRIVER
EDGE
WITHIN 30 s
OPERATING
MODE
FORCEON
FORCEOFF
DRIVER
RECEIVER
INVALID
READY
PRESENT AT
RECEIVER
Auto-Power-Down Plus Conditions
Normal operation,
auto-power-down
plus disabled
H
H
L
L
L
L
H
H
H
H
H
H
No
No
No
Yes
No
Active
Active
Active
Active
Z
Active
Active
Active
Active
Active
Active
L
H
L
H
H
H
H
L
Normal operation,
auto-power-down
plus disabled
Normal operation,
auto-power-down
plus enabled
Yes
Yes
No
Normal operation,
auto-power-down
plus enabled
Yes
No
H
L
Power down,
auto-power-down
plus enabled
Power down,
auto-power-down
plus enabled
No
Yes
Z
H
L
Manual power
down
X
X
L
L
X
X
No
Z
Z
Active
Active
L
L
L
Manual power
down
Yes
H
Auto-Power-Down Conditions
Power down,
auto power down
enabled
INVALID
INVALID
INVALID
INVALID
X
X
No
Z
Active
Active
L
L
Normal operation,
auto power down
enabled
Yes
Active
H
H
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
3
Submit Documentation Feedback
MAX3318E
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS741–JUNE 2006
LOGIC DIAGRAM (POSITIVE LOGIC)
13
17
8
DIN1
DIN2
DOUT1
DOUT2
12
20
14
11
1
FORCEOFF
FORCEON
INVALID
READY
Auto-Power-Down Plus
15
10
16
ROUT1
ROUT2
RIN1
RIN2
5 k
Ω
9
5 k
Ω
4
Submit Documentation Feedback
MAX3318E
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS741–JUNE 2006
TERMINAL FUNCTIONS
TERMINAL
NAME
DESCRIPTION
NO.
C1+
C1–
C2+
C2–
DIN
2
4
Positive voltage-doubler charge-pump capacitor
Negative voltage-doubler charge-pump capacitor
Positive inverting charge-pump capacitor
Negative inverting charge-pump capacitor
CMOS driver inputs
5
6
12, 13
8, 17
DOUT
RS-232 driver outputs
Force-off input, active low. Drive low to power down transmitters, receivers, and charge pump. This overrides
auto power down and FORCEON (see Function Table).
FORCEOFF
20
Force-on input, active high. Drive high to override auto power down, keeping transmitters and receivers on
(FORCEOFF must be high) (see Function Table).
FORCEON
GND
14
18
11
Ground
Valid signal detector output, active low. A logic high indicates that a valid RS-232 level is present on a receiver
input.
INVALID
Ready to transmit output, active high. READY is enabled high when V– goes below –3.5 V and the device is
ready to transmit.
READY
1
RIN
ROUT
V+
9, 16
10, 15
3
RS-232 receiver inputs
CMOS receiver outputs
2 × VCC generated by the charge pump
–2 × VCC generated by the charge pump
2.25-V to 3-V single-supply voltage
V–
7
VCC
19
5
Submit Documentation Feedback
MAX3318E
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS741–JUNE 2006
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
–7
MAX UNIT
VCC to GND
V+ to GND(2)
V– to GND(2)
V+ + IV-I(2)
6
V
V
V
V
7
0.3
13
DIN, FORCEON, FORCEOFF to GND
–0.3
–0.3
6
Input voltage
V
V
RIN to GND
±25
DOUT to GND
±13.2
VCC + 0.3
Continuous
571
Output voltage
ROUT, INVALID, READY to GND
DOUT to GND
Short-circuit duration
16-pin SSOP (derate 7.14 mW/°C above 70°C)
20-pin SSOP (derate 8 mW/°C above 70°C
20-pin TSSOP (derate 7 mW/°C above 70°C)
Continuous power dissipation (TA = 70°C)
640 mW
559
Storage temperature range
–65
150
300
°C
°C
Lead temperature (soldering, 10 s)
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) V+ and V– can have maximum magnitudes of 7 V, but their absolute difference cannot exceed 13 V.
Recommended Operating Conditions
See Figure 4
MIN NOM
MAX UNIT
Supply voltage
2.25
2.5
3
V
DIN, FORCEOFF,
FORCEON
VIH Driver and control high-level input voltage
VCC = 2.5 V to 3 V
VCC = 2.5 V to 3 V
0.7 × VCC
5.5
V
DIN, FORCEOFF,
FORCEON
VIL Driver and control low-level input voltage
0
0.3 × VCC
V
V
VI
Receiver input voltage
–25
0
25
70
85
MAX3318EC
MAX3318EI
TA Operating free-air temperature
°C
–40
6
Submit Documentation Feedback
MAX3318E
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS741–JUNE 2006
Supply Current Section Electrical Characteristics
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF, TA = TMIN to TMAX (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP(1) MAX UNIT
DC Characteristics (VCC = 2.5 V, TA = 25°C)
Auto-power-down plus supply current FORCEON = GND, FORCEOFF = VCC, All RIN and DIN idle
1
1
10
10
2
µA
µA
Auto-power-down supply current
Supply current
FORCEOFF = GND
FORCEON = FORCEOFF = VCC, No load
0.3
mA
(1) Typical values are at VCC = 2.5 V, TA = 25°C.
ESD Protection
PARAMETER
TEST CONDITIONS
TYP UNIT
HBM
±15
RIN, DOUT
IEC 61000-4-2 Air-Gap Discharge method
IEC 61000-4-2 Contact Discharge method
±15
±8
kV
7
Submit Documentation Feedback
MAX3318E
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS741–JUNE 2006
Driver Section Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
Driver input hysteresis
TEST CONDITIONS
MIN TYP(1)
0.3
MAX UNIT
V
Input leakage current
Output voltage swing
Output resistance
FORCEON, DIN, FORCEOFF
±0.01
±1
µA
V
All driver outputs loaded with 3 kΩ to ground
VCC = 0, Driver output = ±2 V
±3.7
±4
10M
±25
300
Ω
Output short-circuit current(2)
±60
±25
mA
µA
Output leakage current
VCC = 0 or 2.25 V to 3 V, VOUT = ±12 V, Drivers disabled
(1) Typical values are at VCC = 2.5 V, TA = 25°C.
(2) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Driver Section Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 1)
PARAMETER
Maximum data rate
Driver skew(2)
TEST CONDITIONS
MIN TYP(1)
MAX UNIT
RL = 3 kΩ, CL = 1000 pF, One transmitter switching
460
100
kbps
ns
|tPHL – tPLH
|
VCC = 2.5 V, TA = 25°C, RL = 3 kΩ to 7 kΩ,
Measured from 3 V to –3 V or –3 V to 3 V,
CL = 150 pF to 2500 pF
Transition-region slew rate
4
30 V/µs
(1) Typical values are at VCC = 2.5 V, TA = 25°C.
(2) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
8
Submit Documentation Feedback
MAX3318E
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS741–JUNE 2006
Receiver Section Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
Input voltage range
TEST CONDITIONS
MIN TYP(1)
MAX UNIT
–25
25
V
V
Input threshold low
Input threshold high
Input hysteresis
TA = 25°C
TA = 25°C
0.3 × VCC
0.7 × VCC
V
0.3
5
V
Input resistance
TA = 25°C
3
7
±10
kΩ
µA
V
Output leakage current
Output voltage low
Output voltage high
±0.05
IOUT = 0.5 mA
IOUT = –0.5 mA
0.1 × VCC
0.9 × VCC
V
(1) Typical values are at VCC = 2.5 V, TA = 25°C.
Receiver Section Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
Receiver propagation delay
Receiver skew(2)
TEST CONDITIONS
TYP(1) UNIT
tPHL
0.175
µs
RIN to ROUT, CL = 150 pF
tPLH
0.175
|tPHL – tPLH
|
50
ns
(1) Typical values are at VCC = 2.5 V, TA = 25°C.
(2) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
9
Submit Documentation Feedback
MAX3318E
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS741–JUNE 2006
Auto-Power-Down Plus Section Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
Positive threshold
MIN
MAX UNIT
2.7
V
Receiver input threshold to INVALID high
Negative threshold
–2.7
–0.3
Receiver input threshold INVALID low
INVALID, READY voltage low
INVALID, READY voltage high
0.3
V
V
V
IOUT = 0.5 mA
IOUT = –0.5 mA
0.1 × VCC
0.8 × VCC
Auto-Power-Down Plus Section Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 µF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN TYP(1)
MAX UNIT
tINVH
Receiver positive or negative threshold to INVALID high VCC = 2.5 V
1
30
µs
µs
µs
tINVL
Receiver positive or negative threshold to INVALID low
Receiver or driver edge to driver enabled
VCC = 2.5 V
VCC = 2.5 V
VCC = 2.5 V
tWU
100
tAUTOPRDN
Receiver or driver edge to driver shutdown
15
30
60
s
(1) Typical values are at VCC = 2.5 V, TA = 25°C.
10
Submit Documentation Feedback
MAX3318E
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS741–JUNE 2006
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
t
TLH
THL
R
L
(see Note A)
V
V
OH
3 V
−3 V
3 V
FORCEOFF
3 V
−3 V
Output
OL
6 V
tTHL or tTLH
SR(tr) +
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
2.25 V
0 V
Input
1.125 V
1.125 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
t
PLH
PHL
R
L
(see Note A)
V
V
OH
3 V
FORCEOFF
50%
50%
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
3 V
Input
0 V
0 V
−3 V
Output
Generator
(see Note B)
t
t
PLH
PHL
50 Ω
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
11
Submit Documentation Feedback
MAX3318E
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS741–JUNE 2006
PARAMETER MEASUREMENT INFORMATION
Invalid
Region
Receiver
Inputs
}
Driver
Inputs
Driver
Outputs
V
CC
INVALID
Output
t
INVL
t
INVH
0
t
t
WU
WU
V
CC
Ready
Output
0
V+
V
CC
0
V−
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
Indeterminate
ROUT
2.7 V
0.3 V
Generator
(see Note B)
50 Ω
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low
0 V
†
−0.3 V
Indeterminate
Auto-Power-
Down Plus
INVALID
−2.7 V
C = 30 pF
L
(see Note A)
Valid RS-232 Level, INVALID High
†
Auto power down disables drivers and reduces supply
current to 1 µA.
FORCEON
FORCEOFF
DIN
DOUT
TEST CIRCUIT
Figure 4. INVALID Propagation Delay Times and Supply Enabling Time
12
Submit Documentation Feedback
MAX3318E
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS741–JUNE 2006
PARAMETER MEASUREMENT INFORMATION
2.5 V
+
+
19
0.1 mF
C
BYPASS
V
CC
3
7
2
C1+
V+
V−
+
C3
0.1 mF
C1
0.1 mF
4
5
6
C1−
C2+
+
C4
0.1 mF
C2
0.1 mF
+
C2−
13
12
15
DOUT1
DOUT2
RIN1
17
8
DIN1
RS-232-Compatible
Outputs
DIN2
RS-232-Compatible
Inputs
16
9
ROUT1
5k
10
1
ROUT2
RIN2
5k
READY
To Power-Management Unit
Auto-Power-
Down Plus
INVALID
11
20
V
CC
14
FORCEOFF
GND
FORCEON
18
Figure 5. Typical Application Circuit
13
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
MAX3318ECDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3318ECDBG4
MAX3318ECDBR
MAX3318ECDBRG4
MAX3318ECPW
SSOP
SSOP
DB
DB
DB
PW
PW
PW
PW
DB
DB
DB
DB
PW
PW
PW
PW
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3318ECPWG4
MAX3318ECPWR
MAX3318ECPWRG4
MAX3318EIDB
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3318EIDBG4
MAX3318EIDBR
MAX3318EIDBRG4
MAX3318EIPW
SSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3318EIPWG4
MAX3318EIPWR
MAX3318EIPWRG4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
Digital Control
Military
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
Logic
interface.ti.com
logic.ti.com
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
Low Power Wireless www.ti.com/lpw
Telephony
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2006, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明