MAX3386ECDW [TI]
RS-232 TRANSCEIVER WITH SPLIT SUPPLY PIN FOR LOGIC SIDE; RS - 232收发器,带有SPLIT电源引脚逻辑端型号: | MAX3386ECDW |
厂家: | TEXAS INSTRUMENTS |
描述: | RS-232 TRANSCEIVER WITH SPLIT SUPPLY PIN FOR LOGIC SIDE |
文件: | 总14页 (文件大小:217K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MAX3386E
RS-232 TRANSCEIVER
WITH SPLIT SUPPLY PIN FOR LOGIC SIDE
www.ti.com
SLLS659–MAY 2006
FEATURES
TSSOP OR SSOP PACKAGE
TOP VIEW
•
VL Pin for Compatibility With Mixed-Voltage
Systems Down to 1.8 V on Logic Side
C1+ 1
V+ 2
20
19
•
Enhanced ESD Protection on RIN Inputs and
DOUT Outputs
PWRDOWN
V
CC
– ±15-kV Human-Body Model
C1− 3
18 GND
– ±15-kV IEC 61000-4-2, Air-Gap Discharge
– ±8-kV IEC 61000-4-2, Contact Discharge
Low 300-µA Supply Current
C2+ 4
17 DOUT1
C2− 5
16
15
14
13
12
DOUT2
DOUT3
RIN1
•
•
•
•
V− 6
Specified 250-kbps Data Rate
DIN1 7
DIN2 8
DIN3 9
ROUT2 10
1-µA Low-Power Shutdown
RIN2
Meets EIA/TIA-232 Specifications Down
to 3 V
V
L
11 ROUT1
APPLICATIONS
•
•
•
•
•
Hand-Held Equipment
PDAs
Cell Phones
Battery-Powered Equipment
Data Cables
DESCRIPTION/ORDERING INFORMATION
The MAX3386E is a three-driver and two-receiver RS-232 interface device, with split supply pins for
mixed-signal operations. All RS-232 inputs and outputs are protected to ±15 kV using the IEC 61000-4-2
Air-Gap Discharge method, ±8 kV using the IEC 61000-4-2 Contact Discharge method, and ±15 kV using the
Human-Body Model.
The charge pump requires only four small 0.1-µF capacitors for operation from a 3.3-V supply. The MAX3386E
is capable of running at data rates up to 250 kbps, while maintaining RS-232-compliant output levels.
The MAX3386E has a unique VL pin that allows operation in mixed-logic voltage systems. Both driver in (DIN)
and receiver out (ROUT) logic levels are pin programmable through the VL pin. The MAX3386E is available in a
space-saving thin shrink small-outline package (TSSOP).
ORDERING INFORMATION
TA
0°C to 70°C
PACKAGE(1)
TSSOP
ORDERABLE PART NUMBER
MAX3386ECPWR
TOP-SIDE MARKING
MP386EC
SSOP
TSSOP
SSOP
MAX3386ECDBR
MAX3386EIPWR
MAX3386EIDBR
MAX3386EC
MP386EI
–40°C to 85°C
MAX3386EI
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
TRUTH TABLE (SHUTDOWN FUNCTION)
DRIVER
OUTPUTS
PWRDWN
RECEIVER OUTPUTS
CHARGE PUMP
L
High-Z
High-Z
Active
Inactive
Active
H
Active
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
MAX3386E
RS-232 TRANSCEIVER
WITH SPLIT SUPPLY PIN FOR LOGIC SIDE
www.ti.com
SLLS659–MAY 2006
FUNCTIONAL BLOCK DIAGRAM
7
8
17
16
15
DIN1
DIN1
DOUT1
DOUT2
DOUT3
9
DIN2
20
Powerdown
PWRDOWN
11
10
14
13
ROUT1
ROUT2
RIN1
RIN2
5 K
5 K
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTION
NAME
NO.
1
C1+
V+
Positive terminal of the voltage-doubler charge-pump capacitor
5.5-V supply generated by the charge pump
2
C1–
C2+
C2–
V–
3
Negative terminal of the voltage-doubler charge-pump capacitor
Positive terminal of the inverting charge-pump capacitor
Negative terminal of the inverting charge-pump capacitor
–5.5-V supply generated by the charge pump
4
5
6
DIN1
DIN2
DIN3
7
8
9
Driver inputs
ROUT2
ROUT1
10
11
Receiver outputs. Swing between 0 and VL.
VL
12
Logic-level supply. All CMOS inputs and outputs are referenced to this supply.
RS-232 receiver inputs
RIN2
RIN1
13
14
DOUT3
DOUT2
DOUT1
15
16
17
RS-232 driver outputs
GND
VCC
18
19
Ground
3-V to 5.5-V supply voltage
Powerdown input
L = Powerdown
PWRDWN
20
H = Normal operation
2
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MAX3386E
RS-232 TRANSCEIVER
WITH SPLIT SUPPLY PIN FOR LOGIC SIDE
www.ti.com
SLLS659–MAY 2006
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
–0.3
0.3
MAX UNIT
VCC to GND
6
V
V
V
V
V
VL to GND
VCC + 0.3
V+ to GND
7
– 7
V– to GND
V+ + |V–|(2)
13
DIN, PWRDWN to GND
–0.3
–0.3
6
VI
Input voltage
V
V
RIN to GND
DOUT to GND
ROUT
±25
±13.2
VL + 0.3
Continuous
VO
Output voltage
Short-circuit duration DOUT to GND
Continuous power dissipation
TA = 70°C, 20-pin TSSOP
(derate 7 mW/°C above 70°C)
559 mW
TJ
Junction temperature
150 °C
150 °C
300 °C
Tstg
Storage temperature range
Lead temperature (soldering, 10 s)
–65
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
(2) V+ and V– can have maximum magnitudes of 7 V, but their absolute difference cannot exceed 13 V.
Recommended Operating Conditions
MIN
3
MAX UNIT
VCC Supply voltage
5.5
VCC
0.8
V
V
VL
Supply voltage
1.65
VL = 3 V or 5.5 V
VL = 2.3 V
Input logic threshold low
DIN, PWRDWN
DIN, PWRDWN
0.6
V
VL = 1.65 V
0.5
VL = 5.5 V
2.4
2.0
1.4
0.9
0
VL = 3 V
Input logic threshold high
V
VL = 2.7 V
VL = 1.95 V
MAX3386ECPWR
MAX3386EIPWR
70
85
25
Operating temperature
Receiver input voltage
°C
–40
–25
V
Electrical Characteristics
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 µF (tested at 3.3 V ± 10%), C1 = 0.047 µF,
C2–C4 = 0.33 µF (tested at 5 V ± 10%) (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP(1)
MAX UNIT
DC Characteristics (VCC = 3.3 V or 5 V, TA = 25°C)
Powerdown supply current
Supply current
PWRDWN = GND, All inputs at VCC or GND
PWRDWN = VCC, No load
1
10
1
µA
0.3
mA
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C.
3
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MAX3386E
RS-232 TRANSCEIVER
WITH SPLIT SUPPLY PIN FOR LOGIC SIDE
www.ti.com
SLLS659–MAY 2006
ESD Protection
PARAMETER
TEST CONDITIONS
TYP UNIT
Human-Body Model
±15
RIN, DOUT
IEC 61000-4-2 Air-Gap Discharge
IEC 61000-4-2 Contact Discharge
±15
±8
kV
4
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MAX3386E
RS-232 TRANSCEIVER
WITH SPLIT SUPPLY PIN FOR LOGIC SIDE
www.ti.com
SLLS659–MAY 2006
RECEIVER SECTION
Electrical Characteristics
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 µF (tested at 3.3 V ± 10%), C1 = 0.047 µF,
C2–C4 = 0.33 µF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)
PARAMETER
TEST CONDITIONS
ROUT, receivers disabled
MIN
TYP(1)
MAX
±10
0.4
UNIT
µA
V
Ioff
Output leakage current
Output voltage low
Output voltage high
±0.05
VOL
VOH
IOUT = 1.6 mA
IOUT = –1 mA
VL – 0.6
0.8
VL – 0.1
1.2
V
VL = 5 V
VIT–
Input threshold low
Input threshold high
TA = 25°C
TA = 25°C
V
V
VL = 3.3 V
VL = 5 V
0.6
1.5
1.8
2.4
2.4
VIT+
Vhys
VL = 3.3 V
1.5
Input hysteresis
Input resistance
0.5
V
TA = 25°C
3
5
7
kΩ
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C
Switching Characteristics
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 µF (tested at 3.3 V ± 10%), C1 = 0.047 µF,
C2–C4 = 0.33 µF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP(1)
0.15
0.15
50
UNIT
tPHL
Receiver propagation delay
Receiver input to receiver output, CL = 150 pF
µs
tPLH
tPHL – tPLH
ten
Receiver skew
ns
ns
ns
Receiver output enable time
Receiver output disable time
From PWRDWN
From PWRDWN
200
tdis
200
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C.
5
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MAX3386E
RS-232 TRANSCEIVER
WITH SPLIT SUPPLY PIN FOR LOGIC SIDE
www.ti.com
SLLS659–MAY 2006
DRIVER SECTION
Electrical Characteristics
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 µF (tested at 3.3 V ± 10%), C1 = 0.047 µF,
C2–C4 = 0.33 µF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)
PARAMETER
Output voltage swing
Output resistance
TEST CONDITIONS
All driver outputs loaded with 3 kΩ to ground
VCC = V+ = V– = 0, Driver output = ±2 V
VT_OUT = 0
MIN TYP(1)
MAX UNIT
VOH
ro
±5
±5.4
V
300
10M
Ω
IOS
Output short-circuit current
±60
±25
mA
VT_OUT = ±12 V, Driver disabled,
VCC = 0 or 3 V to 5.5 V
IOZ
Output leakage current
µA
Driver input hysteresis
Input leakage current
0.5
V
DIN, PWRDWN
±0.01
±1
µA
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C
Timing Requirements
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 µF (tested at 3.3 V ± 10%), C1 = 0.047 µF,
C2–C4 = 0.33 µF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)
PARAMETER
MIN
TYP(1)
MAX
UNIT
kbps
µs
Maximum data rate
Time-to-exit powerdown
Driver skew(2)
RL = 3 kΩ, CL = 1000 pF, One driver switching
250
|VT_OUT| > 3.7 V
100
100
|tPHL– tPLH
|
ns
VCC = 3.3 V,
TA = 25°C,
RL = 3 kΩ to 7 kΩ,
Measured from 3 V
to –3 V or –3 V to 3 V
CL = 150 pF to 1000 pF
CL = 150 pF to 2500 pF
6
4
30
30
Transition-region
slew rate
V/µs
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C.
(2) Driver skew is measured at the driver zero crosspoint.
ESD Protection
PARAMETER
TEST CONDITIONS
TYP UNIT
Human-Body Model
±15
RIN, DOUT
IEC 61000-4-2 Air-Gap Discharge
IEC 61000-4-2 Contact Discharge
±15
±8
kV
6
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MAX3386E
RS-232 TRANSCEIVER
WITH SPLIT SUPPLY PIN FOR LOGIC SIDE
www.ti.com
SLLS659–MAY 2006
APPLICATION INFORMATION
3.3 V
20
19
12
C
BYPASS
V
V
L
PWRDWN
CC
2
6
1
3
4
5
C1+
V+
V−
C1
0.1mF
C3
0.1
C1−
C2+
µF
µF
C2
0.1mF
C4
0.1
C2−
7
DOUT1
DOUT2
DOUT3
DIN1
17
16
15
DIN2
DIN3
TTL/CMOS
Inputs
V
V
L
14
13
11 ROUT1
10 ROUT2
RIN1
5kΩ
TTL/CMOS
Outputs
L
RIN2
5kΩ
GND
18
7
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MAX3386E
RS-232 TRANSCEIVER
WITH SPLIT SUPPLY PIN FOR LOGIC SIDE
www.ti.com
SLLS659–MAY 2006
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
R
L
t
THL
TLH
(see Note A)
3 V
PWRDWN
V
V
OH
3 V
−3 V
3 V
−3 V
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
THL
TLH
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle,
O
t ≤ 10 ns, t ≤ 10 ns.
r
f
Figure 1. Driver Slew Rate
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
t
PLH
PHL
R
L
(see Note A)
V
V
OH
3 V
PWRDWN
50%
50%
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
PWRDWN
3 V
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PHL
PLH
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
8
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MAX3386E
RS-232 TRANSCEIVER
WITH SPLIT SUPPLY PIN FOR LOGIC SIDE
www.ti.com
SLLS659–MAY 2006
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
V
CC
GND
Input
1.5 V
1.5 V
S1
R
L
t
t
PZH
PHZ
S1 at GND)
(S1 at GND)
3 V or 0 V
Output
V
OH
C
L
Output
50%
(see Note A)
PWRDWN
0.3 V
0.3 V
t
PLZ
Generator
(see Note B)
(S1 at V
)
CC
50 Ω
Output
50%
V
OL
t
PZL
(S1 at V )
CC
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 4. Receiver Enable and Disable Times
9
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PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
MAX3386ECDW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3386ECDWG4
MAX3386ECDWR
MAX3386ECDWRG4
MAX3386ECPW
SOIC
SOIC
DW
DW
DW
PW
PW
PW
PW
DW
DW
DW
DW
PW
PW
PW
PW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3386ECPWG4
MAX3386ECPWR
MAX3386ECPWRG4
MAX3386EIDW
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3386EIDWG4
MAX3386EIDWR
MAX3386EIDWRG4
MAX3386EIPW
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
MAX3386EIPWG4
MAX3386EIPWR
MAX3386EIPWRG4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
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interface.ti.com
logic.ti.com
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power.ti.com
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Security
www.ti.com/opticalnetwork
www.ti.com/security
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www.ti.com/video
microcontroller.ti.com
Low Power Wireless www.ti.com/lpw
Telephony
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2006, Texas Instruments Incorporated
相关型号:
MAX3386ECUP+T
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MAX3386EEUP+T
Line Transceiver, 2 Func, 3 Driver, 2 Rcvr, PDSO20, 4.40 MM, 0.65 MM PITCH, TSSOP-20
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