MCP809 [TI]
低电平有效 3 引脚复位 IC;
| 型号： | MCP809 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 低电平有效 3 引脚复位 IC |
| 文件： | 总15页 (文件大小：516K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP809, MCP810
www.ti.com
SNVS165A –JUNE 2001–REVISED MAY 2013
MCP809/MCP810 3-Pin Microprocessor Reset Circuits
Check for Samples: MCP809, MCP810
1
FEATURES
DESCRIPTION
The MCP809/810 microprocessor supervisory circuits
can be used to monitor the power supplies in
microprocessor and digital systems. They provide a
reset to the microprocessor during power-up, power-
down and brown-out conditions.
2
•
Precise Monitoring of 3V, 3.3V, and 5V Supply
Voltages
•
•
Fully specified over temperature
140ms min. Power-On Reset Pulse Width,
240ms Typical
The function of the MCP809/810 is to monitor the VCC
supply voltage, and assert a reset signal whenever
this voltage declines below the factory-programmed
reset threshold. The reset signal remains asserted for
240ms after VCC rises above the threshold. The
MCP809 has an active-low RESET output, while the
MCP810 has an active-high RESET output.
–
–
Active-low RESET Output (MCP809)
Active-high RESET Output (MCP810)
•
•
•
Specified RESET Output Valid for VCC≥1V
Low Supply Current, 15µA typical
Power supply transient immunity
Seven standard reset voltage options are available,
suitable for monitoring 5V, 3.3V, and 3V supply
voltages.
APPLICATIONS
•
•
•
•
•
•
Microprocessor Systems
Computers
With
a low supply current of only 15µA, the
MCP809/810 are ideal for use in portable equipment.
The MCP809/MCP810 are available in the 3-pin
SOT23 package.
Controllers
Intelligent Instruments
Portable/Battery-Powered Equipment
Automotive
Typical Application Circuit
Figure 1. Typical Application Circuit
Connection Diagram
Figure 2. ( ) are for MCP810
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2013, Texas Instruments Incorporated
MCP809, MCP810
SNVS165A –JUNE 2001–REVISED MAY 2013
www.ti.com
Pin Description
PIN
NAME
FUNCTION
3
GND
Ground reference
Active-low output. RESET remains low while VCC is below the reset threshold, and for 240ms after
VCC rises above the reset threshold.
RESET (MCP809)
1
2
Active-high output. RESET remains high while VCC is below the reset threshold, and for 240ms after
VCC rises above the reset threshold.
RESET (MCP810)
VCC
Supply Voltage (+5V, +3.3V, or +3.0V)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)
Absolute Maximum Ratings
VCC
−0.3V to 6.0V
RESET, RESET
−0.3V to (VCC+ 0.3V)
Input Current, VCC Pin
Output Current, RESET, RESET Pin
Rate of Rise, VCC
20mA
20mA
100V/µs
2kV
(2)
ESD Rating
Continuous Power Dissipation (TA = +70°C)
(3)
SOT-23
320mW
−40°C to +105°C
125°C
Ambient Temperature Range
Maximum Junction Temperature
Storage Temperature Range
−65°C to +160°C
+300°C
Lead Temperature (soldering, 10sec)
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which the
device operates correctly. Operating ratings do not imply specified performance limits. For specified performance limits and associated
test conditions, see the Electrical Characteristics.
(2) The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin.
(3) Production testing done at TA = +25°C, over temperature limits specified by design only.
2
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SNVS165A –JUNE 2001–REVISED MAY 2013
Electrical Characteristics
VCC = full range, TA = −40°C to +105°C, unless otherwise noted. Typical values are at TA = +25°C, VCC = 5V for
(1)
4.63/4.38/4.00 versions, VCC = 3.3V for 3.08/2.93 versions, and VCC = 3V for 2.63 version.
Symbol
Parameter
Conditions
Min
1.0
1.2
Typ
Max
5.5
5.5
60
Units
TA = 0°C to +70°C
VCC Range
V
TA = −40°C to +105°C
TA = −40°C to
+85°C
VCC<5.5V, MCP8_ _ -
4.63/4.38/4.00
18
15
VCC<3.6V, MCP8_ _ -
3.08/2.93/2.63
50
ICC
Supply Current
µA
TA = +85°C to
+105°C
VCC<5.5V, MCP8_ _ -
4.63/4.38/4.00
100
100
VCC<3.6V, MCP8_ _ -
3.08/2.93/2.63
TA = +25°C
4.56
4.50
4.40
4.31
4.25
4.16
3.93
3.89
3.80
3.04
3.00
2.92
2.89
2.85
2.78
2.59
2.55
2.50
4.63
4.38
4.00
3.08
2.93
2.63
4.70
4.75
4.86
4.45
4.50
4.56
4.06
4.10
4.20
3.11
3.15
3.23
2.96
3.00
3.08
2.66
2.70
2.76
MCP8_ _ -4.63
MCP8_ _ -4.38
MCP8_ _ -4.00
MCP8_ _ -3.08
MCP8_ _ -2.93
MCP8_ _ -2.63
TA = −40°C to +85°C
TA = +85°C to +105°C
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
TA = +25°C
(2)
VTH
Reset Threshold
V
TA = −40°C to +85°C
TA = +85°C to +105°C
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
TA = +25°C
TA = −40°C to +85°C
TA = +85°C to +105°C
Reset Threshold Temperature
Coefficient
30
ppm/°C
µs
(2)
VCC to Reset Delay
VCC = VTH to (VTH − 100mV)
TA = −40°C to +85°C
20
140
240
560
Reset Active Timeout Period
ms
TA = +85°C to +105°C
100
840
(1) At elevated temperatures, devices must be derated based on package thermal resistance. The device in the SOT23-3 package must be
derated at 4mW/°C at ambient temperatures above 70°C. The device has internal thermal protection.
(2) RESET Output for MCP809, RESET output for MCP810.
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SNVS165A –JUNE 2001–REVISED MAY 2013
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Electrical Characteristics (continued)
VCC = full range, TA = −40°C to +105°C, unless otherwise noted. Typical values are at TA = +25°C, VCC = 5V for
4.63/4.38/4.00 versions, VCC = 3.3V for 3.08/2.93 versions, and VCC = 3V for 2.63 version. (1)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VCC = VTH min, ISINK = 1.2mA,
MCP809-2.63/2.93/3.08
0.3
RESET Output Voltage Low
(MCP809)
VOL
VCC = VTH min, ISINK = 3.2mA,
MCP809-4.63/4.38/4.00
0.4
0.3
V
VCC > 1.0V, ISINK = 50µA
VCC > VTH max, ISOURCE = 500µA,
MCP809-2.63/2.93/3.08
0.8VCC
RESET Output Voltage High
(MCP809)
VOH
V
VCC > VTH max, ISOURCE = 800µA,
MCP809-4.63/4.38/4.00
VCC−1.5
VCC = VTH max, ISINK = 1.2mA,
MCP810-2.63/2.93/3.08
0.3
0.4
RESET Output Voltage Low
(MCP810)
VOL
V
V
VCC = VTH max, ISINK = 3.2mA,
MCP810-4.63/4.38/4.00
VOH
RESET Output Voltage High
(MCP810)
0.8VCC
1.8V < VCC < VTH min, ISOURCE = 150μA
4
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MCP809, MCP810
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SNVS165A –JUNE 2001–REVISED MAY 2013
TYPICAL PERFORMANCE CHARACTERISTICS
Supply Current
vs
Supply Current
vs
Temperature
Temperature
(No Load, MCP8_ _-2.63/2.93/3.08)
(No Load, MCP8_ _-4.63/4.38)
Figure 3.
Figure 4.
Power-Down Reset Delay
vs
Temp (MCP8_ _-2.63/2.93/3.08)
Power-Down Reset Delay
vs
Temperature (MCP8_ _-4.63/4.38)
Figure 5.
Figure 6.
Power-Up Reset Timeout
Normalized Reset Threshold
vs
vs
Temperature
Temperature
Figure 7.
Figure 8.
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SNVS165A –JUNE 2001–REVISED MAY 2013
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APPLICATION INFORMATION
Benefits of Precision Reset Thresholds
A microprocessor supply supervisor must provide a reset output within a predictable range of the supply voltage.
A common threshold range is between 5% and 10% below the nominal supply voltage. The 4.63V and 3.08V
options of the MCP809/810 use highly accurate circuitry to ensure that the reset threshold occurs only within this
range (for 5V and 3.3V supplies). The other voltage options have the same tight tolerance to ensure a reset
signal for other narrow monitor ranges. See Table 1 for examples of how the standard reset thresholds apply to
3V, 3.3V, and 5V nominal supply voltages.
Table 1. Reset Thresholds Related to Common Supply Voltages
Reset Threshold
4.63 ± 3%
3.0V
3.3V
5.0V
90 - 95%
85 - 90%
78 - 82%
4.38 ± 3%
4.00 ± 3%
3.08 ± 3%
90 - 95%
86 - 90%
77 - 81%
2.93 ± 3%
2.63 ± 3%
85 - 90%
Ensuring a Valid Reset Output Down to VCC = 0V
When VCC falls below 1V, the MCP809 RESET output no longer sinks current. A high-impedance CMOS logic
input connected to RESET can therefore drift to undetermined voltages. To prevent this situation, a 100kΩ
resistor should be connected from the RESET output to ground, as shown in Figure 9.
A 100kΩ pull-up resistor to VCC is also recommended for the MCP810, if RESET is required to remain valid for
VCC < 1V.
Figure 9. RESET Valid to VCC = Ground Circuit
Negative-Going VCC Transients
The MCP809/810 are relatively immune to short negative-going transients or glitches on VCC. Figure 10 shows
the maximum pulse width a negative-going VCC transient can have without causing a reset pulse. In general, as
the magnitude of the transient increases, going further below the threshold, the maximum allowable pulse width
decreases. Typically, for the 4.63V and 4.38V version of the MCP809/810, a VCC transient that goes 100mV
below the reset threshold and lasts 20µs or less will not cause a reset pulse. A 0.1 µF bypass capacitor mounted
as close as possible to the VCC pin will provide additional transient rejection.
6
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Product Folder Links: MCP809 MCP810
MCP809, MCP810
www.ti.com
SNVS165A –JUNE 2001–REVISED MAY 2013
Figure 10. Maximum Transient Duration without Causing a Reset Pulse vs. Reset Comparator Overdrive
Interfacing to µPs with Bidirectional Reset Pins
Microprocessors with bidirectional reset pins, such as the Motorola 68HC11 series, can be connected to the
MCP809 RESET output. To ensure a correct output on the MCP809 even when the microprocessor reset pin is
in the opposite state, connect a 4.7kΩ resistor between the MCP809 RESET output and the µP reset pin, as
shown in Figure 11. Buffer the MCP809 RESET output to other system components.
Figure 11. Interfacing to Microprocessors with Bidirectional Reset I/O
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SNVS165A –JUNE 2001–REVISED MAY 2013
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REVISION HISTORY
Changes from Original (May 2013) to Revision A
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
MCP809M3-2.93/NOPB
ACTIVE
SOT-23
DBZ
3
1000 RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 105
SRB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
MCP809M3-2.93/NOPB SOT-23
DBZ
3
1000
178.0
8.4
3.3
2.9
1.22
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOT-23 DBZ
SPQ
Length (mm) Width (mm) Height (mm)
208.0 191.0 35.0
MCP809M3-2.93/NOPB
3
1000
Pack Materials-Page 2
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
(0.125)
3.04
2.80
1.9
3
(0.15)
NOTE 4
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/D 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
4. Support pin may differ or may not be present.
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EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214838/D 03/2023
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/D 03/2023
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
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相关型号：
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