MSP430F261X_14 [TI]
MIXED SIGNAL MICROCONTROLLER;
| 型号： | MSP430F261X_14 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | MIXED SIGNAL MICROCONTROLLER |
| 文件： | 总102页 (文件大小：6657K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
D
D
D
D
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
DVCC1
P6.3/A3
1
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
P7.6
2
P7.5
P6.4/A4
3
P7.4
P6.5/A5
4
P7.3
P6.6/A6
5
P7.2
P6.7/A7/SVSIN
VREF+
6
P7.1
7
P7.0
XIN
8
DVSS2
XOUT
9
DVCC2
80-pin
PN PACKAGE
(TOP VIEW)
VeREF+
10
11
12
13
14
15
16
17
18
19
20
P5.7/TBOUTH/SVSOUT
P5.6/ACLK
VREF-/VeREF-
P1.0/TACLK/CAOUT
P1.1/TA0
P5.5/SMCLK
P5.4/MCLK
P1.2/TA1
P5.3/UCB1CLK/UCA1STE
P5.2/UCB1SOMI/UCB1SCL
P5.1/UCB1SIMO/UCB1SDA
P5.0/UCB1STE/UCA1CLK
P4.7/TBCLK
P1.3/TA2
P1.4/SMCLK
P1.5/TA0
P1.6/TA1
P1.7/TA2
P4.6/TB6
P2.0/ACLK/CA2
P4.5/TB5
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
P5.4/MCLK
1
DVCC1
P6.3/A3
P6.4/A4
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
P5.3/UCB1CLK/UCA1STE
P5.2/UCB1SOMI/UCB1SCL
P5.1/UCB1SIMO/UCB1SDA
P5.0/UCB1STE/UCA1CLK
2
3
4
P6.5/A5
P6.6/A6
5
P6.7/A7/SVSIN
6
P4.7/TBCLK
7
VREF+
XIN
P4.6/TB6
64-pin
PM PACKAGE
(TOP VIEW)
8
P4.5/TB5
9
XOUT
P4.4/TB4
10
11
12
13
14
15
16
VeREF+
P4.3/TB3
VREF-/VeREF-
P1.0/TACLK/CAOUT
P1.1/TA0
P4.2/TB2
P4.1/TB1
P4.0/TB0
P3.7/UCA1RXD/UCA1SOMI
P3.6/UCA1TXD/UCA1SIMO
P3.5/UCA0RXD/UCA0SOMI
P1.2/TA1
P1.3/TA2
P1.4/SMCLK
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
DVCC1
P6.3/A3
1
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
P7.6
2
P7.5
P6.4/A4
3
P7.4
P6.5/A5/DAC1
P6.6/A6/DAC0
P6.7/A7/DAC1/SVSIN
VREF+
4
P7.3
5
P7.2
6
P7.1
7
P7.0
XIN
8
DVSS2
XOUT
9
DVCC2
80-pin
PN PACKAGE
(TOP VIEW)
VeREF+/DAC0
10
11
12
13
14
15
16
17
18
19
20
P5.7/TBOUTH/SVSOUT
P5.6/ACLK
V
REF-/VeREF-
P1.0/TACLK/CAOUT
P1.1/TA0
P5.5/SMCLK
P5.4/MCLK
P1.2/TA1
P5.3/UCB1CLK/UCA1STE
P5.2/UCB1SOMI/UCB1SCL
P5.1/UCB1SIMO/UCB1SDA
P5.0/UCB1STE/UCA1CLK
P4.7/TBCLK
P1.3/TA2
P1.4/SMCLK
P1.5/TA0
P1.6/TA1
P1.7/TA2
P4.6/TB6
P2.0/ACLK/CA2
P4.5/TB5
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
DVCC1
P6.3/A3
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
P5.4/MCLK
2
P5.3/UCB1CLK/UCA1STE
P5.2/UCB1SOMI/UCB1SCL
P5.1/UCB1SIMO/UCB1SDA
P5.0/UCB1STE/UCA1CLK
P4.7/TBCLK
P6.4/A4
3
P6.5/A5/DAC1
P6.6/A6/DAC0
P6.7/A7/DAC1/SVSIN
VREF+
4
5
6
7
P4.6/TB6
64-pin
PM PACKAGE
(TOP VIEW)
XIN
8
P4.5/TB5
XOUT
9
P4.4/TB4
VeREF+/DAC0
10
11
12
13
14
15
16
P4.3/TB3
V
REF-/VeREF-
P4.2/TB2
P1.0/TACLK/CAOUT
P1.1/TA0
P4.1/TB1
P4.0/TB0
P1.2/TA1
P3.7/UCA1RXD/UCA1SOMI
P3.6/UCA1TXD/UCA1SIMO
P3.5/UCA0RXD/UCA0SOMI
P1.3/TA2
P1.4/SMCLK
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
A1
B1
C1
D1
E1
F1
G1
H1
J1
A2
B2
C2
D2
E2
F2
G2
H2
J2
A3
B3
C3
A4
B4
A5
B5
A6
B6
A7
B7
A8
B8
A9
B9
A10
B10
A11
B11
C11
D11
E11
F11
G11
H11
J11
A12
B12
C12
D12
E12
F12
G12
H12
J12
D4
E4
F4
G4
H4
J4
D5
E5
D6
E6
D7
E7
D8
E8
D9
E9
F9
G9
H9
J9
F5
G5
H5
F8
G8
H8
H6
J6
H7
J7
J5
J8
K1
L1
K2
L2
K11
L11
M11
K12
L12
M12
L3
L4
L5
L6
L7
L8
L9
L10
M1
M2
M3
M4
M5
M6
M7
M8
M9
M10
Note: For terminal assignments, see the MSP430F261x Terminal Functions table.
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
XIN/
XOUT/
P3.x/P4.x
P5.x/P6.x
DVCC1/2 DVSS1/2
AVCC
AVSS
P1.x/P2.x
2x8
P7.x/P8.x
2x8/
XT2IN XT2OUT
2
2
4x8
1x16
ACLK
Oscillators
Basic Clock
System+
Flash
RAM
Ports
P1/P2
Ports
P3/P4
P5/P6
Ports
P7/P8
USCI A0
UART/
LIN,
ADC12
12-Bit
SMCLK
120kB
116kB
92kB
4kB
8kB
8kB
4kB
IrDA, SPI
2x8 I/O
Interrupt
capability
2x8/1x16
I/O
8
4x8 I/O
MCLK
USCI B0
SPI, I2C
Channels
92kB
16MHz
MAB
CPU
1MB
incl. 16
Registers
MDB
Hardware
Multiplier
Timer_B7
USCI A1
UART/
LIN,
Brownout
Protection
Emulation
Watchdog
WDT+
Timer_A3
Comp_A+
7 CC
Registers,
Shadow
Reg
MPY,
MPYS,
MAC,
IrDA, SPI
3 CC
Registers
8
JTAG
Interface
SVS,
SVM
15-Bit
Channels
USCI B1
SPI, I2C
MACS
RST/NMI
DVCC
P3.x/P4.x
P5.x/P6.x
XIN/ XOUT/
XT2IN XT2OUT
DVSS
RAM
AVCC
AVSS
P1.x/P2.x
2x8
4x8
2
2
ACLK
Oscillators
Basic Clock
System+
Flash
Ports
P1/P2
Ports
P3/P4
P5/P6
USCI A0
ADC12
12-Bit
UART/
LIN,
SMCLK
120kB
116kB
92kB
4kB
8kB
8kB
4kB
IrDA, SPI
2x8 I/O
Interrupt
capability
8
4x8 I/O
MCLK
USCI B0
SPI, I2C
Channels
92kB
16MHz
CPU
MAB
1MB
incl. 16
Registers
MDB
Hardware
Multiplier
Timer_B7
USCI A1
UART/
LIN,
Brownout
Protection
Emulation
Watchdog
WDT+
Timer_A3
Comp_A+
7 CC
Registers,
Shadow
Reg
MPY,
MPYS,
MAC,
IrDA, SPI
3 CC
Registers
8
JTAG
Interface
SVS,
SVM
15-Bit
Channels
USCI B1
SPI, I2C
MACS
RST/NMI
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
XIN/
XOUT/
P3.x/P4.x
P5.x/P6.x
DVCC1/2 DVSS1/2
AVCC
AVSS
P1.x/P2.x
2x8
P7.x/P8.x
2x8/
XT2IN XT2OUT
2
2
4x8
1x16
ACLK
Flash
RAM
DAC12
12-Bit
Oscillators
Basic Clock
System+
Ports
P1/P2
Ports
P3/P4
P5/P6
Ports
P7/P8
USCI A0
UART/
LIN,
ADC12
12-Bit
SMCLK
120kB
116kB
92kB
92kB
56kB
4kB
8kB
8kB
4kB
4kB
2
IrDA, SPI
2x8 I/O
Interrupt
capability
2x8/1x16
I/O
8
Channels
Voltage
Out
4x8 I/O
MCLK
USCI B0
SPI, I2C
Channels
16MHz
MAB
CPU
1MB
incl. 16
Registers
MDB
Hardware
Multiplier
Timer_B7
USCI A1
UART/
LIN,
Brownout
Protection
DMA
Controller
Emulation
Watchdog
WDT+
Timer_A3
Comp_A+
7 CC
Registers,
Shadow
Reg
MPY,
MPYS,
MAC,
IrDA, SPI
3 CC
Registers
8
JTAG
Interface
SVS,
SVM
3
15-Bit
Channels
USCI B1
SPI, I2C
Channels
MACS
RST/NMI
DVCC
XIN/
XOUT/
P3.x/P4.x
P5.x/P6.x
DVSS
RAM
AVCC
AVSS
P1.x/P2.x
XT2IN XT2OUT
2
2
2x8
4x8
ACLK
Flash
DAC12
12-Bit
Oscillators
Basic Clock
System+
Ports
P1/P2
Ports
P3/P4
P5/P6
USCI A0
UART/
LIN,
ADC12
12-Bit
SMCLK
120kB
116kB
92kB
92kB
56kB
4kB
8kB
8kB
4kB
4kB
2
IrDA, SPI
2x8 I/O
Interrupt
capability
8
Channels
Voltage
Out
4x8 I/O
MCLK
USCI B0
SPI, I2C
Channels
16MHz
MAB
CPU
1MB
incl. 16
Registers
MDB
Hardware
Multiplier
Timer_B7
USCI A1
UART/
LIN,
Brownout
Protection
DMA
Controller
Emulation
Watchdog
WDT+
Timer_A3
Comp_A+
7 CC
Registers,
Shadow
Reg
MPY,
MPYS,
MAC,
IrDA, SPI
3 CC
Registers
8
JTAG
Interface
SVS,
SVM
3
15-Bit
Channels
USCI B1
SPI, I2C
Channels
MACS
RST/NMI
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
D D
D D
D D
D D
D
D
D
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
D
D
D
D
D
D
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
Legend
rw:
Bit can be read and written .
rw-0,1:
rw-(0,1)
Bit can be read and written . It is Reset or Set by PUC .
Bit can be read and written . It is Reset or Set by POR .
SFR bit is not present in device .
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
D
D
D
D
D
D
D
D
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
D
D
D
D
D
D
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
VCC
Vhys(B_IT-)
V(B_IT-)
VCC(Start)
1
0
td(BOR)
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
D
D
D
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
Pad Logic
P1REN.x
P1DIR.x
0
DVSS
DVCC
1
1
0
1
Direction
0: Input
1: Output
P1OUT.x
0
1
Module X OUT
P1.0/TACLK/CAOUT
P1.1/TA0
P1.2/TA1
P1.3/TA2
P1.4/SMCLK
P1.5/TA0
P1SEL.x
P1IN.x
EN
P1.6/TA1
P1.7/TA2
Module X IN
P1IRQ.x
D
P1IE.x
EN
Set
Q
P1IFG.x
P1SEL.x
P1IES.x
Interrupt
Edge Select
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
Pad Logic
To
Comparator_A
From
Comparator_A
CAPD.x
P2REN.x
0
1
DVSS
DVCC
1
0
1
P2DIR.x
Direction
0: Input
1: Output
P2OUT.x
0
1
Module X OUT
P2.0/ACLK/CA2
P2.1/TAINCLK/CA3
P2.2/CAOUT/TA0/CA4
P2.3/CA0/TA1
Bus
Keeper
EN
P2SEL.x
P2IN.x
P2.4/CA1/TA2
P2.6/ADC12CLK/
DMAE0/CA6
EN
P2.7/TA0/CA7
D
Module X IN
P2IRQ.x
P2IE.x
EN
Set
Q
P2IFG.x
P2SEL.x
P2IES.x
Interrupt
Edge Select
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
Pad Logic
To Comparator
From Comparator
CAPD.5
To DCO
in DCO
DCOR
P2REN.5
0
1
DVSS
DVCC
1
P2DIR.5
0
1
Direction
0: Input
1: Output
P2OUT.5
0
1
Module X OUT
P2.5/ROSC/CA5
Bus
Keeper
EN
P2SEL.x
P2IN.5
EN
Module X IN
P2IRQ.5
D
P2IE.5
EN
Set
Q
P2IFG.5
P2SEL.5
P2IES.5
Interrupt
Edge Select
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
Pad Logic
P3REN.x
0
1
DVSS
DVCC
1
P3DIR.x
0
1
Direction
0: Input
1: Output
Module
direction
P3OUT.x
0
1
Module X OUT
P3.0/UCB0STE/UCA0CLK
P3.1/UCB0SIMO/UCB0SDA
P3.2/UCB0SOMI/UCB0SCL
P3.3/UCB0CLK/UCA0STE
P3.4/UCA0TXD/UCA0SIMO
P3.5/UCA0RXD/UCA0SOMI
P3.6/UCA1TXD/UCA1SIMO
P3.7/UCA1RXD/UCA1SOMI
P3SEL.x
P3IN.x
EN
D
Module X IN
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
Pad Logic
P4REN.x
P4DIR.x
0
DVSS
DVCC
1
1
0
1
Direction
0: Input
1: Output
P4OUT.x
0
1
Module X OUT
P4.0/TB0
P4.1/TB1
P4.2/TB2
P4.3/TB3
P4.4/TB4
P4.5/TB5
P4.6/TB6
P4.7/TBCLK
P4SEL.x
P4IN.x
EN
D
Module X IN
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
Pad Logic
P5REN.x
0
1
DVSS
DVCC
1
P5DIR.x
0
1
Direction
0: Input
1: Output
Module
Direction
P5OUT.x
0
1
Module X OUT
P5.0/UCB1STE/UCA1CLK
P5.1/UCB1SIMO/UCB1SDA
P5.2/UCB1SOMI/UCB1SCL
P5.3/UCB1CLK/UCA1STE
P5.4/MCLK
P5SEL.x
P5IN.x
P5.5/SMCLK
P5.6/ACLK
P5.7/TBOUTH/SVSOUT
EN
D
Module X IN
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
Pad Logic
ADC12 Ax
P6REN.x
0
1
DVSS
DVCC
1
P6DIR.x
0
1
Direction
0: Input
1: Output
P6OUT.x
0
1
Module X OUT
P6.0/A0
P6.1/A1
P6.2/A2
P6.3/A3
P6.4/A4
Bus
Keeper
EN
P6SEL.x
P6IN.x
EN
D
Module X IN
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
Pad Logic
DAC12_0OUT
DAC12AMP > 0
ADC12 Ax
ADC12 Ax
P6REN.x
0
1
DVSS
DVCC
1
P6DIR.x
0
1
Direction
0: Input
1: Output
P6OUT.x
0
1
Module X OUT
P6.5/A5/DAC1
P6.6/A6/DAC0
Bus
Keeper
EN
P6SEL.x
P6IN.x
EN
D
Module X IN
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
Pad Logic
to SVS Mux
VLD = 15
DAC12_0OUT
DAC12AMP > 0
ADC12 A7
from ADC12
P6REN.7
0
1
DVSS
DVCC
1
0
1
P6DIR.7
Direction
0: Input
1: Output
P6OUT.7
0
1
Module X OUT
P6.7/A7/DAC1/SVSIN
Bus
Keeper
EN
P6SEL.7
P6IN.7
EN
D
Module X IN
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
Pad Logic
1
P7REN.x
0
1
DVSS
DVCC
0
1
P7DIR.x
0
Direction
0: Input
1: Output
0
1
P7OUT.x
VSS
P7.x
P7SEL.x
P7IN.x
EN
D
Module X IN
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
Pad Logic
P8REN.x
0
1
DVSS
DVCC
1
0
1
P8DIR.x
0
Direction
0: Input
1: Output
0
1
P8OUT.x
VSS
P8.0
P8.1
P8.2
P8.3
P8.4
P8.5
P8SEL.x
P8IN.x
EN
D
Module X IN
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
BCSCTL3.XT2Sx = 11
0
XT2CLK
From
P8.7/XIN
P8.7/XIN
1
XT2 off
Pad Logic
P8SEL.7
P8REN.6
0
1
DVSS
DVCC
1
0
1
P8DIR.6
Direction
0: Input
1: Output
P8OUT.6
0
1
Module X OUT
P8.6/XOUT
Bus
Keeper
EN
P8SEL.6
P8IN.6
EN
D
Module X IN
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
BCSCTL3.XT2Sx = 11
XT2 off
P8.6/XOUT
0
1
XT2CLK
P8SEL.6
P8REN.7
Pad Logic
0
1
DVSS
DVCC
0
1
0
P8DIR.7
Direction
0: Input
1: Output
1
P8OUT.7
0
1
Module X OUT
P8.7/XIN
Bus
Keeper
EN
P8SEL.7
P8IN.7
EN
D
Module X IN
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
MSP430F241x, MSP430F261x
MIXED SIGNAL MICROCONTROLLER
PACKAGE OPTION ADDENDUM
www.ti.com
4-Dec-2009
PACKAGING INFORMATION
Orderable Device
MSP430F2416TPM
MSP430F2416TPMR
MSP430F2416TPN
MSP430F2416TPNR
MSP430F2416TZQW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
LQFP
PM
64
160 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
LQFP
LQFP
LQFP
PM
PN
64
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
80
119 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
PN
80
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
ZQW
113
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2416TZQWR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQW
113
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2417TPM
MSP430F2417TPMR
MSP430F2417TPN
MSP430F2417TPNR
MSP430F2417TZQW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LQFP
LQFP
LQFP
LQFP
PM
PM
64
64
160 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
PN
80
119 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
PN
80
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
ZQW
113
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2417TZQWR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQW
113
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2418TPM
MSP430F2418TPMR
MSP430F2418TPN
MSP430F2418TPNR
MSP430F2418TZQW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LQFP
LQFP
LQFP
LQFP
PM
PM
64
64
160 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
PN
80
119 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
PN
80
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
ZQW
113
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2418TZQWR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQW
113
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2419TPM
MSP430F2419TPMR
ACTIVE
ACTIVE
LQFP
PM
PM
64
64
160 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
LQFP
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Dec-2009
Orderable Device
Status (1)
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
MSP430F2419TPN
MSP430F2419TPNR
MSP430F2419TZQW
LQFP
PN
80
119 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
LQFP
PN
80
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
ZQW
113
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2419TZQWR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQW
113
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2616TPM
MSP430F2616TPMR
MSP430F2616TPN
MSP430F2616TPNR
MSP430F2616TZQW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LQFP
LQFP
LQFP
LQFP
PM
PM
64
64
160 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
PN
80
119 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
PN
80
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
ZQW
113
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2616TZQWR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQW
113
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2617TPM
MSP430F2617TPMR
MSP430F2617TPN
MSP430F2617TPNR
MSP430F2617TZQW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LQFP
LQFP
LQFP
LQFP
PM
PM
64
64
160 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
PN
80
119 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
PN
80
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
ZQW
113
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2617TZQWR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQW
113
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2618TPM
MSP430F2618TPMR
MSP430F2618TPN
MSP430F2618TPNR
MSP430F2618TZQW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LQFP
PM
PM
64
64
160 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
LQFP
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
LQFP
PN
80
119 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
LQFP
PN
80
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
BGA MI
ZQW
113
250 Green (RoHS &
SNAGCU
Level-3-260C-168 HR
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
4-Dec-2009
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
CROSTA
R JUNI
OR
no Sb/Br)
MSP430F2618TZQWR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQW
113
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2619TPM
MSP430F2619TPMR
MSP430F2619TPN
MSP430F2619TPNR
MSP430F2619TZQW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LQFP
LQFP
LQFP
LQFP
PM
PM
64
64
160 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
PN
80
119 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
PN
80
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
ZQW
113
250 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
MSP430F2619TZQWR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQW
113
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
4-Dec-2009
OTHER QUALIFIED VERSIONS OF MSP430F2618 :
Enhanced Product: MSP430F2618-EP
•
NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 4
MECHANICAL DATA
MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996
PM (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
M
0,08
33
48
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
0,25
12,20
SQ
0,05 MIN
0°–7°
11,80
1,45
1,35
0,75
0,45
Seating Plane
0,08
1,60 MAX
4040152/C 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
D. May also be thermally enhanced plastic with leads connected to the die pads.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTQF010A – JANUARY 1995 – REVISED DECEMBER 1996
PN (S-PQFP-G80)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
60
M
0,08
41
61
40
0,13 NOM
80
21
1
20
Gage Plane
9,50 TYP
0,25
12,20
SQ
11,80
0,05 MIN
0°–7°
14,20
SQ
13,80
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040135 /B 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
Automotive
www.ti.com/automotive
www.ti.com/communications
Communications and
Telecom
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Consumer Electronics
Energy
www.ti.com/consumer-apps
www.ti.com/energy
Logic
Industrial
www.ti.com/industrial
Power Mgmt
Microcontrollers
RFID
power.ti.com
Medical
www.ti.com/medical
microcontroller.ti.com
www.ti-rfid.com
Security
www.ti.com/security
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明