O31310QRWGRQ1 [TI]
适用于汽车应用的高压 PMIC | RWG | 40 | -40 to 125;
| 型号： | O31310QRWGRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 适用于汽车应用的高压 PMIC | RWG | 40 | -40 to 125 高压 集成电源管理电路 |
| 文件： | 总13页 (文件大小：984K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPS65313-Q1
ZHCSHK1A –FEBRUARY 2018–REVISED SEPTEMBER 2018
TPS65313-Q1 适用于汽车应用的宽输入电压 电源管理 IC
1 器件概述
1.1 特性
1
– SYNC_IN 引脚支持调制或非调制外部时钟
• 适用于所有稳压器
• 符合面向汽车应用的 AEC-Q100 标准：
– 器件温度等级 1：–40°C 至 +125°C，TA
• 同步降压前置稳压器 (BUCK1)
– 输入电压范围：4V 至 36V
– 输出电流高达 3.1A
– 工厂可选 3.3V 或 3.6V 输出电压
• 同步降压稳压器 (BUCK2)
– 3.3V 或 3.6V 固定输入电压
– 输出电流高达 2A
– 工厂可选 1.2V、1.25V、1.8V 或 2.3V 输出电压
• 同步升压转换器 (BOOST)
– 3.3V 或 3.6V 固定输入电压
– 输出电流高达 600mA
– 软启动功能
– 独立电压监控和诊断
– 过流、过载、过压、欠压和热保护
– 内部环路补偿
• 通过集成自适应随机扩频 (ARSS) 调制实现稳压器
开关时钟
• 关闭状态下 3µA 静态电流
• SPI 提供控制和诊断功能
• 两个通用外部电压监控器
• 用于 MCU 或 DSP 的集成式 Q&A 看门狗和复位监
控器
• 支持最高 ASIL-C (ISO 26262) / SIL-2 (IEC 61508)
的系统级功能安全要求
– 输出电压 5V
• 锁相环 (PLL)
• 具有 0.5mm 引脚间距的热增强型 40 引脚 VQFNP
封装
– 输出频率约为 2.2MHz。
1.2 应用
•
•
汽车雷达和摄像头 应用
汽车传感器融合 应用
•
•
工业雷达 应用
楼宇和工厂自动化 应用
1.3 说明
TPS65313-Q1 器件是一款电源管理集成电路 (PMIC)，满足由 MCU 控制或 DSP 控制的汽车和工业、机械
或交通运输系统的要求。该器件集成了多种常用 特性，有助于减小布板空间和降低系统成本。
该器件包括一个宽输入电压同步降压稳压器 (BUCK1)，并整合了一个低压 (LV) 降压稳压器 (BUCK2) 和一个
升压转换器 (BOOST)，这两个器件均由宽输入电压降压稳压器 (BUCK1) 供电。该器件在关闭状态下 具有
较低的静态电流，在系统永久性连接到电源时可以减少电流损耗。所有输出端都受到过压、过载和过热条件
保护。
所有稳压电源输出具有独立的监控和保护功能，可支持最高
ASIL-C / SIL-2 系统级功能安全要求，包括防止潜在故障的强制性和可编程诊断功能（模拟和逻辑内置自
检）。 器件还集成了一个可编程监控器、看门狗功能和一个 MCU 或 DSP 错误引脚监控器。
器件信息(1)
封装
器件型号
封装尺寸（标称值）
VQFNP (40)
6.00mm × 6.00mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLDS252
TPS65313-Q1
ZHCSHK1A –FEBRUARY 2018–REVISED SEPTEMBER 2018
www.ti.com.cn
1.3.1 功能方框图
VBAT
MCU_ERR
MCU Error
Signal Monitor
UV/OV
Monitor
ENDRV/nIRQ
Enable and
Interrupt
BG2
BG1
DVDD
VBUCK1
VIO
UV/OV
Monitor
5.8 V
VREG
+
VEXTSUP-TH
œ
VREG
NRES
RESET
Supervisor
Synchronous Buck Converter
BUCK1
VIN
WAKE
(High Voltage)
Wake-Up
BOOT1
Circuit
Q&A
Window
Watchdog
VBUCK1
PH1
Digital
Core
NCS
SCK
PGND1
PGND1A
VSENSE1
SPI
SDO
Voltage
Monitoring
SDI
SYNC_IN
Synchronous Buck Converter
BUCK2
VSUP2
BOOT2
VBUCK1
DIAG_OUT
PLL
(Low Voltage)
(SYNC_OUT observed
through DIAG_OUT pin)
VBOOST
Synchronous Boost Converter
BOOST
VBOOST
PH2
VBUCK2
(Low Voltage)
BOOT3
PGND2
VBUCK1
PH3
VSENSE2
Voltage
Monitoring
PGND3
VSENSE3
EXT_VSENSE1
EXT_VSENSE2
Voltage
Monitoring
Programmable
Voltage
Monitoring
Voltage
Monitoring
Voltage
Monitoring
图 1-1. 器件功能方框图
2
器件概述
版权 © 2018, Texas Instruments Incorporated
TPS65313-Q1
www.ti.com.cn
ZHCSHK1A –FEBRUARY 2018–REVISED SEPTEMBER 2018
内容
1
器件概述.................................................... 1
4.1 接收文档更新通知..................................... 5
4.2 社区资源 .............................................. 5
4.3 商标 ................................................... 5
4.4 静电放电警告 ......................................... 5
4.5 Glossary .............................................. 5
机械、封装和可订购信息 ................................. 5
1.1 特性 ................................................... 1
1.2 应用 ................................................... 1
1.3 说明 ................................................... 1
修订历史记录............................................... 3
Device Option Table..................................... 4
器件和文档支持............................................ 5
2
3
4
5
2 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Original (February 2018) to Revision A
Page
•
已更改 数据表状态从预告信息 改为生产数据 ..................................................................................... 1
Copyright © 2018, Texas Instruments Incorporated
修订历史记录
3
Submit Documentation Feedback
Product Folder Links: TPS65313-Q1
TPS65313-Q1
ZHCSHK1A –FEBRUARY 2018–REVISED SEPTEMBER 2018
www.ti.com.cn
3 Device Option Table
EXT_VMON1 ENABLED AT
POWER-UP
EXT_VMON2 ENABLED AT
POWER-UP
OPTION PART NUMBER
BUCK1
BUCK2
fSW MODULATION
O313B012QRWGRQ1
3.3 V
1.25 V
Internal
NO
NO
4
Device Option Table
版权 © 2018, Texas Instruments Incorporated
提交文档反馈意见
产品主页链接: TPS65313-Q1
TPS65313-Q1
www.ti.com.cn
ZHCSHK1A –FEBRUARY 2018–REVISED SEPTEMBER 2018
4 器件和文档支持
4.1 接收文档更新通知
要接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册，即可每周
接收产品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
4.2 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信
息。
4.3 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
4.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
4.5 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
5 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通
知，且不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
版权 © 2018, Texas Instruments Incorporated
机械、封装和可订购信息
5
提交文档反馈意见
产品主页链接: TPS65313-Q1
TPS65313-Q1
ZHCSHK1A –FEBRUARY 2018–REVISED SEPTEMBER 2018
www.ti.com.cn
PACKAGE OUTLINE
RWG0040B
VQFNP - 0.9 mm max height
SCALE 2.400
PLASTIC QUAD FLATPACK - NO LEAD
6.1
5.9
B
A
PIN 1 ID
6.1
5.9
(
5.75)
0.05
0.00
(0.09)
DETAIL A
TYPICAL
D
E
T
A
I
L
A
S
C
A
L
E
2
0
.
0
0
0
C
0.9 MAX
(0.2)
SEATING PLANE
0.08 C
SEE DETAIL A
4.4 0.1
SYMM
SEE DETAIL B
8X 0.495 0.1
(0.15)
4X (45 X 0.6)
11
(0.15)
10
21
D
E
T
A
I
L
B
S
C
A
L
E
2
0
.
0
0
0
EXPOSED
THERMAL PAD
DETAIL B
TYPICAL
SYMM
41
4X
4.5
1
30
0.30
40X
36X 0.5
0.18
40
31
PIN 1 ID
(OPTIONAL)
0.1
C B A
0.6
0.4
38X
0.05
C
4223780 /A 06/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
6
机械、封装和可订购信息
版权 © 2018, Texas Instruments Incorporated
提交文档反馈意见
产品主页链接: TPS65313-Q1
TPS65313-Q1
www.ti.com.cn
ZHCSHK1A –FEBRUARY 2018–REVISED SEPTEMBER 2018
EXAMPLE BOARD LAYOUT
RWG0040B
VQFNP - 0.9 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
4.4)
4X (1.43)
4X (1.235)
40
31
40X (0.7)
1
30
40X (0.25)
4X
(1.235)
41
(5.7)
SYMM
4X
(1.43)
36X (0.5)
21
10
(
0.2) VIA
TYP
11
(R0.05) TYP
20
SYMM
(5.7)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4223780 /A 06/2017
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
版权 © 2018, Texas Instruments Incorporated
机械、封装和可订购信息
7
提交文档反馈意见
产品主页链接: TPS65313-Q1
TPS65313-Q1
ZHCSHK1A –FEBRUARY 2018–REVISED SEPTEMBER 2018
www.ti.com.cn
EXAMPLE STENCIL DESIGN
RWG0040B
VQFNP - 0.9 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.43 TYP)
9X ( 1.23)
40
31
40X (0.7)
1
41
30
40X (0.25)
(1.43)
TYP
SYMM
(5.7)
36X (0.5)
21
10
METAL
TYP
11
20
SYMM
(5.7)
(R0.05) TYP
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
PAD 41: 70%
SCALE:15X
4223780 /A 06/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
8
机械、封装和可订购信息
版权 © 2018, Texas Instruments Incorporated
提交文档反馈意见
产品主页链接: TPS65313-Q1
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资
源，不保证其中不含任何瑕疵，且不做任何明示或暗示的担保，包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任：(1) 针对您的应用选择合适的TI 产品；(2) 设计、
验证并测试您的应用；(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更，恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源，也不提供其它TI或任何第三方的知识产权授权
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等，TI对此概不负责，并且您须赔偿由此对TI 及其代表造成的损害。
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122
Copyright © 2019 德州仪器半导体技术（上海）有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
O31310QRWGRQ1
ACTIVE
VQFNP
RWG
40
2000 RoHS & Green
NIPDAUAG
Level-3-260C-168 HR
-40 to 125
TPS653
1310
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Apr-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
O31310QRWGRQ1
VQFNP
RWG
40
2000
330.0
16.4
6.3
6.3
1.3
8.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Apr-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
VQFNP RWG 40
SPQ
Length (mm) Width (mm) Height (mm)
350.0 350.0 43.0
O31310QRWGRQ1
2000
Pack Materials-Page 2
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资
源，不保证其中不含任何瑕疵，且不做任何明示或暗示的担保，包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任：(1) 针对您的应用选择合适的TI 产品；(2) 设计、
验证并测试您的应用；(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更，恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源，也不提供其它TI或任何第三方的知识产权授权
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等，TI对此概不负责，并且您须赔偿由此对TI 及其代表造成的损害。
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122
Copyright © 2020 德州仪器半导体技术（上海）有限公司
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