OPA121KU/2K5 [TI]

OPERATIONAL AMPLIFIER;
OPA121KU/2K5
型号: OPA121KU/2K5
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

OPERATIONAL AMPLIFIER

放大器 光电二极管
文件: 总10页 (文件大小:261K)
中文:  中文翻译
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®
OPA121  
Low Cost Precision Difet®  
OPERATIONAL AMPLIFIER  
FEATURES  
APPLICATIONS  
LOW NOISE: 6nV/Hz typ at 10kHz  
LOW BIAS CURRENT: 5pA max  
LOW OFFSET: 2mV max  
OPTOELECTRONICS  
DATA ACQUISITION  
TEST EQUIPMENT  
LOW DRIFT: 3µV/°C typ  
MEDICAL EQUIPMENT  
HIGH OPEN-LOOP GAIN: 110dB min  
RADIATION HARD EQUIPMENT  
HIGH COMMON-MODE  
REJECTION: 86dB min  
Case (TO-99) and Substrate  
8
DESCRIPTION  
7
The OPA121 is a precision monolithic dielectrically-  
isolated FET (Difet®) operational amplifier. Out-  
standing performance characteristics are now  
available for low-cost applications.  
+V  
CC  
–In  
2
Noise, bias current, voltage offset, drift, open-loop  
gain, common-mode rejection, and power supply  
rejection are superior to BIFET® amplifiers.  
3
Noise-Free  
Cascode*  
+In  
Very low bias current is obtained by dielectric  
isolation with on-chip guarding.  
6
Output  
Laser-trimming of thin-film resistors gives very low  
offset and drift. Extremely low noise is achieved with  
new circuit design techniques (patented). A new  
cascode design allows high precision input specifica-  
tions and reduced susceptibility to flicker noise.  
2kΩ  
2kΩ  
2kΩ  
2kΩ  
Trim  
1
10kΩ  
10kΩ  
5
Trim  
Standard 741 pin configuration allows upgrading of  
existing designs to higher performance levels.  
4
–V  
*Patented  
CC  
OPA121 Simplified Circuit  
Difet®, Burr-Brown Corp.  
BIFET®, National Semiconductor Corp.  
International Airport Industrial Park  
Mailing Address: PO Box 11400  
Cable: BBRCORP  
Tucson, AZ 85734  
Street Address: 6730 S. Tucson Blvd.  
Tucson, AZ 85706  
Tel: (520) 746-1111 Twx: 910-952-1111  
Telex: 066-6491  
FAX: (520) 889-1510  
Immediate Product Info: (800) 548-6132  
© 1984 Burr-Brown Corporation  
PDS-539F  
Printed in U.S.A. September, 1993  
SBOS139  
SPECIFICATIONS  
ELECTRICAL  
At VCC = ±15VDC and TA = +25°C unless otherwise noted. Pin 8 connected to ground.  
OPA121KM  
OPA121KP, KU  
TYP  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
MIN  
MAX  
UNITS  
INPUT  
NOISE  
Voltage, fO = 10Hz  
(1)  
(1)  
(1)  
(1)  
(1)  
(1)  
(1)  
(1)  
40  
15  
8
50  
18  
10  
7
0.8  
2
nV/Hz  
nV/Hz  
nV/Hz  
nV/Hz  
µVrms  
µVp-p  
f
f
f
f
f
O = 100Hz  
O = 1kHz  
O = 10kHz  
B = 10Hz to 10kHz  
B = 0.1Hz to 10 Hz  
6
0.7  
1.6  
15  
0.8  
Current, fB = 0.1Hz to 10Hz  
O = 0.1Hz thru 20kHz  
21  
1.1  
fA, p-p  
fA/Hz  
f
OFFSET VOLTAGE(2)  
Input Offset Voltage  
Average Drift  
VCM = 0VDC  
A = TMIN to TMAX  
±0.5  
±3  
104  
±6  
±2  
±10  
±0.5  
±3  
104  
±6  
±3  
±10  
mV  
µV/°C  
dB  
T
Supply Rejection  
86  
86  
±50  
±5  
±50  
±10  
µV/V  
BIAS CURRENT(2)  
Input Bias Current  
VCM = 0VDC  
Device Operating  
±1  
±1  
pA  
pA  
OFFSET CURRENT(2)  
Input Offset Current  
VCM = 0VDC  
±0.7  
±4  
±0.7  
±8  
Device Operating  
IMPEDANCE  
Differential  
Common-Mode  
1013 || 1  
1014 || 3  
1013 || 1  
1014 || 3  
|| pF  
|| pF  
VOLTAGE RANGE  
Common-Mode Input Range  
Common-Mode Rejection  
±10  
86  
±11  
104  
±10  
82  
±11  
100  
V
dB  
V
IN = ±10VDC  
OPEN-LOOP GAIN, DC  
Open-Loop Voltage Gain  
R
L 2kΩ  
110  
120  
106  
114  
dB  
FREQUENCY RESPONSE  
Unity Gain, Small Signal  
Full Power Response  
Slew Rate  
Settling Time, 0.1%  
0.01%  
2
32  
2
6
10  
2
32  
2
6
10  
MHz  
kHz  
V/µs  
µs  
20Vp-p, RL = 2kΩ  
O = ±10V, RL = 2kΩ  
Gain = –1, RL = 2kΩ  
V
10V Step  
µs  
Overload Recovery,  
50% Overdrive(3)  
Gain = –1  
5
5
µs  
RATED OUTPUT  
Voltage Output  
Current Output  
Output Resistance  
Load Capacitance Stability  
Short Circuit Current  
RL = 2kΩ  
O = ±10VDC  
DC, Open Loop  
Gain = +1  
±11  
±5.5  
±12  
±10  
100  
1000  
40  
±11  
±5.5  
±12  
±10  
100  
1000  
40  
V
mA  
pF  
mA  
V
10  
10  
POWER SUPPLY  
Rated Voltage  
±15  
±15  
VDC  
Voltage Range,  
Derated Performance  
Current, Quiescent  
±5  
±18  
4
±5  
±18  
4.5  
VDC  
mA  
IO = 0mADC  
2.5  
2.5  
TEMPERATURE RANGE  
Specification  
Operating  
Storage  
θ Junction-Ambient  
Ambient Temperature  
Ambient Temperature  
Ambient Temperature  
0
–40  
–65  
+70  
+85  
+150  
0
–25  
–55  
+70  
+85  
+125  
°C  
°C  
°C  
200  
150(4)  
°C/W  
NOTES: (1) Sample tested. (2) Offset voltage, offset current, and bias current are specified with the units fully warmed up. (3) Overload recovery is defined as  
the time required for the output to return from saturation to linear operation following the removal of a 50% input overdrive. (4) 100°C/W for KU grade.  
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes  
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change  
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant  
any BURR-BROWN product for use in life support devices and/or systems.  
®
2
OPA121  
ELECTRICAL (FULL TEMPERATURE RANGE SPECIFICATIONS)  
At VCC = ±15VDC and TA = TMIN to TMAX unless otherwise noted.  
OPA121KM  
OPA121KP, KU  
TYP  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
MIN  
MAX  
UNITS  
TEMPERATURE RANGE  
Specification Range  
Ambient Temperature  
0
+70  
0
+70  
°C  
INPUT  
OFFSET VOLTAGE(1)  
Input Offset Voltage  
Average Drift  
VCM = 0VDC  
±1  
±3  
94  
±3  
±10  
±1  
±3  
94  
±5  
±10  
mV  
µV/°C  
dB  
Supply Rejection  
82  
82  
±20  
±80  
±20  
±80  
µV/V  
BIAS CURRENT(1)  
Input Bias Current  
VCM = 0VDC  
Device Operating  
±23  
±16  
±115  
±23  
±16  
±250  
pA  
pA  
OFFSET CURRENT(1)  
Input Offset Current  
VCM = 0VDC  
±100  
±200  
Device Operating  
VOLTAGE RANGE  
Common-Mode Input Range  
Common-Mode Rejection  
±10  
82  
±11  
98  
±10  
80  
±11  
96  
V
dB  
VIN = ±10VDC  
OPEN-LOOP GAIN, DC  
Open-Loop Voltage Gain  
RL 2kΩ  
106  
116  
100  
110  
dB  
RATED OUTPUT  
Voltage Output  
Current Output  
RL = 2kΩ  
O = ±10VDC  
VO = 0VDC  
±10.5  
±5.25  
10  
±11  
±10  
40  
±10.5  
±5.25  
10  
±11  
±10  
40  
V
mA  
mA  
V
Short Circuit Current  
POWER SUPPLY  
Current, Quiescent  
IO = 0mADC  
2.5  
4.5  
2.5  
5
mA  
NOTE: (1) Offset voltage, offset current, and bias current are measured with the units fully warmed up.  
ABSOLUTE MAXIMUM RATINGS  
CONNECTION DIAGRAMS  
Top View  
M-Package TO-99 (Hermetic)  
Supply ........................................................................................... ±18VDC  
Internal Power Dissipation(1) ......................................................... 500mW  
Differential Input Voltage ............................................................... ±36VDC  
Input Voltage Range ..................................................................... ±18VDC  
Storage Temperature Range  
M package .................................................................... –65°C to +150°C  
P, U packages............................................................... –55°C to +125°C  
Operating Temperature Range  
Substrate and Case  
8
Offset  
Trim  
+VCC  
1
3
7
–In  
2
OPA121  
6
Output  
M package ...................................................................... –40°C to +85°C  
P, U packages................................................................. –25°C to +85°C  
Offset  
Trim  
5
Lead Temperature  
+In  
M, P packages (soldering, 10s) ................................................... +300°C  
U package (soldering, 3s) ........................................................... +260°C  
Output Short-Circuit Duration(2) ............................................... Continuous  
Junction Temperature .................................................................... +175°C  
4
–VCC  
NOTES: (1) Packages must be derated based on θJA = 150°C/W  
(P package); θJA = 200°C/W (M package); θJA = 100°C/W (U package).  
(2) Short circuit may be to power supply common only. Rating applies to  
+25°C ambient. Observe dissipation limit and TJ.  
Top View  
P-Package Plastic Mini-DIP  
U-Package Plastic SOIC  
Offset Trim  
1
2
3
4
8
7
6
5
Substrate  
+VCC  
PACKAGE INFORMATION  
–In  
+In  
PACKAGE DRAWING  
OPA121  
MODEL  
PACKAGE  
NUMBER(1)  
Output  
OPA121KM  
OPA121KP  
OPA121KU  
TO-99  
8-Pin Plastic DIP  
8-Pin SOIC  
001  
006  
182  
–VCC  
Offset Trim  
NOTE: (1) For detailed drawing and dimension table, please see end of data  
sheet, or Appendix D of Burr-Brown IC Data Book.  
ORDERING INFORMATION  
TEMPERATURE  
MODEL  
PACKAGE  
RANGE  
OPA121KM  
OPA121KP  
OPA121KU  
TO-99  
8-Pin Plastic DIP  
8-Pin SOIC  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
®
3
OPA121  
TYPICAL PERFORMANCE CURVES  
TA = +25°C, VCC = ±15VDC unless otherwise noted.  
BIAS AND OFFSET CURRENT  
vs TEMPERATURE  
INPUT VOLTAGE NOISE SPECTRAL DENSITY  
1k  
1k  
100  
10  
1k  
100  
10  
1
KM  
KP, KU  
100  
1
KM  
10  
0.1  
0.1  
1
0.01  
0.01  
1
10  
100  
1k  
10k  
100k  
1M  
–50  
–25  
0
+25  
+50  
+75  
+100  
+125  
Frequency (Hz)  
Ambient Temperature (°C)  
POWER SUPPLY REJECTION  
vs FREQUENCY  
BIAS AND OFFSET CURRENT  
vs INPUT COMMON-MODE VOLTAGE  
140  
120  
100  
80  
10  
1
10  
1
Bias Current  
Offset Current  
60  
KM  
0.1  
0.1  
40  
20  
0
0.01  
0.01  
1
10  
100  
1k  
10k  
100k  
1M  
10M  
–15  
–10  
–5  
0
+5  
+10  
+15  
Frequency (Hz)  
Common-Mode Voltage (V)  
COMMON-MODE REJECTION  
vs FREQUENCY  
OPEN-LOOP FREQUENCY RESPONSE  
KM  
140  
120  
100  
80  
140  
120  
100  
80  
KM  
–45  
Gain  
Ø
–90  
60  
60  
Phase  
Margin  
65°  
–135  
–180  
40  
40  
20  
0
20  
0
1
10  
100  
1k  
10k  
100k  
1M  
10M  
1
10  
100  
1k  
10k  
100k  
1M  
10M  
Frequency (Hz)  
Frequency (Hz)  
®
4
OPA121  
TYPICAL PERFORMANCE CURVES (CONT)  
TA = +25°C, VCC = ±15VDC unless otherwise noted.  
SMALL SIGNAL TRANSIENT RESPONSE  
LARGE SIGNAL TRANSIENT RESPONSE  
+80  
+15  
+40  
0
0
+40  
-15  
+80  
0
1
2
3
4
5
0
25  
50  
Time(µs)  
Time(µs)  
INPUT CURRENTS vs INPUT VOLTAGE  
WITH ±VCC PINS GROUNDED  
+2  
+1  
0
Maximum Safe Current  
I
IN  
V
–1  
–2  
Maximum Safe Current  
–15  
–10  
–5  
0
+5  
+10  
+15  
Input Voltage (V)  
+V  
APPLICATIONS INFORMATION  
CC  
OFFSET VOLTAGE ADJUSTMENT  
7
2
3
The OPA121 offset voltage is laser-trimmed and will require  
no further trim for most applications. As with most ampli-  
fiers, externally trimming the remaining offset can change  
drift performance by about 0.3µV/°C for each 100µV of  
adjusted offset. Note that the trim (Figure 1) is similar to  
operational amplifiers such as 741 and AD547. The OPA121  
can replace most BIFET amplifiers by leaving the external  
null circuit unconnected.  
6
1
OPA121  
5
4
±10mV Typical  
Trim Range  
*
*10kto 1MΩ  
Trim Potentiometer  
(100kRecommended)  
–V  
CC  
FIGURE 1. Offset Voltage Trim.  
INPUT PROTECTION  
Conventional monolithic FET operational amplifiers require  
external current-limiting resistors to protect their inputs  
against destructive currents that can flow when input FET  
gate-to-substrate isolation diodes are forward-biased. Most  
than 6V more negative than –VCC. A 10kseries resistor  
will limit input current to a safe level with up to ±15V input  
levels even if both supply voltages are lost.  
BIFET amplifiers can be destroyed by the loss of –VCC  
.
Static damage can cause subtle changes in amplifier input  
characteristics without necessarily destroying the device. In  
precision operational amplifiers (both bipolar and FET types),  
Unlike BIFET amplifiers, the Difet OPA121 requires input  
current limiting resistors only if its input voltage is greater  
®
5
OPA121  
this may cause a noticeable degradation of offset voltage and  
drift.  
Non-Inverting  
Buffer  
8
Static protection is recommended when handling any  
precision IC operational amplifier.  
8
2
2
Out  
Out  
6
6
OPA121  
OPA121  
GUARDING AND SHIELDING  
3
3
In  
In  
As in any situation where high impedances are involved,  
careful shielding is required to reduce “hum” pickup in input  
leads. If large feedback resistors are used, they should also  
be shielded along with the external input circuitry.  
Inverting  
TO-99 Bottom View  
5
In  
Leakage currents across printed circuit boards can easily  
exceed the bias current of the OPA121. To avoid leakage  
problems, it is recommended that the signal input lead of the  
OPA121 be wired to a Teflon™ standoff. If the OPA121 is  
to be soldered directly into a printed circuit board, utmost  
care must be used in planning the board layout. A “guard”  
pattern should completely surround the high-impedance in-  
put leads and should be connected to a low-impedance point  
which is at the signal input potential.  
4
6
7
3
2
2
3
Out  
6
OPA121  
8
8
1
Mini-DIP Bottom View  
1
8
7
6
5
BOARD LAYOUT  
FOR INPUT GUARDING  
Guard top and bottom of board.  
Alternate: use Teflon standoff  
for sensitive input pins.  
The amplifier case should be connected to any input shield  
or guard via pin 8. This insures that the amplifier itself is  
fully surrounded by guard potential, minimizing both leak-  
age and noise pickup (see Figure #2).  
2
3
4
If guarding is not required, pin 8 (case) should be connected  
to ground.  
FIGURE 2. Connection of Input Guard.  
BIAS CURRENT CHANGE  
VERSUS COMMON-MODE VOLTAGE  
80  
LF156/157  
AD547  
T = +25°C; curves taken from  
mfg. published typical data  
60  
A
70  
The input bias currents of most popular BIFET operational  
amplifiers are affected by common-mode voltage (Figure 3).  
Higher input FET gate-to-drain voltage causes leakage and  
ionization (bias) currents to increase. Due to its cascode  
input stage, the extremely-low bias current of the OPA121  
is not compromised by common-mode voltage.  
50  
40  
LF155  
LF156/157  
30  
20  
LF155  
AD547  
OPA121  
10  
0
OPA121  
–10  
–20  
OP-15/16/17 "Perfect Bias Current Cancellation"  
Teflon™ E.I. du Pont de Nemours & Co.  
–10  
–5  
0
+5  
+10  
Common-Mode Voltage (VDC)  
FIGURE 3. Input Bias Current vs Common-Mode Voltage.  
®
6
OPA121  
PACKAGE OPTION ADDENDUM  
www.ti.com  
12-Feb-2009  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
TO-99  
TO-99  
PDIP  
PDIP  
SOIC  
Drawing  
OPA121KM  
OPA121KM3  
OPA121KP  
OPA121KP4  
OPA121KU  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
LMC  
LMC  
P
8
8
8
8
8
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
P
D
75 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
OPA121KU/2K5  
OPA121KU/2K5G4  
OPA121KUE4  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
D
D
D
8
8
8
2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
75 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Apr-2009  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
OPA121KU/2K5  
SOIC  
D
8
2500  
330.0  
12.4  
6.4  
5.2  
2.1  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Apr-2009  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SOIC  
SPQ  
Length (mm) Width (mm) Height (mm)  
346.0 346.0 29.0  
OPA121KU/2K5  
D
8
2500  
Pack Materials-Page 2  
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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
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