OPA177GP [TI]

精密运算放大器 | P | 8 | -40 to 85;
OPA177GP
型号: OPA177GP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

精密运算放大器 | P | 8 | -40 to 85

放大器 光电二极管 运算放大器
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®
OPA177  
OPA177  
OPA177  
Precision  
OPERATIONAL AMPLIFIER  
FEATURES  
APPLICATIONS  
LOW OFFSET VOLTAGE: 25µV max  
PRECISION INSTRUMENTATION  
LOW DRIFT: 0.3µV/°C  
DATA ACQUISITION  
TEST EQUIPMENT  
HIGH OPEN-LOOP GAIN: 130dB min  
LOW QUIESCENT CURRENT: 1.5mA typ  
BRIDGE AMPLIFIER  
THERMOCOUPLE AMPLIFIER  
REPLACES INDUSTRY-STANDARD OP  
AMPS: OP-07, OP-77, OP-177, AD707,  
ETC.  
DESCRIPTION  
The OPA177 precision bipolar op amp feature very  
low offset voltage and drift. Laser-trimmed offset,  
drift and input bias current virtually eliminate the need  
for costly external trimming. The high performance  
and low cost make them ideally suited to a wide range  
of precision instrumentation.  
electric effects in input interconnections. It provides  
an effective alternative to chopper-stabilized amplifi-  
ers. The low noise of the OPA177 maintains accuracy.  
OPA177 performance gradeouts are available. Pack-  
aging options include 8-pin plastic DIP  
and SO-8 surface-mount packages.  
The low quiescent current of the OPA177 dramati-  
cally reduce warm-up drift and errors due to thermo-  
V+  
7
14k  
Trim  
1
Trim  
8
25Ω  
VO  
6
30Ω  
500Ω  
500Ω  
+In  
3
–In  
2
20µA  
V–  
4
International Airport Industrial Park  
Mailing Address: PO Box 11400, Tucson, AZ 85734  
FAXLine: (800) 548-6133 (US/Canada Only)  
• Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111  
Internet: http://www.burr-brown.com/  
Cable: BBRCORP  
Telex: 066-6491  
FAX: (520) 889-1510  
Immediate Product Info: (800) 548-6132  
©1990 Burr-Brown Corporation  
PDS-1081E  
Printed in U.S.A. August, 1997  
SBOS008  
OPA177 SPECIFICATIONS  
At VS = ±15V, TA = +25°C, unless otherwise noted.  
OPA177F  
MAX  
OPA177G  
PARAMETER  
CONDITION  
MIN  
TYP  
MIN  
TYP  
MAX  
UNITS  
OFFSET VOLTAGE  
Input Offset Voltage  
10  
25  
20  
60  
µV  
Long-Term Input Offset(1)  
Voltage Stability  
0.3  
0.4  
µV/Mo  
Offset Adjustment Range  
Power Supply Rejection Ratio  
R
P = 20kΩ  
±3  
125  
120  
mV  
dB  
V
S = ±3V to ±18V  
115  
110  
INPUT BIAS CURRENT  
Input Offset Current  
Input Bias Current  
0.3  
0.5  
1.5  
±2  
2.8  
±2.8  
nA  
nA  
NOISE  
Input Noise Voltage  
Input Noise Current  
1Hz to 100Hz(2)  
1Hz to 100Hz  
85  
4.5  
150  
nVrms  
pArms  
INPUT IMPEDANCE  
Input Resistance  
Differential Mode(3)  
Common-Mode  
26  
45  
200  
18.5  
MΩ  
GΩ  
INPUT VOLTAGE RANGE  
Common-Mode Input Range(4)  
Common-Mode Rejection  
±13  
130  
±14  
140  
115  
V
dB  
V
CM = ±13V  
OPEN-LOOP GAIN  
Large Signal Voltage Gain  
RL 2kΩ  
O = ±10V(5)  
V
5110  
12,000  
2000  
6000  
V/mV  
OUTPUT  
Output Voltage Swing  
R
R
R
L 10kΩ  
L 2kΩ  
L 1kΩ  
±13.5  
±12.5  
±12  
±14  
±13  
±12.5  
60  
V
V
V
Open-Loop Output Resistance  
FREQUENCY RESPONSE  
Slew Rate  
Closed-Loop Bandwidth  
R
L 2kΩ  
0.1  
0.4  
0.3  
0.6  
V/µs  
MHz  
G = +1  
POWER SUPPLY  
Power Consumption  
V
V
S = ±15V, No Load  
S = ±3V, No Load  
40  
3.5  
1.3  
60  
4.5  
2
mW  
mW  
mA  
Supply Current  
VS = ±15V, No Load  
At VS = ±15V, –40°C TA +85°C, unless otherwise noted.  
OFFSET VOLTAGE  
Input Offset Voltage  
Average Input Offset  
Voltage Drift  
15  
0.1  
40  
0.3  
20  
0.7  
100  
1.2  
µV  
µV/°C  
Power Supply Rejection Ratio  
VS = ±3V to ±18V  
110  
120  
106  
115  
dB  
INPUT BIAS CURRENT  
Input Offset Current  
Average Input Offset Current  
Drift(6)  
0.5  
1.5  
2.2  
40  
4.5  
85  
nA  
pA/°C  
Input Bias Current  
Average Input Bias Current  
Drift(6)  
0.5  
8
±4  
40  
15  
±6  
60  
nA  
pA/°C  
INPUT VOLTAGE RANGE  
Common-Mode Input Range  
Common-Mode Rejection  
±13  
120  
±13.5  
140  
110  
V
dB  
V
CM = ±13V  
OPEN-LOOP GAIN  
Large Signal Voltage Gain  
R
L 2k, VO = ±10V  
2000  
6000  
1000  
4000  
V/mV  
V
OUTPUT  
Output Voltage Swing  
RL 2kΩ  
±12  
±13  
POWER SUPPLY  
Power Consumption  
Supply Current  
V
V
S = ±15V, No Load  
S = ±15V, No Load  
60  
2
75  
25  
mW  
mA  
Same as specification for product to left.  
NOTES: (1) Long-Term Input Offset Voltage Stability refers to the averaged trend line of VOS vs time over extended periods after the first 30 days of operation. Excluding  
the initial hour of operation, changes in VOS during the first 30 operating days are typically less than 2µV. (2) Sample tested. (3) Guaranteed by design. (4) Guaranteed  
by CMRR test condition. (5) To insure high open-loop gain throughout the ±10V output range, AOL is tested at –10V VO 0V, 0V VO +10V, and –10V VO +10V.  
(6) Guaranteed by end-point limits.  
®
2
OPA177  
PIN CONFIGURATION  
ABSOLUTE MAXIMUM RATINGS  
Power Supply Voltage ....................................................................... ±22V  
Differential Input Voltage ................................................................... ±30V  
Input Voltage ....................................................................................... ±VS  
Output Short Circuit ................................................................. Continuous  
Operating Temperature:  
Plastic DIP (P), SO-8 (S) .............................................. –40°C to +85°C  
θJA (PDIP) ................................................................................. 100°C/W  
θJA (SOIC)................................................................................. 160°C/W  
Storage Temperature:  
Plastic DIP (P), SO-8 (S) ............................................ –65°C to +125°C  
Junction Temperature .................................................................... +150°C  
Lead Temperature (soldering, 10s) P packages ........................... +300°C  
(soldering, 3s) S package............................... +260°C  
Top View  
DIP/SOIC  
1
2
3
4
8
7
6
5
Offset Trim  
Offset Trim  
V+  
VO  
–In  
+In  
V–  
No Internal Connection  
PACKAGE/ORDERING INFORMATION  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
PACKAGE  
DRAWING TEMPERATURE  
PRODUCT  
PACKAGE  
NUMBER(1)  
RANGE  
Any integrated circuit can be damaged by ESD. Burr-Brown  
recommends that all integrated circuits be handled with  
appropriate precautions. ESD can cause damage ranging  
from subtle performance degradation to complete device  
failure. Precision integrated circuits may be more suscep-  
tible to damage because very small parametric changes  
could cause the device not to meet published specifications.  
OPA177FP  
OPA177GP  
OPA177GS  
8-Pin Plastic DIP  
8-Pin Plastic DIP  
SO-8 Surface-Mount  
006  
006  
182  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
NOTE: (1) For detailed drawing and dimension table, please see end of data  
sheet, or Appendix C of Burr-Brown IC Data Book.  
Burr-Brown’s standard ESD test method consists of five  
1000V positive and negative discharges (100pF in series  
with 1.5k) applied to each pin.  
Failure to observe proper handling procedures could result  
in small changes to the OPA177’s input bias current.  
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes  
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change  
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant  
any BURR-BROWN product for use in life support devices and/or systems.  
®
3
OPA177  
TYPICAL PERFORMANCE CURVES  
At TA = +25°C, VS = ±15V, unless otherwise noted.  
TOTAL HARMONIC DISTORTION AND NOISE  
vs FREQUENCY  
1
MAXIMUM VOUT vs IOUT  
(Negative Swing)  
–17.5  
–15  
–12.5  
–10  
–7.5  
–5  
A = 20dB, 3Vrms, 10kload  
VS = ±18V  
VS = ±15V  
VS = ±12V  
0.1  
Inverting  
Noninverting  
0.01  
VS = ±15V  
–2.5  
0
30kHz low pass filtered  
0.001  
1k  
10k  
100k  
0
–2  
–4  
–6  
–8  
–10  
–12  
Frequency (Hz)  
–IOUT (mA)  
MAXIMUM VOUT vs IOUT  
(Positive Swing)  
WARM-UP OFFSET VOLTAGE DRIFT  
3
2
17.5  
15  
VS = ±18V  
VS = ±15V  
12.5  
10  
1
0
VS = ±12V  
7.5  
5
–1  
–2  
–3  
2.5  
0
VS = ±15V  
0
15  
30  
45  
60  
75  
90  
105  
120  
0
6
12  
18  
24  
30  
36  
Time from Power Supply Turn-On (s)  
I
OUT (mA)  
OFFSET VOLTAGE CHANGE  
DUE TO THERMAL SHOCK  
CLOSED-LOOP RESPONSE vs FREQUENCY  
30  
25  
20  
15  
10  
5
100  
80  
60  
40  
20  
0
Device Immersed in 70°C Inert Liquid  
Plastic DIP  
0
–20  
0
10  
20  
30  
40  
50  
60  
70  
80  
10  
100  
1k  
10k  
100k  
1M  
10M  
Time (s)  
Frequency (Hz)  
®
4
OPA177  
TYPICAL PERFORMANCE CURVES (CONT)  
At TA = +25°C, VS = ±15V, unless otherwise noted.  
CMRR vs FREQUENCY  
OPEN-LOOP GAIN/PHASE vs FREQUENCY  
160  
140  
120  
100  
80  
0
150  
140  
130  
120  
110  
100  
90  
Gain  
45  
90  
135  
180  
Phase  
60  
40  
20  
0
80  
0.01  
0.1  
1
10  
100  
1k  
10k 100k  
1M  
1
–40  
1
10  
100  
1k  
10k  
100k  
Frequency (Hz)  
Frequency (Hz)  
INPUT BIAS AND INPUT OFFSET CURRENT  
vs TEMPERATURE  
POWER SUPPLY REJECTION  
vs FREQUENCY  
2
150  
130  
110  
90  
1
0
IB  
IOS  
–1  
–2  
70  
50  
–15  
10  
35  
60  
85  
0.1  
1
10  
100  
1k  
10k  
Temperature (°C)  
Frequency (Hz)  
TOTAL NOISE vs BANDWIDTH  
(0.1Hz to Frequency Indicated)  
INPUT NOISE VOLTAGE DENSITY vs FREQUENCY  
1k  
100  
10  
10  
1
RS1 = RS2 = 200kΩ  
Thermal noise of  
source resistors  
included.  
RS = 0  
0.1  
0.01  
1
10  
100  
Frequency (Hz)  
1k  
10k  
100  
1k  
10k  
100k  
Bandwidth (Hz)  
®
5
OPA177  
TYPICAL PERFORMANCE CURVES (CONT)  
At TA = +25°C, VS = ±15V, unless otherwise noted.  
MAXIMUM OUTPUT SWING vs FREQUENCY  
POWER CONSUMPTION vs POWER SUPPLY  
100  
10  
1
32  
28  
24  
20  
16  
12  
8
G = +1  
RL = 2k  
4
0
1k  
10k  
100k  
Frequency (Hz)  
1M  
0
10  
20  
30  
40  
Total Supply Voltage (V)  
OUTPUT SHORT-CIRCUIT CURRENT vs TIME  
MAXIMUM OUTPUT VOLTAGE vs LOAD RESISTANCE  
40  
35  
30  
25  
20  
15  
20  
15  
10  
5
Positive  
Output  
Negative  
Output  
ISC  
+
ISC  
0
0
1
2
3
4
100  
1k  
10k  
Time from Output Being Shorted (min)  
Load Resistance to Ground ()  
®
6
OPA177  
APPLICATIONS INFORMATION  
V+  
The OPA177 is unity-gain stable, making it easy to use and  
free from oscillations in the widest range of circuitry. Ap-  
plications with noisy or high impedance power supply lines  
may require decoupling capacitors close to the device pins.  
In most cases 0.1µF ceramic capacitors are adequate.  
20kΩ  
1
2
3
8
The OPA177 has very low offset voltage and drift. To  
achieve highest performance, circuit layout and mechanical  
conditions must be optimized. Offset voltage and drift can  
be degraded by small thermoelectric potentials at the op amp  
inputs. Connections of dissimilar metals will generate ther-  
mal potential which can mask the ultimate performance of  
the OPA177. These thermal potentials can be made to cancel  
by assuring that they are equal in both input terminals.  
VIN  
OPA177  
VOUT  
Trim Range is approximately ±3.0mV  
FIGURE 1. Optional Offset Nulling Circuit.  
NOISE PERFORMANCE  
1. Keep connections made to the two input terminals close  
together.  
The noise performance of the OPA177 is optimized for  
circuit impedances in the range of 2kto 50k. Total noise  
in an application is a combination of the op amp’s input  
voltage noise and input bias current noise reacting with  
circuit impedances. For applications with higher source  
impedance, the OPA627 FET-input op amp will generally  
provide lower noise. For very low impedance applications,  
the OPA27 will provide lower noise.  
2. Locate heat sources as far as possible from the critical  
input circuitry.  
3. Shield the op amp and input circuitry from air currents  
such as cooling fans.  
OFFSET VOLTAGE ADJUSTMENT  
The OPA177 has been laser-trimmed for low offset voltage  
and drift so most circuits will not require external adjust-  
ment. Figure 1 shows the optional connection of an external  
potentiometer to adjust offset voltage. This adjustment should  
not be used to compensate for offsets created elsewhere in a  
system since this can introduce excessive temperature drift.  
INPUT BIAS CURRENT CANCELLATION  
The input stage base current of the OPA177 is internally  
compensated with an equal and opposite cancellation cur-  
rent. The resulting input bias current is the difference  
between the input stage base current and the cancellation  
current. This residual input bias current can be positive or  
negative.  
INPUT PROTECTION  
The inputs of the OPA177 are protected with 500series  
input resistors and diode clamps as shown in the simplified  
circuit diagram. The inputs can withstand ±30V differential  
inputs without damage. The protection diodes will, of course,  
conduct current when the inputs are overdriven. This may  
disturb the slewing behavior of unity-gain follower applica-  
tions, but will not damage the op amp.  
When the bias current is cancelled in this manner, the input  
bias current and input offset current are approximately the  
same magnitude. As a result, it is not necessary to balance  
the DC resistance seen at the two input terminals (Figure 2).  
A resistor added to balance the input resistances may actu-  
ally increase offset and noise.  
R2  
R2  
R1  
Op Amp  
R1  
OPA177  
RB = R2 || R1  
No bias current  
cancellation resistor needed  
(a)  
(b)  
Conventional op amp with  
external bias current  
cancellation resistor.  
OPA177 with no external  
bias current cancellation  
resistor.  
FIGURE 2. Input Bias Current Cancellation.  
®
7
OPA177  
PACKAGE OPTION ADDENDUM  
www.ti.com  
29-Jun-2023  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
OPA177FP  
OPA177FPG4  
OPA177GP  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
PDIP  
PDIP  
PDIP  
SOIC  
P
P
P
P
D
8
8
8
8
8
50  
50  
50  
50  
75  
RoHS & Green  
RoHS & Green  
RoHS & Green  
RoHS & Green  
RoHS & Green  
NIPDAU  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
Level-3-260C-168 HR  
OPA177FP  
Samples  
Samples  
Samples  
Samples  
Samples  
NIPDAU  
NIPDAU  
NIPDAU  
NIPDAU  
OPA177FP  
OPA177GP  
OPA177GP  
-40 to 85  
-40 to 85  
OPA177GPG4  
OPA177GS  
OPA  
177GS  
OPA177GS/2K5  
OPA177GS/2K5E4  
OPA177GS/2K5G4  
OPA177GSG4  
ACTIVE  
ACTIVE  
ACTIVE  
LIFEBUY  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
8
8
8
8
2500 RoHS & Green  
2500 RoHS & Green  
2500 RoHS & Green  
NIPDAU  
NIPDAU  
NIPDAU  
NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
OPA  
177GS  
Samples  
Samples  
Samples  
OPA  
177GS  
OPA  
177GS  
75  
RoHS & Green  
OPA  
177GS  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
29-Jun-2023  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
2-Dec-2022  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
OPA177GS/2K5  
SOIC  
D
8
2500  
330.0  
12.4  
6.4  
5.2  
2.1  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
2-Dec-2022  
TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SOIC  
SPQ  
Length (mm) Width (mm) Height (mm)  
356.0 356.0 35.0  
OPA177GS/2K5  
D
8
2500  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
2-Dec-2022  
TUBE  
T - Tube  
height  
L - Tube length  
W - Tube  
width  
B - Alignment groove width  
*All dimensions are nominal  
Device  
Package Name Package Type  
Pins  
SPQ  
L (mm)  
W (mm)  
T (µm)  
B (mm)  
OPA177FP  
OPA177FPG4  
OPA177GP  
P
P
P
P
D
D
PDIP  
PDIP  
PDIP  
PDIP  
SOIC  
SOIC  
8
8
8
8
8
8
50  
50  
50  
50  
75  
75  
506  
506  
13.97  
13.97  
13.97  
13.97  
8
11230  
11230  
11230  
11230  
3940  
4.32  
4.32  
4.32  
4.32  
4.32  
4.32  
506  
OPA177GPG4  
OPA177GS  
506  
506.6  
506.6  
OPA177GSG4  
8
3940  
Pack Materials-Page 3  
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