OPA211A [TI]

1.1nV/Noise, Low Power, Precision Operational Amplifier in Tiny DFN-8 Package; 1.1nV /噪声，低功耗，采用微型DFN -8封装的高精度运算放大器


型号：	OPA211A
厂家：	TEXAS INSTRUMENTS
描述：	1.1nV/Noise, Low Power, Precision Operational Amplifier in Tiny DFN-8 Package 1.1nV /噪声，低功耗，采用微型DFN -8封装的高精度运算放大器运算放大器
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中文：	中文翻译
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OPA211

OPA2211

SBOS377A–OCTOBER 2006–REVISED FEBRUARY 2007

1.1nV/√Hz Noise, Low Power, Precision

Operational Amplifier in Tiny DFN-8 Package

FEATURES

DESCRIPTION

•

LOW-VOLTAGE NOISE: 1.1nV/√Hz at 1kHz

100nV_PPINPUT VOLTAGE NOISE, 0.1Hz–10Hz

LOW OFFSET VOLTAGE: 100µV (max)

LOW OFFSET VOLTAGE DRIFT: 0.2µV/°C (typ)

LOW SUPPLY CURRENT: 3.6mA/Ch

UNITY GAIN STABLE

The OPA211 series achieves very low 1.1nV/√Hz

noise density with a supply current of only 3.6mA. It

also offers rail-to-rail output swing, which helps to

maximize dynamic range.

The OPA211 series’ extremely low voltage and

current noise, high speed and wide output swing

make it an excellent choice as a loop filter amplifier

in PLL applications.

GAIN BANDWIDTH PRODUCT:

80MHz (G = 100)

In precision data acquisition applications, the

OPA211 series of op amps provide <1µs settling

time to 16-bit accuracy even for 10V output swings.

This ac performance, combined with only 100µV of

offset and low drift over temperature, make the

•

SLEW RATE: 27V/µs

WIDE SUPPLY RANGE:

±2.25V to ±18V, +4.5V to +36V

•

RAIL-TO-RAIL OUTPUT

OUTPUT CURRENT: 30mA

SHUTDOWN: 20µA (max)

OPA211

high-precision analog-to-digital converters (ADCs) or

buffering the outputs of high-resolution

digital-to-analog converters (DACs).

highly

suitable

for

driving

fast,

AVAILABLE IN TINY DFN-8 (3x3mm), MSOP-8,

SO-8

The OPA211 is specified over the very wide

dual-power supply range of ±2.25V to ±18V, or

single-supply operation from +4.5V to +36V.

APPLICATIONS

•

PLL LOOP FILTER

LOW-NOISE, LOW-POWER SIGNAL

PROCESSING

HIGH-PERFORMANCE ADC DRIVERS

HIGH-PERFORMANCE DAC OUTPUT

AMPLIFIER

The OPA211 is available in the tiny DFN-8 (3×3mm)

and MSOP-8 and SO-8 packages. A dual version,

the OPA2211, is available in the DFN-8 (3×3mm) or

an MSOP-8 package. This series of op amps is

specified from –40°C to +125°C.

•

OPA211

•

ACTIVE FILTERS

-IN

+IN

V-

Enable

V+

LOW-NOISE INSTRUMENTATION AMPS

ULTRASOUND AMPLIFIERS

PROFESSIONAL AUDIO PREAMPLIFIERS

LOW-NOISE FREQUENCY SYNTHESIZERS

INFRARED DETECTOR AMPLIFIERS

HYDROPHONE AMPLIFIERS

MEDICAL

OUT

MSOP-8

OPA2211

OUT A

-IN A

+IN A

V-

V+

OUT B

-IN B

+IN B

MSOP-8

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCT PREVIEW information concerns products in the

formative or design phase of development. Characteristic data and

other specifications are design goals. Texas Instruments reserves

the right to change or discontinue these products without notice.

OPA211

OPA2211

www.ti.com

SBOS377A–OCTOBER 2006–REVISED FEBRUARY 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

ABSOLUTE MAXIMUM RATINGS⁽¹⁾

Over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

Supply Voltage

±20

(V–) – 0.7 to (V+) + 0.7

±10

Input Voltage

Input Current

Output Short-Circuit⁽²⁾

Operating Temperature

Storage Temperature

Junction Temperature

Continuous

–55 to +150

–65 to +150

+150

°C

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2) Short-circuit to ground, one amplifier per package.

PACKAGE/ORDERING INFORMATION⁽¹⁾

PACKAGE

PRODUCT

PACKAGE-LEAD

SINGLE

ENABLE

DUAL

DESIGNATOR

PACKAGE MARKING

Standard Grade

DFN-8 (3×3mm)⁽²⁾

MSOP-8⁽²⁾

DRG

DCK

TBD

OPA211A

SO-8

DFN-8 (3×3mm)⁽²⁾

MSOP-8⁽²⁾

DRG

DCK

OPA2211A

High Grade

DFN-8 (3×3mm)⁽²⁾

MSOP-8⁽²⁾

DRG

DCK

TBD

OPA211I

SO-8

DFN-8 (3×3mm)⁽²⁾

MSOP-8⁽²⁾

DRG

DCK

OPA2211I

(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Available Q4, 2007.

Submit Documentation Feedback

OPA211

OPA2211

www.ti.com

SBOS377A–OCTOBER 2006–REVISED FEBRUARY 2007

PIN CONFIGURATIONS

OPA211

NC⁽¹⁾

-IN

+IN

V-

NC⁽¹⁾

V+

NC⁽¹⁾

-IN

+IN

V-

NC⁽¹⁾

-IN

+IN

V-

Enable⁽³⁾

V+

Enable⁽³⁾

V+

Exposed

Thermal

Die Pad

OUT

NC⁽¹⁾

OUT

Underside⁽²⁾

NC⁽¹⁾

DFN-8 (3x3mm)

SO-8

MSOP-8

OPA2211

V+

OUT A

-IN A

+IN A

V-

OUT A

-IN A

+IN A

V-

V+

Exposed

Thermal

Die Pad

OUT B

-IN B

+IN B

OUT B

-IN B

+IN B

Underside⁽²⁾

DFN-8 (3x3mm)

MSOP-8

(1) NC denotes no internal connection. Pin can be left floating or connected to any voltage between (V-) and (V+).

(2) Connect thermal die pad to V-.

(3) Enable function: (V-) £ ENABLED £ (V+) - 3V; DISABLED ³ (V+) - 0.35V.

Submit Documentation Feedback

OPA211

OPA2211

www.ti.com

SBOS377A–OCTOBER 2006–REVISED FEBRUARY 2007

ELECTRICAL CHARACTERISTICS: V_S= ±2.25V to ±18V

BOLDFACE limits apply over the specified temperature range, T_A= –40°C to +125°C.

At T_A= +25°C and R_L= 10kΩ, unless otherwise noted.

Standard Grade

OPA211A, OPA2211A

High Grade

OPA211I, OPA2211I⁽¹⁾

PARAMETER

OFFSET VOLTAGE

CONDITIONS

±15V

MIN

TYP

MAX

MIN

TYP

MAX

TBD

UNIT

Input Offset Voltage

Drift

V_OS

dV_OS/dT

PSRR

±20

±100

±20

µV

0.35

µV/°C

µV/V

vs Power Supply

INPUT BIAS CURRENT

Input Bias Current

Over Temperature

Offset Current

V_S= ±2.25V to ±18V

V_CM= 0V

I_B

TBD

150

TBD

100

TBD

I_OS

V_CM= 0V

Over Temperature

NOISE

TBD

Input Voltage Noise:

f = 0.1Hz to 10Hz

Voltage Noise Density:

f = 10Hz

e_n

0.1

µV_PP

2.5

1.6

1.1

2.5

1.6

1.1

nV/√Hz

f = 100Hz

f = 1kHz

Input Current Noise Density:

f = 10Hz

i_n

TBD

1.5

TBD

1.5

pA/√Hz

f = 1kHz

INPUT VOLTAGE RANGE

Common-Mode Voltage

Range

V_CM

(V–)+1.8

114

(V+)–1.4

(V–)+1.8

114

(V+)–1.4

Common-Mode Rejection

Ratio

CMRR (V–)+1.8V < V_CM< (V+)–1.4V

120

INPUT IMPEDANCE

Differential

10¹⁰||TBD

10⁹|| 2

10¹⁰||TBD

10⁹|| 2

Ω || pF

Common-Mode

OPEN-LOOP GAIN

Open-Loop Voltage Gain

A_OL(V–)+0.2V < V_O< (V+)–0.2V,

R_L= 10kΩ

114

110

120

114

110

120

114

A_OL(V–)+0.6V < V_O< (V+)–0.6V,

R_L= 600Ω

Over Temperature

(V–)+0.6V < V_O< (V+)–0.6V,

R_L= 600Ω, I_O< 25mA

FREQUENCY RESPONSE

Gain-Bandwidth Product

GBW

G = 100

G = 1

MHz

V/µs

µs

Slew Rate

Settling Time, 0.01%

0.0015% (16-bit)

Overload Recovery Time

t_SG = –1, 10V Step, C_L= 100pF

G = –1, 10V Step, C_L= 100pF

G = –1

TBD

< 1

TBD

< 1

µs

Total Harmonic Distortion +

Noise

G = +10, f = 20kHz,

V_O= 20V_PP, 600Ω

THD+N

TBD

(1) Shaded cells indicate different specifications from low-grade version of device.

Submit Documentation Feedback

OPA211

OPA2211

www.ti.com

SBOS377A–OCTOBER 2006–REVISED FEBRUARY 2007

ELECTRICAL CHARACTERISTICS: V_S= ±2.25V to ±18V (continued)

BOLDFACE limits apply over the specified temperature range, T_A= –40°C to +125°C.

At T_A= +25°C and R_L= 10kΩ, unless otherwise noted.

Standard Grade

OPA211A, OPA2211A

High Grade

OPA211I, OPA2211I⁽¹⁾

PARAMETER

CONDITIONS

MIN

TYP

MAX

MIN

TYP

MAX

UNIT

OUTPUT

Voltage Output

V_OUT

R_L= 10kΩ, A_OL> 114dB

R_L= 600Ω, A_OL> 110dB

(V–)+0.2

(V+)–0.2

(V–)+0.2

(V+)–0.2

(V–)+0.6

(V+)–0.6

(V–)+0.6

(V+)–0.6

R_L= 600Ω, A_OL> 110dB,

(V–)+0.6

(V+)–0.6

(V–)+0.6

(V+)–0.6

I_O< 25mA

Short-Circuit Current

Capacitive Load Drive

POWER SUPPLY

Specified Voltage

I_SC

+30/–45

C_LOAD

See Typical Characteristics

V_S

I_Q

±2.25

±18

±2.25

±18

Quiescent Current

(per channel)

I_OUT= 0

3.6

TBD

3.6

TBD

Over Temperature

Shutdown Current

TBD

µA

Disabled

Enabled

Disabled

TBD

ENABLE Pin Input Voltage

TEMPERATURE RANGE

Specified Range

(V+)–3

(V+)–0.35

–40

–55

+125

+150

–40

–55

+125

+150

°C

Operating Range

Thermal Resistance

Soldered to approximately

5cm × 5cm copper area

DFN (3mm × 3mm)

°C/W

SO-8, MSOP-8

150

Submit Documentation Feedback

PACKAGE OPTION ADDENDUM

www.ti.com

30-Jan-2007

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

SOIC

MSOP

SOIC

Drawing

OPA211AID

OPA211AIDGKR

OPA211AIDGKT

OPA211AIDR

PREVIEW

DGK

2500

250

2500

TBD

Call TI

POPA211AID

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

IMPORTANT NOTICE

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enhancements, improvements, and other changes to its products and services at any time and to

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TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent

TI deems necessary to support this warranty. Except where mandated by government requirements, testing

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TI assumes no liability for applications assistance or customer product design. Customers are responsible

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Mailing Address:

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Post Office Box 655303 Dallas, Texas 75265

OPA211A [TI]

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