OPA2277UA/2K5E4 [TI]
10µV、0.1µV/˚C、高精密、低功耗运算放大器 | D | 8 | -40 to 85;
| 型号： | OPA2277UA/2K5E4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 10µV、0.1µV/˚C、高精密、低功耗运算放大器 | D | 8 | -40 to 85 放大器 运算放大器 放大器电路 |
| 文件： | 总27页 (文件大小：1457K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
O
O
P
A
2
2
P
A
2
O
7
7
7
P
A
4
7
OPA277
OPA2277
OPA4277
2
7
7
OPA2277
OPA277
O
P
A
4277
O
P
O
P
A
A
2
2
2
7
7
7
7
SBOS079A – MARCH 1999 – REVISED APRIL 2005
High Precision
OPERATIONAL AMPLIFIERS
FEATURES
DESCRIPTION
The OPA277 series precision op amps replace the industry
standard OP-177. They offer improved noise, wider output
voltage swing, and are twice as fast with half the quiescent
current. Features include ultra low offset voltage and drift, low
bias current, high common-mode rejection, and high power
supply rejection. Single, dual, and quad versions have identical
specifications for maximum design flexibility.
ꢀ ULTRA LOW OFFSET VOLTAGE: 10µV
ꢀ ULTRA LOW DRIFT: ±0.1µV/°C
ꢀ HIGH OPEN-LOOP GAIN: 134dB
ꢀ HIGH COMMON-MODE REJECTION: 140dB
ꢀ HIGH POWER SUPPLY REJECTION: 130dB
ꢀ LOW BIAS CURRENT: 1nA max
OPA277 series op amps operate from ±2V to ±18V supplies with
excellent performance. Unlike most op amps which are specified
at only one supply voltage, the OPA277 series is specified for
real-world applications; a single limit applies over the ±5V to
±15V supply range. High performance is maintained as the
amplifiers swing to their specified limits. Because the initial offset
voltage (±20µV max) is so low, user adjustment is usually not
required. However, the single version (OPA277) provides exter-
nal trim pins for special applications.
ꢀ WIDE SUPPLY RANGE: ±2V to ±18V
ꢀ LOW QUIESCENT CURRENT: 800µA/amplifier
ꢀ SINGLE, DUAL, AND QUAD VERSIONS
ꢀ REPLACES OP-07, OP-77, OP-177
APPLICATIONS
ꢀ TRANSDUCER AMPLIFIER
OPA277 op amps are easy to use and free from phase inversion
and overload problems found in some other op amps. They are
stable in unity gain and provide excellent dynamic behavior over
a wide range of load conditions. Dual and quad versions feature
completely independent circuitry for lowest crosstalk and free-
dom from interaction, even when overdriven or overloaded.
ꢀ BRIDGE AMPLIFIER
ꢀ TEMPERATURE MEASUREMENTS
ꢀ STRAIN GAGE AMPLIFIER
ꢀ PRECISION INTEGRATOR
ꢀ BATTERY POWERED INSTRUMENTS
ꢀ TEST EQUIPMENT
Single (OPA277) and dual (OPA2277) versions are available
in DIP-8, SO-8, and DFN-8 (4mm x 4mm) packages. The quad
(OPA4277) comes in DIP-14 and SO-14 surface-mount pack-
ages. All are fully specified from –40°C to +85°C and operate
OPA277
Offset Trim
1
2
3
4
8
7
6
5
Offset Trim
V+
from –55°C to +125°C.
OPA277AIDRM
–In
+In
V–
Output
NC
Offset Trim
−In
1
2
3
4
8
7
6
5
Offset Trim
V+
OPA4277
Pin 1
Indicator
Out A
–In A
+In A
V+
1
14 Out D
13 –In D
12 +In D
11 V–
8-Pin DIP, SO-8
2
3
4
5
6
7
+In
Output
NC
A
B
D
C
OPA2277AIDRM
V−
Out A
−In A
+In A
V−
1
2
3
4
8
7
6
5
Out B
+In B
–In B
Out B
10 +In C
Pin 1
Indicator
DFN-8 4mm x 4mm
(top view)
9
8
–In C
OPA2277
Thermal Pad
on Bottom
(Connect to V−)
V+
Out C
Out A
–In A
+In A
V–
1
2
3
4
8
V+
−In B
+In B
A
14-Pin DIP, SO-14
7
Out B
–In B
+In B
B
6
5
DFN-8 4mm x 4mm
(top view)
Thermal Pad
on Bottom
NC = No connection.
8-Pin DIP, SO-8
(Connect to V−)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 1999-2005, Texas Instruments Incorporated
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
Supply Voltage .................................................................................... 36V
Input Voltage .....................................................(V–) –0.7V to (V+) +0.7V
Output Short-Circuit(2) .............................................................. Continuous
Operating Temperature ..................................................–55°C to +125°C
Storage Temperature .....................................................–55°C to +125°C
Junction Temperature ...................................................................... 150°C
Lead Temperature (soldering, 10s) ................................................. 300°C
ESD Rating (Human Body Model) .................................................. 2000V
(Machine Model) ........................................................... 100V
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
NOTE: (1) Stresses above these rating may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. (2) Short-circuit to ground, one amplifier per package.
PACKAGE/ORDERING INFORMATION(1)
OFFSET
OFFSET
VOLTAGE
VOLTAGE DRIFT
PRODUCT
max, µV
max, µV/°C
PACKAGE-LEAD
Single
OPA277PA
OPA277P
OPA277UA
OPA277U
OPA277AIDRM
±50
±20
±50
±20
±100
±1
±0.15
±1
±0.15
±1
DIP-8
DIP-8
SO-8 Surface Mount
SO-8 Surface Mount
DFN-8 (4mm x 4mm)
Dual
OPA2277PA
OPA2277P
OPA2277UA
OPA2277U
OPA2277AIDRM
±50
±25
±50
±25
±100
±1
±0.25
±1
±0.25
±1
DIP-8
DIP-8
SO-8 Surface Mount
SO-8 Surface Mount
DFN-8 (4mm x 4mm)
Quad
OPA4277PA
OPA4277UA
±50
±50
±1
±1
DIP-14
SO-14 Surface Mount
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet or visit the TI web site
at www.ti.com.
PIN DESCRIPTIONS
OPA2277AIDRM
OPA277
Offset Trim
1
2
3
4
8
7
6
5
Offset Trim
V+
Out A
−In A
+In A
V−
1
2
3
4
8
7
6
5
Out B
V+
–In
+In
V–
Pin 1
Indicator
Output
NC(1)
−In B
+In B
OPA4277
8-Pin DIP, SO-8
Out A
–In A
+In A
V+
1
2
3
4
5
6
7
14 Out D
13 –In D
12 +In D
11 V–
DFN-8 4mm x 4mm
(top view)
A
B
D
C
Thermal Pad
on Bottom
(Connect to V−)
OPA277AIDRM
+In B
–In B
Out B
10 +In C
9
8
–In C
Offset Trim
1
8
Offset Trim
V+
Out C
Pin 1
Indicator
−In
+In
V−
2
3
4
7
6
5
OPA2277
14-Pin DIP, SO-14
Output
NC
Out A
–In A
+In A
V–
1
2
3
4
8
7
6
5
V+
A
Out B
–In B
+In B
B
DFN-8 4mm x 4mm
(top view)
Thermal Pad
on Bottom
NOTE: (1) NC = No connection.
(Connect to V−)
8-Pin DIP, SO-8
OPA277, OPA2277, OPA4277
2
SBOS079A
www.ti.com
ELECTRICAL CHARACTERISTICS: VS = ±5V to VS = ±15V
At TA = +25°C, and RL = 2kΩ, unless otherwise noted.
Boldface limits apply over the specified temperature range, –40°C to +85°C.
OPA277PA, UA
OPA277P, U
OPA2277P, U
OPA2277PA, UA
OPA4277PA, UA
OPA277AIDRM,
OPA2277AIDRM
PARAMETER
CONDITION
MIN
TYP(1)
MAX
MIN
TYP(1)
MAX
MIN
TYP(1)
MAX
UNITS
OFFSET VOLTAGE
Input Offset Voltage:
VOS
OPA277P, U (high grade, single)
OPA2277P, U (high grade, dual)
All PA, UA, Versions
±10
±10
±20
±25
µV
µV
µV
µV
±20
±50
AIDRM Versions
±35
±100
Input Offset Voltage Over Temperature
OPA277P, U (high grade, single)
OPA2277P, U (high grade, dual)
All PA, UA, Versions
T
T
T
T
A = –40
A = –40
A = –40
A = –40
°
°
°
°
C to +85
C to +85
C to +85
C to +85
°
°C
°C
°C
C
±
±50
30
µV
µV
µV
µV
±100
AIDRM Versions
±165
Input Offset Voltage Drift
dVOS/dT
OPA277P, U (high grade, single)
OPA2277P, U (high grade, dual)
All PA, UA, AIDRM Versions
T
T
T
A = –40
A = –40
A = –40
°
°
°
C to +85
C to +85
C to +85
°
°C
°C
C
±
±0.1
0.1
±
0.15
µV/°C
µV/°C
µV/°C
±0.25
±0.15
±1
±0.15
±1
Input Offset Voltage: (all models)
vs Time
0.2
ꢀ
ꢀ
ꢀ
ꢀ
µV/mo
µV/V
µV/V
µV/V
vs Power Supply
PSRR
VS = ±2V to ±18V
VS = ±2V to ±18V
dc
±0.3
±0.5
0.5
±1
±1
T
A = –40°C to +85
°C
±
±1
±1
Channel Separation (dual, quad)
0.1
ꢀ
ꢀ
INPUT BIAS CURRENT
Input Bias Current
IB
±0.5
±0.5
±1
ꢀ
ꢀ
±2.8
±2.8
nA
nA
nA
nA
T
A = –40
Input Offset Current
A = –40 C to +85
°
C to +85
°
C
±2
±1
±4
±2.8
±4
±2.8
IOS
T
°
°
C
±2
±4
±4
NOISE
Input Voltage Noise, f = 0.1 to 10Hz
0.22
0.035
12
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
µVPP
µVrms
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
pA/√Hz
Input Voltage Noise Density, f = 10Hz en
f = 100Hz
f = 1kHz
8
8
f = 10kHz
8
Current Noise Density, f = 1kHz
in
0.2
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection
VCM
(V–) +2
130
(V+) –2
ꢀ
115
115
ꢀ
ꢀ
115
115
ꢀ
V
CMRR VCM = (V–) +2V to (V+) –2V
VCM = (V–) +2V to (V+) –2V
140
ꢀ
ꢀ
dB
dB
T
A = –40°C to +85
°C
128
INPUT IMPEDANCE
Differential
100 || 3
250 || 3
ꢀ
ꢀ
ꢀ
ꢀ
MΩ || pF
GΩ || pF
Common-Mode
VCM = (V–) +2V to (V+) –2V
OPEN-LOOP GAIN
Open-Loop Voltage Gain
AOL
VO = (V–)+0.5V to
(V+)–1.2V, RL = 10kΩ
140
134
ꢀ
ꢀ
ꢀ
ꢀ
dB
dB
dB
VO = (V–)+1.5V to
(V+)–1.5V, RL = 2kΩ
126
ꢀ
ꢀ
ꢀ
ꢀ
TA = –40°C to +85
°C
VO = (V–)+1.5V to
(V+)–1.5V, RL = 2kΩ
126
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
GBW
SR
1
0.8
14
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
MHz
V/µs
µs
Settling Time, 0.1%
0.01%
VS = ±15V, G = 1, 10V Step
VS = ±15V, G = 1, 10V Step
VIN • G = VS
16
µs
Overload Recovery Time
3
µs
Total Harmonic Distortion + Noise THD+N
1kHz, G = 1, VO = 3.5Vrms
0.002
%
ꢀ Specifications same as OPA277P, U.
NOTE: (1) VS = ±15V.
OPA277, OPA2277, OPA4277
SBOS079A
3
www.ti.com
ELECTRICAL CHARACTERISTICS: VS = ±5V to VS = ±15V (CONT)
At TA = +25°C, and RL = 2kΩ, unless otherwise noted.
Boldface limits apply over the specified temperature range, –40°C to +85°C.
OPA277PA, UA
OPA277P, U
OPA2277P, U
OPA2277PA, UA
OPA4277PA, UA
OPA277AIDRM,
OPA2277AIDRM
PARAMETER
CONDITION
MIN
TYP(1)
MAX
MIN
TYP(1)
MAX
MIN
TYP(1)
MAX
UNITS
OUTPUT
Voltage Output
VO
RL = 10kΩ
RL = 10kΩ
(V–) +0.5
(V–) +0.5
(V–) +1.5
(V–) +1.5
(V+) –1.2
(V+) –1.2
(V+) –1.5
(V+) –1.5
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
V
V
T
T
A = –40
°
C to +85
°C
R
L = 2kΩ
V
A = –40
°
C to +85
°C
RL = 2kΩ
V
Short-Circuit Current
ISC
±35
ꢀ
ꢀ
ꢀ
ꢀ
mA
Capacitive Load Drive
CLOAD
See Typical Curve
POWER SUPPLY
Specified Voltage Range
Operating Voltage Range
Quiescent Current (per amplifier)
VS
IQ
±5
±2
±15
±18
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
V
V
IO = 0
IO = 0
±790
±825
ꢀ
ꢀ
µA
µA
T
A = –40°C to +85
°C
±900
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance
SO-8 Surface-Mount
DIP-8
–40
–55
–55
+85
+125
+125
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
°C
°C
°C
θJA
150
100
80
ꢀ
ꢀ
ꢀ
ꢀ
°C/W
°C/W
°C/W
°C/W
°C/W
DIP-14
SO-14 Surface-Mount
DFN-8(2)
100
45
ꢀ Specifications same as OPA277P, U.
NOTES: (1) VS = ±15V.
(2) Thermal pad soldered to printed circuit board (PCB).
OPA277, OPA2277, OPA4277
4
SBOS079A
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = ±15V, and RL = 2kΩ, unless otherwise noted.
POWER SUPPLY AND COMMON-MODE
REJECTION vs FREQUENCY
OPEN-LOOP GAIN/PHASE
vs FREQUENCY
140
140
120
100
80
G
CL = 0
CL = 1500pF
120
0
+PSR
–PSR
100
–30
–60
–90
–120
–150
–180
80
φ
60
40
20
0
CMR
60
40
20
–20
0
0.1
1
10
100
1k
10k
100k
1M
0.1
1
10
100
1k
10k 100k
1M
10M
Frequency (Hz)
Frequency (Hz)
INPUT NOISE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
INPUT NOISE VOLTAGE vs TIME
1000
100
10
Noise signal is bandwidth limited to
lie between 0.1Hz and 10Hz.
Current Noise
Voltage Noise
1
1
10
100
1k
10k
1s/div
Frequency (Hz)
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
CHANNEL SEPARATION vs FREQUENCY
140
120
100
80
1
0.1
VOUT = 3.5Vrms
Dual and quad devices. G = 1,
all channels. Quad measured
channel A to D or B to C—other
combinations yield similar or
improved rejection.
G = 10, RL = 2kΩ, 10kΩ
G = 1, RL = 2kΩ, 10kΩ
0.01
0.001
60
40
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
OPA277, OPA2277, OPA4277
SBOS079A
5
www.ti.com
TYPICAL CHARACTERISTICS (CONT)
At TA = +25°C, VS = ±15V, and RL = 2kΩ, unless otherwise noted.
OFFSET VOLTAGE DRIFT
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
PRODUCTION DISTRIBUTION
16
35
30
25
20
15
10
5
Typical distribution
Typical distribution
14
12
10
8
of packaged units.
Single, dual, and
quad included.
of packaged units.
Single, dual, and
quad included.
6
4
2
0
0
–50–45–40–35–30–25–20–15–10 –5
0
5 10 15 20 25 30 35 40 45 50
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Offset Voltage (µV)
Offset Voltage (µV/°C)
WARM-UP OFFSET VOLTAGE DRIFT
AOL, CMR, PSR vs TEMPERATURE
3
160
150
140
130
120
110
100
2
1
CMR
AOL
0
PSR
–1
–2
–3
0
15
30
45
60
75
90
105
120
–75
–50
–25
0
25
50
75
100
125
Time from Power Supply Turn-On (s)
Temperature (°C)
QUIESCENT CURRENT AND
SHORT-CIRCUIT CURRENT vs TEMPERATURE
INPUT BIAS CURRENT vs TEMPERATURE
100
1000
950
900
850
800
750
700
650
600
550
500
5
4
90
80
70
60
50
40
30
20
10
0
3
2
±IQ
1
0
–ISC
–1
–2
–3
–4
–5
+ISC
Curves represent typical
production units.
–75
–50
–25
0
25
50
75
100
125
–75
–50
–25
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
OPA277, OPA2277, OPA4277
6
SBOS079A
www.ti.com
TYPICAL CHARACTERISTICS (CONT)
At TA = +25°C, VS = ±15V, and RL = 2kΩ, unless otherwise noted.
CHANGE IN INPUT BIAS CURRENT
vs POWER SUPPLY VOLTAGE
2.0
CHANGE IN INPUT BIAS CURRENT
vs COMMON-MODE VOLTAGE
2.0
1.5
Curve shows normalized change in bias current
with respect to VCM = 0V. Typical IB may range
from –05.nA to +0.5nA at VCM = 0V.
Curve shows normalized change in
bias current with respect to VS = ±10V
1.5
(+20V). Typical IB may range from
–0.5nA to +0.5nA at VS = ±10V.
1.0
1.0
VS = ±5V
0.5
0.5
0.0
0.0
VCM = 0V
–0.5
–1.0
–1.5
–2.0
–0.5
–1.0
–1.5
–2.0
VS = ±15V
0
5
10
15
20
25
30
35
40
–15
±1
0
–10
–5
0
5
10
15
Supply Voltage (V)
Common-Mode Voltage (V)
QUIESCENT CURRENT vs SUPPLY VOLTAGE
per amplifier
SETTLING TIME vs CLOSED-LOOP GAIN
1000
900
800
700
600
500
100
50
10V step
CL = 1500pF
0.01%
0.1%
20
10
0
±5
±10
±15
±20
±10
±100
Supply Voltage (V)
Gain (V/V)
MAXIMUM OUTPUT VOLTAGE
vs FREQUENCY
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
(V+)
(V+) – 1
(V+) – 2
(V+) – 3
(V+) – 4
(V+) – 5
30
25
20
15
10
5
VS = ±15V
–55°C
125°C
25°C
25°C
(V–) + 5
(V–) + 4
(V–) + 3
(V–) + 2
(V–) + 1
(V–)
125°C
VS = ±5V
–55°C
0
±5
±10
±15
±20
±25
±30
1k
10k
100k
1M
Output Current (mA)
Frequency (Hz)
OPA277, OPA2277, OPA4277
SBOS079A
7
www.ti.com
TYPICAL CHARACTERISTICS (CONT)
At TA = +25°C, VS = ±15V, and RL = 2kΩ, unless otherwise noted.
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
60
LARGE-SIGNAL STEP RESPONSE
G = +1, CL = 1500pF, VS = +15V
Gain = –1
50
40
Gain = +1
30
20
Gain = ±10
10
0
10
100
1k
10k
100k
10µs/div
Load Capacitance (pF)
SMALL-SIGNAL STEP RESPONSE
SMALL-SIGNAL STEP RESPONSE
G = +1, CL = 0, VS = ±15V
G = +1, CL = 1500pF, VS = ±15V
1µs/div
1µs/div
OPA277, OPA2277, OPA4277
8
SBOS079A
www.ti.com
connecting a potentiometer as shown in Figure 1. This
adjustment should be used only to null the offset of the op
amp. This adjustment should not be used to compensate for
offsets created elsewhere in a system since this can intro-
duce additional temperature drift.
APPLICATIONS INFORMATION
The OPA277 series is unity-gain stable and free from unex-
pected output phase reversal, making it easy to use in a wide
range of applications. Applications with noisy or high imped-
ance power supplies may require decoupling capacitors
close to the device pins. In most cases 0.1µF capacitors are
adequate.
V+
Trim Range: Exceeds
Offset Voltage Specification
0.1µF
The OPA277 series has very low offset voltage and drift. To
achieve highest performance, circuit layout and mechanical
conditions should be optimized. Offset voltage and drift can
be degraded by small thermoelectric potentials at the op amp
inputs. Connections of dissimilar metals will generate thermal
potential which can degrade the ultimate performance of the
OPA277 series. These thermal potentials can be made to
cancel by assuring that they are equal in both input terminals.
20kΩ
7
1
2
8
OPA277
6
3
OPA277 single op amp only.
Use offset adjust pins only to null
4
0.1µF
offset voltage of op amp—see text.
• Keep thermal mass of the connections made to the two
V–
input terminals similar.
FIGURE 1. OPA277 Offset Voltage Trim Circuit.
• Locate heat sources as far as possible from the critical
input circuitry.
• Shield op amp and input circuitry from air currents such as
INPUT PROTECTION
cooling fans.
The inputs of the OPA277 series are protected with 1kΩ
series input resistors and diode clamps. The inputs can
withstand ±30V differential inputs without damage. The pro-
tection diodes will, of course, conduct current when the
inputs are over-driven. This may disturb the slewing behavior
of unity-gain follower applications, but will not damage the op
amp.
OPERATING VOLTAGE
OPA277 series op amp operate from ±2V to ±18V supplies
with excellent performance. Unlike most op amps which are
specified at only one supply voltage, the OPA277 series is
specified for real-world applications; a single limit applies
over the ±5V to ±15V supply range. This allows a customer
operating at VS = ±10V to have the same assured perfor-
mance as a customer using ±15V supplies. In addition, key
parameters are assured over the specified temperature range,
–40°C to +85°C. Most behavior remains unchanged through
the full operating voltage range (±2V to ±18V). Parameters
which vary significantly with operating voltage or temperature
are shown in typical performance curves.
INPUT BIAS CURRENT CANCELLATION
The input stage base current of the OPA277 series is
internally compensated with an equal and opposite cancella-
tion circuit. The resulting input bias current is the difference
between the input stage base current and the cancellation
current. This residual input bias current can be positive or
negative.
When the bias current is canceled in this manner, the input
bias current and input offset current are approximately the
same magnitude. As a result, it is not necessary to use a bias
current cancellation resistor as is often done with other op
amps (Figure 2). A resistor added to cancel input bias current
errors may actually increase offset voltage and noise.
OFFSET VOLTAGE ADJUSTMENT
The OPA277 series is laser-trimmed for very low offset
voltage and drift so most circuits will not require external
adjustment. However, offset voltage trim connections are
provided on pins 1 and 8. Offset voltage can be adjusted by
R2
R2
R1
R1
Op Amp
OPA277
RB = R2 || R1
No bias current
cancellation resistor
(see text)
(a)
(b)
Conventional op amp with external bias
current cancellation resistor.
OPA277 with no external bias current
cancellation resistor.
FIGURE 2. Input Bias Current Cancellation.
OPA277, OPA2277, OPA4277
SBOS079A
9
www.ti.com
V+
1/2
R2
R1
VOUT = (V1 – V2)(1 +
)
OPA2277
R2
V–
V+
R–∆R
R+∆R
R+∆R
V2
R1
Load
Cell
V1
1/2
R–∆R
OPA2277
V–
R2
R1
For integrated solution see: INA126, INA2126 (dual)
INA125 (on-board reference)
INA122 (single-supply)
FIGURE 3. Load Cell Amplifier.
IREG 1mA
5V
12
1
V+
VLIN
VI+N
14
IR1
1/2
13
11
VREG
IR2
10
V+
OPA2277
Type J
RF
10kΩ
4
RG
RG
1250Ω
9
8
B
E
R
412Ω
XTR105
RF
10kΩ
3
RG
VI–N
IO
1/2
OPA2277
2
7
1kΩ
25Ω
IRET
IO = 4mA + (VI+N – VI–N
)
40
RG
V–
6
50Ω
RCM = 1250Ω
2RF
R
(G = 1 +
= 50)
0.01µF
FIGURE 4. Thermocouple Low Offset, Low Drift Loop Measurement with Diode Cold Junction Compensation.
OPA277, OPA2277, OPA4277
10
SBOS079A
www.ti.com
DFN PACKAGE
LAYOUT GUIDELINES
The OPA277 series uses the 8-lead DFN (also known as
SON), which is a QFN package with contacts on only two
sides of the package bottom. This leadless, near-chip-scale
package maximizes board space and enhances thermal and
electrical characteristics through an exposed pad.
The leadframe die pad should be soldered to a thermal pad
on the PCB. Mechanical drawings located at the end of this
data sheet list the physical dimensions for the package and
pad.
Soldering the exposed pad significantly improves board-level
reliability during temperature cycling, key push, package
shear, and similar board-level tests. Even with applications
that have low-power dissipation, the exposed pad must be
soldered to the PCB to provide structural integrity and long-
term reliability.
DFN packages are physically small, have a smaller routing
area, improved thermal performance, and improved electrical
parasitics, with a pinout scheme that is consistent with other
commonly-used packages, such as SO and MSOP. Addition-
ally, the absence of external leads eliminates bent-lead
issues.
The DFN package can be easily mounted using standard
printed circuit board (PCB) assembly techniques. See Appli-
cation Note, QFN/SON PCB Attachment (SLUA271) and
Application Report, Quad Flatpack No-Lead Logic Packages
(SCBA017), both available for download at www.ti.com.
The exposed leadframe die pad on the bottom of the
package should be connected to V–.
OPA277, OPA2277, OPA4277
SBOS079A
11
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
PACKAGING INFORMATION
Orderable Device
OPA2277AIDRMT
OPA2277AIDRMTG4
OPA2277P
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
VSON
VSON
PDIP
PDIP
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
DRM
8
8
8
8
8
8
8
8
8
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
BHZ
BHZ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DRM
P
250
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Green (RoHS
& no Sb/Br)
CU NIPDAU
OPA2277P
OPA2277PA
P
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA2277P
A
OPA2277PAG4
OPA2277PG4
P
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA2277P
A
P
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA2277P
OPA2277U
D
75
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
CU NIPDAU | Call TI
Call TI
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
OPA
2277U
OPA2277U/2K5
OPA2277U/2K5G4
OPA2277UA
D
2500
2500
75
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
-40 to 85
OPA
2277U
D
Green (RoHS
& no Sb/Br)
OPA
2277U
D
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
OPA
2277U
A
OPA2277UA/2K5
OPA2277UA/2K5E4
OPA2277UAE4
OPA2277UAG4
OPA2277UG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
8
8
8
8
8
2500
2500
75
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Call TI
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
OPA
2277U
A
Green (RoHS
& no Sb/Br)
OPA
2277U
A
Green (RoHS
& no Sb/Br)
Call TI
OPA
2277U
A
75
Green (RoHS
& no Sb/Br)
Call TI
OPA
2277U
A
75
Green (RoHS
& no Sb/Br)
Call TI
OPA
2277U
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
OPA277AIDRMR
OPA277AIDRMRG4
OPA277AIDRMT
OPA277AIDRMTG4
OPA277P
ACTIVE
VSON
VSON
VSON
VSON
PDIP
PDIP
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
DRM
8
8
8
8
8
8
8
8
8
8
8
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
NSS
NSS
NSS
NSS
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DRM
DRM
DRM
P
3000
250
250
50
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
OPA277P
OPA277PA
P
50
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
OPA277P
A
OPA277PAG4
OPA277PG4
P
50
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
OPA277P
A
P
50
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
OPA277P
OPA277U
D
75
Green (RoHS
& no Sb/Br)
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
OPA
277U
OPA277U/2K5
OPA277U/2K5G4
OPA277UA
D
2500
2500
75
Green (RoHS
& no Sb/Br)
OPA
277U
D
Green (RoHS
& no Sb/Br)
OPA
277U
D
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
OPA
277U
A
OPA277UA/2K5
OPA277UA/2K5E4
OPA277UAE4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
D
D
D
D
8
8
8
8
2500
2500
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
OPA
277U
A
Green (RoHS
& no Sb/Br)
OPA
277U
A
Green (RoHS
& no Sb/Br)
OPA
277U
A
OPA277UAG4
75
Green (RoHS
& no Sb/Br)
OPA
277U
A
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
OPA277UG4
OPA4277PA
ACTIVE
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-3-260C-168 HR
OPA
277U
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
N
N
D
D
D
D
D
14
14
14
14
14
14
14
25
25
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
OPA4277PA
OPA4277PA
OPA4277UA
OPA4277UA
OPA4277UA
OPA4277UA
OPA4277UA
OPA4277PAG4
OPA4277UA
Green (RoHS
& no Sb/Br)
N / A for Pkg Type
50
Green (RoHS
& no Sb/Br)
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
OPA4277UA/2K5
OPA4277UA/2K5E4
OPA4277UAE4
OPA4277UAG4
2500
2500
50
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
50
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
OPA2277AIDRMT
OPA2277U/2K5
OPA2277UA/2K5
OPA277AIDRMR
OPA277AIDRMT
OPA277U/2K5
VSON
SOIC
SOIC
VSON
VSON
SOIC
SOIC
SOIC
DRM
D
8
8
250
2500
2500
3000
250
180.0
330.0
330.0
330.0
180.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
12.4
16.4
4.25
6.4
4.25
5.2
1.15
2.1
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
16.0
Q2
Q1
Q1
Q2
Q2
Q1
Q1
Q1
D
8
6.4
5.2
2.1
DRM
DRM
D
8
4.25
4.25
6.4
4.25
4.25
5.2
1.15
1.15
2.1
8
8
2500
2500
2500
OPA277UA/2K5
OPA4277UA/2K5
D
8
6.4
5.2
2.1
D
14
6.5
9.0
2.1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
OPA2277AIDRMT
OPA2277U/2K5
OPA2277UA/2K5
OPA277AIDRMR
OPA277AIDRMT
OPA277U/2K5
VSON
SOIC
SOIC
VSON
VSON
SOIC
SOIC
SOIC
DRM
D
8
8
250
2500
2500
3000
250
210.0
367.0
367.0
367.0
210.0
367.0
367.0
367.0
185.0
367.0
367.0
367.0
185.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
38.0
D
8
DRM
DRM
D
8
8
8
2500
2500
2500
OPA277UA/2K5
OPA4277UA/2K5
D
8
D
14
Pack Materials-Page 2
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