OPA335 [TI]
单路、0.05uV/°C（最大值）、单电源 CMOS 运算放大器;
| 型号： | OPA335 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 单路、0.05uV/°C（最大值）、单电源 CMOS 运算放大器 放大器 运算放大器 放大器电路 |
| 文件： | 总31页 (文件大小：1279K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
OPA334
OPA2334
O
P
A
3
3
5
O
P
A
2
3
3
5
O
P
A
2
3
3
4
O
P
A
2
3
3
5
OPA335
OPA2335
SBOS245D – JUNE 2002 – REVISED JULY 2003
0.05µV/°C max, SINGLE-SUPPLY
CMOS OPERATIONAL AMPLIFIERS
Zerø-Drift Series
FEATURES
DESCRIPTION
The OPA334 and OPA335 series of CMOS operational
amplifiers use auto-zeroing techniques to simultaneously
provide very low offset voltage (5µV max), and near-zero drift
over time and temperature. These miniature, high-precision,
low quiescent current amplifiers offer high input impedance
and rail-to-rail output swing. Single or dual supplies as low as
+2.7V (±1.35V) and up to +5.5V (±2.75V) may be used.
These op amps are optimized for low-voltage, single-supply
operation.
● LOW OFFSET VOLTAGE: 5µV (max)
● ZERO DRIFT: 0.05µV/°C (max)
● QUIESCENT CURRENT: 285µA
● SINGLE-SUPPLY OPERATION
● SINGLE AND DUAL VERSIONS
● SHUTDOWN
● MicroSIZE PACKAGES
The OPA334 family includes a shutdown mode. Under logic
control, the amplifiers can be switched from normal operation
to a standby current of 2µA. When the Enable pin is con-
nected high, the amplifier is active. Connecting Enable low
disables the amplifier, and places the output in a high-
impedance state.
APPLICATIONS
● TRANSDUCER APPLICATIONS
● TEMPERATURE MEASUREMENT
● ELECTRONIC SCALES
● MEDICAL INSTRUMENTATION
● BATTERY-POWERED INSTRUMENTS
● HANDHELD TEST EQUIPMENT
The OPA334 (single version with shutdown) comes in
MicroSIZE SOT23-6. The OPA335 (single version without
shutdown) is available in SOT23-5, and SO-8. The OPA2334
(dual version with shutdown) comes in MicroSIZE MSOP-10.
The OPA2335 (dual version without shutdown) is offered in
the MSOP-8 and SO-8 packages. All versions are specified
for operation from –40°C to +125°C.
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION
Absolute Value;
Centered Around Zero
Offset Voltage (µV)
Offset Voltage Drift (µV/°C)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2002-2003, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Supply Voltage .................................................................................... +7V
Signal Input Terminals, Voltage(2) ........................... –0.5V to (V+) + 0.5V
Current(2) .................................................. ±10mA
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper han-
dling and installation procedures can cause damage.
Output Short Circuit(3) .............................................................. Continuous
Operating Temperature ..................................................–40°C to +150°C
Storage Temperature .....................................................–65°C to +150°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may de-
grade device reliability. These are stress ratings only, and functional opera-
tion of the device at these, or any other conditions beyond those specified,
is not implied. (2) Input terminals are diode-clamped to the power-supply
rails. Input signals that can swing more than 0.5V beyond the supply rails
should be current-limited to 10mA or less. (3) Short-circuit to ground, one
amplifier per package.
PACKAGE/ORDERING INFORMATION
SPECIFIED
PACKAGE
DESIGNATOR(1)
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PRODUCT
PACKAGE-LEAD
Shutdown Version
OPA334
SOT23-6
DBV
"
–40°C to +125°C
OAOI
"
OPA334AIDBVT
OPA334AIDBVR
Tape and Reel, 250
Tape and Reel, 3000
"
"
"
OPA2334
MSOP-10
DGS
"
–40°C to +125°C
BHE
"
OPA2334AIDGST
OPA2334AIDGSR
Tape and Reel, 250
Tape and Reel, 2500
"
"
"
Non-Shutdown Version
OPA335
SOT23-5
DBV
–40°C to +125°C
OAPI
OPA335AIDBVT
OPA335AIDBVR
OPA335AID
Tape and Reel, 250
Tape and Reel, 3000
Rails, 100
"
OPA335
"
"
SO-8
"
"
D
"
"
"
OPA335
"
–40°C to +125°C
"
OPA335AIDR
Tape and Reel, 2500
OPA2335
SO-8
D
"
DGK
"
–40°C to +125°C
OPA2335
OPA2335AID
OPA2335AIDR
OPA2335AIDGKT
OPA2335AIDGKR
Rails, 100
"
OPA2335
"
"
MSOP-8
"
"
"
BHF
"
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 2500
–40°C to +125°C
"
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
PIN CONFIGURATIONS
OPA335
OPA335
OPA2334
NC(1)
V+
NC(1)
–In
1
2
3
4
8
7
6
5
Out A
–In A
1
2
3
4
5
10 V+
Out
V–
1
2
3
5
4
V+
9
8
7
6
Out B
A
+In A
–In B
Out
+In
+In
–In
B
NC(1)
V–
+In B
V–
SOT23-5
Enable A
Enable B
SO-8
MSOP-10
OPA2335
OPA334(2)
Out A
1
8
V+
Out
V–
1
2
3
6
5
4
V+
A
–In A
+In A
V–
2
3
4
7
6
5
Out B
–In B
+In B
Enable
–In
B
+In
SOT23-6
SO-8, MSOP-8
NOTES: (1) NC indicates no internal connection. (2) Pin 1 of the SOT23-6 is
determined by orienting the package marking as indicated in the diagram.
OPA334, OPA2334, OPA335, OPA2335
2
SBOS245D
www.ti.com
ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, and VOUT = VS /2, unless otherwise noted.
OPA334AI, OPA335AI
OPA2334AI, OPA2335AI
PARAMETER
CONDITION
MIN
TYP
MAX
UNITS
OFFSET VOLTAGE
Input Offset Voltage
vs Temperature
vs Power Supply
Long-Term Stability(1)
Channel Separation, dc
VOS
dVOS /dT
PSRR
VCM = VS/2
1
±0.02
±1
5
µV
µV/°C
µV/V
±0.05
±2
VS = +2.7V to +5.5V, VCM = 0, Over Temperature
See Note (1)
0.1
µV/V
INPUT BIAS CURRENT
Input Bias Current
Over Temperature
Input Offset Current
IB
VCM = VS/2
±70
1
±120
±200
±400
pA
nA
pA
IOS
NOISE
Input Voltage Noise, f = 0.01Hz to 10Hz
Input Current Noise Density, f = 10Hz
en
in
1.4
20
µVPP
√Hz
fA/
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
VCM
(V–) – 0.1
(V+) – 1.5
V
Common-Mode Rejection Ratio
CMRR
(V–) –0.1V < VCM < (V+) –1.5V, Over Temperature
110
130
dB
INPUT CAPACITANCE
Differential
Common-Mode
1
5
pF
pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain, Over Temperature AOL
Over Temperature
50mV < VO < (V+) – 50mV, RL = 100kΩ, VCM = VS/2
100mV < VO < (V+) – 100mV, RL = 10kΩ, VCM = VS/2
110
110
130
130
dB
dB
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
GBW
SR
2
1.6
MHz
V/µs
G = +1
OUTPUT
Voltage Output Swing from Rail
Voltage Output Swing from Rail
Short-Circuit Current
R
L = 10kΩ, Over Temperature
15
1
±50
100
50
mV
mV
mA
RL = 100kΩ, Over Temperature
ISC
Capacitive Load Drive
CLOAD
See Typical Characteristics
SHUTDOWN
tOFF
tON
VL (shutdown)
1
150
µs
µs
V
(2)
0
+0.8
VH (amplifier is active)
Input Bias Current of Enable Pin
IQSD
0.75 (V+)
5.5
V
pA
µA
50
2
POWER SUPPLY
Operating Voltage Range
Quiescent Current: OPA334, OPA335
Over Temperature
OPA2334, OPA2335 (total—two amplifiers)
Over Temperature
2.7
5.5
350
450
700
900
V
IQ
IO = 0
IO = 0
285
570
µA
µA
µA
µA
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
–40
–40
–65
+125
+150
+150
°C
°C
°C
Thermal Resistance
SOT23-5, SOT23-6 Surface-Mount
MSOP-8, MSOP-10, SO-8 Surface-Mount
θJA
°C/W
°C/W
°C/W
200
150
NOTES: (1) 500-hour life test at 150°C demonstrated randomly distributed variation approximately equal to measurement repeatability of 1µV. (2) Device requires
one complete cycle to return to VOS accuracy.
OPA334, OPA2334, OPA335, OPA2335
3
SBOS245D
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted.
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION
Absolute Value;
Centered Around Zero
Offset Voltage (µV)
Offset Voltage Drift (µV/°C)
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE
(V+)
(V+) – 1
(V–) + 1
(V–)
1200
1000
800
600
400
200
0
+125°C
5.5V
2.7V
+125°C
+25°C
–40°C
+25°C
–40°C
–40°C
+25°C
+125°C
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
2
4
6
8
10
Output Current (mA)
Common-Mode Voltage (V)
QUIESCENT CURRENT (per channel)
vs TEMPERATURE
INPUT BIAS CURRENT vs TEMPERATURE
400
350
300
250
200
150
100
50
1000
100
10
VS = +5.5V
VS = +2.7V
0
–40
–20
0
20
40
60
80
100 120
–40
–20
0
20
40
60
80
100 120
Temperature (°C)
Temperature (°C)
OPA334, OPA2334, OPA335, OPA2335
4
SBOS245D
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted.
LARGE-SIGNAL RESPONSE
OPEN-LOOP GAIN/PHASE vs FREQUENCY
140
120
100
80
–80
G = –1
CL = 300pF
–90
Phase
–100
–110
–120
–130
–140
–150
–160
60
Gain
40
20
0
–20
Time (5µs/div)
0.1
1
10
100
1k
10k 100k
1M
10M
Frequency (Hz)
POSITIVE OVER-VOLTAGE RECOVERY
SMALL-SIGNAL RESPONSE
G = +1
CL = 50pF
0
0
Input
10kΩ
+2.5V
Output
100Ω
OPA335
–2.5V
Time (25µs/div)
Time (5µs/div)
NEGATIVE OVER-VOLTAGE RECOVERY
Input
COMMON-MODE REJECTION vs FREQUENCY
140
120
100
80
0
0
10kΩ
60
+2.5V
100Ω
40
Output
OPA335
20
–2.5V
0
Time (25µs/div)
1
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
OPA334, OPA2334, OPA335, OPA2335
5
SBOS245D
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, and VOUT = VS /2, unless otherwise noted.
POWER-SUPPLY REJECTION RATIO vs FREQUENCY
SAMPLING FREQUENCY vs SUPPLY VOLTAGE
140
120
100
80
11.0
10.9
10.8
10.7
10.6
10.5
10.4
10.3
10.2
10.1
10.0
+PSRR
60
40
–PSRR
20
0
10
100
1k
10k
100k
1M
2.7
3.2
3.7
4.2
4.7
5.2 5.5
Frequency (Hz)
Supply Voltage (V)
0.01Hz TO 10Hz NOISE
NOISE vs FREQUENCY
1000
100
10
1
10
100
1k
10k
100k
10s/div
Frequency (Hz)
SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE
(VS = 2.7V to 5V)
SAMPLING FREQUENCY vs TEMPERATURE
13
12
11
10
9
50
45
40
35
30
25
20
15
10
5
RL = 10kΩ
8
0
–40
–10
20
50
80
110 125
10
100
1000
Temperature (°C)
Load Capacitance (pF)
OPA334, OPA2334, OPA335, OPA2335
6
SBOS245D
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS /2, and VOUT = VS /2, unless otherwise noted.
SETTLING TIME vs CLOSED-LOOP GAIN
COMMON-MODE RANGE vs SUPPLY VOLTAGE
Maximum Common-Mode
100
10
1
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Unity-gain
requires one
complete Auto-Zero
Cycle—see text.
0.01%
0.1%
Minimum Common-Mode
–0.5
1
10
Gain (V/V)
100
2.7
3.2
3.7
4.2
4.7
5.2 5.5
Supply Voltage (V)
OPA334 ENABLE FUNCTION
APPLICATIONS INFORMATION
The enable/shutdown digital input is referenced to the V–
supply voltage of the amp. A logic high enables the op amp. A
valid logic high is defined as > 75% of the total supply voltage.
Thevalidlogichighsignalcanbeupto5.5Vabovethenegative
supply, independent of the positive supply voltage. A valid
logic low is defined as < 0.8V above the V– supply pin. If dual
orsplitpowersuppliesareused,besurethatlogicinputsignals
are properly referred to the negative supply voltage. The
Enable pin must be connected to a valid high or low voltage, or
driven, not left open circuit.
The OPA334 and OPA335 series op amps are unity-gain
stable and free from unexpected output phase reversal. They
use auto-zeroing techniques to provide low offset voltage
and very low drift over time and temperature.
Good layout practice mandates use of a 0.1µF capacitor
placed closely across the supply pins.
For lowest offset voltage and precision performance, circuit
layout and mechanical conditions should be optimized. Avoid
temperature gradients that create thermoelectric (Seebeck)
effects in thermocouple junctions formed from connecting
dissimilar conductors. These thermally-generated potentials
can be made to cancel by assuring that they are equal on
both input terminals.
The logic input is a high-impedance CMOS input, with sepa-
rate logic inputs provided on the dual version. For battery-
operated applications, this feature can be used to greatly
reduce the average current and extend battery life.
• Use low thermoelectric-coefficient connections (avoid dis-
similar metals).
The enable time is 150µs, which includes one full auto-zero
cycle required by the amplifier to return to VOS accuracy.
Prior to this time, the amplifier functions properly, but with
unspecified offset voltage.
• Thermally isolate components from power supplies or
other heat-sources.
Disable time is 1µs. When disabled, the output assumes a
high-impedance state. This allows the OPA334 to be oper-
ated as a gated amplifier, or to have the output multiplexed
onto a common analog output bus.
• Shield op amp and input circuitry from air currents, such as
cooling fans.
Following these guidelines will reduce the likelihood of junc-
tions being at different temperatures, which can cause ther-
moelectric voltages of 0.1µV/°C or higher, depending on
materials used.
INPUT VOLTAGE
The input common-mode range extends from (V–) – 0.1V to
(V+) – 1.5V. For normal operation, the inputs must be limited
to this range. The common-mode rejection ratio is only valid
within the valid input common-mode range. A lower supply
voltage results in lower input common-mode range; there-
fore, attention to these values must be given when selecting
the input bias voltage. For example, when operating on a
single 3V power supply, common-mode range is from 0.1V
below ground to half the power-supply voltage.
OPERATING VOLTAGE
The OPA334 and OPA335 series op amps operate over a
power-supply range of +2.7V to +5.5V (±1.35V to ±2.75V).
Supply voltages higher than 7V (absolute maximum) can
permanently damage the amplifier. Parameters that vary
over supply voltage or temperature are shown in the Typical
Characteristics section of this data sheet.
OPA334, OPA2334, OPA335, OPA2335
7
SBOS245D
www.ti.com
Normally, input bias current is approximately 70pA; however,
input voltages exceeding the power supplies can cause
excessive current to flow in or out of the input pins. Momen-
tary voltages greater than the power supply can be tolerated
if the input current is limited to 10mA. This is easily accom-
plished with an input resistor, as shown in Figure 1.
swing limit of a single-supply op amp. A good single-supply
op amp may swing close to single-supply ground, but will not
reach ground. The output of the OPA334 or OPA335 can be
made to swing to ground, or slightly below, on a single-
supply power source. To do so requires use of another
resistor and an additional, more negative, power supply than
the op amp’s negative supply. A pull-down resistor may be
connected between the output and the additional negative
supply to pull the output down below the value that the output
would otherwise achieve, as shown in Figure 2.
Current-limiting resistor
required if input voltage
exceeds supply rails by
≥ 0.5V.
+5V
V+ = +5V
IOVERLOAD
10mA max
VOUT
OPA335
OPA335
VOUT
VIN
5kΩ
VIN
RP = 40kΩ
Op Amp’s V– = Gnd
–5V
FIGURE 1. Input Current Protection.
Additional
Negative
Supply
INTERNAL OFFSET CORRECTION
The OPA334 and OPA335 series op amps use an auto-zero
topology with a time-continuous 2MHz op amp in the signal
path. This amplifier is zero-corrected every 100µs using a
proprietary technique. Upon power-up, the amplifier requires
one full auto-zero cycle of approximately 100µs to achieve
specified VOS accuracy. Prior to this time, the amplifier
functions properly but with unspecified offset voltage.
FIGURE 2. Op Amp with Pull-Down Resistor to Achieve
VOUT = Ground.
The OPA334 and OPA335 have an output stage that allows
the output voltage to be pulled to its negative supply rail, or
slightly below using the above technique. This technique only
works with some types of output stages. The OPA334 and
OPA335 have been characterized to perform well with this
technique. Accuracy is excellent down to 0V and as low as
–2mV. Limiting and non-linearity occurs below –2mV, but
excellent accuracy returns as the output is again driven
above –2mV. Lowering the resistance of the pull-down resis-
tor will allow the op amp to swing even further below the
negative rail. Resistances as low as 10kΩ can be used to
achieve excellent accuracy down to –10mV.
This design has remarkably little aliasing and noise. Zero
correction occurs at a 10kHz rate, but there is virtually no
fundamental noise energy present at that frequency. For all
practical purposes, any glitches have energy at 20MHz or
higher and are easily filtered, if required. Most applications
are not sensitive to such high-frequency noise, and no
filtering is required.
Unity-gain operation demands that the auto-zero circuitry
correct for common-mode rejection errors of the main ampli-
fier. Because these errors can be larger than 0.01% of a full-
scale input step change, one calibration cycle (100µs) can be
required to achieve full accuracy. This behavior is shown in
the typical characteristic section, see Settling Time vs Closed-
Loop Gain.
LAYOUT GUIDELINES
Attention to good layout practices is always recommended.
Keep traces short. When possible, use a PCB ground plane
with surface-mount components placed as close to the de-
vice pins as possible. Place a 0.1µF capacitor closely across
the supply pins. These guidelines should be applied through-
out the analog circuit to improve performance and provide
benefits such as reducing the EMI (electromagnetic-interfer-
ence) susceptibility.
ACHIEVING OUTPUT SWING TO THE OP AMP’S
NEGATIVE RAIL
Some applications require output voltage swing from 0V to a
positive full-scale voltage (such as +2.5V) with excellent
accuracy. With most single-supply op amps, problems arise
when the output signal approaches 0V, near the lower output
OPA334, OPA2334, OPA335, OPA2335
8
SBOS245D
www.ti.com
4.096V
REF3040
+5V
0.1µF
+
R9
150kΩ
R1
6.04kΩ
R5
+5V
0.1µF
31.6kΩ
D1
R2
2.94kΩ
R2
549Ω
–
–
+
+
VO
OPA335
R6
K-Type
200Ω
Thermocouple
40.7µV/°C
Zero Adj.
R4
6.04kΩ
R3
60.4Ω
FIGURE 3. Temperature Measurement Circuit.
IIN
R1
IIN
R1
+5V
+2.5V
Photodiode
Photodiode
OPA343
OPA343
–2.5V
C1
C1
1MΩ
1MΩ
+5V
+2.5V
R2
R2
OPA335
NOTE: (1) Optional pull-down
resistor to allow below
ground output swing.
OPA335
40kΩ(1)
C2
C2
–2.5V
–5V
a. Split Supply.
b. Single Supply.
FIGURE 4. Auto-Zeroed Transimpedance Amplifier.
VEX = +2.5V
VEX
R1 = 105Ω
R1
R2
Select R1 so bridge
output ≤ VCMmax
@ VS = 2.7V,
CMmax = 1.2V
.
+5V
+2.7V
R
R
R
R
V
300Ω
VOUT
OPA335
Bridge
VOUT
OPA335
R1
R2
VREF
VREF
a. 5V Supply Bridge Amplifier.
b. 2.7V Supply Bridge Amplifier.
FIGURE 5. Single Op Amp Bridge Amplifier Circuits.
OPA334, OPA2334, OPA335, OPA2335
9
SBOS245D
www.ti.com
R2
R1
R1
R2
+5V
VREF
R2
R1
G = 1 +
+5V
1/2
OPA2335
1/2
OPA2335
R
R
R
VOUT
R
(1)
R3
40kΩ
–5V
NOTE: (1) Optional pull-down resistor
to allow accurate swing to 0V.
FIGURE 6. Dual Op Amp IA Bridge Amplifier.
11.5kΩ
+5V
5V
V
FS = 0.63V
Load
OPA335
(1)
R3
I2C
ADS1100
40kΩ
50mV
RS
1kΩ
Shunt
–5V
G = 12.5
(PGA Gain = 8)
5V FS
NOTE: (1) Pull-down resistor
to allow accurate swing to 0V.
FIGURE 7. Low-Side Current Measurement.
OPA334, OPA2334, OPA335, OPA2335
10
SBOS245D
www.ti.com
R1
4.12kΩ
C1
56pF
+5V
C2
0.1µF
R3
100Ω
Photodiode
VOUT
≈ 2pF
OPA353
C3
1nF
(1)
R2
≈ 1MHz Bandwidth
2kΩ
VOS ≈ 10µV
–5V
C4
10nF
+5V
R7
Photodiode
Bias
1kΩ
C6
0.1µF
R4
C7
100kΩ
1µF
R6
49.9kΩ
OPA335
C5
10nF
(1)
R5
40kΩ
–5V
NOTE: (1) Pull-down resistors to allow accurate swing to 0V.
FIGURE 8. High Dynamic Range Transimpedance Amplifier.
OPA334, OPA2334, OPA335, OPA2335
11
SBOS245D
www.ti.com
PACKAGE DRAWINGS
DBV (R-PDSO-G6)
PLASTIC SMALL-OUTLINE
0,50
0,25
M
0,20
0,95
6
6X
4
0,15 NOM
1,70
1,50
3,00
2,60
1
3
Gage Plane
3,00
2,80
0,25
0 –8
0,55
0,35
Seating Plane
0,10
1,45
0,95
0,05 MIN
4073253-5/G 01/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation.
OPA334, OPA2334, OPA335, OPA2335
12
SBOS245D
www.ti.com
PACKAGE DRAWINGS (Cont.)
DGS (S-PDSO-G10)
PLASTIC SMALL-OUTLINE PACKAGE
0,27
0,17
M
0,08
0,50
10
6
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
0°–6°
1
5
0,69
0,41
3,05
2,95
Seating Plane
0,10
0,15
0,05
1,07 MAX
4073272/B 08/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
A. Falls within JEDEC MO-187
OPA334, OPA2334, OPA335, OPA2335
13
SBOS245D
www.ti.com
PACKAGE DRAWINGS (Cont.)
DBV (R-PDSO-G5)
PLASTIC SMALL-OUTLINE
0,50
0,30
M
0,20
0,95
5
4
0,15 NOM
1,70
1,50
3,00
2,60
1
3
Gage Plane
3,00
2,80
0,25
0° – 8°
0,55
0,35
Seating Plane
0,10
1,45
0,95
0,05 MIN
4073253-4/G 01/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-178
OPA334, OPA2334, OPA335, OPA2335
14
SBOS245D
www.ti.com
PACKAGE DRAWINGS (Cont.)
D (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
8 PINS SHOWN
0.020 (0,51)
0.014 (0,35)
0.050 (1,27)
0.010 (0,25)
8
5
0.244 (6,20)
0.228 (5,80)
0.008 (0,20) NOM
0.157 (4,00)
0.150 (3,81)
Gage Plane
1
4
0.010 (0,25)
0°– 8°
A
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.010 (0,25)
0.069 (1,75) MAX
0.004 (0,10)
0.004 (0,10)
PINS **
8
14
16
DIM
A MAX
0.197
(5,00)
0.344
(8,75)
0.394
(10,00)
0.189
(4,80)
0.337
(8,55)
0.386
(9,80)
A MIN
4040047/E 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
OPA334, OPA2334, OPA335, OPA2335
15
SBOS245D
www.ti.com
PACKAGE DRAWINGS (Cont.)
DGK (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,38
0,25
M
0,65
8
0,08
5
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
0°–6°
1
4
0,69
3,05
2,95
0,41
Seating Plane
0,10
0,15
0,05
1,07 MAX
4073329/C 08/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-187
OPA334, OPA2334, OPA335, OPA2335
16
SBOS245D
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
OPA2334AIDGSR
OPA2334AIDGSRG4
OPA2334AIDGST
OPA2334AIDGSTG4
OPA2335AID
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
DGS
10
10
10
10
8
2500
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
BHE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DGS
DGS
DGS
D
2500
250
250
75
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
BHE
BHE
BHE
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA
2335
OPA2335AIDG4
OPA2335AIDGKR
OPA2335AIDGKRG4
OPA2335AIDGKT
OPA2335AIDGKTG4
OPA2335AIDR
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
OPA
2335
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
DGK
DGK
DGK
DGK
D
8
2500
2500
250
250
2500
2500
3000
3000
250
250
75
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
BHF
BHF
BHF
BHF
8
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
8
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
8
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
OPA
2335
OPA2335AIDRG4
OPA334AIDBVR
OPA334AIDBVRG4
OPA334AIDBVT
OPA334AIDBVTG4
OPA335AID
SOIC
D
8
Green (RoHS
& no Sb/Br)
OPA
2335
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBV
DBV
DBV
DBV
D
6
Green (RoHS
& no Sb/Br)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
OAOI
OAOI
OAOI
OAOI
6
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
8
Green (RoHS
& no Sb/Br)
OPA
335
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
OPA335AIDBVR
OPA335AIDBVRG4
OPA335AIDBVT
OPA335AIDBVTG4
OPA335AIDG4
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBV
5
5
5
5
8
8
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
OAPI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
D
3000
250
Green (RoHS
& no Sb/Br)
OAPI
OAPI
OAPI
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
75
Green (RoHS
& no Sb/Br)
OPA
335
OPA335AIDR
SOIC
D
2500
2500
Green (RoHS
& no Sb/Br)
OPA
335
OPA335AIDRG4
SOIC
D
Green (RoHS
& no Sb/Br)
OPA
335
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA2335 :
Military: OPA2335M
•
NOTE: Qualified Version Definitions:
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Aug-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
OPA2334AIDGSR
OPA2334AIDGST
OPA2335AIDGKR
OPA2335AIDGKT
OPA2335AIDR
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
DGS
DGS
DGK
DGK
D
10
10
8
2500
250
330.0
180.0
330.0
330.0
330.0
178.0
178.0
178.0
178.0
330.0
12.4
12.4
12.4
12.4
12.4
9.0
5.3
5.3
3.4
3.4
1.4
1.4
8.0
8.0
8.0
8.0
8.0
4.0
4.0
4.0
4.0
8.0
12.0
12.0
12.0
12.0
12.0
8.0
Q1
Q1
Q1
Q1
Q1
Q3
Q3
Q3
Q3
Q1
2500
250
5.3
3.4
1.4
8
5.3
3.4
1.4
8
2500
3000
250
6.4
5.2
2.1
OPA334AIDBVR
OPA334AIDBVT
OPA335AIDBVR
OPA335AIDBVT
OPA335AIDR
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBV
DBV
DBV
DBV
D
6
3.23
3.23
3.23
3.23
6.4
3.17
3.17
3.17
3.17
5.2
1.37
1.37
1.37
1.37
2.1
6
9.0
8.0
5
3000
250
9.0
8.0
5
9.0
8.0
8
2500
12.4
12.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Aug-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
OPA2334AIDGSR
OPA2334AIDGST
OPA2335AIDGKR
OPA2335AIDGKT
OPA2335AIDR
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
DGS
DGS
DGK
DGK
D
10
10
8
2500
250
367.0
210.0
366.0
366.0
367.0
180.0
180.0
180.0
180.0
367.0
367.0
185.0
364.0
364.0
367.0
180.0
180.0
180.0
180.0
367.0
35.0
35.0
50.0
50.0
35.0
18.0
18.0
18.0
18.0
35.0
2500
250
8
8
2500
3000
250
OPA334AIDBVR
OPA334AIDBVT
OPA335AIDBVR
OPA335AIDBVT
OPA335AIDR
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBV
DBV
DBV
DBV
D
6
6
5
3000
250
5
8
2500
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
OPA3355EA/2K5G4
TRIPLE OP-AMP, 15000uV OFFSET-MAX, 200MHz BAND WIDTH, PDSO14, GREEN, PLASTIC, TSSOP-14
TI
©2020 ICPDF网 联系我们和版权申明