OPA336MDBVREP [TI]
SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER MicroAmplifier⢠SERIES; 单电源微功耗CMOS运算放大器MicroAmplifierâ ?? ¢系列
| 型号： | OPA336MDBVREP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER MicroAmplifier⢠SERIES |
| 文件： | 总15页 (文件大小：570K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
OPA336-EP
SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER
MicroAmplifier™ SERIES
www.ti.com
SCES658–JUNE 2006
FEATURES
•
Controlled Baseline
•
•
•
Micro-Size Packages
– One Assembly/Test Site, One Fabrication
Site
Low Offset Voltage: 500 µV Typical
Specified From VS = 2.3 V to 5.5 V
•
•
Extended Temperature Performance of
–55°C to 125°C
APPLICATIONS
•
•
•
•
•
•
•
Battery-Powered Instruments
Portable Devices
High-Impedance Applications
Photodiode Preamplifiers
Precision Integrators
Medical Instruments
Enhanced Diminishing Manufacturing
Sources (DMS) Support
•
•
•
•
•
Enhanced Product-Change Notification
(1)
Qualification Pedigree
Single-Supply Operation
Rail-to-Rail Output (Within 3 mV)
Micro Power: IQ = 23 µA/Amplifier
Test Equipment
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
DBV PACKAGE
(TOP VIEW)
Out
V–
1
2
5
4
V+
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
+In
3
–In
DESCRIPTION/ORDERING INFORMATION
The OPA336 micro-power CMOS operational amplifier (MicroAmplifier™ series) is designed for battery-powered
applications. The device operates on a single supply, with operation as low as 2.1 V. The output is rail to rail and
swings to within 3 mV of the supplies with a 100-kΩ load. The common-mode range extends to the negative
supply — ideal for single-supply applications.
In addition to small size and low quiescent current (23 µA/amplifier), the OPA336 features low offset voltage
(500 µV typical), low input bias current (1 pA), and high open-loop gain (115 dB).
The device is packaged in the tiny DBV (SOT23-5) surface-mount package. It operates from –55°C to 125°C. A
macromodel is available for download (at www.ti.com) for design analysis.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–55°C to 125°C
DBV – SOT23-5
OPA336MDBVREP
OAYM
ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroAmplifier is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
OPA336-EP
SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER
MicroAmplifier™ SERIES
www.ti.com
SCES658–JUNE 2006
Absolute Maximum Ratings(1)
MIN
MAX UNIT
Supply voltage
Voltage range(2)
Signal input terminals
7.5
V
V
(V–) – 0.3 (V+) + 0.3
Current(2)
10
mA
Output short circuit(3)
Continuous
TA
Operating free-air temperature range
Storage temperature range
–55
–55
125
125
150
300
1000
500
100
°C
°C
°C
°C
Tstg
TJ
Junction temperature
Lead temperature (soldering, 10 s)
Charged-Device Model (CDM)
ESD rating
Human-Body Model (HBM)
Machine Model (MM)
V
θJA
Package thermal impedance
200 °C/W
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should
be current limited to 10 mA or less.
(3) Short circuit to ground, one amplifier per package
2
Submit Documentation Feedback
OPA336-EP
SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER
MicroAmplifier™ SERIES
www.ti.com
SCES658–JUNE 2006
Electrical Characteristics
over recommended operating temperature range, VS = 2.3 V to 5.5 V, TA = 25°C, VS = 5 V, RL = 25 kΩ connected to VS/2
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
µV
Offset Voltage
Input offset voltage
±500
±950
100
VOS
Input offset voltage overtemperature(1)
Input offset voltage vs power supply
Overtemperature(1)
25
0.1
±1
VS = 2.3 V to 5.5 V
PSRR
150
µV/V
Channel separation, dc
Input Bias Current
Input bias current
Overtemperature(1)
±10
±200
±60
IB
pA
pA
IOS
Input offset current
±1
Noise
Input voltage noise
f = 0.1 Hz to 10 Hz
f = 1 kHz
3
40
30
µVp-p
nV/√Hz
fA/√Hz
en
in
Input voltage noise density
Current noise density
f = 1 kHz
Input Voltage Range
VCM
Common-mode voltage range
–0.2
76
(V+) – 1
V
Common-mode rejection ratio
Overtemperature(1)
86
CMRR
–0.2 V < VCM < (V+) – 1 V
dB
72
Input Impedance
Differential input impedance
Common mode input impedance
Open-Loop Gain
1013
1013
2
4
Ω
Ω
pF
pF
RL = 25 kΩ,
100 mV < VO < (V+) – 100 mV
90
90
82
89
Open-loop voltage gain
Overtemperature(1)
RL = 5 kΩ,
500 mV < VO < (V+) – 500 mV
AOL
dB
RL = 25 kΩ,
100 mV < VO < (V+) – 100 mV
RL = 5 kΩ,
500 mV < VO < (V+) – 500 mV
Frequency Response
GBW
SR
Gain-bandwidth product
VS = 5 V, G = 1
VS = 5 V, G = 1
100
0.03
100
kHz
V/µs
µs
Slew rate
Overload recovery time
VIN × G = VS
(1) Limits apply over the specified temperature range, TA = –55°C to 125°C.
3
Submit Documentation Feedback
OPA336-EP
SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER
MicroAmplifier™ SERIES
www.ti.com
SCES658–JUNE 2006
Electrical Characteristics (continued)
over recommended operating temperature range, VS = 2.3 V to 5.5 V, TA = 25°C, VS = 5 V, RL = 25 kΩ connected to VS/2
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Output
RL = 100 kΩ, AOL ≥ 70 dB
RL = 25 kΩ, AOL ≥ 90 dB
RL = 5 kΩ, AOL ≥ 90 dB
RL = 25 kΩ, AOL ≥ 82 dB
RL = 5 kΩ, AOL ≥ 89 dB
3
20
70
Voltage output swing from rail(2)
Overtemperature(3)
100
500
100
500
mV
mV
mA
ISC
Short-circuit current
±5
CLOAD
Capacitive load drive(4)
Power Supply
VS Specified voltage range
2.3
5.5
V
V
Minimum operating voltage
Quiescent current (per amplifier)
Overtemperature(3)
2.1
23
35
38
IQ
IO = 0
µA
(2) Output voltage swings are measured between the output and positive and negative power-supply rails.
(3) Limits apply over the specified temperature range, TA = –55°C to 125°C.
(4) See Capacitive Load and Stability section
4
Submit Documentation Feedback
OPA336-EP
SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER
MicroAmplifier™ SERIES
www.ti.com
SCES658–JUNE 2006
TYPICAL CHARACTERISTICS
TA = 25°C, VS = 5 V, RL = 25 kΩ connected to VS/2 (unless otherwise noted)
POWER SUPPLY and COMMON MODE
CMRR
OPEN−LOOP GAIN/PHASE vs FREQUENCY
100
80
60
40
20
0
G
0
80
60
40
20
0
–45
–90
–135
–180
PSRR
Φ
–20
1
10
100
1k
10k
100k
1M
1
10
100
1k
10k
100k
125
125
Frequency (Hz)
Frequency (Hz)
QUIESCENT CURRENT vs SUPPLY VOLTAGE
Per Amplifier
QUIESCENT CURRENT vs TEMPERATURE
Per Amplifier
30
25
20
15
10
5
30
25
20
15
10
VS = 5 V
VS = 2.3 V
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
–75
–50
–25
0
25
50
75
100
Temperature (°C)
Supply Voltage (V)
SHORT−CIRCUIT CURRENT vs SUPPLY VOLTAGE
SHORT−CIRCUIT CURRENT vs TEMPERATURE
±6
±5
±4
±3
±2
±1
0
8
7
6
5
4
3
2
1
0
V
S = 5 V
–ISC
ISC
ISC
ISC
VS = 2.3 V
–ISC
–ISC
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
–75
–50
–25
0
25
50
75
100
Supply Voltage (V)
Temperature (°C)
5
Submit Documentation Feedback
OPA336-EP
SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER
MicroAmplifier™ SERIES
www.ti.com
SCES658–JUNE 2006
TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VS = 5 V, RL = 25 kΩ connected to VS/2 (unless otherwise noted)
INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
CHANNEL SEPARATION vs FREQUENCY
1k
100
10
1k
150
140
130
120
110
Voltage noise
100
10
Dual and quad devices, G = 1, all
channels. Quad measured channel A
to D or B to C—other combinations
yield improved rejection.
Current noise
100
1
1
10
1k
10k
100k
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
AOL, CMRR, PSRR vs TEMPERATURE
AOL
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
VS = 5.5 V
120
110
100
90
6
5
4
3
2
1
0
PSRR
VS = 2.3 V
CMRR
80
70
–75
–50
–25
0
25
50
75
100
125
100
1k
100k
Temperature (ºC)
OFFSET VOLTAGE-DRIFT MAGNITUDE
PRODUCTION DISTRIBUTION
25
20
15
10
5
25
20
15
10
5
Typical production
packaged units
Typical production
packaged units
0.3%
0.1%
0.2%
0.1%
0
0
Offset Voltage (µV)
Offset Voltage Drift (µV/_C)
6
Submit Documentation Feedback
OPA336-EP
SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER
MicroAmplifier™ SERIES
www.ti.com
SCES658–JUNE 2006
TYPICAL CHARACTERISTICS (continued)
TA = 25°C, VS = 5 V, RL = 25 kΩ connected to VS/2 (unless otherwise noted)
INPUT BIAS CURRENT
vs INPUT COMMON-MODE VOLTAGE
INPUT BIAS CURRENT vs TEMPERATURE
1k
100
10
4
3
2
1
0
= 5 V
VS
1
0.1
–75
–50
–25
0
25
50
75
100
125
0123 45
Common-Mode Voltage (V)
Temperature (°C)
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
VS = 5 V
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
= 2.5 V
5
4
3
2
1
0
–2.5
–2.0
–1.5
–1.0
–0.5
0
VS
−55°C
Sourcing
Current
125°C
25°C
VS = +2.3 V
125°C
125°C
−55°C
−55°C
25°C
25°C
01 234 567 8
–0
–1
–2
–3
–4
–5
–6
–7
–8
Output Current (mA)
Output Current (mA)
LARGE-SIGNAL STEP RESPONSE
G = 1, C L= 620 pF, VS = +5 V
SMALL-SIGNALSTEP RESPONSE
G = 1, C L = 200 pF, VS = +5 V
200 Ωs/div
50 Ωs/div
7
Submit Documentation Feedback
OPA336-EP
SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER
MicroAmplifier™ SERIES
www.ti.com
SCES658–JUNE 2006
APPLICATION INFORMATION
The OPA336 operational amplifier is fabricated with a state-of-the-art 0.6-micron CMOS process. The device is
unity-gain stable and suitable for a wide range of general-purpose applications. Power-supply pins should be
bypassed with 0.01-µF ceramic capacitors. The OPA336 is protected against reverse battery voltages.
Operating Voltage
The OPA336 can operate from a 2.1-V to 5.5-V single supply voltage, with excellent performance. Most behavior
remains unchanged throughout the full operating voltage range. Parameters that vary significantly with operating
voltage are shown in the typical characteristics. The OPA336 is fully specified for operation from
2.3 V to 5.5 V; a single limit applies over the supply range. In addition, many parameters are ensured over the
specified temperature range, –55°C to 125°C.
Input Voltage
The input common-mode range of the OPA336 extends from (V–) – 0.2 V to (V+) – 1 V. For normal operation,
inputs should be limited to this range. The absolute maximum input voltage is 300 mV beyond the supplies.
Thus, inputs greater than the input common-mode range, but less than maximum input voltage, while not valid,
will not cause any damage to the operational amplifier. Furthermore, the inputs may go beyond the power
supplies without phase inversion (see Figure 1), unlike some other operational amplifiers.
Normally, input bias current is approximately 1 pA. However, input voltages exceeding the power supplies can
cause excessive current to flow in or out of the input pins. Momentary voltages greater than the power supply
can be tolerated, as long as the current on the input pins is limited to 10 mA. This is easily accomplished with an
input resistor (see Figure 2).
6V
VOUT
0V
Figure 1. No Phase Inversion
With Inputs Greater Than Power-Supply Voltage
+5 V
IOVERLOAD
10 mA max
VOUT
VIN
5 kΩ
Figure 2. Input Current Protection
for Voltages Exceeding Power-Supply Voltage
8
Submit Documentation Feedback
OPA336-EP
SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER
MicroAmplifier™ SERIES
www.ti.com
SCES658–JUNE 2006
APPLICATION INFORMATION (CONTINUED)
Capacitive Load and Stability
The OPA336 can drive a wide range of capacitive loads. However, all operational amplifiers, under certain
conditions, may become unstable. Operational amplifier configuration, gain, and load value are just a few of the
factors to consider when determining stability.
When properly configured, the OPA336 drives approximately 10,000 pF. An operational amplifier in unity-gain
configuration is the most vulnerable to capacitive load. The capacitive load reacts with the operational amplifier
output resistance along with any additional load resistance to create a pole in the response, which degrades the
phase margin. In unity gain, the OPA336 performs well with a pure capacitive load, up to about 300 pF.
Increasing gain enhances the amplifier's ability to drive loads beyond this level.
One method of improving capacitive load drive in the unity-gain configuration is to insert a 50-Ω to 100-Ω
resistor inside the feedback loop (see Figure 3). This reduces ringing with large capacitive loads, while
maintaining direct current (DC) accuracy. For example, with RL = 25 kΩ, OPA336 performs well with capacitive
loads in excess of 1000 pF (see Figure 4). Without the OPA336 RS, capacitive load drive typically is 350 pF for
these conditions (see Figure 5).
RS
100 Ω
VOUT
VIN
CL
RL
Figure 3. Series Resistor in Unity-Gain Configuration
Improves Capacitive Load Drive
R
S
= 100 Ω, Load = 2 kΩ || 1000 pF, V +5 V
s
50 µs/div
Figure 4. Small-Signal Step Response
Using Series Resistor to Improve Capacitive Load Drive
9
Submit Documentation Feedback
OPA336-EP
SINGLE-SUPPLY MICRO-POWER CMOS OPERATIONAL AMPLIFIER
MicroAmplifier™ SERIES
www.ti.com
SCES658–JUNE 2006
APPLICATION INFORMATION (CONTINUED)
10k
Operation Above Selected Gain
Curve Not Recommended
G = +1
R
L
to Ground
R
L
to Ground
1k
R
L
to V /2
S
VS = +5 V, VO = VS/2
100
5
10
100
Resistive Load (kΩ)
Figure 5. Stability — Capacitive Load vs Resistive Load
Alternatively, the resistor may be connected in series with the output outside of the feedback loop. However, if
there is a resistive load parallel to the capacitive load, it and the series resistor create a voltage divider. This
introduces a DC error at the output; however, this error may be insignificant. For instance, with
RL = 100 kΩ and RS = 100 Ω, there is only about a 0.1% error at the output.
Figure 5 shows the recommended operating regions for the OPA336. Decreasing the load resistance generally
improves capacitive load drive. Figure 5 also shows how stability differs, depending on where the resistive load
is connected. With G = 1 and RL = 10 kΩ connected to VS/2, the OPA336 typically can drive 500 pF. Connecting
the same load to ground improves capacitive load drive to 1000 pF.
10
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2009
PACKAGING INFORMATION
Orderable Device
OPA336MDBVREP
V62/06641-01XE
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
Call TI
Level-2-260C-1 YEAR
SOT-23
DBV
5
3000 Green (RoHS &
no Sb/Br)
Call TI
Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA336-EP :
Catalog: OPA336
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
OPA336MDBVREP
SOT-23
DBV
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOT-23 DBV
SPQ
Length (mm) Width (mm) Height (mm)
195.0 200.0 45.0
OPA336MDBVREP
5
3000
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Logic
Power Mgmt
Microcontrollers
RFID
Telephony
Video & Imaging
Wireless
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明