OPA660U [TI]
SPECIALTY ANALOG CIRCUIT, PDSO8, SOIC-8;
| 型号： | OPA660U |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | SPECIALTY ANALOG CIRCUIT, PDSO8, SOIC-8 光电二极管 |
| 文件： | 总11页 (文件大小：272K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
OPA693
OPA693
OPA693
SBOS257A – AUGUST 2002 – REVISED JUNE 2003
Ultra-Wideband, Fixed Gain
Video BUFFER AMPLIFIER with Disable
DESCRIPTION
FEATURES
The OPA693 provides an easy to use, broadband fixed gain
buffer amplifier. Depending on the external connections, the
internal resistor network may be used to provide either a
fixed gain of +2 video buffer or a gain of +1 or –1 voltage
buffer. Operating on a low 13mA supply current, the OPA693
offers a slew rate (2500V/µs) and bandwidth (> 800MHz)
normally associated with a much higher supply current. A
new output stage architecture delivers high output current
with a minimal headroom and crossover distortion. This gives
exceptional single-supply operation. Using a single +5V
supply, the OPA693 can deliver a 2.5VPP swing with over
80mA drive current and 500MHz bandwidth at a gain of +2.
This combination of features makes the OPA693 an ideal
RGB line driver or single-supply undersampling Analog-to-
Digital Converter (ADC) input driver.
● VERY HIGH BANDWIDTH (G = +2): 800MHz
● FLEXIBLE SUPPLY RANGE:
+5V to +12V Single Supply
±2.5V to ±6V Dual Supplies
● INTERNALLY FIXED GAIN: +2 or ±1
● LOW SUPPLY CURRENT: 13mA
● LOW DISABLED CURRENT: 120µA
● HIGH OUTPUT CURRENT: 100mA
● OUTPUT VOLTAGE SWING: ±4.0V
● SOT23-6 AVAILABLE
APPLICATIONS
The OPA693’s low 13mA supply current is precisely trimmed
at 25°C. This trim, along with low drift over temperature,
ensures lower maximum supply current than competing
products that report only a room temperature nominal supply
current. System power may be further reduced by using the
optional disable control pin. Leaving this disable pin open, or
holding it HIGH, gives normal operation. This optional dis-
able allows the OPA693 to fit into existing video buffer
layouts where the disable pin is unconnected to get improved
performance with no board changes. If pulled LOW, the
OPA693 supply current drops to less than 120µA while the
output goes into a high impedance state. This feature may be
used for power savings.
● BROADBAND VIDEO LINE DRIVERS
● MULTIPLE LINE VIDEO DA
● PORTABLE INSTRUMENTS
● ADC BUFFERS
● ACTIVE FILTERS
● HFA1112 IMPROVED DROP-IN
OPA693 RELATED PRODUCTS
SINGLES
OPA690
OPA691
OPA692
DUALS
OPA2690
OPA2691
—
TRIPLES
OPA3690
OPA3691
OPA3692
Voltage Feedback
Current Feedback
Fixed Gain
The low gain stable current feedback architecture used in the
OPA693 is particularly suitable for high full-power bandwidth
cable driving requirements. Where the additional flexibility of
an op amp is required, consider the OPA695 ultra wideband
current feedback op amp. Where a unity gain stable voltage
feedback op amp with very high slew rate is required,
consider the OPA690.
OPA693
1
2
3
4
300Ω
8
7
6
5
DIS
75Ω
300Ω
+5V
Video
In
RG-59
75Ω
75Ω
–5V
75Ω
RG-59
75Ω
SO-8
G = +2
800MHz, 2-Output Component Video DA
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2002-2003, Texas Instruments Incorporated
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
Power Supply .............................................................................. ±6.5VDC
Internal Power Dissipation(2) ............................ See Thermal Information
Differential Input Voltage .................................................................. ±1.2V
Input Voltage Range............................................................................ ±VS
Storage Temperature Range: D, DVB ...........................–40°C to +125°C
Lead Temperature (soldering, 10s).............................................. +300°C
Junction Temperature (TJ ) ........................................................... +150°C
NOTES:: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
(2) Packages must be derated based on specified θJA. Maximum TJ must be
observed.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
SPECIFIED
PACKAGE
DESIGNATOR(1)
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PRODUCT
PACKAGE-LEAD
OPA693
SO-8
D
"
–40°C to +85°C
OPA693D
OPA693ID
OPA693IDR
Rails, 100
"
OPA693
"
"
"
"
TBD
"
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 3000
SOT23-6
DBV
–40°C to +85°C
OPA693IDBVT
OPA693IDBVR
"
"
"
NOTES: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
PIN CONFIGURATION
Top View
SO-8
Top View
SOT23-6
Output
–VS
1
2
3
6
5
4
+VS
RF
300Ω
DIS
–IN
RG
300Ω
NC
–IN
+IN
–VS
1
2
3
4
8
7
6
5
DIS
R
F
R
G
+IN
+VS
300Ω
300Ω
Output
NC
6
5
4
NC: No Connection
C59
1
2
3
Pin Orientation/Package Marking
OPA693
2
SBOS257
www.ti.com
ELECTRICAL CHARACTERISTICS: VS = ±5V
Boldface limits are tested at 25°C.
G = +2 (–IN grounded) and RL = 100Ω (see Figure 1 for AC performance only), unless otherwise noted.
OPA693ID, IDBV
TYP
MIN/MAX OVER TEMPERATURE(1)
0
°
C to
–40
+85°C
°
C to
MIN/
TEST
MAX LEVEL(2 )
PARAMETER
CONDITIONS
+25°C
+25°C
70°C
UNITS
AC PERFORMANCE (see Figure 1)
Small-Signal Bandwidth (VO < 0.5VPP
)
G = +1
G = +2
1200
800
700
400
0.5
220
2400
0.7
2.2
5
MHz
MHz
MHz
MHz
dB
typ
min
typ
C
B
C
B
B
C
B
C
C
C
C
600
550
300
1
550
500
250
1.5
500
450
200
1.8
G = –1
Bandwidth for 0.1dB Gain Flatness
Peaking at a Gain of +1
Large-Signal Bandwidth
Slew Rate
G = +2, VO < 0.5VPP
VO < 0.5VPP
min
max
typ
G = +2, VO = 5VPP
G = +2, 4V Step
G = +2, VO = 0.5V Step
G = +2, VO = 5V Step
G = +2, VO = 2V Step
G = +2, VO = 2V Step
G = +2, f = 10MHz, VO = 2VPP
RL = 100Ω
MHz
V/µs
ns
2100
1375
1350
min
typ
Rise-and-Fall Time
ns
typ
Settling Time to 0.02%
0.1%
ns
typ
3
ns
typ
Harmonic Distortion
2nd-Harmonic
–75
–85
–89
–99
1.6
dBc
dBc
max
max
max
max
max
max
max
typ
B
B
B
B
B
B
B
C
C
C
C
RL ≥ 500Ω
3rd-Harmonic
RL = 100Ω
dBc
RL ≥ 500Ω
dBc
Input Voltage Noise
f > 1MHz
nV/√Hz
pA/√Hz
pA/√Hz
%
Noninverting Input Current Noise
Inverting Input Current Noise (internal)
Differential Gain
f > 1MHz
17
f > 1MHz
21
NTSC, RL = 150Ω
NTSC, RL = 37.5Ω
NTSC, RL = 150Ω
NTSC, RL = 37.5Ω
0.02
0.05
0.01
0.05
%
typ
Differential Phase
deg
typ
deg
typ
DC PERFORMANCE(3)
Gain Error
G = +1
G = +2
±0.2
±0.3
±0.2
%
%
%
typ
C
A
B
±0.6
±0.5
±0.7
±0.6
±0.8
±0.8
max
max
G = –1, RS = 0Ω
Internal RF and RG
Maximum
300
300
341
264
345
260
0.13
348
255
0.13
Ω
Ω
max
min
A
A
B
A
B
A
B
A
B
Minimum
Average Drift
0.13
±2.0
%/C°
mV
max
max
max
max
max
max
max
Input Offset Voltage
VCM = 0V
VCM = 0V
VCM = 0V
VCM = 0V
VCM = 0V
VCM = 0V
±0.7
+10
±10
Average Offset Voltage Drift
Noninverting Input Bias Current
Average Noninverting Input Bias Current Drift
Inverting Input Bias Current (internal)
Average Inverting Input Bias Current Drift
±12
±20
µV/°C
µA
±30
±40
nA/°C
µA
nA°C
INPUT
Common-Mode Input Range
Noninverting Input Impedance
±3.5
±3.4
±3.3
±3.2
V
min
typ
B
C
100 || 2
kΩ || pF
OUTPUT
Voltage Output Swing
No Load
±4.0
±3.9
+120
–120
0.12
±3.8
±3.7
+90
–90
V
V
min
min
min
min
typ
A
A
A
A
C
100Ω Load
Current Output, Sourcing
Sinking
mA
mA
Ω
Closed-Loop Output Impedance
G = +2, f = 100kHz
NOTES: (1) Junction temperature = ambient temperature for low temperature limit and +25°C specifications. Junction temperature = ambient temperature +10°C
at high temperature limit specifications.
(2) Test Levels: (A) 100% tested at +25°C. Over temperature limits by characterization and simulation. (B) Limits set by characterization and simulation. (C) Typical
value only for information.
(3) Current is considered positive out-of-node. VCM is the input common-mode voltage.
OPA693
SBOS257
3
www.ti.com
ELECTRICAL CHARACTERISTICS: VS = ±5V (Cont.)
Boldface limits are tested at 25°C.
G = +2 (–IN grounded) and RL = 100Ω (see Figure 1 for AC performance only), unless otherwise noted.
OPA693ID, IDBV
MIN/MAX OVER TEMPERATURE(1)
TYP
0
°
C to
–40
+85°C
°
C to
MIN/
TEST
MAX LEVEL(2 )
PARAMETER
CONDITIONS
+25°C
+25°C
70°C
UNITS
DISABLE/POWER DOWN (DIS Pin)
Power-Down Supply Current (+VS)
Disable Time
VDIS = 0
–80
1
–120
µA
µs
ns
dB
pF
mV
mV
V
max
typ
A
C
C
C
C
C
C
A
A
A
VIN = +1VDC
VIN = +1VDC
G = +2, 5MHz
Enable Time
25
typ
Off Isolation
70
typ
Output Capacitance in Disable
Turn On Glitch
4
typ
G = +2, RL = 150Ω, VIN = V
G = +2, RL= 150Ω, VIN = V
+VS = +5V
±100
±20
3.3
1.8
75
typ
Turn Off Glitch
typ
Enable Voltage
3.5
1.7
130
min
max
max
Disable Voltage
+VS = +5V
V
Control Pin Input Bias Current
VDIS = 0
µA
POWER SUPPLY
Specified Operating Voltage
Maximum Operating Voltage Range
Max Quiescent Current
±5
V
typ
max
max
min
min
C
A
A
A
A
±6
13.3
12.7
55
±6
±6
V
VS = ±5V
VS = ±5V
13
13
58
mA
mA
dB
Min Quiescent Current
Power-Supply Rejection Ratio (–PSRR)
Input Referred
TEMPERATURE RANGE
Specification: D, DBV
–40 to +85
°C
typ
C
Thermal Resistance, θJA
D
SO-8
125
150
°C/W
°C/W
typ
typ
C
C
DBV SOT23-6
NOTES: (1) Junction temperature = ambient temperature for low temperature limit and +25°C specifications. Junction temperature = ambient temperature +10°C
at high temperature limit specifications.
(2) Test Levels: (A) 100% tested at +25°C. Over temperature limits by characterization and simulation. (B) Limits set by characterization and simulation. (C) Typical
value only for information.
(3) Current is considered positive out-of-node. VCM is the input common-mode voltage.
OPA693
4
SBOS257
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
OPA693ID
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOIC
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
D
8
6
6
6
6
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
OPA
693
OPA693IDBVR
OPA693IDBVRG4
OPA693IDBVT
OPA693IDBVTG4
OPA693IDG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DBV
D
3000
3000
250
250
75
Green (RoHS
& no Sb/Br)
C59
Green (RoHS
& no Sb/Br)
C59
C59
C59
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
OPA
693
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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