OPA846-DIE [TI]
宽带、低噪声、电压反馈运算放大器，OPA846-DIE;
| 型号： | OPA846-DIE |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 宽带、低噪声、电压反馈运算放大器，OPA846-DIE 放大器 运算放大器 |
| 文件： | 总5页 (文件大小：319K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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OPA846-DIE
ZHCSBV4A –DECEMBER 2013–REVISED MARCH 2017
OPA846-DIE 宽带、低噪声、电压反馈运算放大器
1 特性
3 说明
1
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高带宽
OPA846-DIE 兼具极高增益带宽和大信号性能以及极
低输入电压噪声，且耗散较低的电源电流。经典的差分
输入级以及两个正向增益级和一个高功率输出级相结
合，使得 OPA846-DIE 成为具有出色直流精度和输出
驱动能力的优质低失真放大器。借助电压反馈架构，所
有标准运算放大器 应用 应用都能实现非常高的性能。
低输入电压噪声
极低失真
高转换率
高直流精度
低电源电流
高增益带宽积
低输入电压和电流噪声以及增益带宽相结合，使得
OPA846 成为适合宽带互阻抗级的理想放大器。
2 应用
可使用一项全新的外部补偿技术来为 OPA846-DIE 提
供一个低于最小稳定增益的十分平坦的频率响应，从而
进一步改进其已经十分出色的失真性能。
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高动态范围 ADC 前置放大器
低噪声、宽带、互阻抗放大器
宽带、高增益放大器
低噪声差动接收器
VDSL 线路接收器
超声通道放大器
安全传感器前端
订购信息(1)
封装
标识符
产品
封装
裸片采用叠片封装(2)
可订购部件号
封装数量
OPA846TDB1
OPA846TDB2
300
10
OPA846
TD
(1) 要获得最新的封装和订购信息，请参阅本文档末尾的封装选项附录，或者浏览 TI 网站 www.ti.com。
(2) 加工过程遵循德州仪器 (TI) 商业生产基本规范，制造过程符合德州仪器 (TI) 质量控制系统的实际要求。电气筛选仅包括室温下的直流参数
和功能测试。除非德州仪器 (TI) 另有说明，否则不对交流性能和过热性能进行保证。在最少 75 倍的放大倍数下，按照 MIL-STD-883 测试
方法 2010 条件 B 执行目视检查。
4 修订历史记录
Changes from Original (December 2013) to Revision A
Page
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Added designator to diagram in Bare Die Information section............................................................................................... 2
Added note after diagram in Bare Die Information section regarding added designator ....................................................... 2
Changed description for pad number 5 and 6 in the Bond Pad Coordinates in Microns table .............................................. 2
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SBOS696
OPA846-DIE
ZHCSBV4A –DECEMBER 2013–REVISED MARCH 2017
www.ti.com.cn
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5 Bare Die Information
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
Silicon with backgrind
10.5 mils.
Floating
Ti/Alcu (0.5%)/TiW
1010 nm
(1) Designator "CIC60140" may appear on die.
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
N/C
PAD NUMBER
X MIN
27
Y MIN
477
251
27
X MAX
103
Y MAX
553
1
2
3
4
5
6
Inverting Input
Noninverting Input
Output
27
105
329
27
103
103
949
947
949
27
1025
1025
1025
103
–Vs
251
477
329
+Vs
553
2
版权 © 2013–2017, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
14-Feb-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
OPA846TDB1
OPA846TDB2
ACTIVE
ACTIVE
0
0
300
10
RoHS & Green
RoHS & Green
Call TI
N / A for Pkg Type
N / A for Pkg Type
25 to 25
25 to 25
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Feb-2021
Addendum-Page 2
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有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
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