PADS131B26QPHPRQ1 [TI]
用于检测电流和电压的汽车类、六个 ADC 通道、高压 SPI 电池包监视器 | PHP | 48 | -40 to 125;
| 型号： | PADS131B26QPHPRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 用于检测电流和电压的汽车类、六个 ADC 通道、高压 SPI 电池包监视器 | PHP | 48 | -40 to 125 电池 监视器 高压 |
| 文件： | 总8页 (文件大小：1111K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ADS131B26-Q1
ZHCSQY2 –SEPTEMBER 2022
ADS131B26-Q1 适用于电池管理系统的汽车类电流、电压和温度测量模拟前端
1 特性
3 说明
• 符合面向汽车应用的AEC-Q100 标准
ADS131B26-Q1 是一款适用于电动汽车(EV) 电池管理
系统 (BMS) 的完整模拟前端 (AFE)。该 AFE 集成了两
个同步采样、高精度、24 位 ADC 通道（ADC1A、
ADC1B），可使用外部分流电阻器以高分辨率和高精
度对电池电流进行冗余测量。两个独立的数字过流检测
比较器与两个ADC 并联工作，可实现快速过流检测。
– 温度等级1：–40°C 至+125°C，TA
• 以符合功能安全标准为目标
– 专为功能安全应用开发
– 在发布量产版本时将会提供有助于进行ISO
26262 系统设计的文档
– 系统可满足ASIL D 等级要求
– 硬件可满足ASIL D 等级要求
• 两个用于电流分流测量的同步采样24 位ADC
（ADC1A、ADC1B）
此外，该器件还集成了一组（两个）同步采样 24 位
ADC（ADC3A、ADC3B），可使用外部高压电阻分压
器同时测量电池包电压和电池电流，从而准确监测电池
充电状态和运行状况。
– 可编程数据速率：500SPS 至64kSPS
– 可编程满标量程：±39 mV 至±312.5 mV
– 偏移误差（全局斩波模式）：2μV（最大值）
– 增益漂移：15ppm/°C（最大值）
– 每个ADC 均连接具有可编程阈值和抗尖峰脉冲
时间的数字过流比较器
两个额外的多路复用 16 位 ADC 通道（ADC2A、
ADC2B）可借助热敏电阻或模拟输出温度传感器等外
部温度传感器测量分流器温度以及系统中的其他电压。
该器件集成了多种监控和诊断功能，可缓解和检测随机
硬件故障，从而帮助开发功能安全的BMS。
• 两个用于电压测量的同步采样24 位ADC
（ADC3A、ADC3B）
– 可编程数据速率：500SPS 至64kSPS
– 可编程满标量程：±312.5mV 至±1.25V
• 两个用于电压和温度测量的多路复用16 位ADC
（ADC2A、ADC2B）
ADS131B26-Q1 采用 48 引脚 HTQFP 封装，额定汽
车级温度范围为–40°C 至+105°C。
封装信息(1)
器件型号
封装
封装尺寸（标称值）
ADS131B26-Q1
7.00mm × 7.00mm
PHP（HTQFP、
48）
– 每个ADC 八个输入通道
– 可编程满标量程：±312.5mV 至±1.25V
– 通道自动序列发生器
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
2 应用
• 汽车电池管理系统(BMS)：
– 电流分流测量
– 使用外部电阻分压器实现电压测量
– 使用热敏电阻或模拟输出温度传感器实现温度测
量
Kl.30
Isolated
DC/DC-Converter
CAN
SBC
CAN Bus
IBAT
HV-
ADS131B26-Q1
SPI
SPI
Digital
Shunt
MCU
Isolator
UI-Sensor AFE
HV-
Isolation Barrier
Temperature
Sensor
EV BMS 电流检测模块(CSM) 系统方框图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SBASAM9
ADS131B26-Q1
ZHCSQY2 –SEPTEMBER 2022
www.ti.com.cn
4 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
4.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
4.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
4.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
4.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
4.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
2
Submit Document Feedback
Product Folder Links: ADS131B26-Q1
ADS131B26-Q1
ZHCSQY2 –SEPTEMBER 2022
www.ti.com.cn
5.1 Mechanical Data
PACKAGE OUTLINE
PowerPADTM HTQFP - 1.2 mm max height
PHP0048G
.
PLASTIC QUAD FLATPACK
7.2
6.8
B
NOTE 3
37
48
PIN 1 ID
1
36
7.2
6.8
9.2
TYP
8.8
NOTE 3
12
25
13
24
A
0.27
48X
44X 0.5
0.17
0.08
C A B
4X 5.5
1.2 MAX
C
SEATING PLANE
SEE DETAIL A
0.08
(0.13)
TYP
13
24
12
25
0.25
(1)
GAGE PLANE
5.17
3.89
49
0.75
0.45
0.15
0.05
0 -7
A
16
36
DETAIL A
TYPICAL
1
48
37
5.17
3.89
4X (0.109) NOTE 5
4225861/A 4/2020
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MS-026.
5. Feature may not be present.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: ADS131B26-Q1
ADS131B26-Q1
ZHCSQY2 –SEPTEMBER 2022
www.ti.com.cn
EXAMPLE BOARD LAYOUT
PowerPADTM HTQFP - 1.2 mm max height
PHP0048G
PLASTIC QUAD FLATPACK
( 6.5)
NOTE 10
(5.17)
SYMM
48
37
SOLDER MASK
DEFINED PAD
48X (1.6)
1
36
48X (0.3)
SYMM
49
(5.17)
(1.1 TYP)
(8.5)
44X (0.5)
12
25
(R0.05) TYP
(
0.2) TYP
VIA
METAL COVERED
BY SOLDER MASK
13
24
(1.1 TYP)
SEE DETAILS
(8.5)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4225861/A 4/2020
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
10. Size of metal pad may vary due to creepage requirement.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
4
Submit Document Feedback
Product Folder Links: ADS131B26-Q1
ADS131B26-Q1
ZHCSQY2 –SEPTEMBER 2022
www.ti.com.cn
EXAMPLE STENCIL DESIGN
PowerPADTM HTQFP - 1.2 mm max height
PHP0048G
PLASTIC QUAD FLATPACK
(5.17)
BASED ON
0.125 THICK STENCIL
SEE TABLE FOR
SYMM
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
48
37
48X (1.6)
1
36
48X (0.3)
(8.5)
(5.17)
SYMM
49
BASED ON
0.125 THICK
STENCIL
44X (0.5)
12
25
(R0.05) TYP
METAL COVERED
BY SOLDER MASK
24
13
(8.5)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
5.78 X 5.78
5.17 X 5.17 (SHOWN)
4.72 X 4.72
0.125
0.150
0.175
4.37 X 4.37
4225861/A 4/2020
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: ADS131B26-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PADS131B26QPHPRQ1
ACTIVE
HTQFP
PHP
48
1000
TBD
Call TI
Call TI
-40 to 125
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
GENERIC PACKAGE VIEW
PHP 48
7 x 7, 0.5 mm pitch
TQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226443/A
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022，德州仪器 (TI) 公司
相关型号：
PADS5281IRGCT
8-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PQCC64, 9 X 9 MM, PLASTIC, QFN-48
TI
PADS9817RSHT
Eight-channel, 18-bit, 2-MSPS/ch dual simultaneous-sampling ADC with integrated analog front end | RSH | 56 | -40 to 125
TI
©2020 ICPDF网 联系我们和版权申明