PBQ79718B1PAPTQ1 [TI]

符合 ASIL-D 标准的汽车类 18 节串联精密电池监控器、平衡器和集成保护器 | PAP | 64 | -40 to 125;


型号：	PBQ79718B1PAPTQ1
厂家：	TEXAS INSTRUMENTS
描述：	符合 ASIL-D 标准的汽车类 18 节串联精密电池监控器、平衡器和集成保护器 \| PAP \| 64 \| -40 to 125 电池监控
文件：	总11页 (文件大小：1668K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BQ79718-Q1

ZHCSRE7 –DECEMBER 2022

BQ79718-Q1 功能安全合规型汽车类18 节串联电池监测器

器件信息

封装⁽¹⁾

1 特性

器件型号

封装尺寸（标称值）

• 符合AEC-Q100 标准，环境温度范围为–40°C 至

+125°C

• 以功能安全合规型为目标

BQ79718-Q1

10.00mm ×

10.00mm

HTQFP（64 引脚）

BQ79716-Q1⁽²⁾

BQ79714-Q1⁽²⁾

BQ79758-Q1⁽²⁾

10.00mm ×

10.00mm

– 可提供用于ISO 26262 系统设计的文档

– 系统可满足ASIL D 等级要求

– 硬件可满足ASIL D 等级要求

• 每个器件可测量9-18 节串联电池，最多可堆叠35

个器件

10.00mm ×

10.00mm

10.00mm ×

10.00mm

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

(2) 预发布

• 每节电池具有专用ADC，精度为+/- 1mV

• 电池电压和电池包电流测量同步至64us

• 支持完全冗余的跛行回家模式

• 集成式后ADC 可配置数字低通滤波器

• 支持汇流条而不影响测量精度

• 12 个用于温度传感器/模拟/数字/I2C 控制器/SPI 控

制器的GPIO

Isolation

circuit

COMHP

COMHN

CELL 18

CELL 17

BQ79718

CELL 1

• 内部电池均衡

Isolation

circuit

GPIOx

COMLN

COMLP

– 300mA 时达到平衡

NTC/PTC

ModuleN

– 用户控制PWM 调节平衡电流

– 内置平衡热管理，具有自动暂停和恢复控制功能

• 稳健的菊花链通信和支持环形架构

• 主机的硬件复位可在不移除电池的情况下模拟类似

POR 的事件

• 支持变压器和电容隔离

• 用于一次自定义编程的片上存储器

• 关断电流< 5uA

Busbar

Isolation

circuit

COMHP

COMHN

CELL 18

CELL 17

BQ79718

CELL 1

Isolation

circuit

GPIOx

COMLN

COMLP

NTC/PTC

• 与具有SPI/UART 接口的BQ79600-Q1 兼容

Module2

2 应用

Busbar

Isolation

circuit

• 混合动力和电动动力总成系统中的电池管理系统

(BMS)

• 带有电池管理系统的储能电池组

COMHP

COMHN

PACK+

CELL 18

CELL 17

LINK+

BQ79718

12V

CELL 1

3 说明

Isolation

circuit

GPIOx

COMLN

COMLP

Safety

MCU

CAN

NTC/PTC

BQ79718-Q1 可对 xEV/EV 的高压电池管理系统中高

达 18 节串联的电池模块提供高精度的电芯电压测量。

该系列监测器在同一封装类型中提供不同的通道选项，

同时提供引脚对引脚兼容性，并支持在任何平台上高度

重复使用既有的软件和硬件。该器件具有非常先进的

ADC 架构/测量系统，可满足严格的汽车标准/安全要

求。该器件通过变压器（或电容器）隔离菊花链，适用

于xEV 动力总成中的集中式或分布式架构。

Module1

SPI or

UART

LINK+/-; PACK+/-; Insulation

COMLP

COMLN

COMHP

Isolation

circuit

COMHN

BQ79600

UIR

Isolation circuit

sensor

COMLN

COMHP

COMHN

COMLP

Chassis ground

Pyro Fuse

PACK-

LINK-

简化版系统图

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLUSF54

BQ79718-Q1

ZHCSRE7 –DECEMBER 2022

www.ti.com.cn

4 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed below.

4.1 Device Support

4.1.1 第三方产品免责声明

TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此

类产品或服务单独或与任何TI 产品或服务一起的表示或认可。

4.2 Documentation Support

4.2.1 Related Documentation

4.3 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新进行注册，即可每周接收产品信息更

改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

4.4 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

4.5 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

4.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

4.7 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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BQ79718-Q1

ZHCSRE7 –DECEMBER 2022

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5.1 Package Option Addendum

Packaging Information

Package

Type

Package

Drawing

Package

Qty

Lead/Ball

Finish⁽⁶⁾

MSL Peak

Temp⁽³⁾

Op Temp

(°C)

Device

Orderable Device

Status⁽¹⁾

Pins

Eco Plan⁽²⁾

Marking^{(4) (5)}

PBQ79718B1PAPRQ1

HTQFP

PAP

1000

Call TI

–40 to 85

PRE_PROD

PBQ79718B1

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest

availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the

requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified

lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used

between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by

weight in homogeneous material).

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the

finish value exceeds the maximum column width.

Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on

information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI

has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming

materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Submit Document Feedback

Product Folder Links: BQ79718-Q1

BQ79718-Q1

ZHCSRE7 –DECEMBER 2022

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5.2 Tape and Reel Information

REEL DIMENSIONS

TAPE DIMENSIONS

Reel

Diameter

Cavity

A0 Dimension designed to accommodate the component width

B0 Dimension designed to accommodate the component length

K0 Dimension designed to accommodate the component thickness

Overall width of the carrier tape

P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2

Q3 Q4

Q1 Q2

Q3 Q4

User Direction of Feed

Pocket Quadrants

Reel

Diameter

(mm)

Reel

Width W1

(mm)

Package

Type

Package

Drawing

(mm)

Pin1

Quadrant

Device

Pins

SPQ

PBQ79718B1PAPTQ1

HTQFP

PAP

1000

330.0

1.5

12.0

16.0

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TAPE AND REEL BOX DIMENSIONS

Width (mm)

Device

PBQ79718B1PAPTQ1

Package Type

Package Drawing Pins

PAP 64

SPQ

Length (mm) Width (mm)

367.0 367.0

Height (mm)

HTQFP

1000

55.0

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5.3 Mechanical Data

PACKAGE OUTLINE

HTQFP - 1.2 mm max height

PAP0064N

PLASTIC QUAD FLATPACK

10.2

9.8

PIN 1 ID

10.2

9.8

12.2

11.8

0.27

0.17

64X

60X 0.5

0.08

4X 7.5

1.2

SEE DETAIL A

SEATING PLANE

0.09- 0.20

TYP

0.08

(0.11) TYP

NOTE 5

0° MIN

0.25

(1)

GAGE PLANE

5.30

4.06

0.15

0.05

0°- 7°

0.75

0.45

(0.11) TYP

NOTE 5

EXPOSED

THERMAL PAD

4225982/B 07/2021

PowerPAD is a trademark of Texas Instruments

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Body length does not include mold ﬂash, protrusions, or gate burrs. Mold ﬂash, protrusions, or gate burrs shall not exceed 0.15

per side.

4. Body width does not include interlead ﬂash. Interlead ﬂash shall not exceed 0.50 per side.

5. Strap features may not be present.

6. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

www.ti.com

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EXAMPLE BOARD LAYOUT

HTQFP - 1.2 mm max height

PAP0064N

PLASTIC QUAD FLATPACK

(

8) NOTE 9

SYMM

(

5.3)

SOLDER MASK

OPENING

SOLDER MASK

DEFINED PAD

64X (1.5)

64X (0.3)

(0.65)

TYP

SYMM

(11.4)

60X (0.5)

(1.3)

TYP

(Ø 0.2) TYP

VIA

METAL COVERED

BY SOLDER MASK

(1.3) TYP

SEE DETAIL

(0.65) TYP

(11.4)

LAND PATTERN EXAMPLE

SCALE: 8X

0.05 MAX

ALL AROUND

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

4225982/B 07/2021

NOTES: (continued)

7. Publication IPC-7351 may have alternate designs.

8. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

9. This package is designed to be soldered to a thermal pad on the board. Refer to technical brief, PowerPAD Thermally Enhanced

Package, Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).

www.ti.com

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EXAMPLE STENCIL DESIGN

HTQFP - 1.2 mm max height

PAP0064N

PLASTIC QUAD FLATPACK

(

5.3)

BASED ON

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

0.1 THICK STENCIL

THICKNESSES

64X (1.5)

64X (0.3)

SYMM

(11.4)

60X (0.5)

METAL COVERED

BY SOLDER MASK

SYMM

(11.4)

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED COVERAGE BY AREA

SCALE: 8X

STENCIL

THICKNESS

SOLDER STENCIL

OPENING

5.3X5.3 (SHOWN)

4.44 X 4.44

0.1

0.127

0.152

0.178

4.06 X 4.06

3.75 X 3.75

4225982/B 07/2021

NOTES: (continued)

9. Laser cutting apertures with trapezoidal walls and rounded corners may oﬀer better paste release. IPC-7525 may have alternate

design recommendations.

10. Board assembly site may have diﬀerent recommendations for stencil design.

www.ti.com

Submit Document Feedback

Product Folder Links: BQ79718-Q1

PACKAGE OPTION ADDENDUM

www.ti.com

21-Dec-2022

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

PBQ79718B1PAPTQ1

ACTIVE

HTQFP

PAP

250

TBD

Call TI

-40 to 125

Samples

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

GENERIC PACKAGE VIEW

PAP 64

10 x 10, 0.5 mm pitch

HTQFP - 1.2 mm max height

QUAD FLATPACK

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4226442/A

www.ti.com

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担

保。

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证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

本、损失和债务，TI 对此概不负责。

TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改

TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

PBQ79718B1PAPTQ1 [TI]

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