PCF8574RGTRG4 [TI]

REMOTE 8-BIT I/O EXPANDER FOR I2C BUS; 远程8位I / O扩展器I2C总线
PCF8574RGTRG4
型号: PCF8574RGTRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

REMOTE 8-BIT I/O EXPANDER FOR I2C BUS
远程8位I / O扩展器I2C总线

文件: 总23页 (文件大小:944K)
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PCF8574  
REMOTE 8-BIT I/O EXPANDER FOR I2C BUS  
www.ti.com  
SCPS068FJULY 2001REVISED OCTOBER 2006  
FEATURES  
Low Standby-Current Consumption of  
10 µA Max  
I2C to Parallel-Port Expander  
Latched Outputs With High-Current Drive  
Capability for Directly Driving LEDs  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Open-Drain Interrupt Output  
Compatible With Most Microcontrollers  
RGY PACKAGE  
(TOP VIEW)  
DGV OR PW PACKAGE  
(TOP VIEW)  
RGT PACKAGE  
DW OR N PACKAGE  
(TOP VIEW)  
(TOP VIEW)  
1
20  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
INT  
SCL  
NC  
P7  
P6  
19  
18  
17  
16  
15  
14  
13  
12  
2
3
4
5
6
7
8
9
SCL  
NC  
SDA  
P6  
NC  
P5  
P4  
GND  
P3  
V
SDA  
A0  
A1  
A2  
P0  
P1  
P2  
P3  
1
2
3
4
5
6
7
8
16  
15  
CC  
NC  
P5  
P4  
GND  
P3  
14 SCL  
VCC  
A0  
A1  
A2  
1
2
3
4
12 P6  
11 P5  
10 P4  
SDA  
V
CC  
INT  
P7  
P6  
P5  
P4  
13  
12  
11  
10  
9
V
CC  
A0  
A1  
NC  
A2  
A0  
A1  
NC  
A2  
P0  
9
GND  
NC  
P2  
NC  
P2  
P1  
GND  
10  
11  
NC – No internal connection  
NC – No internal connection  
DESCRIPTION/ORDERING INFORMATION  
This 8-bit input/output (I/O) expander for the two-line bidirectional bus (I2C) is designed for 2.5-V to 6-V VCC  
operation.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
PCF8574N  
TOP-SIDE MARKING  
PCF8574N  
PDIP – N  
Tube of 25  
PCF8574NE4  
QFN – RGT  
QFN – RGY  
Reel of 3000  
Reel of 1000  
PCF8574RGTR  
PCF8574RGYR  
PCF8574RGYRG4  
PCF8574DW  
ZWJ  
PF574  
Tube of 40  
PCF8574DWE4  
PCF8574DWR  
SOIC – DW  
PCF8574  
–40°C to 85°C  
Reel of 2000  
Tube of 70  
PCF8574DWRE4  
PCF8574PW  
PCF8574PWE4  
PCF8574PWR  
TSSOP – PW  
TVSOP – DGV  
PF574  
PF574  
Reel of 2000  
Reel of 2000  
PCF8574PWRE4  
PCF8574DGVR  
PCF8574DGVRE4  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2001–2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
PCF8574  
REMOTE 8-BIT I/O EXPANDER FOR I2C BUS  
www.ti.com  
SCPS068FJULY 2001REVISED OCTOBER 2006  
DESCRIPTION/ORDERING INFORMATION (CONTINUED)  
The PCF8574 provides general-purpose remote I/O expansion for most microcontroller families via the I2C  
interface [serial clock (SCL), serial data (SDA)].  
The device features an 8-bit quasi-bidirectional I/O port (P0–P7), including latched outputs with high-current  
drive capability for directly driving LEDs. Each quasi-bidirectional I/O can be used as an input or output without  
the use of a data-direction control signal. At power on, the I/Os are high. In this mode, only a current source to  
VCC is active. An additional strong pullup to VCC allows fast rising edges into heavily loaded outputs. This device  
turns on when an output is written high and is switched off by the negative edge of SCL. The I/Os should be  
high before being used as inputs.  
The PCF8574 provides an open-drain output (INT) that can be connected to the interrupt input of a  
microcontroller. An interrupt is generated by any rising or falling edge of the port inputs in the input mode. After  
time, tiv, INT is valid. Resetting and reactivating the interrupt circuit is achieved when data on the port is changed  
to the original setting or data is read from, or written to, the port that generated the interrupt. Resetting occurs in  
the read mode at the acknowledge bit after the rising edge of the SCL signal, or in the write mode at the  
acknowledge bit after the high-to-low transition of the SCL signal. Interrupts that occur during the acknowledge  
clock pulse can be lost (or be very short) due to the resetting of the interrupt during this pulse. Each change of  
the I/Os after resetting is detected and, after the next rising clock edge, is transmitted as INT. Reading from, or  
writing to, another device does not affect the interrupt circuit.  
By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data  
on its ports without having to communicate via the I2C bus. Therefore, the PCF8574 can remain a simple slave  
device.  
LOGIC DIAGRAM (POSITIVE LOGIC)  
PCF8574  
13  
Interrupt  
Logic  
LP Filter  
INT  
1
2
3
4
5
A0  
A1  
A2  
P0  
P1  
P2  
P3  
P4  
P5  
P6  
P7  
6
14  
15  
7
SCL  
SDA  
2
Input  
Filter  
I C Bus  
Shift  
Register  
I/O  
Port  
Control  
8 Bit  
9
10  
11  
12  
Write Pulse  
Read Pulse  
16  
8
V
Power-On  
Reset  
CC  
GND  
Pin numbers shown are for the DW and N packages.  
2
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PCF8574  
REMOTE 8-BIT I/O EXPANDER FOR I2C BUS  
www.ti.com  
SCPS068FJULY 2001REVISED OCTOBER 2006  
SIMPLIFIED SCHEMATIC DIAGRAM OF EACH P-PORT INPUT/OUTPUT  
V
CC  
Write Pulse  
100 µA  
Data From  
Shift Register  
D
C
Q
FF  
S
P0−P7  
GND  
I
Power-On  
Reset  
D
C
Q
FF  
S
I
Read Pulse  
To Interrupt  
Logic  
Data to  
Shift Register  
I2C Interface  
I2C communication with this device is initiated by a master sending a start condition, a high-to-low transition on  
the SDA I/O while the SCL input is high. After the start condition, the device address byte is sent,  
most-significant bit (MSB) first, including the data direction bit (R/W). This device does not respond to the  
general call address. After receiving the valid address byte, this device responds with an acknowledge, a low on  
the SDA I/O during the high of the acknowledge-related clock pulse. The address inputs (A0–A2) of the slave  
device must not be changed between the start and the stop conditions.  
The data byte follows the address acknowledge. If the R/W bit is high, the data from this device are the values  
read from the P port. If the R/W bit is low, the data are from the master, to be output to the P port. The data byte  
is followed by an acknowledge sent from this device. If other data bytes are sent from the master, following the  
acknowledge, they are ignored by this device. Data are output only if complete bytes are received and  
acknowledged. The output data will be valid at time, tpv, after the low-to-high transition of SCL and during the  
clock cycle for the acknowledge.  
A stop condition, which is a low-to-high transition on the SDA I/O while the SCL input is high, is sent by the  
master.  
Interface Definition  
BIT  
BYTE  
7 (MSB)  
6
H
5
L
4
L
3
2
1
0 (LSB)  
R/W  
I2C slave address  
I/O data bus  
L
A2  
P3  
A1  
P2  
A0  
P1  
P7  
P6  
P5  
P4  
P0  
3
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PCF8574  
REMOTE 8-BIT I/O EXPANDER FOR I2C BUS  
www.ti.com  
SCPS068FJULY 2001REVISED OCTOBER 2006  
Figure 1 and Figure 2 show the address and timing diagrams for the write and read modes, respectively.  
Integral Multiples of Two Bytes  
SCL  
1
6
2
3
4
6
7
8
1
2
3
4
5
7
8
1
2
3
4
5
6
7
8
5
ACK  
From Slave  
Start  
Condition  
ACK  
From Slave  
ACK  
From Slave  
R/W  
Slave Address (PCF8575C)  
Data  
Data  
SDA  
S
0
1
0
0
A2 A1 A0  
0
A
P7 P6  
1
P0  
A
P7  
P0  
A
P5  
Write to  
Port  
Data A0  
and B0  
Valid  
Data Output  
Voltage  
t
pv  
P5 Output  
Voltage  
I
P5 Pullup  
Output  
OH  
I
OHT  
Current  
INT  
t
ir  
Figure 1. Write Mode (Output)  
SCL  
1
6
2
3
4
6
7
8
1
2
3
4
5
7
8
1
2
3
4
5
6
7
8
5
ACK  
From Master  
ACK  
From Slave  
ACK  
From Master  
R/W  
S
0
1
0
0
A2 A1 A0  
1
A
P7 P6 P5 P4 P3 P2 P1 P0  
A
P7 P6 P5 P4 P3 P2 P1 P0  
A P7 P6  
SDA  
Read From  
Port  
Data Into  
Port  
P7 to P0  
P7 to P0  
t
su  
t
h
INT  
t
ir  
t
iv  
t
ir  
A low-to-high transition of SDA while SCL is high is defined as the stop condition (P). The transfer of data can be stopped at any moment by  
a stop condition. When this occurs, data present at the latest ACK phase is valid (output mode). Input data is lost.  
Figure 2. Read Mode (Input)  
4
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PCF8574  
REMOTE 8-BIT I/O EXPANDER FOR I2C BUS  
www.ti.com  
SCPS068FJULY 2001REVISED OCTOBER 2006  
Address Reference  
INPUTS  
I2C BUS SLAVE ADDRESS  
A2  
L
A1  
L
A0  
L
32 (decimal), 20 (hexadecimal)  
33 (decimal), 21 (hexadecimal)  
34 (decimal), 22 (hexadecimal)  
35 (decimal), 23 (hexadecimal)  
36 (decimal), 24 (hexadecimal)  
37 (decimal), 25 (hexadecimal)  
38 (decimal), 26 (hexadecimal)  
39 (decimal), 27 (hexadecimal)  
L
L
H
L
L
H
H
L
L
H
L
H
H
H
H
L
H
L
H
H
H
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
MAX  
UNIT  
V
VCC  
VI  
Supply voltage range  
Input voltage range(2)  
–0.5  
7
–0.5 VCC + 0.5  
V
VO  
IIK  
Output voltage range(2)  
–0.5 VCC + 0.5  
V
Input clamp current  
VI < 0  
–20  
–20  
±400  
50  
mA  
mA  
µA  
mA  
mA  
mA  
IOK  
IOK  
IOL  
IOH  
Output clamp current  
VO < 0  
Input/output clamp current  
Continuous output low current  
Continuous output high current  
Continuous current through VCC or GND  
VO < 0 or VO > VCC  
VO = 0 to VCC  
VO = 0 to VCC  
–4  
±100  
92  
DGV package(3)  
DW package(3)  
N package(3)  
PW package(3)  
RGT package(4)  
RGY package(4)  
57  
67  
θJA  
Package thermal impedance  
°C/W  
83  
53  
37  
Tstg  
Storage temperature range  
–65  
150  
°C  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The package thermal impedance is calculated in accordance with JESD 51-7.  
(4) The package thermal impedance is calculated in accordance with JESD 51-5.  
Recommended Operating Conditions  
MIN  
2.5  
MAX UNIT  
VCC  
VIH  
VIL  
IOH  
IOL  
TA  
Supply voltage  
6
VCC + 0.5  
0.3 × VCC  
–1  
V
V
High-level input voltage  
Low-level input voltage  
High-level output current  
Low-level output current  
Operating free-air temperature  
0.7 × VCC  
–0.5  
V
mA  
mA  
°C  
25  
–40  
85  
5
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PCF8574  
REMOTE 8-BIT I/O EXPANDER FOR I2C BUS  
www.ti.com  
SCPS068FJULY 2001REVISED OCTOBER 2006  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
Input diode clamp voltage  
Power-on reset voltage(2)  
P port  
TEST CONDITIONS  
VCC  
2.5 V to 6 V  
6 V  
MIN TYP(1)  
MAX UNIT  
VIK  
II = –18 mA  
–1.2  
1.3  
30  
–1  
3
V
VPOR  
IOH  
VI = VCC or GND,  
VO = GND  
IO = 0  
2.4  
V
2.5 V to 6 V  
2.5 V  
300  
µA  
mA  
IOHT  
P-port transient pullup current High during acknowledge, VOH = GND  
SDA  
VO = 0.4 V  
VO = 1 V  
2.5 V to 6 V  
5 V  
IOL  
P port  
10  
25  
mA  
INT  
VO = 0.4 V  
2.5 V to 6 V  
1.6  
SCL, SDA  
INT  
±5  
±5  
II  
VI = VCC or GND  
2.5 V to 6 V  
µA  
A0, A1, A2  
P port  
±5  
IIHL  
ICC  
Ci  
VI VCC or VI GND  
VI = VCC or GND,  
VI = VCC or GND,  
VI = VCC or GND  
2.5 V to 6 V  
6 V  
±400  
100  
10  
µA  
µA  
pF  
pF  
Operating mode  
Standby mode  
SCL  
IO = 0, fSCL = 100 kHz  
IO = 0  
40  
2.5  
1.5  
3
2.5 V to 6 V  
2.5 V to 6 V  
7
SDA  
7
Cio  
VIO = VCC or GND  
P port  
4
10  
(1) All typical values are at VCC = 5 V, TA = 25°C.  
(2) The power-on reset circuit resets the I2C-bus logic with VCC < VPOR and sets all I/Os to logic high (with current source to VCC).  
I2C Interface Timing Requirements  
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)  
MIN  
MAX UNIT  
fscl  
tsch  
tscl  
tsp  
I2C clock frequency  
I2C clock high time  
I2C clock low time  
I2C spike time  
I2C serial data setup time  
I2C serial data hold time  
I2C input rise time  
100  
kHz  
µs  
µs  
ns  
ns  
ns  
µs  
µs  
ns  
µs  
µs  
µs  
µs  
µs  
pF  
4
4.7  
100  
tsds  
tsdh  
ticr  
250  
0
1
0.3  
ticf  
I2C input fall time  
tocf  
tbuf  
tsts  
tsth  
tsps  
tvd  
I2C output fall time (10-pF to 400-pF bus)  
I2C bus free time between stop and start  
I2C start or repeated start condition setup  
I2C start or repeated start condition hold  
I2C stop condition setup  
Valid data time  
300  
4.7  
4.7  
4
4
SCL low to SDA output valid  
3.4  
Cb  
I2C bus capacitive load  
400  
6
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PCF8574  
REMOTE 8-BIT I/O EXPANDER FOR I2C BUS  
www.ti.com  
SCPS068FJULY 2001REVISED OCTOBER 2006  
Switching Characteristics  
over recommended operating free-air temperature range, CL 100 pF (unless otherwise noted) (see Figure 4)  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
MIN  
MAX UNIT  
tpv  
tsu  
th  
Output data valid  
SCL  
P port  
P port  
P port  
SCL  
P port  
SCL  
SCL  
INT  
4
µs  
µs  
µs  
µs  
µs  
Input data setup time  
Input data hold time  
Interrupt valid time  
Interrupt reset delay time  
0
4
tiv  
tir  
4
4
INT  
7
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PCF8574  
REMOTE 8-BIT I/O EXPANDER FOR I2C BUS  
www.ti.com  
SCPS068FJULY 2001REVISED OCTOBER 2006  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
R
= 1 k  
L
L
P
n
DUT  
C
= 10 pF to 400 pF  
LOAD CIRCUIT  
2 Bytes for Complete Device  
Programming  
Stop  
Condition  
(P)  
Start  
Condition  
(S)  
Bit 0  
LSB  
(R/W)  
Stop  
Condition  
(P)  
Bit 7  
MSB  
Acknowledge  
(A)  
Bit 6  
t
scl  
t
sch  
0.7 × V  
0.3 × V  
CC  
SCL  
CC  
t
icr  
t
sts  
t
PHL  
t
icf  
t
buf  
t
t
sp  
PLH  
0.7 × V  
0.3 × V  
CC  
SDA  
CC  
t
icf  
t
icr  
t
sdh  
t
sps  
t
sth  
t
sds  
Repeat  
Start  
Condition  
Stop  
Condition  
Start or  
Repeat  
Start  
Condition  
VOLTAGE WAVEFORMS  
Figure 3. I2C Interface Load Circuit and Voltage Waveforms  
8
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PCF8574  
REMOTE 8-BIT I/O EXPANDER FOR I2C BUS  
www.ti.com  
SCPS068FJULY 2001REVISED OCTOBER 2006  
PARAMETER MEASUREMENT INFORMATION (continued)  
Acknowledge  
From Slave  
Start  
Condition  
Acknowledge  
From Slave  
R/W  
Slave Address  
Data From Port  
Data 1  
Data From Port  
Data 3  
S
0
1
0
0
A2 A1 A0  
1
A
A
1
P
1
2
3
4
5
6
7
8
A
A
t
ir  
B
B
t
ir  
INT  
A
t
iv  
t
sps  
A
Data  
Into  
Port  
Data 1  
Data 2  
Data 3  
0.7 × V  
0.3 × V  
CC  
0.7 × V  
0.3 × V  
CC  
SCL  
INT  
R/W  
A
CC  
CC  
t
iv  
t
ir  
0.7 × V  
0.3 × V  
0.7 × V  
CC  
CC  
INT  
P
n
0.3 × V  
CC  
CC  
View A−A  
SCL  
View B−B  
Figure 4. Interrupt Voltage Waveforms  
0.7 × V  
CC  
W
A
D
0.3 × V  
CC  
Slave  
Acknowledge  
SDA  
t
pv  
P
n
Last Stable Bit  
Unstable  
Data  
Figure 5. I2C Write Voltage Waveforms  
9
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PCF8574  
REMOTE 8-BIT I/O EXPANDER FOR I2C BUS  
www.ti.com  
SCPS068FJULY 2001REVISED OCTOBER 2006  
PARAMETER MEASUREMENT INFORMATION (continued)  
V
CC  
V
CC  
R
L
= 1 k  
R
L
= 4.7 kΩ  
INT  
SDA  
DUT  
DUT  
C
L
= 10 pF to 400 pF  
C
L
= 10 pF to 400 pF  
GND  
SDA LOAD CONFIGURATION  
GND  
INTERRUPT LOAD CONFIGURATION  
Figure 6. Load Circuits  
10  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
14-Nov-2006  
PACKAGING INFORMATION  
Orderable Device  
PCF8574DGVR  
PCF8574DGVRE4  
PCF8574DW  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TVSOP  
DGV  
20  
20  
16  
16  
16  
16  
16  
16  
20  
20  
20  
20  
16  
16  
20  
20  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TVSOP  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
DGV  
DW  
DW  
DW  
DW  
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
PCF8574DWE4  
PCF8574DWR  
PCF8574DWRE4  
PCF8574N  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
PCF8574NE4  
PDIP  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
PCF8574PW  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
QFN  
PW  
PW  
PW  
PW  
RGT  
RGT  
RGY  
RGY  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
PCF8574PWE4  
PCF8574PWR  
PCF8574PWRE4  
PCF8574RGTR  
PCF8574RGTRG4  
PCF8574RGYR  
PCF8574RGYRG4  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
QFN  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
QFN  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR  
no Sb/Br)  
QFN  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
14-Nov-2006  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to  
discontinue any product or service without notice. Customers should obtain the latest relevant information  
before placing orders and should verify that such information is current and complete. All products are sold  
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent  
TI deems necessary to support this warranty. Except where mandated by government requirements, testing  
of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible  
for their products and applications using TI components. To minimize the risks associated with customer  
products and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent  
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