PE-53933-S [TI]

LM2596 SIMPLE SWITCHER® Power Converter 150 kHz 3A Step-Down Voltage Regulator; LM2596 SIMPLE SWITCHER®电源转换器150千赫3A降压型稳压器
PE-53933-S
型号: PE-53933-S
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LM2596 SIMPLE SWITCHER® Power Converter 150 kHz 3A Step-Down Voltage Regulator
LM2596 SIMPLE SWITCHER®电源转换器150千赫3A降压型稳压器

转换器 稳压器
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LM2596  
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SNVS124C NOVEMBER 1999REVISED APRIL 2013  
®
LM2596 SIMPLE SWITCHER Power Converter 150 kHz  
3A Step-Down Voltage Regulator  
Check for Samples: LM2596  
1
FEATURES  
DESCRIPTION  
The LM2596 series of regulators are monolithic  
23  
3.3V, 5V, 12V, and Adjustable Output Versions  
integrated circuits that provide all the active functions  
for a step-down (buck) switching regulator, capable of  
driving a 3A load with excellent line and load  
regulation. These devices are available in fixed output  
voltages of 3.3V, 5V, 12V, and an adjustable output  
version.  
Adjustable Version Output Voltage Range,  
1.2V to 37V ±4% Max Over Line and Load  
Conditions  
Available in TO-220 and TO-263 Packages  
Ensured 3A Output Load Current  
Input Voltage Range Up to 40V  
Requiring  
a
minimum number of external  
components, these regulators are simple to use and  
include internal frequency compensation , and a  
fixed-frequency oscillator.  
Requires Only 4 External Components  
Excellent Line and Load Regulation  
Specifications  
The LM2596 series operates at a switching frequency  
of 150 kHz thus allowing smaller sized filter  
components than what would be needed with lower  
150 kHz Fixed Frequency Internal Oscillator  
TTL Shutdown Capability  
frequency switching regulators. Available in  
a
Low Power Standby Mode, IQ Typically 80 μA  
High Efficiency  
standard 5-lead TO-220 package with several  
different lead bend options, and a 5-lead TO-263  
surface mount package.  
Uses Readily Available Standard Inductors  
Thermal Shutdown and Current Limit  
Protection  
A standard series of inductors are available from  
several different manufacturers optimized for use with  
the LM2596 series. This feature greatly simplifies the  
design of switch-mode power supplies.  
APPLICATIONS  
Simple High-Efficiency Step-Down (Buck)  
Regulator  
Other features include a ensured ±4% tolerance on  
output voltage under specified input voltage and  
output load conditions, and ±15% on the oscillator  
frequency. External shutdown is included, featuring  
typically 80 μA standby current. Self protection  
features include a two stage frequency reducing  
current limit for the output switch and an over  
temperature shutdown for complete protection under  
On-Card Switching Regulators  
Positive to Negative Converter  
(1)  
fault conditions.  
(1) † Patent Number 5,382,918.  
Typical Application  
(Fixed Output Voltage Versions)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
SIMPLE SWITCHER is a registered trademark of Texas Instruments.  
2
3
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1999–2013, Texas Instruments Incorporated  
LM2596  
SNVS124C NOVEMBER 1999REVISED APRIL 2013  
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Connection Diagrams  
Figure 1. 5-Lead Bent and Staggered Leads,  
Through Hole TO-220 (T) Package  
See Package Number NDH0005D  
Figure 2. 5-Lead DDPAK/TO-263 (S) Package  
See Package Number KTT0005B  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
(1)(2)  
Absolute Maximum Ratings  
Maximum Supply Voltage  
ON /OFF Pin Input Voltage  
Feedback Pin Voltage  
45V  
0.3 V +25V  
0.3 V +25V  
1V  
Output Voltage to Ground (Steady State)  
Power Dissipation  
Internally limited  
65°C to +150°C  
Storage Temperature Range  
ESD Susceptibility  
(3)  
Human Body Model  
2 kV  
Lead Temperature  
DDPAK/TO-263 Package  
Vapor Phase (60 sec.)  
+215°C  
+245°C  
+260°C  
+150°C  
Infrared (10 sec.)  
TO-220 Package (Soldering, 10 sec.)  
Maximum Junction Temperature  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test  
conditions, see the Electrical Characteristics.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and  
specifications.  
(3) The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin.  
Operating Conditions  
Temperature Range  
40°C TJ +125°C  
Supply Voltage  
4.5V to 40V  
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LM2596-3.3 Electrical Characteristics  
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating  
Temperature Range  
LM2596-3.3  
Units  
(Limits)  
Symbol  
Parameter  
Conditions  
Typ  
Limit  
(1)  
(2)  
SYSTEM PARAMETERS (3) Test Circuit Figure 20  
VOUT  
Output Voltage  
4.75V VIN 40V, 0.2A ILOAD 3A  
3.3  
73  
V
3.168/3.135  
3.432/3.465  
V(min)  
V(max)  
%
η
Efficiency  
VIN = 12V, ILOAD = 3A  
(1) Typical numbers are at 25°C and represent the most likely norm.  
(2) All limits specified at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits  
are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control  
(SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).  
(3) External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect  
switching regulator system performance. When the LM2596 is used as shown in the Figure 20 test circuit, system performance will be  
as shown in system parameters of Electrical Characteristics section.  
LM2596-5.0 Electrical Characteristics  
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating  
Temperature Range  
LM2596-5.0  
Units  
Symbol  
Parameter  
Conditions  
Typ  
Limit  
(Limits)  
(1)  
(2)  
SYSTEM PARAMETERS (3) Test Circuit Figure 20  
VOUT  
Output Voltage  
7V VIN 40V, 0.2A ILOAD 3A  
5.0  
80  
V
4.800/4.750  
5.200/5.250  
V(min)  
V(max)  
%
η
Efficiency  
VIN = 12V, ILOAD = 3A  
(1) Typical numbers are at 25°C and represent the most likely norm.  
(2) All limits specified at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits  
are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control  
(SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).  
(3) External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect  
switching regulator system performance. When the LM2596 is used as shown in the Figure 20 test circuit, system performance will be  
as shown in system parameters of Electrical Characteristics section.  
LM2596-12 Electrical Characteristics  
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating  
Temperature Range  
LM2596-12  
Units  
Symbol  
Parameter  
Conditions  
Typ  
Limit  
(Limits)  
(1)  
(2)  
SYSTEM PARAMETERS (3) Test Circuit Figure 20  
VOUT  
Output Voltage  
15V VIN 40V, 0.2A ILOAD 3A  
12.0  
90  
V
11.52/11.40  
12.48/12.60  
V(min)  
V(max)  
%
η
Efficiency  
VIN = 25V, ILOAD = 3A  
(1) Typical numbers are at 25°C and represent the most likely norm.  
(2) All limits specified at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits  
are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control  
(SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).  
(3) External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect  
switching regulator system performance. When the LM2596 is used as shown in the Figure 20 test circuit, system performance will be  
as shown in system parameters of Electrical Characteristics section.  
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LM2596-ADJ Electrical Characteristics  
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating  
Temperature Range  
LM2596-ADJ  
Units  
(Limits)  
Symbol  
Parameter  
Conditions  
Typ  
Limit  
(1)  
(2)  
SYSTEM PARAMETERS (3) Test Circuit Figure 20  
VFB  
Feedback Voltage  
4.5V VIN 40V, 0.2A ILOAD 3A  
1.230  
73  
V
VOUT programmed for 3V. Circuit of Figure 20  
1.193/1.180  
1.267/1.280  
V(min)  
V(max)  
%
η
Efficiency  
VIN = 12V, VOUT = 3V, ILOAD = 3A  
(1) Typical numbers are at 25°C and represent the most likely norm.  
(2) All limits specified at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits  
are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control  
(SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).  
(3) External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect  
switching regulator system performance. When the LM2596 is used as shown in the Figure 20 test circuit, system performance will be  
as shown in system parameters of Electrical Characteristics section.  
All Output Voltage Versions Electrical Characteristics  
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating  
Temperature Range. Unless otherwise specified, VIN = 12V for the 3.3V, 5V, and Adjustable version and VIN = 24V for the  
12V version. ILOAD = 500 mA  
LM2596-XX  
Units  
Symbol  
Parameter  
Conditions  
Typ  
Limit  
(Limits)  
(1)  
(2)  
DEVICE PARAMETERS  
Ib  
Feedback Bias Current  
Adjustable Version Only, VFB = 1.3V  
10  
nA  
nA (max)  
kHz  
50/100  
(3)  
fO  
Oscillator Frequency  
Saturation Voltage  
See  
150  
127/110  
173/173  
kHz(min)  
kHz(max)  
V
(4) (5)  
VSAT  
DC  
IOUT = 3A  
1.16  
1.4/1.5  
V(max)  
%
(5)  
Max Duty Cycle (ON)  
Min Duty Cycle (OFF)  
Current Limit  
See  
100  
0
(6)  
See  
(4)(5)  
ICL  
Peak Current  
4.5  
A
3.6/3.4  
6.9/7.5  
50  
A(min)  
A(max)  
μA(max)  
mA  
(4)(6)  
IL  
Output Leakage Current  
Quiescent Current  
Output = 0V  
(7)  
Output = 1V  
2
5
30  
10  
mA(max)  
mA  
(6)  
IQ  
See  
mA(max)  
(1) Typical numbers are at 25°C and represent the most likely norm.  
(2) All limits specified at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits  
are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control  
(SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).  
(3) The switching frequency is reduced when the second stage current limit is activated.  
(4) No diode, inductor or capacitor connected to output pin.  
(5) Feedback pin removed from output and connected to 0V to force the output transistor switch ON.  
(6) Feedback pin removed from output and connected to 12V for the 3.3V, 5V, and the ADJ. version, and 15V for the 12V version, to force  
the output transistor switch OFF.  
(7) VIN = 40V.  
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All Output Voltage Versions Electrical Characteristics (continued)  
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating  
Temperature Range. Unless otherwise specified, VIN = 12V for the 3.3V, 5V, and Adjustable version and VIN = 24V for the  
12V version. ILOAD = 500 mA  
LM2596-XX  
Units  
Symbol  
ISTBY  
Parameter  
Conditions  
Typ  
Limit  
(Limits)  
(1)  
(2)  
(7)  
Standby Quiescent Current  
ON/OFF pin = 5V (OFF)  
80  
μA  
μA(max)  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
200/250  
θJC  
θJA  
θJA  
θJA  
θJA  
Thermal Resistance  
TO-220 or TO-263 Package, Junction to Case  
2
(8)  
TO-220 Package, Junction to Ambient  
50  
50  
30  
20  
(9)  
TO-263 Package, Junction to Ambient  
(10)  
TO-263 Package, Junction to Ambient  
(11)  
TO-263 Package, Junction to Ambient  
ON/OFF CONTROL Test Circuit Figure 20  
ON /OFF Pin Logic Input  
1.3  
V
VIH  
VIL  
IH  
Threshold Voltage  
Low (Regulator ON)  
0.6  
2.0  
V(max)  
V(min)  
μA  
High (Regulator OFF)  
ON /OFF Pin Input Current  
VLOGIC = 2.5V (Regulator OFF)  
5
15  
5
μA(max)  
μA  
IL  
VLOGIC = 0.5V (Regulator ON)  
0.02  
μA(max)  
(8) Junction to ambient thermal resistance (no external heat sink) for the TO-220 package mounted vertically, with the leads soldered to a  
printed circuit board with (1 oz.) copper area of approximately 1 in2.  
(9) Junction to ambient thermal resistance with the TO-263 package tab soldered to a single printed circuit board with 0.5 in2 of (1 oz.)  
copper area.  
(10) Junction to ambient thermal resistance with the TO-263 package tab soldered to a single sided printed circuit board with 2.5 in2 of (1  
oz.) copper area.  
(11) Junction to ambient thermal resistance with the TO-263 package tab soldered to a double sided printed circuit board with 3 in2 of (1 oz.)  
copper area on the LM2596S side of the board, and approximately 16 in2 of copper on the other side of the p-c board. See Application  
Information in this data sheet and the thermal model in Switchers Made Simple™ version 4.3 software.  
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Typical Performance Characteristics  
(Circuit of Figure 20)  
Normalized  
Output Voltage  
Line Regulation  
Figure 3.  
Figure 4.  
Switch Saturation  
Voltage  
Efficiency  
Figure 5.  
Figure 6.  
Switch Current Limit  
Dropout Voltage  
Figure 7.  
Figure 8.  
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Typical Performance Characteristics (continued)  
(Circuit of Figure 20)  
Operating  
Quiescent Current  
Shutdown  
Quiescent Current  
Figure 9.  
Figure 10.  
Minimum Operating  
Supply Voltage  
ON /OFF Threshold  
Voltage  
Figure 11.  
Figure 12.  
ON /OFF Pin  
Current (Sinking)  
Switching Frequency  
Figure 13.  
Figure 14.  
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Typical Performance Characteristics (continued)  
(Circuit of Figure 20)  
Continuous Mode Switching Waveforms  
Feedback Pin  
Bias Current  
VIN = 20V, VOUT = 5V, ILOAD = 2A  
L = 32 μH, COUT = 220 μF, COUT ESR = 50 mΩ  
A: Output Pin Voltage, 10V/div.  
B: Inductor Current 1A/div.  
C: Output Ripple Voltage, 50 mV/div.  
Figure 15.  
Figure 16. Horizontal Time Base: 2 μs/div.  
Discontinuous Mode Switching Waveforms  
VIN = 20V, VOUT = 5V, ILOAD = 500 mA  
L = 10 μH, COUT = 330 μF, COUT ESR = 45 mΩ  
Load Transient Response for Continuous Mode  
VIN = 20V, VOUT = 5V, ILOAD = 500 mA to 2A  
L = 32 μH, COUT = 220 μF, COUT ESR = 50 mΩ  
A: Output Voltage, 100 mV/div. (AC)  
B: 500 mA to 2A Load Pulse  
A: Output Pin Voltage, 10V/div.  
B: Inductor Current 0.5A/div.  
C: Output Ripple Voltage, 100 mV/div.  
Figure 17. Horizontal Time Base: 2 μs/div.  
Figure 18. Horizontal Time Base: 100 μs/div.  
Load Transient Response for Discontinuous Mode  
VIN = 20V, VOUT = 5V, ILOAD = 500 mA to 2A  
L = 10 μH, COUT = 330 μF, COUT ESR = 45 mΩ  
A: Output Voltage, 100 mV/div. (AC)  
B: 500 mA to 2A Load Pulse  
Figure 19. Horizontal Time Base: 200 μs/div.  
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Test Circuit and Layout Guidelines  
Fixed Output Voltage Versions  
CIN —470 μF, 50V, Aluminum Electrolytic Nichicon “PL Series”  
COUT —220 μF, 25V Aluminum Electrolytic, Nichicon “PL Series”  
D1 —5A, 40V Schottky Rectifier, 1N5825  
L1 —68 μH, L38  
Adjustable Output Voltage Versions  
where VREF = 1.23V  
Select R1 to be approximately 1 k, use a 1% resistor for best stability.  
CIN —470 μF, 50V, Aluminum Electrolytic Nichicon “PL Series”  
COUT —220 μF, 35V Aluminum Electrolytic, Nichicon “PL Series”  
D1 —5A, 40V Schottky Rectifier, 1N5825  
L1 —68 μH, L38  
R1 —1 kΩ, 1%  
CFF —See Application Information Section  
Figure 20. Standard Test Circuits and Layout Guides  
As in any switching regulator, layout is very important. Rapidly switching currents associated with wiring  
inductance can generate voltage transients which can cause problems. For minimal inductance and ground  
loops, the wires indicated by heavy lines should be wide printed circuit traces and should be kept as short  
as possible. For best results, external components should be located as close to the switcher lC as possible  
using ground plane construction or single point grounding.  
If open core inductors are used, special care must be taken as to the location and positioning of this type of  
inductor. Allowing the inductor flux to intersect sensitive feedback, lC groundpath and COUT wiring can cause  
problems.  
When using the adjustable version, special care must be taken as to the location of the feedback resistors and  
the associated wiring. Physically locate both resistors near the IC, and route the wiring away from the inductor,  
especially an open core type of inductor. (See Application Information section for more information.)  
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LM2596 Series Buck Regulator Design Procedure (Fixed Output)  
PROCEDURE (Fixed Output Voltage Version)  
EXAMPLE (Fixed Output Voltage Version)  
Given:  
Given:  
VOUT = Regulated Output Voltage (3.3V, 5V or 12V)  
VIN(max) = Maximum DC Input Voltage  
ILOAD(max) = Maximum Load Current  
VOUT = 5V  
VIN(max) = 12V  
ILOAD(max) = 3A  
1. Inductor Selection (L1)  
1. Inductor Selection (L1)  
A. Select the correct inductor value selection guide from Figures A. Use the inductor selection guide for the 5V version shown in  
Figure 21, Figure 22, or Figure 23. (Output voltages of 3.3V, 5V, or Figure 22.  
12V respectively.) For all other voltages, see the Design Procedure  
for the adjustable version.  
B. From the inductor value selection guide shown in Figure 22, the  
inductance region intersected by the 12V horizontal line and the 3A  
B. From the inductor value selection guide, identify the inductance vertical line is 33 μH, and the inductor code is L40.  
region intersected by the Maximum Input Voltage line and the  
C. The inductance value required is 33 μH. From the table in  
Maximum Load Current line. Each region is identified by an  
Table 3, go to the L40 line and choose an inductor part number from  
inductance value and an inductor code (LXX).  
any of the four manufacturers shown. (In most instance, both  
C. Select an appropriate inductor from the four manufacturer's part through hole and surface mount inductors are available.)  
numbers listed in Table 3.  
2. Output Capacitor Selection (COUT  
)
2. Output Capacitor Selection (COUT)  
A. In the majority of applications, low ESR (Equivalent Series A. See section on output capacitors in Application Information  
Resistance) electrolytic capacitors between 82 μF and 820 μF and section.  
low ESR solid tantalum capacitors between 10 μF and 470 μF  
B. From the quick design component selection table shown in  
provide the best results. This capacitor should be located close to  
Table 1, locate the 5V output voltage section. In the load current  
the IC using short capacitor leads and short copper traces. Do not  
column, choose the load current line that is closest to the current  
use capacitors larger than 820 μF .  
needed in your application, for this example, use the 3A line. In the  
For additional information, see section on output capacitors in maximum input voltage column, select the line that covers the input  
Application Information section.  
voltage needed in your application, in this example, use the 15V line.  
Continuing on this line are recommended inductors and capacitors  
that will provide the best overall performance.  
B. To simplify the capacitor selection procedure, refer to the quick  
design component selection table shown in Table 1. This table  
contains different input voltages, output voltages, and load currents, The capacitor list contains both through hole electrolytic and surface  
and lists various inductors and output capacitors that will provide the mount tantalum capacitors from four different capacitor  
best design solutions.  
manufacturers. It is recommended that both the manufacturers and  
the manufacturer's series that are listed in the table be used.  
C. The capacitor voltage rating for electrolytic capacitors should be  
at least 1.5 times greater than the output voltage, and often much In this example aluminum electrolytic capacitors from several  
higher voltage ratings are needed to satisfy the low ESR different manufacturers are available with the range of ESR numbers  
requirements for low output ripple voltage.  
needed.  
D. For computer aided design software, see Switchers Made  
330 μF 35V Panasonic HFQ Series  
Simple™ version 4.3 or later.  
330 μF 35V Nichicon PL Series  
C. For a 5V output, a capacitor voltage rating at least 7.5V or more  
is needed. But even a low ESR, switching grade, 220 μF 10V  
aluminum electrolytic capacitor would exhibit approximately 225 mΩ  
of ESR (see the curve in Figure 26 for the ESR vs voltage rating).  
This amount of ESR would result in relatively high output ripple  
voltage. To reduce the ripple to 1% of the output voltage, or less, a  
capacitor with a higher value or with a higher voltage rating (lower  
ESR) should be selected. A 16V or 25V capacitor will reduce the  
ripple voltage by approximately half.  
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PROCEDURE (Fixed Output Voltage Version)  
3. Catch Diode Selection (D1)  
EXAMPLE (Fixed Output Voltage Version)  
3. Catch Diode Selection (D1)  
A. The catch diode current rating must be at least 1.3 times greater A. Refer to the table shown in Table 6. In this example, a 5A, 20V,  
than the maximum load current. Also, if the power supply design 1N5823 Schottky diode will provide the best performance, and will  
must withstand a continuous output short, the diode should have a not be overstressed even for a shorted output.  
current rating equal to the maximum current limit of the LM2596. The  
most stressful condition for this diode is an overload or shorted  
output condition.  
B. The reverse voltage rating of the diode should be at least 1.25  
times the maximum input voltage.  
C. This diode must be fast (short reverse recovery time) and must be  
located close to the LM2596 using short leads and short printed  
circuit traces. Because of their fast switching speed and low forward  
voltage drop, Schottky diodes provide the best performance and  
efficiency, and should be the first choice, especially in low output  
voltage applications. Ultra-fast recovery, or High-Efficiency rectifiers  
also provide good results. Ultra-fast recovery diodes typically have  
reverse recovery times of 50 ns or less. Rectifiers such as the  
1N5400 series are much too slow and should not be used.  
4. Input Capacitor (CIN  
)
4. Input Capacitor (CIN)  
A low ESR aluminum or tantalum bypass capacitor is needed The important parameters for the Input capacitor are the input  
between the input pin and ground pin to prevent large voltage voltage rating and the RMS current rating. With a nominal input  
transients from appearing at the input. This capacitor should be voltage of 12V, an aluminum electrolytic capacitor with a voltage  
located close to the IC using short leads. In addition, the RMS rating greater than 18V (1.5 × VIN) would be needed. The next  
current rating of the input capacitor should be selected to be at least higher capacitor voltage rating is 25V.  
½ the DC load current. The capacitor manufacturers data sheet must  
The RMS current rating requirement for the input capacitor in a buck  
be checked to assure that this current rating is not exceeded. The  
regulator is approximately ½ the DC load current. In this example,  
curve shown in Figure 25 shows typical RMS current ratings for  
with a 3A load, a capacitor with a RMS current rating of at least 1.5A  
several different aluminum electrolytic capacitor values.  
is needed. The curves shown in Figure 25 can be used to select an  
For an aluminum electrolytic, the capacitor voltage rating should be appropriate input capacitor. From the curves, locate the 35V line and  
approximately 1.5 times the maximum input voltage. Caution must note which capacitor values have RMS current ratings greater than  
be exercised if solid tantalum capacitors are used (see Application 1.5A. A 680 μF/35V capacitor could be used.  
Information on input capacitor). The tantalum capacitor voltage rating  
For a through hole design, a 680 μF/35V electrolytic capacitor  
should be 2 times the maximum input voltage and it is recommended  
(Panasonic HFQ series or Nichicon PL series or equivalent) would  
that they be surge current tested by the manufacturer.  
be adequate. other types or other manufacturers capacitors can be  
Use caution when using ceramic capacitors for input bypassing, used provided the RMS ripple current ratings are adequate.  
because it may cause severe ringing at the VIN pin.  
For surface mount designs, solid tantalum capacitors can be used,  
For additional information, see section on input capacitors in but caution must be exercised with regard to the capacitor surge  
Application Information section.  
current rating (see Application Information on input capacitors in this  
data sheet). The TPS series available from AVX, and the 593D  
series from Sprague are both surge current tested.  
Table 1. LM2596 Fixed Voltage Quick Design Component Selection Table  
Conditions  
Inductor  
Output Capacitor  
Through Hole Electrolytic  
Surface Mount Tantalum  
Output  
Voltage  
(V)  
Load  
Current  
(A)  
Max Input  
Voltage  
(V)  
Panasonic  
HFQ Series  
(μF/V)  
Nichicon  
PL Series  
(μF/V)  
AVX TPS  
Series  
(μF/V)  
Sprague  
595D Series  
(μF/V)  
Inductance  
(μH)  
Inductor  
(#)  
3.3  
3
5
7
22 L41  
470/25  
560/35  
680/35  
560/35  
470/25  
330/35  
330/35  
560/16  
560/35  
680/35  
470/35  
470/35  
330/35  
270/50  
330/6.3  
330/6.3  
330/6.3  
330/6.3  
330/6.3  
330/6.3  
220/10  
390/6.3  
390/6.3  
390/6.3  
390/6.3  
390/6.3  
390/6.3  
330/10  
22 L41  
22 L41  
33 L40  
22 L33  
33 L32  
47 L39  
10  
40  
6
2
10  
40  
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Table 1. LM2596 Fixed Voltage Quick Design Component Selection Table (continued)  
Conditions  
Inductor  
Output Capacitor  
Through Hole Electrolytic Surface Mount Tantalum  
Output  
Voltage  
(V)  
Load  
Current  
(A)  
Max Input  
Voltage  
(V)  
Panasonic  
HFQ Series  
(μF/V)  
Nichicon  
PL Series  
(μF/V)  
AVX TPS  
Series  
(μF/V)  
Sprague  
595D Series  
(μF/V)  
Inductance  
(μH)  
Inductor  
(#)  
5
3
8
22 L41  
470/25  
560/25  
330/35  
330/35  
470/25  
180/35  
180/35  
470/25  
330/25  
180/25  
180/35  
330/25  
180/25  
82/25  
560/16  
560/25  
330/35  
270/35  
560/16  
180/35  
180/35  
470/25  
330/25  
180/25  
180/35  
330/25  
180/25  
82/25  
220/10  
220/10  
220/10  
220/10  
220/10  
100/10  
100/10  
100/16  
100/16  
100/16  
100/16  
100/16  
100/16  
68/20  
330/10  
330/10  
330/10  
330/10  
330/10  
270/10  
270/10  
180/16  
180/16  
120/20  
120/20  
180/16  
120/20  
68/25  
10  
15  
40  
9
22 L41  
33 L40  
47 L39  
22 L33  
68 L38  
68 L38  
22 L41  
33 L40  
68 L44  
68 L44  
33 L32  
68 L38  
150 L42  
2
3
20  
40  
15  
18  
30  
40  
15  
20  
40  
12  
2
LM2596 Series Buck Regulator Design Procedure (Adjustable Output)  
PROCEDURE (Adjustable Output Voltage Version)  
EXAMPLE (Adjustable Output Voltage Version)  
Given:  
Given:  
VOUT = Regulated Output Voltage  
VOUT = 20V  
VIN(max) = Maximum Input Voltage  
VIN(max) = 28V  
ILOAD(max) = Maximum Load Current  
F = Switching Frequency (Fixed at a nominal 150 kHz).  
ILOAD(max) = 3A  
F = Switching Frequency (Fixed at a nominal 150 kHz).  
1. Programming Output Voltage (Selecting R1 and R2, as shown in 1. Programming Output Voltage (Selecting R1 and R2, as shown in  
Figure 20 )  
Figure 20 )  
Use the following formula to select the appropriate resistor values.  
Select R1 to be 1 kΩ, 1%. Solve for R2.  
(3)  
(1)  
R2 = 1k (16.26 1) = 15.26k, closest 1% value is 15.4 kΩ.  
R2 = 15.4 kΩ.  
Select a value for R1 between 240Ω and 1.5 kΩ. The lower resistor  
values minimize noise pickup in the sensitive feedback pin. (For the  
lowest temperature coefficient and the best stability with time, use  
1% metal film resistors.)  
(2)  
12  
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PROCEDURE (Adjustable Output Voltage Version)  
2. Inductor Selection (L1)  
EXAMPLE (Adjustable Output Voltage Version)  
2. Inductor Selection (L1)  
A. Calculate the inductor Volt • microsecond constant E • T (V • μs), A. Calculate the inductor Volt • microsecond constant  
from the following formula:  
(E • T),  
where  
(5)  
VSAT = internal switch saturation voltage =  
1.16V  
B. E • T = 34.2 (V • μs)  
C. ILOAD(max) = 3A  
VD = diode forward voltage drop = 0.5V  
(4)  
D. From the inductor value selection guide shown in Figure 24, the  
inductance region intersected by the 34 (V • μs) horizontal line and  
the 3A vertical line is 47 μH, and the inductor code is L39.  
B. Use the E • T value from the previous formula and match it with  
the E • T number on the vertical axis of the Inductor Value Selection  
Guide shown in Figure 24.  
E. From the table in Table 3, locate line L39, and select an inductor  
part number from the list of manufacturers part numbers.  
C. on the horizontal axis, select the maximum load current.  
D. Identify the inductance region intersected by the E • T value and  
the Maximum Load Current value. Each region is identified by an  
inductance value and an inductor code (LXX).  
E. Select an appropriate inductor from the four manufacturer's part  
numbers listed in Table 3.  
3. Output Capacitor Selection (COUT  
)
3. Output Capacitor SeIection (COUT)  
A. In the majority of applications, low ESR electrolytic or solid A. See section on COUT in Application Information section.  
tantalum capacitors between 82 μF and 820 μF provide the best  
B. From the quick design table shown in Table 2, locate the output  
results. This capacitor should be located close to the IC using short  
voltage column. From that column, locate the output voltage closest  
capacitor leads and short copper traces. Do not use capacitors  
to the output voltage in your application. In this example, select the  
larger than 820 μF. For additional information, see section on  
output capacitors in Application Information section.  
24V line. Under the OUTPUT CAPACITOR section, select  
a
capacitor from the list of through hole electrolytic or surface mount  
B. To simplify the capacitor selection procedure, refer to the quick tantalum types from four different capacitor manufacturers. It is  
design table shown in Table 2. This table contains different output recommended that both the manufacturers and the manufacturers  
voltages, and lists various output capacitors that will provide the best series that are listed in the table be used.  
design solutions.  
In this example, through hole aluminum electrolytic capacitors from  
C. The capacitor voltage rating should be at least 1.5 times greater several different manufacturers are available.  
than the output voltage, and often much higher voltage ratings are  
needed to satisfy the low ESR requirements needed for low output  
ripple voltage.  
220 μF/35V Panasonic HFQ Series  
150 μF/35V Nichicon PL Series  
C. For a 20V output, a capacitor rating of at least 30V or more is  
needed. In this example, either a 35V or 50V capacitor would work.  
A 35V rating was chosen, although a 50V rating could also be used  
if a lower output ripple voltage is needed.  
Other manufacturers or other types of capacitors may also be used,  
provided the capacitor specifications (especially the 100 kHz ESR)  
closely match the types listed in the table. Refer to the capacitor  
manufacturers data sheet for this information.  
4. Feedforward Capacitor (CFF) (See Figure 20)  
4. Feedforward Capacitor (CFF)  
For output voltages greater than approximately 10V, an additional The table shown in Table 2 contains feed forward capacitor values  
capacitor is required. The compensation capacitor is typically for various output voltages. In this example, a 560 pF capacitor is  
between 100 pF and 33 nF, and is wired in parallel with the output needed.  
voltage setting resistor, R2. It provides additional stability for high  
output voltages, low input-output voltages, and/or very low ESR  
output capacitors, such as solid tantalum capacitors.  
(6)  
This capacitor type can be ceramic, plastic, silver mica, etc.  
(Because of the unstable characteristics of ceramic capacitors made  
with Z5U material, they are not recommended.)  
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PROCEDURE (Adjustable Output Voltage Version)  
5. Catch Diode Selection (D1)  
EXAMPLE (Adjustable Output Voltage Version)  
5. Catch Diode Selection (D1)  
A. The catch diode current rating must be at least 1.3 times greater A. Refer to the table shown in Table 6. Schottky diodes provide the  
than the maximum load current. Also, if the power supply design best performance, and in this example a 5A, 40V, 1N5825 Schottky  
must withstand a continuous output short, the diode should have a diode would be a good choice. The 5A diode rating is more than  
current rating equal to the maximum current limit of the LM2596. The adequate and will not be overstressed even for a shorted output.  
most stressful condition for this diode is an overload or shorted  
output condition.  
B. The reverse voltage rating of the diode should be at least 1.25  
times the maximum input voltage.  
C. This diode must be fast (short reverse recovery time) and must be  
located close to the LM2596 using short leads and short printed  
circuit traces. Because of their fast switching speed and low forward  
voltage drop, Schottky diodes provide the best performance and  
efficiency, and should be the first choice, especially in low output  
voltage applications. Ultra-fast recovery, or High-Efficiency rectifiers  
are also a good choice, but some types with an abrupt turn-off  
characteristic may cause instability or EMl problems. Ultra-fast  
recovery diodes typically have reverse recovery times of 50 ns or  
less. Rectifiers such as the 1N4001 series are much too slow and  
should not be used.  
6. Input Capacitor (CIN  
)
6. Input Capacitor (CIN)  
A low ESR aluminum or tantalum bypass capacitor is needed The important parameters for the Input capacitor are the input  
between the input pin and ground to prevent large voltage transients voltage rating and the RMS current rating. With a nominal input  
from appearing at the input. In addition, the RMS current rating of voltage of 28V, an aluminum electrolytic aluminum electrolytic  
the input capacitor should be selected to be at least ½ the DC load capacitor with a voltage rating greater than 42V (1.5 × VIN) would be  
current. The capacitor manufacturers data sheet must be checked to needed. Since the the next higher capacitor voltage rating is 50V, a  
assure that this current rating is not exceeded. The curve shown in 50V capacitor should be used. The capacitor voltage rating of (1.5 ×  
Figure 25 shows typical RMS current ratings for several different VIN) is a conservative guideline, and can be modified somewhat if  
aluminum electrolytic capacitor values.  
desired.  
This capacitor should be located close to the IC using short leads The RMS current rating requirement for the input capacitor of a buck  
and the voltage rating should be approximately 1.5 times the regulator is approximately ½ the DC load current. In this example,  
maximum input voltage.  
with a 3A load, a capacitor with a RMS current rating of at least 1.5A  
is needed.  
If solid tantalum input capacitors are used, it is recomended that they  
be surge current tested by the manufacturer.  
The curves shown in Figure 25 can be used to select an appropriate  
input capacitor. From the curves, locate the 50V line and note which  
capacitor values have RMS current ratings greater than 1.5A. Either  
a 470 μF or 680 μF, 50V capacitor could be used.  
Use caution when using a high dielectric constant ceramic capacitor  
for input bypassing, because it may cause severe ringing at the VIN  
pin.  
For a through hole design, a 680 μF/50V electrolytic capacitor  
(Panasonic HFQ series or Nichicon PL series or equivalent) would  
be adequate. Other types or other manufacturers capacitors can be  
used provided the RMS ripple current ratings are adequate.  
For additional information, see section on input capacitors in  
Application Information section.  
For surface mount designs, solid tantalum capacitors can be used,  
but caution must be exercised with regard to the capacitor surge  
current rting (see Application Information or input capacitors in this  
data sheet). The TPS series available from AVX, and the 593D  
series from Sprague are both surge current tested.  
To further simplify the buck regulator design procedure, Texas  
Instruments is making available computer design software to be  
used with the Simple Switcher line ot switching regulators.  
Switchers Made Simple (version 4.3 or later) is available on a 3½  
diskette for IBM compatible computers.  
LM2596 Series Buck Regulator Design Procedure (Adjustable Output)  
Table 2. Output Capacitor and Feedforward Capacitor Selection Table  
Output  
Voltage  
(V)  
Through Hole Output Capacitor  
Surface Mount Output Capacitor  
Panasonic  
HFQ Series  
(μF/V)  
Nichicon PL  
AVX TPS  
Series  
Sprague  
595D Series  
Feedforward  
Capacitor  
Feedforward  
Capacitor  
Series  
(μF/V)  
(μF/V)  
(μF/V)  
2
4
6
820/35  
560/35  
470/25  
820/35  
470/35  
470/25  
33 nF  
10 nF  
3.3 nF  
330/6.3  
330/6.3  
220/10  
470/4  
390/6.3  
330/10  
33 nF  
10 nF  
3.3 nF  
14  
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Table 2. Output Capacitor and Feedforward Capacitor Selection Table (continued)  
Output  
Voltage  
(V)  
Through Hole Output Capacitor  
Surface Mount Output Capacitor  
Panasonic  
HFQ Series  
(μF/V)  
Nichicon PL  
AVX TPS  
Series  
Sprague  
595D Series  
Feedforward  
Capacitor  
Feedforward  
Capacitor  
Series  
(μF/V)  
(μF/V)  
(μF/V)  
9
330/25  
330/25  
220/35  
220/35  
100/50  
330/25  
330/25  
220/35  
150/35  
100/50  
1.5 nF  
1 nF  
100/16  
100/16  
68/20  
33/25  
10/35  
180/16  
180/16  
120/20  
33/25  
1.5 nF  
1 nF  
1 2  
1 5  
2 4  
2 8  
680 pF  
560 pF  
390 pF  
680 pF  
220 pF  
220 pF  
15/50  
LM2596 Series Buck Regulator Design Procedure  
INDUCTOR VALUE SELECTION GUIDES  
(For Continuous Mode Operation)  
Figure 21. LM2596-3.3  
Figure 22. LM2596-5.0  
Figure 23. LM2596-12  
Figure 24. LM2596-ADJ  
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Coilcraft  
Table 3. Inductor Manufacturers Part Numbers  
Inductance Current  
Schott  
Through  
Hole  
Renco  
Through  
Hole  
Pulse Engineering  
(μH)  
(A)  
Surface  
Mount  
Surface  
Mount  
Through  
Hole  
Surface  
Mount  
Surface  
Mount  
L15  
L21  
L22  
L23  
L24  
L25  
L26  
L27  
L28  
L29  
L30  
L31  
L32  
L33  
L34  
L35  
L36  
L37  
L38  
L39  
L40  
L41  
L42  
L43  
L44  
22  
68  
0.99  
0.99  
1.17  
1.40  
1.70  
2.10  
0.80  
1.00  
1.20  
1.47  
1.78  
2.20  
2.50  
3.10  
3.40  
1.70  
2.10  
2.50  
3.10  
3.50  
3.50  
3.50  
2.70  
3.40  
3.40  
67148350 67148460 RL-1284-22-43  
67144070 67144450 RL-5471-5  
67144080 67144460 RL-5471-6  
67144090 67144470 RL-5471-7  
67148370 67148480 RL-1283-22-43  
67148380 67148490 RL-1283-15-43  
67144100 67144480 RL-5471-1  
67144110 67144490 RL-5471-2  
67144120 67144500 RL-5471-3  
67144130 67144510 RL-5471-4  
67144140 67144520 RL-5471-5  
67144150 67144530 RL-5471-6  
67144160 67144540 RL-5471-7  
67148390 67148500 RL-1283-22-43  
67148400 67148790 RL-1283-15-43  
RL1500-22 PE-53815  
RL1500-68 PE-53821  
PE-53815-S  
PE-53821-S  
PE-53822-S  
PE-53823-S  
PE-53825-S  
PE-53824-S  
PE-53826-S  
PE-53827-S  
PE-53828-S  
PE-53829-S  
PE-53830-S  
PE-53831-S  
PE-53932-S  
PE-53933-S  
PE-53934-S  
PE-53935-S  
PE-54036-S  
PE-54037-S  
PE-54038-S  
PE-54039-S  
PE-54040-S  
PE-54041-S  
PE-54042-S  
DO3308-223  
DO3316-683  
DO3316-473  
DO3316-333  
DO3316-223  
DO3316-153  
DO5022P-334  
DO5022P-224  
DO5022P-154  
DO5022P-104  
DO5022P-683  
DO5022P-473  
DO5022P-333  
DO5022P-223  
DO5022P-153  
47  
PE-53822  
PE-53823  
PE-53824  
PE-53825  
PE-53826  
PE-53827  
PE-53828  
PE-53829  
PE-53830  
PE-53831  
PE-53932  
PE-53933  
PE-53934  
PE-53935  
PE-54036  
PE-54037  
PE-54038  
PE-54039  
PE-54040  
PE-54041  
PE-54042  
PE-54043  
PE-54044  
33  
22  
15  
330  
220  
150  
100  
68  
47  
33  
22  
15  
220  
150  
100  
68  
67144170  
67144180  
67144190  
67144200  
67144210  
RL-5473-1  
RL-5473-4  
RL-5472-1  
RL-5472-2  
RL-5472-3  
47  
33  
67144220 67148290 RL-5472-4  
67144230 67148300 RL-5472-5  
22  
150  
100  
68  
67148410  
67144240  
67144250  
RL-5473-4  
RL-5473-2  
RL-5473-3  
Table 4. Inductor Manufacturers Phone Numbers  
Coilcraft Inc.  
Phone  
FAX  
(800) 322-2645  
(708) 639-1469  
+11 1236 730 595  
+44 1236 730 627  
(619) 674-8100  
(619) 674-8262  
+353 93 24 107  
+353 93 24 459  
(800) 645-5828  
(516) 586-5562  
(612) 475-1173  
(612) 475-1786  
Coilcraft Inc., Europe  
Pulse Engineering Inc.  
Phone  
FAX  
Phone  
FAX  
Pulse Engineering Inc., Europe  
Renco Electronics Inc.  
Schott Corp.  
Phone  
FAX  
Phone  
FAX  
Phone  
FAX  
Table 5. Capacitor Manufacturers Phone Numbers  
Nichicon Corp.  
Panasonic  
Phone  
FAX  
(708) 843-7500  
(708) 843-2798  
(714) 373-7857  
(714) 373-7102  
Phone  
FAX  
16  
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Table 5. Capacitor Manufacturers Phone Numbers (continued)  
AVX Corp.  
Phone  
FAX  
(803) 448-9411  
(803) 448-1943  
(207) 324-4140  
(207) 324-7223  
Sprague/Vishay  
Phone  
FAX  
Table 6. Diode Selection Table  
VR  
3A Diodes  
4A–6A Diodes  
Surface Mount  
Schottky Ultra Fast  
Through Hole  
Surface Mount  
Through Hole  
Schottky  
Ultra Fast  
Schottky  
Ultra Fast  
Schottky  
Ultra Fast  
Recovery  
Recovery  
Recovery  
Recovery  
20V  
All of  
these  
diodes  
are  
rated to  
at least  
50V.  
1N5820  
SR302  
All of  
these  
diodes  
are  
rated to  
at least  
50V.  
All of  
these  
diodes  
are  
rated to  
at least  
50V.  
SR502  
1N5823  
SB520  
All of  
these  
diodes  
are  
rated to  
at least  
50V.  
SK32  
MBR320  
1N5821  
MBR330  
31DQ03  
1N5822  
SR304  
30V 30WQ03  
SK33  
50WQ03  
50WQ04  
SR503  
1N5824  
SB530  
SR504  
1N5825  
SB540  
40V SK34  
MBRS340  
30WQ04  
MBR340  
31DQ04  
SR305  
MURS320  
30WF10  
MUR320  
MURS620  
50WF10  
MUR620  
HER601  
50V SK35  
or  
MBRS360  
MBR350  
31DQ05  
50WQ05  
SB550  
More 30WQ05  
50SQ080  
Block Diagram  
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APPLICATION INFORMATION  
Table 7. PIN DESCRIPTIONS  
Name  
+VIN  
Description  
This is the positive input supply for the IC switching regulator. A suitable input bypass  
capacitor must be present at this pin to minimize voltage transients and to supply the  
switching currents needed by the regulator.  
Ground  
Output  
Feedback  
Circuit ground.  
Internal switch. The voltage at this pin switches between (+VIN VSAT) and approximately  
0.5V, with a duty cycle of approximately VOUT/VIN. To minimize coupling to sensitive  
circuitry, the PC board copper area connected to this pin should be kept to a minimum.  
Senses the regulated output voltage to complete the feedback loop.  
Allows the switching regulator circuit to be shut down using logic level signals thus dropping  
the total input supply current to approximately 80 μA. Pulling this pin below a threshold  
voltage of approximately 1.3V turns the regulator on, and pulling this pin above 1.3V (up to a  
maximum of 25V) shuts the regulator down. If this shutdown feature is not needed, the ON  
/OFF pin can be wired to the ground pin or it can be left open, in either case the regulator will  
be in the ON condition.  
ON /OFF  
EXTERNAL COMPONENTS  
INPUT CAPACITOR  
CIN — A low ESR aluminum or tantalum bypass capacitor is needed between the input pin and ground pin. It  
must be located near the regulator using short leads. This capacitor prevents large voltage transients from  
appearing at the input, and provides the instantaneous current needed each time the switch turns on.  
The important parameters for the Input capacitor are the voltage rating and the RMS current rating. Because of  
the relatively high RMS currents flowing in a buck regulator's input capacitor, this capacitor should be chosen for  
its RMS current rating rather than its capacitance or voltage ratings, although the capacitance value and voltage  
rating are directly related to the RMS current rating.  
The RMS current rating of a capacitor could be viewed as a capacitor's power rating. The RMS current flowing  
through the capacitors internal ESR produces power which causes the internal temperature of the capacitor to  
rise. The RMS current rating of a capacitor is determined by the amount of current required to raise the internal  
temperature approximately 10°C above an ambient temperature of 105°C. The ability of the capacitor to dissipate  
this heat to the surrounding air will determine the amount of current the capacitor can safely sustain. Capacitors  
that are physically large and have a large surface area will typically have higher RMS current ratings. For a given  
capacitor value, a higher voltage electrolytic capacitor will be physically larger than a lower voltage capacitor, and  
thus be able to dissipate more heat to the surrounding air, and therefore will have a higher RMS current rating.  
The consequences of operating an electrolytic capacitor above the RMS current rating is a shortened operating  
life. The higher temperature speeds up the evaporation of the capacitor's electrolyte, resulting in eventual failure.  
Selecting an input capacitor requires consulting the manufacturers data sheet for maximum allowable RMS ripple  
current. For a maximum ambient temperature of 40°C, a general guideline would be to select a capacitor with a  
ripple current rating of approximately 50% of the DC load current. For ambient temperatures up to 70°C, a  
current rating of 75% of the DC load current would be a good choice for a conservative design. The capacitor  
voltage rating must be at least 1.25 times greater than the maximum input voltage, and often a much higher  
voltage capacitor is needed to satisfy the RMS current requirements.  
A graph shown in Figure 25 shows the relationship between an electrolytic capacitor value, its voltage rating, and  
the RMS current it is rated for. These curves were obtained from the Nichicon “PL” series of low ESR, high  
reliability electrolytic capacitors designed for switching regulator applications. Other capacitor manufacturers offer  
similar types of capacitors, but always check the capacitor data sheet.  
“Standard” electrolytic capacitors typically have much higher ESR numbers, lower RMS current ratings and  
typically have a shorter operating lifetime.  
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Because of their small size and excellent performance, surface mount solid tantalum capacitors are often used  
for input bypassing, but several precautions must be observed. A small percentage of solid tantalum capacitors  
can short if the inrush current rating is exceeded. This can happen at turn on when the input voltage is suddenly  
applied, and of course, higher input voltages produce higher inrush currents. Several capacitor manufacturers do  
a 100% surge current testing on their products to minimize this potential problem. If high turn on currents are  
expected, it may be necessary to limit this current by adding either some resistance or inductance before the  
tantalum capacitor, or select a higher voltage capacitor. As with aluminum electrolytic capacitors, the RMS ripple  
current rating must be sized to the load current.  
FEEDFORWARD CAPACITOR  
(Adjustable Output Voltage Version)  
CFF — A Feedforward Capacitor CFF, shown across R2 in Figure 20 is used when the ouput voltage is greater  
than 10V or when COUT has a very low ESR. This capacitor adds lead compensation to the feedback loop and  
increases the phase margin for better loop stability. For CFF selection, see the Design Procedure section.  
Figure 25. RMS Current Ratings for Low ESR Electrolytic Capacitors (Typical)  
OUTPUT CAPACITOR  
COUT — An output capacitor is required to filter the output and provide regulator loop stability. Low impedance or  
low ESR Electrolytic or solid tantalum capacitors designed for switching regulator applications must be used.  
When selecting an output capacitor, the important capacitor parameters are; the 100 kHz Equivalent Series  
Resistance (ESR), the RMS ripple current rating, voltage rating, and capacitance value. For the output capacitor,  
the ESR value is the most important parameter.  
The output capacitor requires an ESR value that has an upper and lower limit. For low output ripple voltage, a  
low ESR value is needed. This value is determined by the maximum allowable output ripple voltage, typically 1%  
to 2% of the output voltage. But if the selected capacitor's ESR is extremely low, there is a possibility of an  
unstable feedback loop, resulting in an oscillation at the output. Using the capacitors listed in the tables, or  
similar types, will provide design solutions under all conditions.  
If very low output ripple voltage (less than 15 mV) is required, refer to the section on OUTPUT VOLTAGE  
RIPPLE AND TRANSIENTS for a post ripple filter.  
An aluminum electrolytic capacitor's ESR value is related to the capacitance value and its voltage rating. In most  
cases, higher voltage electrolytic capacitors have lower ESR values (see Figure 26 ). Often, capacitors with  
much higher voltage ratings may be needed to provide the low ESR values required for low output ripple voltage.  
The output capacitor for many different switcher designs often can be satisfied with only three or four different  
capacitor values and several different voltage ratings. See the quick design component selection tables in  
Table 1 and 4 for typical capacitor values, voltage ratings, and manufacturers capacitor types.  
Electrolytic capacitors are not recommended for temperatures below 25°C. The ESR rises dramatically at cold  
temperatures and typically rises 3X @ 25°C and as much as 10X at 40°C. See curve shown in Figure 27.  
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Solid tantalum capacitors have a much better ESR spec for cold temperatures and are recommended for  
temperatures below 25°C.  
Figure 26. Capacitor ESR vs Capacitor Voltage Rating (Typical Low ESR Electrolytic Capacitor)  
CATCH DIODE  
Buck regulators require a diode to provide a return path for the inductor current when the switch turns off. This  
must be a fast diode and must be located close to the LM2596 using short leads and short printed circuit traces.  
Because of their very fast switching speed and low forward voltage drop, Schottky diodes provide the best  
performance, especially in low output voltage applications (5V and lower). Ultra-fast recovery, or High-Efficiency  
rectifiers are also a good choice, but some types with an abrupt turnoff characteristic may cause instability or  
EMI problems. Ultra-fast recovery diodes typically have reverse recovery times of 50 ns or less. Rectifiers such  
as the 1N5400 series are much too slow and should not be used.  
Figure 27. Capacitor ESR Change vs Temperature  
INDUCTOR SELECTION  
All switching regulators have two basic modes of operation; continuous and discontinuous. The difference  
between the two types relates to the inductor current, whether it is flowing continuously, or if it drops to zero for a  
period of time in the normal switching cycle. Each mode has distinctively different operating characteristics,  
which can affect the regulators performance and requirements. Most switcher designs will operate in the  
discontinuous mode when the load current is low.  
The LM2596 (or any of the Simple Switcher family) can be used for both continuous or discontinuous modes of  
operation.  
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In many cases the preferred mode of operation is the continuous mode. It offers greater output power, lower  
peak switch, inductor and diode currents, and can have lower output ripple voltage. But it does require larger  
inductor values to keep the inductor current flowing continuously, especially at low output load currents and/or  
high input voltages.  
To simplify the inductor selection process, an inductor selection guide (nomograph) was designed (see Figure 21  
through 8). This guide assumes that the regulator is operating in the continuous mode, and selects an inductor  
that will allow a peak-to-peak inductor ripple current to be a certain percentage of the maximum design load  
current. This peak-to-peak inductor ripple current percentage is not fixed, but is allowed to change as different  
design load currents are selected. (See Figure 28.)  
Figure 28. (ΔIIND) Peak-to-Peak Inductor  
Ripple Current (as a Percentage of the Load Current)  
vs Load Current  
By allowing the percentage of inductor ripple current to increase for low load currents, the inductor value and size  
can be kept relatively low.  
When operating in the continuous mode, the inductor current waveform ranges from a triangular to a sawtooth  
type of waveform (depending on the input voltage), with the average value of this current waveform equal to the  
DC output load current.  
Inductors are available in different styles such as pot core, toroid, E-core, bobbin core, etc., as well as different  
core materials, such as ferrites and powdered iron. The least expensive, the bobbin, rod or stick core, consists of  
wire wound on a ferrite bobbin. This type of construction makes for an inexpensive inductor, but since the  
magnetic flux is not completely contained within the core, it generates more Electro-Magnetic Interference (EMl).  
This magnetic flux can induce voltages into nearby printed circuit traces, thus causing problems with both the  
switching regulator operation and nearby sensitive circuitry, and can give incorrect scope readings because of  
induced voltages in the scope probe. Also see section on OPEN CORE INDUCTORS.  
When multiple switching regulators are located on the same PC board, open core magnetics can cause  
interference between two or more of the regulator circuits, especially at high currents. A torroid or E-core inductor  
(closed magnetic structure) should be used in these situations.  
The inductors listed in the selection chart include ferrite E-core construction for Schott, ferrite bobbin core for  
Renco and Coilcraft, and powdered iron toroid for Pulse Engineering.  
Exceeding an inductor's maximum current rating may cause the inductor to overheat because of the copper wire  
losses, or the core may saturate. If the inductor begins to saturate, the inductance decreases rapidly and the  
inductor begins to look mainly resistive (the DC resistance of the winding). This can cause the switch current to  
rise very rapidly and force the switch into a cycle-by-cycle current limit, thus reducing the DC output load current.  
This can also result in overheating of the inductor and/or the LM2596. Different inductor types have different  
saturation characteristics, and this should be kept in mind when selecting an inductor.  
The inductor manufacturer's data sheets include current and energy limits to avoid inductor saturation.  
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DISCONTINUOUS MODE OPERATION  
The selection guide chooses inductor values suitable for continuous mode operation, but for low current  
applications and/or high input voltages, a discontinuous mode design may be a better choice. It would use an  
inductor that would be physically smaller, and would need only one half to one third the inductance value needed  
for a continuous mode design. The peak switch and inductor currents will be higher in a discontinuous design,  
but at these low load currents (1A and below), the maximum switch current will still be less than the switch  
current limit.  
Discontinuous operation can have voltage waveforms that are considerable different than a continuous design.  
The output pin (switch) waveform can have some damped sinusoidal ringing present. (See Typical Performance  
Characteristics photo titled Discontinuous Mode Switching Waveforms) This ringing is normal for discontinuous  
operation, and is not caused by feedback loop instabilities. In discontinuous operation, there is a period of time  
where neither the switch or the diode are conducting, and the inductor current has dropped to zero. During this  
time, a small amount of energy can circulate between the inductor and the switch/diode parasitic capacitance  
causing this characteristic ringing. Normally this ringing is not a problem, unless the amplitude becomes great  
enough to exceed the input voltage, and even then, there is very little energy present to cause damage.  
Different inductor types and/or core materials produce different amounts of this characteristic ringing. Ferrite core  
inductors have very little core loss and therefore produce the most ringing. The higher core loss of powdered iron  
inductors produce less ringing. If desired, a series RC could be placed in parallel with the inductor to dampen the  
ringing. The computer aided design software Switchers Made Simple (version 4.3) will provide all component  
values for continuous and discontinuous modes of operation.  
Figure 29. Post Ripple Filter Waveform  
OUTPUT VOLTAGE RIPPLE AND TRANSIENTS  
The output voltage of a switching power supply operating in the continuous mode will contain a sawtooth ripple  
voltage at the switcher frequency, and may also contain short voltage spikes at the peaks of the sawtooth  
waveform.  
The output ripple voltage is a function of the inductor sawtooth ripple current and the ESR of the output  
capacitor. A typical output ripple voltage can range from approximately 0.5% to 3% of the output voltage. To  
obtain low ripple voltage, the ESR of the output capacitor must be low, however, caution must be exercised when  
using extremely low ESR capacitors because they can affect the loop stability, resulting in oscillation problems. If  
very low output ripple voltage is needed (less than 20 mV), a post ripple filter is recommended. (See Figure 20.)  
The inductance required is typically between 1 μH and 5 μH, with low DC resistance, to maintain good load  
regulation. A low ESR output filter capacitor is also required to assure good dynamic load response and ripple  
reduction. The ESR of this capacitor may be as low as desired, because it is out of the regulator feedback loop.  
The photo shown in Figure 29 shows a typical output ripple voltage, with and without a post ripple filter.  
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When observing output ripple with a scope, it is essential that a short, low inductance scope probe ground  
connection be used. Most scope probe manufacturers provide a special probe terminator which is soldered onto  
the regulator board, preferable at the output capacitor. This provides a very short scope ground thus eliminating  
the problems associated with the 3 inch ground lead normally provided with the probe, and provides a much  
cleaner and more accurate picture of the ripple voltage waveform.  
The voltage spikes are caused by the fast switching action of the output switch and the diode, and the parasitic  
inductance of the output filter capacitor, and its associated wiring. To minimize these voltage spikes, the output  
capacitor should be designed for switching regulator applications, and the lead lengths must be kept very short.  
Wiring inductance, stray capacitance, as well as the scope probe used to evaluate these transients, all contribute  
to the amplitude of these spikes.  
When a switching regulator is operating in the continuous mode, the inductor current waveform ranges from a  
triangular to a sawtooth type of waveform (depending on the input voltage). For a given input and output voltage,  
the peak-to-peak amplitude of this inductor current waveform remains constant. As the load current increases or  
decreases, the entire sawtooth current waveform also rises and falls. The average value (or the center) of this  
current waveform is equal to the DC load current.  
If the load current drops to a low enough level, the bottom of the sawtooth current waveform will reach zero, and  
the switcher will smoothly change from a continuous to a discontinuous mode of operation. Most switcher  
designs (irregardless how large the inductor value is) will be forced to run discontinuous if the output is lightly  
loaded. This is a perfectly acceptable mode of operation.  
Figure 30. Peak-to-Peak Inductor  
Ripple Current vs Load Current  
In a switching regulator design, knowing the value of the peak-to-peak inductor ripple current (ΔIIND) can be  
useful for determining a number of other circuit parameters. Parameters such as, peak inductor or peak switch  
current, minimum load current before the circuit becomes discontinuous, output ripple voltage and output  
capacitor ESR can all be calculated from the peak-to-peak ΔIIND. When the inductor nomographs shown in  
Figure 21 through 8 are used to select an inductor value, the peak-to-peak inductor ripple current can  
immediately be determined. The curve shown in Figure 30 shows the range of (ΔIIND) that can be expected for  
different load currents. The curve also shows how the peak-to-peak inductor ripple current (ΔIIND) changes as  
you go from the lower border to the upper border (for a given load current) within an inductance region. The  
upper border represents a higher input voltage, while the lower border represents a lower input voltage (see  
Inductor Selection Guides section).  
These curves are only correct for continuous mode operation, and only if the inductor selection guides are used  
to select the inductor value  
Consider the following example:  
VOUT = 5V, maximum load current of 2.5A  
VIN = 12V, nominal, varying between 10V and 16V.  
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The selection guide in Figure 22 shows that the vertical line for a 2.5A load current, and the horizontal line for the  
12V input voltage intersect approximately midway between the upper and lower borders of the 33 μH inductance  
region. A 33 μH inductor will allow a peak-to-peak inductor current (ΔIIND) to flow that will be a percentage of the  
maximum load current. Referring to Figure 30, follow the 2.5A line approximately midway into the inductance  
region, and read the peak-to-peak inductor ripple current (ΔIIND) on the left hand axis (approximately 620 mA p-  
p).  
As the input voltage increases to 16V, it approaches the upper border of the inductance region, and the inductor  
ripple current increases. Referring to the curve in Figure 30, it can be seen that for a load current of 2.5A, the  
peak-to-peak inductor ripple current (ΔIIND) is 620 mA with 12V in, and can range from 740 mA at the upper  
border (16V in) to 500 mA at the lower border (10V in).  
Once the ΔIIND value is known, the following formulas can be used to calculate additional information about the  
switching regulator circuit.  
1. Peak Inductor or peak switch current  
2. Minimum load current before the circuit becomes discontinuous  
3. Output Ripple Voltage = (ΔIIND)×(ESR of COUT) = 0.62A×0.1Ω = 62 mV p-p  
4. added  
for  
line  
break  
OPEN CORE INDUCTORS  
Another possible source of increased output ripple voltage or unstable operation is from an open core inductor.  
Ferrite bobbin or stick inductors have magnetic lines of flux flowing through the air from one end of the bobbin to  
the other end. These magnetic lines of flux will induce a voltage into any wire or PC board copper trace that  
comes within the inductor's magnetic field. The strength of the magnetic field, the orientation and location of the  
PC copper trace to the magnetic field, and the distance between the copper trace and the inductor, determine  
the amount of voltage generated in the copper trace. Another way of looking at this inductive coupling is to  
consider the PC board copper trace as one turn of a transformer (secondary) with the inductor winding as the  
primary. Many millivolts can be generated in a copper trace located near an open core inductor which can cause  
stability problems or high output ripple voltage problems.  
If unstable operation is seen, and an open core inductor is used, it's possible that the location of the inductor with  
respect to other PC traces may be the problem. To determine if this is the problem, temporarily raise the inductor  
away from the board by several inches and then check circuit operation. If the circuit now operates correctly,  
then the magnetic flux from the open core inductor is causing the problem. Substituting a closed core inductor  
such as a torroid or E-core will correct the problem, or re-arranging the PC layout may be necessary. Magnetic  
flux cutting the IC device ground trace, feedback trace, or the positive or negative traces of the output capacitor  
should be minimized.  
Sometimes, locating a trace directly beneath a bobbin in- ductor will provide good results, provided it is exactly in  
the center of the inductor (because the induced voltages cancel themselves out), but if it is off center one  
direction or the other, then problems could arise. If flux problems are present, even the direction of the inductor  
winding can make a difference in some circuits.  
This discussion on open core inductors is not to frighten the user, but to alert the user on what kind of problems  
to watch out for when using them. Open core bobbin or “stick” inductors are an inexpensive, simple way of  
making a compact efficient inductor, and they are used by the millions in many different applications.  
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THERMAL CONSIDERATIONS  
The LM2596 is available in two packages, a 5-pin TO-220 (T) and a 5-pin surface mount TO-263 (S).  
The TO-220 package needs a heat sink under most conditions. The size of the heatsink depends on the input  
voltage, the output voltage, the load current and the ambient temperature. The curves in Figure 31 show the  
LM2596T junction temperature rises above ambient temperature for a 3A load and different input and output  
voltages. The data for these curves was taken with the LM2596T (TO-220 package) operating as a buck  
switching regulator in an ambient temperature of 25°C (still air). These temperature rise numbers are all  
approximate and there are many factors that can affect these temperatures. Higher ambient temperatures require  
more heat sinking.  
The TO-263 surface mount package tab is designed to be soldered to the copper on a printed circuit board. The  
copper and the board are the heat sink for this package and the other heat producing components, such as the  
catch diode and inductor. The PC board copper area that the package is soldered to should be at least 0.4 in2,  
and ideally should have 2 or more square inches of 2 oz. (0.0028 in.) copper. Additional copper area improves  
the thermal characteristics, but with copper areas greater than approximately 6 in2, only small improvements in  
heat dissipation are realized. If further thermal improvements are needed, double sided, multilayer PC board with  
large copper areas and/or airflow are recommended.  
The curves shown in Figure 32 show the LM2596S (TO-263 package) junction temperature rise above ambient  
temperature with a 2A load for various input and output voltages. This data was taken with the circuit operating  
as a buck switching regulator with all components mounted on a PC board to simulate the junction temperature  
under actual operating conditions. This curve can be used for a quick check for the approximate junction  
temperature for various conditions, but be aware that there are many factors that can affect the junction  
temperature. When load currents higher than 2A are used, double sided or multilayer PC boards with large  
copper areas and/or airflow might be needed, especially for high ambient temperatures and high output voltages.  
For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper  
should be used in the board layout. (One exception to this is the output (switch) pin, which should not have large  
areas of copper.) Large areas of copper provide the best transfer of heat (lower thermal resistance) to the  
surrounding air, and moving air lowers the thermal resistance even further.  
Package thermal resistance and junction temperature rise numbers are all approximate, and there are many  
factors that will affect these numbers. Some of these factors include board size, shape, thickness, position,  
location, and even board temperature. Other factors are, trace width, total printed circuit copper area, copper  
thickness, single- or double-sided, multilayer board and the amount of solder on the board. The effectiveness of  
the PC board to dissipate heat also depends on the size, quantity and spacing of other components on the  
board, as well as whether the surrounding air is still or moving. Furthermore, some of these components such as  
the catch diode will add heat to the PC board and the heat can vary as the input voltage changes. For the  
inductor, depending on the physical size, type of core material and the DC resistance, it could either act as a  
heat sink taking heat away from the board, or it could add heat to the board.  
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Circuit Data for Temperature Rise Curve  
TO-220 Package (T)  
Through hole electrolytic  
Capacitors  
Inductor  
Diode  
Through hole, Renco  
Through hole, 5A 40V, Schottky  
3 square inches single sided 2 oz. copper (0.0028)  
PC board  
Figure 31. Junction Temperature Rise, TO-220  
Circuit Data for Temperature Rise Curve  
TO-263 Package (S)  
Capacitors  
Inductor  
Diode  
Surface mount tantalum, molded “D” size  
Surface mount, Pulse Engineering, 68 μH  
Surface mount, 5A 40V, Schottky  
PC board  
9 square inches single sided 2 oz. copper (0.0028)  
Figure 32. Junction Temperature Rise, TO-263  
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Figure 33. Delayed Startup  
Figure 34. Undervoltage Lockout  
for Buck Regulator  
DELAYED STARTUP  
The circuit in Figure 33 uses the the ON /OFF pin to provide a time delay between the time the input voltage is  
applied and the time the output voltage comes up (only the circuitry pertaining to the delayed start up is shown).  
As the input voltage rises, the charging of capacitor C1 pulls the ON /OFF pin high, keeping the regulator off.  
Once the input voltage reaches its final value and the capacitor stops charging, and resistor R2 pulls the ON  
/OFF pin low, thus allowing the circuit to start switching. Resistor R1 is included to limit the maximum voltage  
applied to the ON /OFF pin (maximum of 25V), reduces power supply noise sensitivity, and also limits the  
capacitor, C1, discharge current. When high input ripple voltage exists, avoid long delay time, because this ripple  
can be coupled into the ON /OFF pin and cause problems.  
This delayed startup feature is useful in situations where the input power source is limited in the amount of  
current it can deliver. It allows the input voltage to rise to a higher voltage before the regulator starts operating.  
Buck regulators require less input current at higher input voltages.  
UNDERVOLTAGE LOCKOUT  
Some applications require the regulator to remain off until the input voltage reaches a predetermined voltage. An  
undervoltage lockout feature applied to a buck regulator is shown in Figure 34, while Figure 35 and Figure 36  
applies the same feature to an inverting circuit. The circuit in Figure 35 features a constant threshold voltage for  
turn on and turn off (zener voltage plus approximately one volt). If hysteresis is needed, the circuit in Figure 36  
has a turn ON voltage which is different than the turn OFF voltage. The amount of hysteresis is approximately  
equal to the value of the output voltage. If zener voltages greater than 25V are used, an additional 47 kΩ resistor  
is needed from the ON /OFF pin to the ground pin to stay within the 25V maximum limit of the ON /OFF pin.  
INVERTING REGULATOR  
The circuit in Figure 37 converts a positive input voltage to a negative output voltage with a common ground. The  
circuit operates by bootstrapping the regulator's ground pin to the negative output voltage, then grounding the  
feedback pin, the regulator senses the inverted output voltage and regulates it.  
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This circuit has an ON/OFF threshold of approximately 13V.  
Figure 35. Undervoltage Lockout  
for Inverting Regulator  
This example uses the LM2596-5.0 to generate a 5V output, but other output voltages are possible by selecting  
other output voltage versions, including the adjustable version. Since this regulator topology can produce an  
output voltage that is either greater than or less than the input voltage, the maximum output current greatly  
depends on both the input and output voltage. The curve shown in Figure 38 provides a guide as to the amount  
of output load current possible for the different input and output voltage conditions.  
The maximum voltage appearing across the regulator is the absolute sum of the input and output voltage, and  
this must be limited to a maximum of 40V. For example, when converting +20V to 12V, the regulator would see  
32V between the input pin and ground pin. The LM2596 has a maximum input voltage spec of 40V.  
Additional diodes are required in this regulator configuration. Diode D1 is used to isolate input voltage ripple or  
noise from coupling through the CIN capacitor to the output, under light or no load conditions. Also, this diode  
isolation changes the topology to closley resemble a buck configuration thus providing good closed loop stability.  
A Schottky diode is recommended for low input voltages, (because of its lower voltage drop) but for higher input  
voltages, a fast recovery diode could be used.  
Without diode D3, when the input voltage is first applied, the charging current of CIN can pull the output positive  
by several volts for a short period of time. Adding D3 prevents the output from going positive by more than a  
diode voltage.  
This circuit has hysteresis  
Regulator starts switching at VIN = 13V  
Regulator stops switching at VIN = 8V  
Figure 36. Undervoltage Lockout with Hysteresis for Inverting Regulator  
28  
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Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM2596  
LM2596  
www.ti.com  
SNVS124C NOVEMBER 1999REVISED APRIL 2013  
CIN —68 μF/25V Tant. Sprague 595D  
470 μF/50V Elec. Panasonic HFQ  
COUT —47 μF/20V Tant. Sprague 595D  
220 μF/25V Elec. Panasonic HFQ  
Figure 37. Inverting 5V Regulator with Delayed Startup  
Figure 38. Inverting Regulator Typical Load Current  
Because of differences in the operation of the inverting regulator, the standard design procedure is not used to  
select the inductor value. In the majority of designs, a 33 μH, 3.5A inductor is the best choice. Capacitor  
selection can also be narrowed down to just a few values. Using the values shown in Figure 37 will provide good  
results in the majority of inverting designs.  
This type of inverting regulator can require relatively large amounts of input current when starting up, even with  
light loads. Input currents as high as the LM2596 current limit (approx 4.5A) are needed for at least 2 ms or  
more, until the output reaches its nominal output voltage. The actual time depends on the output voltage and the  
size of the output capacitor. Input power sources that are current limited or sources that can not deliver these  
currents without getting loaded down, may not work correctly. Because of the relatively high startup currents  
required by the inverting topology, the delayed startup feature (C1, R1 and R2) shown in Figure 37 is  
recommended. By delaying the regulator startup, the input capacitor is allowed to charge up to a higher voltage  
before the switcher begins operating. A portion of the high input current needed for startup is now supplied by the  
input capacitor (CIN). For severe start up conditions, the input capacitor can be made much larger than normal.  
INVERTING REGULATOR SHUTDOWN METHODS  
To use the ON /OFF pin in a standard buck configuration is simple, pull it below 1.3V (@25°C, referenced to  
ground) to turn regulator ON, pull it above 1.3V to shut the regulator OFF. With the inverting configuration, some  
level shifting is required, because the ground pin of the regulator is no longer at ground, but is now setting at the  
negative output voltage level. Two different shutdown methods for inverting regulators are shown in Figure 39  
and Figure 40.  
Copyright © 1999–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
29  
Product Folder Links: LM2596  
 
LM2596  
SNVS124C NOVEMBER 1999REVISED APRIL 2013  
www.ti.com  
Figure 39. Inverting Regulator Ground Referenced Shutdown  
Figure 40. Inverting Regulator Ground Referenced Shutdown using Opto Device  
TYPICAL THROUGH HOLE PC BOARD LAYOUT, FIXED OUTPUT (1X SIZE), DOUBLE SIDED  
CIN—470 μF, 50V, Aluminum Electrolytic Panasonic, “HFQ Series”  
COUT—330 μF, 35V, Aluminum Electrolytic Panasonic, “HFQ Series”  
D1—5A, 40V Schottky Rectifier, 1N5825  
L1—47 μH, L39, Renco, Through Hole  
Thermalloy Heat Sink #7020  
30  
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Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM2596  
LM2596  
www.ti.com  
SNVS124C NOVEMBER 1999REVISED APRIL 2013  
TYPICAL THROUGH HOLE PC BOARD LAYOUT, ADJUSTABLE OUTPUT (1X SIZE), DOUBLE SIDED  
CIN—470 μF, 50V, Aluminum Electrolytic Panasonic, “HFQ Series”  
COUT—220 μF, 35V Aluminum Electrolytic Panasonic, “HFQ Series”  
D1—5A, 40V Schottky Rectifier, 1N5825  
L1—47 μH, L39, Renco, Through Hole  
R1—1 kΩ, 1%  
R2—Use formula in Design Procedure  
CFF—See Table 2.  
Thermalloy Heat Sink #7020  
Figure 41. PC Board Layout  
Copyright © 1999–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
31  
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LM2596  
SNVS124C NOVEMBER 1999REVISED APRIL 2013  
www.ti.com  
REVISION HISTORY  
Changes from Revision B (April 2013) to Revision C  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 31  
32  
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Copyright © 1999–2013, Texas Instruments Incorporated  
Product Folder Links: LM2596  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Nov-2013  
PACKAGING INFORMATION  
Orderable Device  
LM2596S-12/NOPB  
LM2596S-3.3  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
DDPAK/  
TO-263  
KTT  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
45  
Pb-Free (RoHS  
Exempt)  
CU SN  
Call TI  
CU SN  
Call TI  
CU SN  
CU SN  
CU SN  
Call TI  
CU SN  
CU SN  
Call TI  
CU SN  
Call TI  
CU SN  
CU SN  
Call TI  
CU SN  
Level-3-245C-168 HR  
LM2596S  
-12 P+  
NRND  
ACTIVE  
NRND  
DDPAK/  
TO-263  
KTT  
KTT  
KTT  
KTT  
KTT  
KTT  
KTT  
KTT  
KTT  
KTT  
KTT  
NDH  
NDH  
NDH  
NDH  
NDH  
45  
45  
TBD  
Call TI  
LM2596S  
-3.3 P+  
LM2596S-3.3/NOPB  
LM2596S-5.0  
DDPAK/  
TO-263  
Pb-Free (RoHS  
Exempt)  
Level-3-245C-168 HR  
Call TI  
LM2596S  
-3.3 P+  
DDPAK/  
TO-263  
45  
TBD  
LM2596S  
-5.0 P+  
LM2596S-5.0/NOPB  
LM2596S-ADJ/NOPB  
LM2596SX-12/NOPB  
LM2596SX-3.3  
ACTIVE  
ACTIVE  
ACTIVE  
NRND  
DDPAK/  
TO-263  
45  
Pb-Free (RoHS  
Exempt)  
Level-3-245C-168 HR  
Level-3-245C-168 HR  
Level-3-245C-168 HR  
Call TI  
LM2596S  
-5.0 P+  
DDPAK/  
TO-263  
45  
Pb-Free (RoHS  
Exempt)  
-40 to 125  
LM2596S  
-ADJ P+  
DDPAK/  
TO-263  
500  
500  
500  
500  
500  
500  
45  
Pb-Free (RoHS  
Exempt)  
LM2596S  
-12 P+  
DDPAK/  
TO-263  
TBD  
LM2596S  
-3.3 P+  
LM2596SX-3.3/NOPB  
LM2596SX-5.0/NOPB  
LM2596SX-ADJ  
ACTIVE  
ACTIVE  
NRND  
DDPAK/  
TO-263  
Pb-Free (RoHS  
Exempt)  
Level-3-245C-168 HR  
Level-3-245C-168 HR  
Call TI  
LM2596S  
-3.3 P+  
DDPAK/  
TO-263  
Pb-Free (RoHS  
Exempt)  
LM2596S  
-5.0 P+  
DDPAK/  
TO-263  
TBD  
-40 to 125  
-40 to 125  
LM2596S  
-ADJ P+  
LM2596SX-ADJ/NOPB  
LM2596T-12  
ACTIVE  
NRND  
DDPAK/  
TO-263  
Pb-Free (RoHS  
Exempt)  
Level-3-245C-168 HR  
Call TI  
LM2596S  
-ADJ P+  
TO-220  
TO-220  
TO-220  
TO-220  
TO-220  
TBD  
LM2596T  
-12 P+  
LM2596T-12/LF03  
LM2596T-12/NOPB  
LM2596T-3.3  
ACTIVE  
ACTIVE  
NRND  
45  
Green (RoHS  
& no Sb/Br)  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Call TI  
LM2596T  
-12 P+  
45  
Green (RoHS  
& no Sb/Br)  
LM2596T  
-12 P+  
45  
TBD  
LM2596T  
-3.3 P+  
LM2596T-3.3/LF03  
ACTIVE  
45  
Green (RoHS  
& no Sb/Br)  
Level-1-NA-UNLIM  
LM2596T  
-3.3 P+  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Nov-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
LM2596T-3.3/NOPB  
LM2596T-5.0  
ACTIVE  
TO-220  
TO-220  
TO-220  
TO-220  
TO-220  
TO-220  
TO-220  
TO-220  
NDH  
5
5
5
5
5
5
5
5
45  
Green (RoHS  
& no Sb/Br)  
CU SN  
Call TI  
CU SN  
CU SN  
Call TI  
Call TI  
CU SN  
CU SN  
Level-1-NA-UNLIM  
LM2596T  
-3.3 P+  
NRND  
ACTIVE  
ACTIVE  
NRND  
NDH  
NDH  
NDH  
NDH  
NEB  
NEB  
NDH  
45  
45  
45  
45  
45  
45  
45  
TBD  
Call TI  
LM2596T  
-5.0 P+  
LM2596T-5.0/LF03  
LM2596T-5.0/NOPB  
LM2596T-ADJ  
Green (RoHS  
& no Sb/Br)  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Call TI  
LM2596T  
-5.0 P+  
Green (RoHS  
& no Sb/Br)  
LM2596T  
-5.0 P+  
TBD  
-40 to 125  
LM2596T  
-ADJ P+  
LM2596T-ADJ/LB05  
LM2596T-ADJ/LF02  
LM2596T-ADJ/NOPB  
NRND  
TBD  
Call TI  
LM2596T  
-ADJ P+  
ACTIVE  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
LM2596T  
-ADJ P+  
Green (RoHS  
& no Sb/Br)  
-40 to 125  
LM2596T  
-ADJ P+  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Nov-2013  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Sep-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM2596SX-12/NOPB  
LM2596SX-3.3  
DDPAK/  
TO-263  
KTT  
KTT  
KTT  
KTT  
KTT  
KTT  
5
5
5
5
5
5
500  
500  
500  
500  
500  
500  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
24.4  
24.4  
24.4  
24.4  
24.4  
24.4  
10.75 14.85  
10.75 14.85  
10.75 14.85  
10.75 14.85  
10.75 14.85  
10.75 14.85  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
16.0  
16.0  
16.0  
16.0  
16.0  
16.0  
24.0  
24.0  
24.0  
24.0  
24.0  
24.0  
Q2  
Q2  
Q2  
Q2  
Q2  
Q2  
DDPAK/  
TO-263  
LM2596SX-3.3/NOPB  
LM2596SX-5.0/NOPB  
LM2596SX-ADJ  
DDPAK/  
TO-263  
DDPAK/  
TO-263  
DDPAK/  
TO-263  
LM2596SX-ADJ/NOPB DDPAK/  
TO-263  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Sep-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM2596SX-12/NOPB  
LM2596SX-3.3  
DDPAK/TO-263  
DDPAK/TO-263  
DDPAK/TO-263  
DDPAK/TO-263  
DDPAK/TO-263  
DDPAK/TO-263  
KTT  
KTT  
KTT  
KTT  
KTT  
KTT  
5
5
5
5
5
5
500  
500  
500  
500  
500  
500  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
LM2596SX-3.3/NOPB  
LM2596SX-5.0/NOPB  
LM2596SX-ADJ  
LM2596SX-ADJ/NOPB  
Pack Materials-Page 2  
MECHANICAL DATA  
NDH0005D  
www.ti.com  
MECHANICAL DATA  
KTT0005B  
TS5B (Rev D)  
BOTTOM SIDE OF PACKAGE  
www.ti.com  
MECHANICAL DATA  
NEB0005B  
www.ti.com  
MECHANICAL DATA  
NEB0005E  
www.ti.com  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
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complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
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