PGA970QPHPR [TI]
LVDT 传感器信号调理器 | PHP | 48 | -40 to 125;
| 型号： | PGA970QPHPR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LVDT 传感器信号调理器 | PHP | 48 | -40 to 125 传感器 |
| 文件： | 总12页 (文件大小：694K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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PGA970
SLDS257 –APRIL 2019
PGA970 LVDT Sensor Signal Conditioner
Further, the device contains
a
digital signal-
1 Features
demodulation block that interfaces to an integrated
ARM-Cortex M0 MCU, allowing implementation of
custom sensor-compensation algorithms stored in the
device nonvolatile memory. External system
communication is achieved by using any of the SPI,
OWI, GPIO, or PWM digital interfaces. Analog output
1
•
Analog features
–
Programmable-gain analog front end for LVDT
sensors
–
–
Excitation waveform generator and amplifier
Dual 24-bit ADC with amplitude and phase
demodulators
is supported through
a
14-bit DAC and
programmable-gain amplifier offering reference or
absolute-voltage output. Sensing-element excitation
is achieved by the use of an integrated waveform
generator and waveform amplifier. The waveform
signal data is user-defined and stored in a designated
RAM memory area.
–
–
–
–
24-bit auxilary ADC
On-chip internal temperature sensor
14-bit output DAC with programmable gain
Built-in diagnostics
•
Digital features
Besides the primary functional components, the
PGA970 is equipped with additional support circuitry.
The device diagnostics, sensor diagnostics, and
integrated temperature sensor provide protection and
information about the integrity of the overall system
and sensing element. The device also includes a
gate-controller circuit which when used with an
external depletion MOSFET can regulate the device
supply voltage in systems where the supply voltage
exceeds 30 V.
–
–
ARM® Cortex®-M0 microcontroller
16KB ferroelectric RAM (FRAM) program
memory
–
–
–
2KB general-pupose RAM
512B RAM waveform-generator look-up table
8-MHz on-chip oscillator
•
•
Peripheral features
–
–
–
Serial peripheral interface (SPI)
One-wire interface (OWI)
Device Information(1)
ORDER NUMBER
PGA970QPHPR
PGA970QPHPT
PACKAGE
BODY SIZE (NOM)
Ratiometric and absolute voltage output
General features
HTQFP (48)
7.00 mm × 7.00 mm
–
–
–
Operational supply range: 3.5 V to 30 V
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Ambient temperature range: –40°C to +125°C
DMOS gate controller for extended supply
range >30 V
Simplified Diagram
PI
PGA970
Internal
Oscillator
Reference
PE
2 Applications
Power Management
Software and
Data Memory
Waveform
Generator
LVDT
Sensor
P2
P1
•
•
•
•
•
Position sensor signal conditioning
Linear variable differential transformer (LVDT)
Rotational variable differential transformer (RVDT)
Resolver
Wave
Gain
VDD
(3.3 to 30 V)
OWI
S1P
16KB FRAM
2KB RAM
512B RAM
MISO/MOSI
CSN/SCK
SPI
Digital
Demodulation
ADC
PGA
S1N
S2P
S2N
C
o
r
GPIO1
GPIO2
GPIO
e
14-bit
DAC
Gain
Digital
Demodulation
Control and
Status
Registers
OUT
ADC
PGA
RLC measurement
COMP
FBN
AIN1
M
U
X
External
Temperature
Sensor
ADC
PGA
3 Description
Internal
Temperature
Sensor
ARM Cortex M0
(User
Programmable)
Diagnostics
The PGA970 is a highly integrated system-on-chip
LVDT sensor-signal conditioner with advanced signal-
processing capabilities. It contains a three-channel,
low-noise, programmable-gain, analog front end that
allows direct connection to the sense element,
followed by three independent 24-bit delta-sigma
ADCs.
SWDIO
SWDCLK
Debugger
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
PGA970
SLDS257 –APRIL 2019
www.ti.com
4 Device and Documentation Support
4.1 Documentation Support
4.1.1 Related Documentation
For related documentation see the following:
•
•
•
•
Texas Instruments, PGA970 GUI user's guide
Texas Instruments, PGA970 Software Quick Start Guide user's guide
Texas Instruments, PGA970 Software user's guide
Texas Instruments, PGA970EVM user's guide
4.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
4.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
4.4 Trademarks
E2E is a trademark of Texas Instruments.
ARM, Cortex are registered trademarks of ARM Limited.
All other trademarks are the property of their respective owners.
4.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most-
current data available for the designated device. This data is subject to change without notice and without
revision of this document. For browser-based versions of this data sheet, see the left-hand navigation pane.
2
Submit Documentation Feedback
Copyright © 2019, Texas Instruments Incorporated
Product Folder Links: PGA970
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PGA970QPHPR
ACTIVE
HTQFP
PHP
48
1000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
PGA970Q
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Feb-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
PGA970QPHPR
HTQFP
PHP
48
1000
330.0
16.4
9.6
9.6
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Feb-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTQFP PHP 48
SPQ
Length (mm) Width (mm) Height (mm)
350.0 350.0 43.0
PGA970QPHPR
1000
Pack Materials-Page 2
GENERIC PACKAGE VIEW
PHP 48
7 x 7, 0.5 mm pitch
TQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226443/A
www.ti.com
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
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is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
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TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
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