PLCC-28 [TI]
STAR STAR Surface Mount Tape-and-Reel Specification; STAR STAR表面贴装带盘式规格型号: | PLCC-28 |
厂家: | TEXAS INSTRUMENTS |
描述: | STAR STAR Surface Mount Tape-and-Reel Specification |
文件: | 总30页 (文件大小:551K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
STAR
STAR STAR Surface Mount Tape-and-Reel Specification
Literature Number: SNOSBW3A
PRELIMINARY
STARTM Surface Mount
Tape-and-Reel Specification
December 1992
General Description
Tape-and-Reel is a new method for shipment of surface
mount devices. This approach simplifies the handling of
semiconductors for automated circuit board assembly sys-
Y
Y
Y
Fully compatible with National’s surface mount package
types
Variable code density code 39 bar code label for Auto-
mated Inventory Management availability
Mechanical samples of surface mount packages avail-
able in Tape-and-Reel for automated assembly process
development
tems.
A Tape-and-Reel holds hundreds-to-thousands of
surface mount devices (as compared with less than 100
devices in a rail), so that pick-and-place machines have to
be reloaded less frequently. This savings in labor will further
reduce manufacturing costs for automated circuit board as-
sembly.
Y
Single Tape-and-Reel holds hundreds-to-thousands of
surface mount semiconductors for additional labor sav-
ings
Features
Y
Y
Y
Conductive cover Tape-and-Reel availability
Reels individually packed
Conductive PVC material redeuces static charge build-
up
Y
Fully meets proposed EIA standard RS-481A (taping of
surface-mounted components for automatic placing)
Tape-and-Reel Diagram
TL/HH/8352–1
STARTM is a trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation
TL/HH/8352
RRD-B30M115/Printed in U. S. A.
Tape-and-Reel Overview
TAPE FORMAT AND DEVICE ORIENTATION
TL/HH/8352–2
Page
Page
Small Outline Transistor
Small Outline IC (SO-IC)
SOT-23 (High Profile)
3
3
Plastic Chip Carrier IC (PLCC-IC)
PLCC-20
11
12
13
14
15
SOT-23 (Low Profile)
SO-8 (Narrow)
SO-14 (Narrow)
SO-14 (Wide)
PLCC-28
PLCC-44
PLCC-68
PLCC-84
4
5
6
SO-16 (Narrow)
SO-16 (Wide)
7
8
SO-20 (Wide)
9
SO-24 (Wide)
10
MATERIALS
5
Cavity Tape: Conductive PVC (less than 10 X/Sq)
Reel: 1. Solid 80 pt. Fibreboard (standard)
2. Conductive Fibreboard available
3. Conductive Plastic (PVC) available
#
#
#
Cover Tape: Polyester
1. Conductive Cover available
LABEL
Human and machine readable label is provided on reel. A variable (C.P.I.) density code 39 is available. NSC STD Label (7.6
C.P.I.).
Field
Lot Number
Date Code
Example:
Revision Level
National Part No. I.D.
Quantity
Fields are separated by at least one blank space.
Future Tape-and-Reel packs will also include a smaller-size
bar code label (high-density code 39) at the beginning of the
tape. (This tape label is not available on current production.)
TL/HH/8352–3
National Semiconductor will also offer additional labels containing information per your specific specification.
2
SOT-23 (High Profile), SOT-23 (Low Profile)
TAPE FORMAT
Ý
Tape Section
Cavities
5 (min)
Cavity Status
Empty
Cover Tape Status
Unsealed
Sealed
Leader
(Start End)
5 (min)
Empty
²
Carrier
*2500 (High)
Filled
Sealed
Directionu
of
²
*3000 (Low)
2 (min)
Filled
Sealed
Feed
Trailer
Empty
Sealed
(Hub End)
2 (min)
Empty
Unsealed
*These quantities represent 7 Reel Quantity availability.
×
²
10,000 For 13 Reel.
×
TAPE DIMENSIONS
TL/HH/8352–4
REEL DIMENSIONS
TL/HH/8352–5
3
SO-8 (Narrow)
TAPE FORMAT
Ý
Tape Section
Cavities
5 (min)
5 (min)
2500
Cavity Status
Empty
Cover Tape Status
Unsealed
Sealed
Leader
(Start End)
Empty
Directionu
of
Carrier
Filled
Sealed
Feed
Trailer
2 (min)
2 (min)
Empty
Sealed
(Hub End)
Empty
Unsealed
TAPE DIMENSIONS
TL/HH/8352–6
REEL DIMENSIONS
TL/HH/8352–7
4
SO-14 (Narrow)
TAPE FORMAT
Ý
Tape Section
Cavities
5 (min)
5 (min)
2500
Cavity Status
Empty
Cover Tape Status
Unsealed
Sealed
Leader
(Start End)
Empty
Directionu
of
Carrier
Filled
Sealed
Feed
Trailer
2 (min)
2 (min)
Empty
Sealed
(Hub End)
Empty
Unsealed
TAPE DIMENSIONS
TL/HH/8352–8
REEL DIMENSIONS
TL/HH/8352–9
5
SO-14 (Wide)
TAPE FORMAT
Ý
Tape Section
Cavities
5 (min)
5 (min)
1000
Cavity Status
Empty
Cover Tape Status
Unsealed
Sealed
Leader
(Start End)
Empty
Directionu
of
Carrier
Filled
Sealed
Feed
Trailer
2 (min)
2 (min)
Empty
Sealed
(Hub End)
Empty
Unsealed
TAPE DIMENSIONS
TL/HH/8352–10
REEL DIMENSIONS
TL/HH/8352–11
6
SO-16 (Narrow)
TAPE FORMAT
Ý
Tape Section
Cavities
5 (min)
5 (min)
2500
Cavity Status
Empty
Cover Tape Status
Unsealed
Sealed
Leader
(Start End)
Empty
Directionu
of
Carrier
Filled
Sealed
Feed
Trailer
2 (min)
2 (min)
Empty
Sealed
(Hub End)
Empty
Unsealed
TAPE DIMENSIONS
TL/HH/8352–12
REEL DIMENSIONS
TL/HH/8352–13
7
SO-16 (Wide)
TAPE FORMAT
Ý
Tape Section
Cavities
5 (min)
5 (min)
1000
Cavity Status
Empty
Cover Tape Status
Unsealed
Sealed
Leader
(Start End)
Empty
Directionu
of
Carrier
Filled
Sealed
Feed
Trailer
2 (min)
2 (min)
Empty
Sealed
(Hub End)
Empty
Unsealed
TAPE DIMENSIONS
TL/HH/8352–14
REEL DIMENSIONS
TL/HH/8352–15
8
SO-20 (Wide)
TAPE FORMAT
Ý
Tape Section
Cavities
5 (min)
5 (min)
1000
Cavity Status
Empty
Cover Tape Status
Unsealed
Sealed
Leader
(Start End)
Empty
Directionu
of
Carrier
Filled
Sealed
Feed
Trailer
2 (min)
2 (min)
Empty
Sealed
(Hub End)
Empty
Unsealed
TAPE DIMENSIONS
TL/HH/8352–16
REEL DIMENSIONS
TL/HH/8352–17
9
SO-24 (Wide)
TAPE FORMAT
Ý
Tape Section
Cavities
5 (min)
5 (min)
1000
Cavity Status
Empty
Cover Tape Status
Unsealed
Sealed
Leader
(Start End)
Empty
Directionu
of
Carrier
Filled
Sealed
Feed
Trailer
2 (min)
2 (min)
Empty
Sealed
(Hub End)
Empty
Unsealed
TAPE DIMENSIONS
TL/HH/8352–18
REEL DIMENSIONS
TL/HH/8352–19
10
PLCC-20
TAPE FORMAT
Ý
Tape Section
Cavities
5 (min)
5 (min)
1000
Cavity Status
Empty
Cover Tape Status
Unsealed
Sealed
Leader
(Start End)
Empty
Directionu
of
Carrier
Filled
Sealed
Feed
Trailer
2 (min)
2 (min)
Empty
Sealed
(Hub End)
Empty
Unsealed
TAPE DIMENSIONS
TL/HH/8352–20
REEL DIMENSIONS
TL/HH/8352–21
11
PLCC-28
TAPE FORMAT
Ý
Tape Section
Cavities
5 (min)
5 (min)
750
Cavity Status
Empty
Cover Tape Status
Unsealed
Sealed
Leader
(Start End)
Empty
Directionu
of
Carrier
Filled
Sealed
Feed
Trailer
2 (min)
2 (min)
Empty
Sealed
(Hub End)
Empty
Unsealed
TAPE DIMENSIONS
TL/HH/8352–22
REEL DIMENSIONS
TL/HH/8352–23
12
PLCC-44
Ý
Tape Section
Cavities
5 (min)
5 (min)
500
Cavity Status
Empty
Cover Tape Status
Unsealed
Sealed
Leader
(Start End)
Empty
Directionu
of
Carrier
Filled
Sealed
Feed
Trailer
2 (min)
2 (min)
Empty
Sealed
(Hub End)
Empty
Unsealed
TAPE DIMENSIONS
TL/HH/8352–24
REEL DIMENSIONS
TL/HH/8352–25
13
PLCC-68
TAPE FORMAT
Ý
Tape Section
Cavities
5 (min)
5 (min)
250
Cavity Status
Empty
Cover Tape Status
Unsealed
Sealed
Leader
(Start End)
Empty
Directionu
of
Carrier
Filled
Sealed
Feed
Trailer
2 (min)
2 (min)
Empty
Sealed
(Hub End)
Empty
Unsealed
TAPE DIMENSIONS
TL/HH/8352–26
REEL DIMENSIONS
TL/HH/8352–27
14
PLCC-84
TAPE FORMAT
Ý
Tape Section
Cavities
5 (min)
5 (min)
250
Cavity Status
Empty
Cover Tape Status
Unsealed
Sealed
Leader
(Start End)
Empty
Directionu
of
Carrier
Filled
Sealed
Feed
Trailer
2 (min)
2 (min)
Empty
Sealed
(Hub End)
Empty
Unsealed
TAPE DIMENSIONS
TL/HH/8352–28
REEL DIMENSIONS
TL/HH/8352–29
15
ApplicationÐTotal System Saving
TL/HH/8352–32
Cost pressures today are forcing many electronics manu-
facturers to automate their production lines. Surface mount
technology plays a key role in this cost-savings trend be-
cause:
Automated manufacturers can improve their cost savings by
using Tape-and-Reel for surface mount devices. Simplified
handling results because hundreds-to-thousands of semi-
conductors are carried on a single Tape-and-Reel pack (see
the ‘‘Ordering Information’’ section for the exact quantities).
With this higher device count per reel (when compared with
less than 100 devices per rail), pick-and-place machines
have to be re-loaded less frequently and lower labor costs
result.
1. The mounting of devices on the PC board surface elimi-
nates the expense of drilling holes;
2. The use of pick-and-place machines to assemble the PC
boards greatly reduces labor costs;
3. The lighter and more compact assembled products re-
sulting from the smaller dimensions of surface mount
packages mean lower material costs.
With Tape-and-Reel, manufacturers save twiceÐonce from
using surface mount technology for automated PC board
assembly and again from less device handling during ship-
ment and machine set-up.
Production processes now permit both surface mount and
insertion mount components to be assembled on the same
PC board.
16
Ordering Information
When you order a surface mount semiconductor, it will be in
one of the 15 available surface mount package types (see
Appendix II for the physical dimensions of the surface
mount packages). Specifying the Tape-and-Reel method of
shipment (Note 1) means that you will receive your devices
in the following quantities per Tape-and-Reel pack:
Device Quantity
Small Outline Transistor
Small Outline IC
SOT-23 (High Profile) (Note 2)
10000
10000
2500*
3000*
SOT-23 (Low Profile) (Note 2)
SO-8 (Narrow)
SO-14 (Narrow)
SO-14 (Wide)
SO-16 (Narrow)
SO-16 (Wide)
SO-20 (Wide)
SO-24 (Wide)
PLCC-20
2500
2500
1000
2500
1000
1000
1000
1000
750
Plastic Chip Carrier IC
PLCC-28
PLCC-44
500
PLCC-68
250
PLCC-84
250
*This denotes 7 reel quantity availability.
×
Note 1: For small outline transistors, your order will automatically be shipped in Tape-and-Reel unless you indicate otherwise. For surface mount integrated circuits,
your order will automatically be shipped in conductive rails unless you indicate ‘‘Tape-and-Reel’’ after the device description on your purchase order.
Note 2: Your SOT-23 devices will automatically have Option 1 orientation unless you indicate ‘‘Option 2 Orientation’’ after the device description on your purchase
order (see ‘‘Tape-and-Reel Overview’’ for definition of SOT-23 orientations). In addition, your SOT-23 devices will automatically have the high-profile outline unless
you indicate ‘‘Low-Profile Outline’’ after the device description on your purchase order (see ‘‘Appendix IIÐPhysical Dimensions of Surface Mount Package’’ for
definition of SOT-23 outlines).
Example: You order 5,000 LM324M ICs shipped in Tape-
and-Reel.
All 5,000 devices have the same date code
#
You receive 2 SO-14 (Narrow) Tape-and-Reel packs,
each having 2500 LM324M ICs
#
17
Appendix IÐShort-Form Procurement Specification
TAPE FORMAT
x
Direction of Feed
Trailer (Hub End)
Carrier
Leader (Start End)
Empty Cavities,
min
Empty Cavities,
min
Empty Cavities,
Empty Cavities,
min
Filled Cavities
(Sealed
min
(Unsealed
Cover Tape)
(Sealed
Sealed
(Unsealed
Cover Tape)
Cover Tape)
Cover Tape)
Cover Tape)
SMALL OUTLINE TRANSISTOR
SOT-23
2
2
2
2
10000
10000
2500*
3000*
5
5
5
5
(High Profile)
SOT-23
(Low Profile)
SMALL OUTLINE IC
SO-8 (Narrow)
SO-14 (Narrow)
SO-14 (Wide)
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2500
2500
1000
2500
1000
1000
1000
5
5
5
5
5
5
5
5
5
5
5
5
5
5
SO-16 (Narrow)
SO-16 (Wide)
SO-20 (Wide)
SO-24 (Wide)
PLASTIC CHIP CARRIER IC
PLCC-20
PLCC-28
PLCC-44
PLCC-68
PLCC-84
2
2
2
2
2
2
1000
750
500
250
250
5
5
5
5
5
5
5
5
5
5
2
2
2
2
*This denotes 7 reel quantity availability.
×
18
Appendix IÐShort-Form Procurement Specification (Continued)
TAPE DIMENSIONS (24 Millimeter Tape or Less)
TL/HH/8352–33
W
P
F
E
P
2
P
0
D
T
A
0
B
0
K
D
1
R
0
SMALL OUTLINE TRANSISTOR
SOT-23
(High Profile)
g
g
g
g
g
g
g
g
g
g
.30 4.0 .10 3.5 .05 1.75 .10 2.0 .05 4.0 .10 1.55 .05 .30 .10 3.15 .05 2.55 .05 1.20 .05 1.05 .05 25
g
g
g
8
8
SOT-23
(Low Profile)
g
g
g
g
g
g
g
g
.30 4.0 .10 3.5 .05 1.75 .10 2.0 .05 4.0 .10 1.55 .05 .30 .10 3.15 .05 2.55 .05 1.20 .05 1.05 .05 25
g
g
g
SMALL OUTLINE IC
SO-8
(Narrow)
g
g
g
g
g
g
g
g
g
12 .30 8.0 .10 5.5 .05 1.75 .10 2.0 .05 4.0 .10 1.55 .05 .30 .10 6.4 .10 5.2 .10 2.1 .10 1.55 .05 30
g
g
g
SO-14
(Narrow)
g
g
g
g
g
g
g
g
g
16 .30 8.0 .10 7.5 .10 1.75 .10 2.0 .05 4.0 .10 1.55 .05 .30 .10 6.5 .10 9.0 .10 2.1 .10 1.55 .05 40
g
g
g
g
g
g
g
g
g
g
g
g
SO-14 (Wide) 16 .30 12.0 .10 7.5 .10 1.75 .10 2.0 .05 4.0 .10 1.55 .05 .30 .10 10.9 .10 9.5 .10 3.0 .10 1.55 .05 40
g
g
g
SO-16
(Narrow)
SO-16 (Wide) 16 .30 12.0 .10 5.5 .10 1.75 .10 2.0 .05 4.0 .10 1.55 .05 .30 .10 10.9 .10 10.76 .10 3.0 .10 1.55 .05 40
g
g
g
g
g
g
g
g
g
16 .30 8.0 .10 7.5 .10 1.75 .10 2.0 .05 4.0 .10 1.55 .05 .30 .10 6.5 .10 10.3 .10 2.1 .10 1.55 .05 40
g
g
g
g
g
g
g
g
g
g
g
g
g
g
g
g
g
g
g
g
g
g
g
g
SO-20 (Wide) 24 .30 12.0 .10 11.5 .10 1.75 .10 2.0 .05 4.0 .10 1.55 .05 .30 .10 10.9 .10 13.3 .10 3.0 .10 2.05 .05 50
g
g
g
g
g
g
g
g
g
g
g
g
SO-24 (Wide) 24 .30 12.0 .10 11.5 .10 1.75 .10 2.0 .05 4.0 .10 1.55 .05 .30 .10 10.9 .10 15.85 .10 3.0 .10 2.05 .05 50
g
g
g
PLASTIC CHIP CARRIER IC
g g g g g g g g g g g g
16 .30 12.0 .10 7.5 .10 1.75 .10 2.0 .05 4.0 .10 1.55 .05 .30 .10 9.3 .10 9.3 .10 4.9 .10 1.55 .05 40
PLCC-20
PLCC-28
g
g
g
g
g
g
g
g
g
24 .30 16.0 .10 11.5 .10 1.75 .10 2.0 .05 4.0 .10 1.55 .05 .30 .10 13.0 .10 13.0 .10 4.9 .10 2.05 .05 50
g
g
g
Note 1: A , B and K dimensions are measured 0.3 mm above the inside wall of the cavity bottom.
0
0
0
Note 2: Tape with components shall pass around a mandril radius R without damage.
5
Note 3: Cavity tape material shall be PVC conductive (less than 10 X/Sq).
Note 4: Cover tape material shall be polyester (30–65 grams peel-back force).
Note 5: D Dimension is centered within cavity.
1
Note 6: All dimensions are in millimeters.
19
Appendix IÐShort-Form Procurement Specification (Continued)
TAPE DIMENSIONS (32 Millimeter Tape or Greater)
TL/HH/8352–34
W
P
F
2
E
P
2
P
0
D
T
A
0
B
0
K
0
D
1
R
PLASTIC CHIP CARRIER IC
g
g
g
g
g
g
g
g
g
PLCC-44 32 .3 24.0 .1 14.25 .1 1.75 .1 2.0 .05 4.0 .1 1.55 .05 .30 .1 18.0 .1 18.0 .1 5.0 .1 2.05 .05 50
g
g
g
g
g
g
g
g
g
g
g
g
PLCC-68 44.3 .3 32.0 .1 20.25 .1 1.75 .1 2.0 .05 4.0 .1 1.55 .05 .30 .1 25.6 .1 25.6 .1 5.0 .1 2.05 .05 50
g
g
g
g
g
g
g
g
g
g
g
g
PLCC-84 44.3 .3 36.0 .1 20.25 .1 1.75 .1 2.0 .05 4.0 .1 1.55 .05 .30 .1 30.7 .1 30.7 .1 5.0 .1 2.05 .05 50
g
g
g
Note 1: A , B and K dimensions are measured 0.3 mm above the inside wall of the cavity bottom.
0
0
0
Note 2: Tape with components shall pass around a mandril radius R without damage.
5
Note 3: Cavity tape material shall be PVC conductive (less than 10 X/Sq).
Note 4: Cover tape material shall be polyester (30–65 grams peel-back force).
Note 5: D Dimension is centered within cavity.
1
Note 6: All dimensions are in millimeters.
20
Appendix IÐShort-Form Procurement Specification (Continued)
REEL DIMENSIONS
TL/HH/8352–35
A (Max)
B (Min)
C
D (Min)
N (Min)
G
T (Max)
8 mm Tape
SOT-23
0.059
g
0.512 0.002
(13.00)
(330)
0.059
1.5
0.795
20.2
1.969
50
0.331a
8.4ba
0.567
14.4
(High Profile)
SOT-23
b
0.000
1.5
0
g
13 0.05
(Low Profile)
0.078
0.000
2
g
0.512 0.002
(13.00)
(330)
0.059
1.5
0.795
20.2
1.969
50
0.488a
12.4ba
0.724
18.4
12 mm Tape
16 mm Tape
SO-8 (Narrow)
b
g
13 0.05
0
SO-14 (Narrow)
SO-14 (Wide)
SO-16 (Narrow)
SO-16 (Wide)
PLCC-20
0.078
0.000
2
g
0.512 0.002
(13.00)
(330)
0.059
1.5
0.795
20.2
1.969
50
0.646a
0.882
22.4
b
16.4ba
g
13 0.05
0
24 mm Tape
SO-20 (Wide)
SO-24 (Wide)
PLCC-28
0.078
0.000
2
g
0.512 0.002
(13.00)
(330)
0.059
1.5
0.795
20.2
1.969
50
0.960a
24.4ba
1.197
30.4
b
g
13 0.05
0
0.078
0.000
2
g
0.512 0.002
(13.00)
(330)
0.059
1.5
0.795
20.2
1.969
50
1.276a
32.4ba
1.512
38.4
32 mm Tape
44 mm Tape
PLCC-44
b
g
13 0.05
0
0.078
0.000
2
g
0.512 0.002
(13.00)
(330)
0.059
1.5
0.795
20.2
1.969
50
1.748a
1.984
50.4
PLCC-68
PLCC-84
b
44.4ba
g
13 0.05
0
Inches
Units:
Millimeters
Material: Paperboard (Non-Flaking)
21
Appendix IIÐPhysical Dimensions of Surface Mount Packages
SOT-23 (High Profile)
(Generally used for Top-of-Board Mounting)
SOT-23 (Low Profile)
(Generally used for Underside-of-Board Mounting)
22
Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued)
SO-8 (Narrow)
SO-14 (Narrow)
23
Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued)
SO-14 (Wide)
SO-16 (Narrow)
24
Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued)
SO-16 (Wide)
SO-20 (Wide)
25
Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued)
SO-24 (Wide)
PLCC-20
26
Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued)
PLCC-28
PLCC-44
27
Appendix IIÐPhysical Dimensions of Surface Mount Packages (Continued)
PLCC-68
PLCC-84
Ý
Lit. 113635
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
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