PT6305U [TI]

1-OUTPUT DC-DC REG PWR SUPPLY MODULE;


型号：	PT6305U
厂家：	TEXAS INSTRUMENTS
描述：	1-OUTPUT DC-DC REG PWR SUPPLY MODULE 输出元件
文件：	总6页 (文件大小：339K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

For assistance or to order, call (800) 531-5782

P T 6 3 0 5 S e r i e s

3 AMP HIGH-PERFORMANCE

ADJUSTABLE ISR

• Single-Device 5V to 3V Power

• 85% Efficiency

Amp, 12-Pin SIP (Single In-line-

Package) Integrated Switching

• Small SIP Footprint:

0.36" x 2.00” x 0.60"(H)

• Wide Input Voltage Range:

+4.5V to +9.0V

• Internal Short Circuit Protection

• Over-Temperature Protection

Regulator (ISR). This high-perfor-

mance ISR allows easy integration of

low-power 3.3V logic IC’s into existing

5V systems without redesigning the

central power supply. Only one external

capacitor is required for proper

operation. The PT6306,7,8 can be used

to power high-speed data buses (+2.1V),

or the new GTL (+1.2V) logic buses.

The PT6305N is Power Trends’

new high performance +5V to +3.3V, 3

Pin-Out Information

Ordering Information

PT6305■ = +3.3 Volts

PT6306■ = +1.8 Volts

PT6307■ = +2.1 Volts

Pin No. Function

N/C

GND

Standard Application

GND

VO Adjust

out

PT6308■ = +1.2 Volts

2,3,4

9,10,11

VIN

(+)

V^OUT

(+)

out

(For dimensions, see page 66.)

PT6305,6,7,8

GND

out

Adjust

(See page 40.)

PT Series Suffix

(PT1234X)

5,6,7,8

Case/Pin

Heat Tab Configuration

Configuration

None

Side

COM

Vertical Through-Hole

Horizontal Through-Hole

Horizontal Surface Mount

C₁= Optional electrolytic (100µF)

C₂= Required 100µF electrolytic (No tantalum)

See capacitor application note on page 43.

(See Thermal Application Notes on page 44 for heat tab

application data.)

Specifications

PT6305 SERIES

Characteristics

(T=25˚C unless noted)

Symbols

I_o

Conditions

Min

0.3

—

Typ

—

Max

3.0**

5.0

Units

ADC

Apk

Output Current

4.5 ≤ V_in≤ V_inMAX

V_in= +5V

Current Limit

I_cl

3.6

5.0

Short Circuit Current

Input Voltage Range

I_sc

V_in= +5V

—

V_in

0.3A ≤ I_o≤ 3.0A

PT6305N

PT6306N

PT6307N

PT6308N

4.5

—

VDC

6.0

Static Voltage Tolerance

V_o

V_in= +5V, I_o= 3.0A PT6305N

3.2

1.7

2.0

1.1

3.3

1.8

2.1

1.2

3.4

1.9

2.2

1.3

VDC

0°C ≤ T_a≤ +70°C

PT6306N

PT6307N

PT6308N

Line Regulation

Reg_line

Reg_load

V_n

4.5V ≤ V_in≤ 5.5V, I_o= 3.0A

V_in= +5V, 0.3 ≤ I_o≤ 3.0A

V_in= 5V, I_o= 3.0A

—

±25

±50

—

Load Regulation

V_oRipple/Noise pk-pk

Transient Response

with C₂= 100µF

t_tr

I_ostep between 1.5A and 3.0A

V_oover/undershoot

—

200

—

µSec

V_os

Efficiency

V_in= +5V, I_o= 1.5A PT6305N

PT6306N

—

PT6307N

PT6308N

V_in= +5V, I_o= 3.0A PT6305N

PT6306N

—

PT6307N

PT6308N

Switching Frequency

ƒ_o

4.5 ≤ V_in≤ V_inMAX

0.3A ≤ I_o≤ 3.0A

500

650

—

800

KHz

°C

Operating Temperature

T_a

Free Air Convection (40-60 LFM)

Over V_{in and}I_oRanges

+70*

Thermal Resistance

Storage Temperature

Mechanical Shock

θ_ja

T_s

Free Air Convection (40-60 LFM)

—

°C/W

°C

-40

+125

Per Mil-STD-883D, Method 2002.3 Condition A, 1 msec, Half Sine,

mounted to a fixture

—

500

G’s

Mechanical Vibration

Weight

Per Mil-STD-883D, Method 2007.2 Condition A, 20-2000 Hz

—

G’s

—

11.2

—

grams

Relative Humidity

Non-condensing

*See Thermal Derating chart. **The PT6305 Series can be easily paralleled to provide output current in multiples of 3 amps. Please contact a Power Trends’ Application Engineer for the

appropriate application note. Note: The PT6305 Series requires a 100µF electrolytic capacitor for proper operation in all applications.

Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902

For assistance or to order, call (800) 531-5782

C H A R A C T E R I S T I C

D A T A

PT6305, 3.3 VDC

PT6307, 2.1 VDC

PT6308, 1.2 VDC

(See Note 1)

Efficiency vs Output Current

100

Efficiency vs Output Current

100

Vin

4.5V

Vin

4.5V

Vin

4.5V

5.0V

5.5V

6.0V

5.0V

5.5V

8.0V

9.0V

5.0V

5.5V

8.0V

9.0V

0.5

1.5

2.5

0.5

1.5

2.5

0.5

1.5

2.5

Iout-(Amps)

Ripple vs Output Current

100

Vin

6.0V

9.0V

8.0V

5.5V

5.0V

4.5V

9.0V

8.0V

5.5V

5.0V

4.5V

5.5V

5.0V

4.5V

0.5

1.5

2.5

0.5

1.5

2.5

0.5

1.5

2.5

Iout-(Amps)

Minimum Input Voltage

4.5

(See Note 2)

Minimum Input Voltage

4.5

(See Note 2)

Minimum Input Voltage

(See Note 2)

4.5

4.25

4.3

4.1

3.9

3.7

3.5

4.25

3.75

3.5

3.75

3.5

0.5

1.5

Iout-(Amps)

2.5

0.5

1.5

2.5

0.5

1.5

2.5

Iout-(Amps)

Thermal Derating (T_a)

(See Note 3)

Thermal Derating (T_a)

(See Note 3)

Thermal Derating (T_a)

(See Note 3)

85°C

70°C

2.5

90°C

2.5

85°C

90°C

95°C

1.5

95°C

0.5

4.5

6.5

8.5

10.5

4.5

6.5

8.5

10.5

4.5

5.5

Vin-(Volts)

Power Dissipation vs Output Current

2.5

Vin

9.0V

Vin

6.0V

9.0V

8.0V

5.5V

5.0V

4.5V

8.0V

5.5V

5.0V

4.5V

5.5V

5.0V

4.5V

1.5

0.5

1.5

2.5

0.5

1.5

2.5

0.5

1.5

2.5

Iout-(Amps)

Note 1: All data listed in the above graphs, except for derating data, has been developed from actual products tested at 25°C. This data is considered typical data for the ISR.

Note 2: Minimum V_indata is typical and is not guaranteed. The data corresponds to a 2% output voltage drop.

Note 3: Thermal derating graphs are developed in free air convection cooling of 40-60 LFM with no optional heat tab soldered in a printed circuit board. (See Thermal Application Notes).

Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902

For assistance or to order, call (800) 531-5782

Product families using

this package style:

PT6400

PT5060

Package Style

300

Suffix A, C, D, E, N, P

Revised 2/11/2000

PACKAGE INFORMATION AND DIMENSIONS

Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.ti.com/powertrends

PACKAGE OPTION ADDENDUM

www.ti.com

25-Jul-2013

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

PT6305B

PT6305C

PT6305N

PT6306A

PT6306B

PT6306C

PT6306G

PT6306R

PT6308A

LIFEBUY SIP MODULE

ECK

TBD

Call TI

Level-1-215C-UNLIM

Call TI

ECC

ECD

ECA

0 to 70

ECK

Call TI

ECC

ECG

ECE

Call TI

ECA

Level-1-215C-UNLIM

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

25-Jul-2013

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products

Applications

Audio

www.ti.com/audio

amplifier.ti.com

dataconverter.ti.com

www.dlp.com

Automotive and Transportation www.ti.com/automotive

Communications and Telecom www.ti.com/communications

Amplifiers

Data Converters

DLP® Products

DSP

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

www.ti.com/computers

www.ti.com/consumer-apps

www.ti.com/energy

dsp.ti.com

Clocks and Timers

Interface

www.ti.com/clocks

interface.ti.com

logic.ti.com

www.ti.com/industrial

www.ti.com/medical

Medical

Logic

Security

www.ti.com/security

Power Mgmt

Microcontrollers

RFID

power.ti.com

Space, Avionics and Defense

Video and Imaging

www.ti.com/space-avionics-defense

www.ti.com/video

microcontroller.ti.com

www.ti-rfid.com

www.ti.com/omap

OMAP Applications Processors

Wireless Connectivity

TI E2E Community

e2e.ti.com

www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

PT6305U [TI]

相关型号：

PT6305_14

PT6306

PT6306

PT6306-H

PT6306A

PT6306B

PT6306C

PT6306G

PT6306J

PT6306N

PT6306R

PT6306U