PT7746C [TI]

1-OUTPUT DC-DC BOOSTER MODULE, HORIZONTAL SMT, SIP-27;
PT7746C
型号: PT7746C
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

1-OUTPUT DC-DC BOOSTER MODULE, HORIZONTAL SMT, SIP-27

输出元件
文件: 总3页 (文件大小:393K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PT7746—5V/3.3V  
32 Amp “Current Booster” for  
PT7770 Series Regulators  
SLTS049A  
(Revised 6/30/2000)  
The PT7746 is a high-output 32 Amp  
“Current Booster” for the PT7770 series  
housed in a 27-pin SIP package.  
regulator. As such, the system runs in per-  
fect sychronization providing a low noise  
solution.  
Multiple PT7746 boosters will operate  
in parallel with any of the PT7770 series  
products, boosting output current in incre-  
ments of 32A. Combinations of a PT7770  
series regulator and PT7746 current boost-  
ers can supply enough power for virtually  
any multiple mega-processor application.  
A PT7746 current booster adds a paral-  
lel output stage that is driven from the  
The PT7746 only operates in combina-  
tion with a PT7770 series regulator and is  
not a stand-alone product. Please refer to  
the PT7771, PT7772, or PT7777 series  
data sheet for performance specifications.  
The PT7746 has the same mechanical  
outline and package options as the PT7770  
series.  
Pin-Out Information  
Ordering Information  
PT7746  
Pin Function  
Pin Function  
14 GND  
15 GND  
16 GND  
17 GND  
18 GND  
19 GND  
20 Vout  
1
2
3
4
5
6
7
8
9
Do not connect  
(For dimensions and PC Board layout, see  
Package Styles 1020 and 1030.)  
Features  
Do not connect  
Do not connect  
Do not connect  
Do not connect  
Do not connect  
Vin  
32A Current Boost  
Tracks Vo of a PT7770  
High Efficiency  
Input Voltage Range:  
3V to 5.5V  
PT Series Suffix  
(PT1234X)  
Case/Pin  
Configuration  
Synchronized with PT7770  
27-pin SIP Package  
Run up to 2 in Parallel -  
96 Amps  
Vin  
21 Vout  
Vertical Through-Hole  
N
A
C
Vin  
22 Vout  
Horizontal Through-Hole  
Horizontal Surface Mount  
10 Vin  
23 Vout  
11 Vin  
24 Vout  
12 Do not connect  
13 GND  
25 Vout  
26 Do not connect  
27 Master Sync In  
Standard Application  
PROGRAMMING PINS  
VID0  
VID1  
VID2  
VID3  
VID4  
REMOTE SENSE (+)  
6
4
3
2
1
26  
L1  
VIN  
VOUT  
7 - 11  
20 - 25  
PT7770  
1 H  
27  
13 - 19  
5
12  
+
+
CIN  
COUT  
LOAD  
STBY*  
GND  
GND  
REMOTE SENSE (-)  
When used with PT7771/7772:  
27  
C
C
L1  
= Required 2400µF electrolytic  
= Required 2400µF electrolytic  
= Optional 1µH input choke  
in  
out  
L1  
7 - 11  
20 - 25  
PT7746  
1 H  
13 - 19  
When used with PT7777:  
+
+
CIN  
COUT  
C
= Required 2400µF electrolytic  
= Required 680µF electrolytic  
= Optional 1µH input choke  
in  
C
L1  
out  
Output Capacitors: When used with a PT7771 or PT7772, the PT7746 requires a minimum ouput capacitance of 2400µF. When used with a PT7777, the  
PT7746 requires a minimum ouput capacitance of 680µF for proper operation. Do not use Oscon type capacitors. The maximum allowable output capacitance is  
30,000µF.  
Input Filter: An input filter is optional for most applications. The input inductor must be sized to handle 32ADC with a typical value of 1µH. The input capacitance  
must be rated for a minimum of 2.6Arms of ripple current. For transient or dynamic load applications, additional capacitance may be required.  
For technical support and more information, see inside back cover or visit www.ti.com/powertrends  
PACKAGE OPTION ADDENDUM  
www.ti.com  
20-Aug-2011  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
PT7746C  
PT7746N  
NRND  
NRND  
SIP MODULE  
SIP MODULE  
EJC  
EJD  
27  
27  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
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Addendum-Page 1  
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