PT78ST107 [TI]
Very Small Footprint;型号: | PT78ST107 |
厂家: | TEXAS INSTRUMENTS |
描述: | Very Small Footprint |
文件: | 总4页 (文件大小:148K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PT78ST100 Series
1.5 Amp Positive Step-Down
Integrated Switching Regulator
SLTS059A
(Revised 6/30/2000)
•
•
•
•
•
•
•
Very Small Footprint
These ISRs have a maximum output current
of 1.5 Amps and an output voltage that is laser
trimmed to a variety of industry standard volt-
ages.
These 78 series regulators have excel-
lent line and load regulation with internal
short- circuit and over-temperature protec-
tion, and are offered in a variety of standard
output voltages. These ISRs are very flex-
ible and may be used in a wide variety of
applications.
High Efficiency > 85%
Self-Contained Inductor
Internal Short-Circuit Protection
Over-Temperature Protection
Fast Transient Response
Wide Input Range
The PT78ST100 is a series of wide-
input range, 3-terminal regulators.
Pin-Out Information
Ordering Information
PT78ST1
XX Y
Pin Function
1
2
3
Vin
Output Voltage
Package Suffix
GND
Vout
Standard Application
33 = 3.3 Volts
36 = 3.6 Volts
05 = 5.0 Volts
51 = 5.1 Volts
53 = 5.25 Volts
06 = 6.0 Volts
65 = 6.5 Volts
07 = 7.0 Volts
08 = 8.0 Volts
09 = 9.0 Volts
10 = 10.0 Volts
12 = 12.0 Volts
14 = 13.9 Volts
15 = 15.0 Volts
V = Vertical Mount
S = Surface Mount
H = Horizontal
Mount
Vin
Vout
1
3
PT78ST100
2
+
C1
COM
C2
COM
C1 = Optional 1µF ceramic
C2 = Required 100µF electrolytic
Pkg Style 500
Specifications
PT78ST100 SERIES
Characteristics
(Ta = 25°C unless noted)
Symbols
Io
Conditions
Min
0.1*
—
Typ
—
Max
Units
A
Output Current
Over Vin range
Vin = Vin min
0.1 ≤ Io ≤ 1.5A
1.5
—
Short Circuit Current
Input Voltage Range
Isc
3.5
Apk
Vin
Vo= 3.3V
Vo= 5V
9
—
—
—
26
38
38
V
V
V
9
Vo= 12V
16
Output Voltage Tolerance
∆Vo
Over Vin range, Io=1.5A
Ta = 0°C to +60°C
—
1.0
2.0
%V
o
Line Regulation
Load Regulation
Vo Ripple/Noise
Regline
Regload
Vn
Over Vin range
—
—
—
0.2
0.1
0.4
0.2
%V
%V
o
0.1 ≤ Io ≤ 1.5A
o
Vin= 9V, Io= 1.5A
Vin= 16V, Io= 1.5A
Vo= 5V
Vo= 12V
65
90
—
mVpp
mVpp
Transient Response
(with 100µF output cap)
ttr
50% load change
Vo over/undershoot
—
—
100
5
—
—
µSec
%V
o
Efficiency
η
Vin= 10V, Io= 1A
Vin= 10V, Io= 1A
Vin= 17V, Io= 1A
Vo= 3.3V
Vo= 5V
—
—
—
80
85
90
—
—
—
%
%
%
Vo= 12V
Switching Frequency
ƒo
Over Vin range, Io=1.5A
—
600
650
700
kHz
Absolute Maximum
Operating Temperature Range
Ta
-40
—
+85
°C
Recommended Operating
Temperature Range
Ta
Free Air Convection, (40-60LFM)
At Vin= 24V, Io=1.0A
-40
—
+80**
°C
Thermal Resistance
Storage Temperature
Mechanical Shock
θja
Ts
—
—
Free Air Convection, (40-60LFM)
—
—
45
—
°C/W
°C
-40
—
—
+125
—
Per Mil-STD-883D, Method 2002.3
500
G’s
Mechanical Vibration
Per Mil-STD-883D, Method 2007.2,
20-2000 Hz, soldered in a PC board
—
—
—
5
G’s
Weight
—
—
6.5
—
grams
*ISR will operate down to no load with reduced specifications.
**See Thermal Derating chart.
Note: The PT78ST100 Series requires a 100µF electrolytic or tantalum output capacitor for proper operation in all applications.
For technical support and more information, see inside back cover or visit www.ti.com/powertrends
Typical Characteristics
PT78ST100 Series
1.5 Amp Positive Step-Down
Integrated Switching Regulator
PT78ST133, 3.3 VDC (See Note 1)
PT78ST105, 5.0 VDC (See Note 1)
PT78ST112, 12.0 VDC (See Note 1)
Efficiency vs Output Current
Efficiency vs Output Current
Efficiency vs Output Current
100
90
100
90
80
70
60
50
40
100
90
Vin
Vin
80
80
9.0V
12.0V
18.0V
24.0V
30.0V
Vin
16.0V
18.0V
24.0V
30.0V
38.0V
9.0V
70
70
12.0V
15.0V
38.0V
60
60
20.0V
26.0V
50
50
40
40
0
0.25
0.5
0.75
1
1.25
1.5
0
0.25
0.5
0.75
1
1.25
1.5
0
0.25
0.5
0.75
1
1.25
1.5
Iout-(Amps)
Iout-(Amps)
Iout-(Amps)
Ripple vs Output Current
Ripple vs Output Current
Ripple vs Output Current
150
120
90
60
30
0
300
250
200
150
100
50
100
80
60
40
20
0
Vin
26.0V
Vin
38.0V
30.0V
24.0V
18.0V
12.0V
9.0V
Vin
38.0V
20.0V
15.0V
12.0V
9.0V
30.0V
24.0V
18.0V
16.0V
0
0
0.25
0.5
0.75
1
1.25
1.5
0
0.25
0.5
0.75
1
1.25
1.5
0
0.25
0.5
0.75
1
1.25
1.5
Iout-(Amps)
Iout-(Amps)
Iout-(Amps)
Thermal Derating (Ta)
(See Note 2)
Thermal Derating (Ta)
(See Note 2)
Thermal Derating (Ta)
(See Note 2)
1.6
1.4
1.2
1
1.6
1.4
1.2
1
1.6
1.4
1.2
1
60°C
60°C
70°C
70°C
70°C
60°C
85°C
85°C
85°C
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
9
12
15
18
21
24
27
30
33
36
39
16
19
22
25
28
31
34
37
40
9
13
17
21
25
Vin-(Volts)
Vin-(Volts)
Vin-(Volts)
Power Dissipation vs Output Current
Power Dissipation vs Output Current
Power Dissipation vs Output Current
1.8
1.6
1.4
1.2
1
3
2.5
2
2.5
2
Vin
Vin
38.0V
30.0V
24.0V
18.0V
12.0V
9.0V
26.0V
20.0V
15.0V
12.0V
9.0V
1.5
1
Vin
1.5
1
0.8
0.6
0.4
0.2
0
38.0V
30.0V
24.0V
18.0V
16.0V
0.5
0
0.5
0
0
0.25
0.5
0.75
1
1.25
1.5
0
0.25
0.5
0.75
1
1.25
1.5
0
0.25
0.5
0.75
1
1.25
1.5
Iout-(Amps)
Iout-(Amps)
Iout-(Amps)
Note 1: All data listed in the above graphs, except for derating data, has been developed from actual products tested at 25°C. This data is considered typical data for the ISR.
Note 2: Thermal derating graphs are developed in free air convection cooling of 40-60 LFM. (See Thermal Application Notes.)
For technical support and more information, see inside back cover or visit www.ti.com/powertrends
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or se rvice s doe s not constitute TI’s approval, warranty or e ndorse me nt the re of.
Copyright 2000, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated
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