PTMAG6181A0DGKRQ1 [TI]
Automotive high-precision analog AMR angle sensor with integrated turns counter | DGK | 8 | -40 to 150;
| 型号： | PTMAG6181A0DGKRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Automotive high-precision analog AMR angle sensor with integrated turns counter | DGK | 8 | -40 to 150 |
| 文件： | 总42页 (文件大小：1997K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMAG6181-Q1
ZHCSPN7 –MARCH 2023
TMAG6181-Q1 具有集成圈数计数器的高精度模拟AMR 角度传感器
1 特性
3 说明
• 符合面向汽车应用的AEC-Q100 标准：
– 温度等级0：–40°C 至150°C
• 以符合功能安全标准为目标
TMAG6181-Q1 是一款基于异性磁阻 (AMR) 技术的高
精度角度传感器。该器件集成信号调节放大器，并提供
与所施加平面磁场的方向相关的差分正弦和余弦模拟输
出。该器件还在 X 轴和 Y 轴上具有两个独立的霍尔传
感器，用于跟踪旋转情况。
– 专为功能安全应用开发
– 在发布量产版本时将会提供有助于使系统设计符
合ISO 26262 ASIL B 标准的文档
• 高精度高速AMR 角度传感器：
TMAG6181-Q1 具有宽工作磁场（20mT 至 1T），可
实现灵活的机械放置。该器件在正弦和余弦输出上具有
超低延迟 (< 2µs)，非常适合转子位置检测等高速应
用。快速启动时间(< 40µs) 可实现低功耗应用。
– 角度误差：0.1°（典型值）
– 角度误差：0.6°（整个温度范围内的最大值）
– < 2µs 的超低延迟支持高达100krpm
– 角度范围：180°
该器件集成一个圈数计数器来跟踪旋转圈数，并使用
TURNS 引脚上的 PWM 来传输计数器值。此类器件具
有一个 SLEEPB 引脚，该引脚可使器件进入两种低功
耗模式，即睡眠模式和低功耗圈数计数模式。
• 具有低角度漂移，无需在整个温度范围内进行校准
• 宽工作磁场范围：20mT 至1T
• 正弦和余弦差分比例式模拟输出
• 支持差分端或单端应用
• 快速启动时间：< 40µs
• 集成的圈数计数器使用PWM 输出提供旋转圈数计
TMAG6181-Q1 提供广泛的诊断功能，专为功能安全
应用而设计。该器件可在 –40°C 至 +150°C 的宽环境
温度范围内保持稳定一致的性能，同时具有超小的热漂
移和寿命误差。
数：
– 在启用圈数计数器的低功耗模式下，功耗不到
45μA
– 智能旋转跟踪功能可在低功耗模式下跟踪高达
8krpm 的旋转
封装信息
封装(1)
封装尺寸（标称值）
器件型号
TMAG6181-Q1
VSSOP (8)
3.00mm × 3.00mm
• 用于进入睡眠模式的专用引脚：< 5µA
• 电源电压范围：2.7V 至5.5V
(1) 要了解所有可用封装，请见数据表末尾的可订购产品附录。
Supply Voltage
2.7 to 5.5V
2 应用
TMAG6181
• 电动助力转向
• 转向角传感器
• BLDC/PMSM 转子位置检测
• 雨刮器模块
• 传动器
VCC
TURNS
SIN_P
0.1µF
SIN_N
µController
COS_P
• 伺服驱动器位置传感器
• 集成带式起动发电机
COS_N
GND
SLEEPB
应用方框图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLYS048
TMAG6181-Q1
ZHCSPN7 –MARCH 2023
www.ti.com.cn
Table of Contents
7.4 Device Functional Modes..........................................24
8 Application and Implementation..................................27
8.1 Application Information............................................. 27
8.2 Typical Application.................................................... 28
8.3 Power Supply Recommendations.............................33
8.4 Layout....................................................................... 33
9 Device and Documentation Support............................34
9.1 接收文档更新通知..................................................... 34
9.2 支持资源....................................................................34
9.3 Trademarks...............................................................34
9.4 静电放电警告............................................................ 34
9.5 术语表....................................................................... 34
10 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................4
6.5 Electrical Characteristics.............................................5
6.6 Magnetic Characteristics.............................................6
7 Detailed Description........................................................8
7.1 Overview.....................................................................8
7.2 Functional Block Diagram...........................................8
7.3 Feature Description.....................................................8
Information.................................................................... 34
10.1 Package Option Addendum....................................37
10.2 Tape and Reel Information......................................38
4 Revision History
DATE
REVISION
NOTES
March 2023
*
Initial release
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5 Pin Configuration and Functions
COS_P
GND
1
2
3
4
8
7
6
5
SIN_P
VCC
COS_N
SLEEP
SIN_N
TURNS
Not to scale
图5-1. DGK Package 8-Pin VSSOP Top View
表5-1. Pin Functions
PIN
TYPE(1)
DESCRIPTION
NO.
NAME
1
COS_P
O
G
O
I
Differential cosine output (positive)
Ground reference
2
3
4
5
6
7
8
GND
COS_N
SLEEP
TURNS
SIN_N
VCC
Differential cosine output (negative)
SLEEPB pin (active low)
I/O
O
P
Turns counter output or Reset input (open drain)
Differential sine output (negative)
Power supply
SIN_P
O
Differential sine output (positive)
(1) I = input, O = output, I/O = input and output, G = ground, P = power
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–10
MAX
UNIT
V
VCC
IOUT
VOUT
VIN
Main supply voltage
7
10
Output current (SIN_P, SIN_N, COS_P, COS_N,TURNS)
Output voltage (SIN_P, SIN_N, COS_P, COS_N, TURNS)
Input voltage (SLEEPB)
mA
V
7
–0.3
–0.3
VVCC+ 0.3
Unlimited
170
V
BMAX
TJ
Magnetic flux density
T
Junction temperature
°C
°C
–40
–65
Tstg
Storage temperature
150
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not
sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,
performance, and shorten the device lifetime.
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per AEC Q100-002(1)
±2000
HBM ESD classification level 2
V(ESD) Electrostatic discharge
V
Charged device model (CDM), per All pins
AEC Q100-011
CDM ESD classification level C4B
±500
±750
Corner pins (1, 4, 5, and 8)
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
2.7
NOM
MAX
UNIT
V
VCC
TA
CL
IL
Main supply voltage
5.5
150
10
Operating free air temperature
Capacitive load on AMR outputs
Current load on the AMR outputs
C
–40
0.1
nF
mA
1
–1
6.4 Thermal Information
TMAG6181-Q1
DGK (VSSOP)
8 PINS
166.8
THERMAL METRIC(1)
UNIT
RθJA
RθJC(top)
RθJB
ΨJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
57.8
88.7
Junction-to-top characterization parameter
Junction-to-board characterization parameter
7.0
87.1
ΨJB
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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English Data Sheet: SLYS048
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6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
AMR Output Parameters
Single-ended output voltage peak to
peak
Vout
TA = 25 oC
55
60
± 0.3
± 2
65 %VCC
Amplitude asynchronism ratio (Vpk
Cos/ Vpk Vsin)
k
%
Differential offset of SIN/COS outputs
at room
Voffset_room
Voffset_tc
B = 30 mT, TA = 25 oC, VCC = 3.3 V
B = 30 mT, VCC = 3.3 V
mV
Temperature coefficient of differential
offset voltage
mV/
degC
± 0.05
VCM
Common-mode output voltage
Output referred noise (differential)
Series output resistance
50
0.5
55
%VCC
mVrms
Ohm
VNOISE
Rout
B= 30 mT, Cload = 100 pF
Rout_sleep
Series output resistance during Sleep SLEEPB = GND
1
Mohm
Update rate of the automatic gain
control
tagc_update
1
s
DC Power
VVCC_UV
VVCC_OV
IACT
Under voltage threshold at VCC
Over voltage threshold at VCC
2.45
5.9
5
2.65
6.2
10
V
V
Active mode current from VCC
Sleep mode current from VCC
Sleep mode current from VCC
SLEEPB = VCC
DCM mode enabled
SLEEPB = GND
mA
µA
µA
IDCM_SLEEP
ISLEEP
35
4.5
Low power DCM mode with turns
counter enabled (no rotations
detected)
Average current during low power
mode from VCC
ILP
50
25
38
µA
ms
µs
Sleep time during low power mode
when the magnetic field is static (not
rotating)
tsleep_no_rotation
B = 30 mT
To achieve 90% of output voltages
after VCC has reached final value
(Cload =100 pF)
ton_startup
Power-on time during Startup
Power-on time after SLEEPB goes
high
To achieve 90% of output voltages
after SLEEPB > VIH (Cload =100 pF)
ton_sleep
45
µs
µs
Time that SLEEPB has to stay low
when transitioning from active mode to
low power mode
tsleepb_pd
125
400
400
Timeout between two consecutive
pulses on SLEEPB pin when entering
low power mode
tsleepb_timeout
25
µs
Time that SLEEPB has to stay low to
enter sleep mode
tsleep_mode
1.1
ms
Digital I/O
VIH_SLEEPB
VIL_SLEEPB
VIH_TURNS
VIL_TURNS
VOL_TURNS
Turns Counter
fPWM
High level input voltage
Low level input voltage
High level input voltage
Low level input voltage
Low level output voltage
on SLEEPB pin
on SLEEPB pin
on TURNS pin
0.65
0.65
0
VVCC
0.35 VVCC
VVCC
on TURNS pin
0.35 VVCC
I = 2 mA on TURNS pin
0.4
V
PWM carrier frequency
When Turns Counter is enabled
2.5
KHz
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MAX UNIT
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
10
TYP
DCPWM
Output Valid Duty Cycle Range
Turns Counter Range
90
%
TC
1023
–1024
TCstep
Turns Counter PWM Step Size
Quiescent Duty Cycle
0.039
50
% / Turn
TC_PWMQ
TC_PWMQΔL
Turns Counter = 0
%
%
Quiescent Duty Cycle Lifetime drift
0.5
RMS noise on PWM duty cycle of
TURNS pin
TCnoise
0.005
%
Minimum Time required to pull down
the TURNS pin to initiate the turns
counter
Ttc_start
125
1.1
µs
Minimum Time required to pull down
the TURNS pin to reset the turns
counter
Ttc_reset
ms
µs
Time delay from rising edge on
TURNS pin to the first PWM falling
edge
Ttc_delay
55
6.6 Magnetic Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Angular Performance
Angular error linearity across
temperature on continuous calibration
(gain / offset) (differential ended)
B=30 mT, VCC= 5V, Magnetic field
Rotation Speed = 1000 rpm
deg
0.4
ANGERR_DYN_DE
0.1
0.1
Angular error linearity across
temperature on continuous calibration
(gain / offset) (single ended)
B=30 mT, VCC= 5V, Magnetic field
Rotation Speed = 1000 rpm
deg
0.5
ANGERR_DYN_SE
Angular error linearity across
temeprature after room temp
calibration (of offset / gain mismatch) alignment
(single ended)
B = 30 mT, VCC = 5V, Ideal magnet
ANGERR_RTCAL_SE
0.2
0.2
0.8
0.7
deg
deg
Angular error linearity across
temeprature after room temp
calibration (of offset / gain mismatch) alignment
(differential ended)
B = 30 mT, VCC = 5V, Ideal magnet
ANGERR_RTCAL_DE
Angular error linearity across
ANGERR_NOCAL_SE temperature with no calibration of
gain / offset (single ended)
B = 30 mT, VCC = 5V, Ideal magnet
alignment
0.6
0.4
1
deg
deg
Angular error linearity across
ANGERR_NOCAL_DE temperature with no calibration of
gain / offset (differential ended)
B = 30 mT, VCC = 5V, Ideal magnet
alignment
0.8
ANGLT_DRIFT
ANGHYST
Angle error lifetime drift
Angle hysteresis error
Orthogonolity Error
B = 30 mT
B = 30 mT
B = 30 mT
0.05
0.01
0.01
deg
deg
deg
ANGOE_ERR
Angular RMS (1-sigma) noise in
degrees
ANGNOISE
B = 30 mT, Cload = 100 pF
0.01
deg
tdel_amr
Propagation Delay time
3-dB Bandwidth
Cload = 100pF
Cload = 100pF
1.6
µs
BW3dB_amr
100
KHz
Magnetic Field Rotation Speed =
10000 rpm, Cload = 100pF
Phase error
0.15
deg
φerr
Hall sensor characteristics
Bop(x),Bop(y) Magnetic field operating point
3
mT
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Brp(x),Brp(y)
Bop - Brp
Bsym_op
Bsym_op
Bsym_rp
Magnetic field release point
Magnetic hysteresis
mT
mT
mT
mT
mT
mT
–3
6
Operating point symmetry
Operating point symmetry
Release point symmetry
Release point symmetry
±0.1
0
Bop(x) –Bop(y)
Bop(x) –Bop(y)
Brp(x) –Brp(y)
Brp(x) –Brp(y)
±0.1
0
Bsym_rp
Change in BOP or BRP to change in
output
tpd_Hall
Propagation delay time per channel
10
μs
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7 Detailed Description
7.1 Overview
The TMAG6181-Q1 is a high-precision angle sensor based on the AMR sensor technology vertically integrated
on top of the integrated amplifiers on silicon. The differential output sine and cosine signals from the AMR sensor
are proportional to the angle of the applied magnetic field. They are internally signal conditioned, temperature
compensated, and driven by differential output amplifiers with the ability to drive large capacitive loads. The
output voltages of the AMR sensor are ratiometric to the supply voltage to ensure the external ADC can use the
supply voltage as a reference.
The TMAG6181-Q1 features a SLEEPB pin to enable low power operation. The device integrates a rotation
turns counter to measure the number of rotations of the external magnetic field using the integrated X and Y Hall
sensors at a resolution of 90 degrees. The TURNS pin provides the integrated turns counter output using Pulse
Width Modulation (PWM) scheme.
The TMAG6181-Q1 contains the following functional and building blocks:
• The Power Management and Oscillators block contains internal regulators, biasing circuitry, a low-frequency,
wake-up oscillator and a high-frequency, wake-up oscillator, overvoltage and undervoltage detection circuitry
• The AMR sensor contains two Wheatstone bridges made of magnetic resistive sensors, each sensing one of
the components of the applied magnetic field, the sine and the cosine components.
• The AMR sensing path contains the signal conditioning amplifiers, offset compensation, automatic gain
control circuitry and the output drivers.
• The Turns Counting path contains the X and Y Hall sensors, related biasing circuitry, signal conditioning, logic
comparators and a counter to keep track of rotations
• The Internal memory block supports the factory-programmed values
• The diagnostic blocks support background diagnostic checks of the internal circuitry
7.2 Functional Block Diagram
Power Management and
Diagnostics
Memory
SLEEP
Oscillators
COS_P
COS_N
Low pass Filter
(optional)
VCC
GND
Output
Driver
Analog
Front End
0.1µF
(minimum)
Low pass Filter
(optional)
Offset
compensation
Automatic Gain
Control
AMR Sensor
SIN_P
SIN_N
Low pass Filter
(optional)
Output
Driver
Analog
Front End
Low pass Filter
(optional)
VCC
Q0
TURNS
Output
Driver
Digital
Logic
Amp
MUX
X – Hall Sensor
Y – Hall Sensor
Q1
7.3 Feature Description
7.3.1 Magnetic Flux Direction
The TMAG6181-Q1 is sensitive to the magnetic field component in X and Y directions. The X and Y fields are in-
plane with the package. The device will generate sine and cosine outputs from the AMR based on the reference
position (0°). See 图7-1.
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By
(Sin)
Bin
Φ
0o
Bx
(Cos)
图7-1. Direction of Sensitivity
7.3.2 Sensors Location and Placement Tolerances
图 7-2 shows the location of the AMR sensor and X, Y Hall elements and their placement tolerances inside the
TMAG6181-Q1.
Top View
1.5 mm
AMR
0.93 mm
sensor
1.5 mm
centered
±25 µm
X
Y
Side View
0.38 mm
图7-2. Location of AMR Sensor and Hall Elements
The center of the AMR and Hall sensors lie in the center of the package. 图 7-3 shows the tolerances of the die
rotation within the package. This causes a reference angle error (Φ) of ± 3°.
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Top View
Die
(typical placement)
Φ
Rotated Die
(Placement error)
图7-3. Die Rotation Tolerances in the Package
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7.3.3 Magnetic Response
The AMR sensor has two components that are sensitive to the in-plane magnetic field X and Y axes parallel to
the chip surface. 图 7-4 shows the AMR sensor with the differential sine and cosine outputs SIN_P, SIN_N,
COS_P and COS_N. The outputs have an electrical range of 180 degrees. If the mechanical angle between the
sensor reference and the direction of the magnetic field is θ, then the AMR outputs correspond to cosine 2θ
and sine 2θ, respectively. For every 360° rotation of the external magnetic field, the AMR outputs provide two
periods at 180° sensing range for each period. Hence, for a dipole magnet rotating at speed of f, the electrical
output from the AMR sensor outputs can be at twice the frequency at 2f. Use 方程式 1 to calculate the angle of
the magnetic field using an arctangent2 function.
Vsin
arctan2
Vcos
θ =
(1)
2
where
• Vsin is the differential sine output
• Vcos is the cosine output
The AMR sensor is sensitive only to the direction of the magnetic field and has a wide operating magnetic field
range. The voltage levels of the AMR outputs are independent of the absolute flux density as long as the
magnetic flux density is above the minimum recommended operating fields.
Voltage (V)
VCC
Diagnostic Band
90% VCC
Vsin_p (max)
By (sin)
90o
Vout
SIN_P
COS_P
SIN_N
COS_N
θ
0o
VCM (VCC / 2
)
Bx (cos)
Vsin_p (min)
10% VCC
Diagnostic Band
180
Magnetic field angle (in degrees)
90
0
270
360
图7-4. AMR Sensor Outputs Magnetic Response
图 7-4 shows the two integrated Hall sensors X and Y that are sensitive to the in-plane X and Y axes similar to
the AMR sensor. The outputs Q0 and Q1 shows the digital outputs of both these sensors, respectively. 图 7-4
shows both the Hall outputs reacting to the input field by going low when the field is higher than operating point
(BOP) and going high when the field is lower than returning point (BRP).
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Hall sensor output (VQ)
VQ (H)
BHYS
VQ (L)
B
South
North
BRP
BOP
图7-5. Hall Sensor Magnetic Response
For a rotating input magnetic field, with the X and Y components of BSIN and BCOS respectively, 图7-6 shows the
response of the AMR and Hall sensors. The integrated X and Y Hall sensors provide digital outputs (Q0 and Q1,
respectively). See the Functional Block Diagram. The Hall sensors have a 360° compared to the 180° angle
range of the AMR sensors.
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Input Magnetic Field
(mT)
BSIN
BCOS
BOP
BRP
Time(s)
(V)
VSIN_P – VSIN_N
AMR outputs
VCOS_P – VCOS_N
Differential
output voltage
Time(s)
(V)
Y Hall output
Q1
Time(s)
X Hall output
Q0
Time(s)
图7-6. Magnetic Response of AMR and Hall Sensors
7.3.4 Parameters Definition
7.3.4.1 AMR Output Parameters
Magnetic Response shows the single-ended output signals as SIN_P, SIN_N, COS_P and COS_N. These
signals are ratiometric to the supply voltage (VCC). The common-mode voltage (VCM) of the individual signals is
half of the supply voltage (VCC /2). For single-ended signals, VOUT is defined as the difference between the
maximum and minimum output voltage for a rotating magnetic field. Use 方程式2 to calculate VOUT_SIN_P
.
V
= V
− V
SIN_P min
(2)
OUT_SIN_P
SIN_P max
where
• VSIN_P (max) is the maximum output voltage across the full magnetic angle range
• VSIN_P (min) is minimum output voltage across the full magnetic angle range
Typically, VOUT is around 60% of the supply voltage (VCC). The diagnostic band indicates that the output signals
are outside normal operating range and indicates a presence of fault.
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Voltage
VCC
Vcos_diff(max)
Vsin_diff(max)
Acos_diff
SIN_P – SIN_N
COS_P – COS_N
Voff_cos
0
Voff_sin
Asin_diff
Vcos_diff(min)
Vsin_diff(min)
- VCC
0
90
270
360
180
Magnetic field angle (in degrees)
图7-7. AMR Differential-Ended Output Signals
图 7-7 shows the differential sine and cosine output signals generated from the corresponding sine and cosine
single-ended outputs. Use 方程式3 and 方程式4 to calculate the differential voltages.
V
V
= V
− V
SIN_N
(3)
(4)
sin_diff
cos_diff
SIN_P
= V
− V
COS_N
COS_P
The offset of the differential signals is the average of the maximum and minimum voltages of the sine or cosine
signals. Use 方程式5 and 方程式6 to calculate the offsets for the sine and cosine signals.
V
+ V
2
sin_diff max
sin_diff min
V
V
=
=
(5)
(6)
offset_sin
offset_cos
V
+ V
2
cos_diff max
cos_diff min
For single-ended signals, the offset is the common-mode voltage (VCM).
Use 方程式7 to calculate the differential offset for sine and cosine channels at any given temperature, TA
o
V
= V
* 1 + V
* T − 25 C
(7)
offset
offset, room
offset_TC
A
where
• VOffset_TC is the temperature drift coefficient of the offset
• VOffset_room is the room temperature offset
Use 方程式8 and 方程式9 to calculate the amplitudes of the differential signals.
V
− V
sin_diff max
sin_diff min
A
=
(8)
sin_diff
2
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V
− V
cos_diff max
cos_diff min
A
=
(9)
cos_diff
2
Use 方程式10 to calculate the amplitude for single-ended signals.
V
− V
sin_p max
sin_p min
A
=
(10)
sin_p
2
Amplitude asynchronism refers to the amplitude mismatch error between sine and cosine channels. Use 方程式
11 to calculate the amplitude mismatch error.
A
cos_diff
k = 1 −
(11)
A
sin_diff
The sine and cosine output signals are typically out-of-phase by 90 degrees, but if an internal phase error occurs
owing to sensor and other on chip circuitry non-idealities, the sine and cosine outputs from the sensor can be
different than the ideal 90 degrees. This error is referred to as the orthogonality error. This error is defined as the
angle error between the zero crossing of the cosine output and maximum value of the sine outputs.
The hysteresis error (ANGhyst) refers to the largest angle error difference between a clockwise rotation and a
counter-clockwise rotation.
For the AMR sensor, the orthogonality error and the hysteresis errors are negligible.
7.3.4.2 Transient Parameters
Propagation delay (tdel_amr) is defined as the time taken for signal to propagate from magnetic input change to
the sine and cosine AMR outputs. The bandwidth limitation of the internal signal conditioning amplifiers causes a
phase shift on the applied magnetic field. The propagation delay increases based on the speed of the rotating
field and it is specified at the maximum speed of the recommended magnetic field. 图 7-8 shows an input
rotating magnetic field and the response of the AMR outputs. The propagation delay leads in the signal path
leads to a phase error.
Angle of input
magnetic field (in deg)
tdel_amr
360o
φerr
Input magnetic angle
Measured magnetic angle
0o
Time(s)
(V)
SIN_P – SIN_N (ideal)
COS_P – COS_N (ideal)
SIN_P – SIN_N (measured)
COS_P – COS_N (measured)
AMR outputs
Differential
output voltage
Time(s)
图7-8. AMR Output Propagation Delay and Phase Error
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The phase error (φerr) refers to the angle error between the input magnetic field and output of the sensor. This
error increases with the speed of the rotating magnetic field and the propagation delay of the AMR sensor.
Typically this error can be compensated to the first order if the speed of the rotating magnetic field is known.
7.3.4.2.1 Power-On Time
The power-on time during start-up (Ton_startup) is defined as the time it takes for the AMR outputs to reach to 90%
of their final value (under a constant magnetic field) after the VCC reaches VCC(min). 图 7-9 shows the power-on
time of the device when the SLEEPB pin is tied to VCC during a VCC ramp.
VCC
VCC (MIN)
TON_STARTUP
time
SIN, COS outputs
90% VOUT_final
Invalid
time
图7-9. Power-On Time During Start-Up
The power-on time from sleep mode (Ton_sleep) is defined as the time it takes for the AMR outputs to reach to
90% of their final value (under a constant magnetic field) after the SLEEPB reaches above VIH_SLEEPB. 图 7-10
shows the power-on time of the device when the SLEEPB pin is ramped high when the VCC is held constant.
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VCC
VCC(MIN)
time
SLEEP
VIH
TON_SLEEPB
time
SIN, COS outputs
90% VOUT_final
Invalid
time
图7-10. Power-On Time When SLEEPB is Pulled High
7.3.4.3 Hall Sensor Parameters
The Hall sensors X and Y have factory-calibrated operating (BOP) and release points (BRP). The operating and
release points shown in 图7-4 give the magnetic hysteresis for each Hall sensor.
Use 方程式12 and 方程式13 to calculate the symmetry point for each axis.
B
= B
+ B
RP X
(12)
(13)
SYM X
OP X
where
• BOP (X) and BRP (X) represent the operating and release points for X Hall sensor
B
= B
+ B
OP Y RP Y
SYM Y
where
• BOP (Y) and BRP (Y) represent the operating and release points for Y Hall sensor
Use 方程式14 to calculate the operating point symmetry.
B
= B
− B
OP Y
(14)
(15)
SYM_OP
OP X
Use 方程式15 to calculate the release point symmetry.
B
= B
− B
SYM_RP
RP X RP Y
7.3.4.4 Angle Accuracy Parameters
The overall angle error represents the relative angular error. 图 7-11 shows the deviation from the reference line
after zero angle definition.
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180o
Ideal output
Measured Angle
(in degrees)
ANGERR
Measured data
0
180o
Magnetic Angle (in degrees)
图7-11. Angle Error
The uncalibrated angular error (ANGERR_NOCAL_DE) is defined as the maximum deviation from an ideal angle
without any offset and amplitude mismatch calibration for the VSIN and VCOS differential signals. For single-
ended signals, the uncalibrated angular error is denoted by ANGERR_NOCAL_SE
.
The single point calibration angular error (ANGERR_RTCAL_DE) is defined as the maximum deviation from an ideal
angle after the offset calibration is applied to the VSIN and VCOS differential signals at room temperature
(25°C). For single-ended signals, the uncalibrated angular error is denoted by ANGERR_RTCAL_SE
.
The dynamic angular error (ANGERR_DYN) is defined as the maximum deviation from an ideal angle with the
continuous offset and gain calibration applied to the VSIN and VCOS differential signals. The error is measured
at 1 krpm and includes the phase error owing to the propagation delay of the AMR outputs.
7.3.5 Automatic Gain Control (AGC)
To reduce the drift of the AMR sensor outputs across temperature, the TMAG6181-Q1 features an automatic
gain control circuitry where the device changes the gain of the output drivers to keep the final output within an
appropriate voltage range on SIN_P, SIN_N, COS_P and COS_N. The AGC block uses the square root of the
sum of the squared amplitudes of the two channels to sense amplitude of output signals and set gain selection.
This means that the AGC block will set the gain for sine and cosine channels such that the peak-to-peak
amplitude of single-ended voltages (VOUT) is within the range listed in Specifications. The AGC block changes
the gain of both the sine and cosine channels simultaneously and does not affect the angle accuracy.
If the outputs are out of the intended operating range, the AGC block changes the gain of the sine and cosine
channels by a step size of ±1% VCC at an interval of tagc_update, approximately one second, as defined in
Specifications. 图 7-12 shows the differential AMR outputs for a continuously rotating input field. The shaded
area represents the 'No AGC Control' band that represents ±5% of VCC and it is centered at 60% of VCC. Notice
that the AGC loop reduces the gain of the sine and cosine channels and updates the amplitude of the sine and
cosine signals when drift outside of the shaded region at a step size of 1% VCC. If the outputs remain within the
shaded region, then no action is taken by the AGC control loop.
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Angle of input
magnetic field (in deg)
360o
0o
Time (s)
AMR output Voltage (V)
tagc_update
± 5% Vcc
V = 1% Vcc
60% Vcc
No AGC control
Time (s)
0
No AGC control
-60% Vcc
± 5% Vcc
SIN_P – SIN_N
COS_P – COS_N
图7-12. Timing Diagram Showing the Operation of Automatic Gain Control
7.3.6 Turns Counter
The TMAG6181-Q1 features an integrated 11-bit turns counter that can be used to keep track of rotation counts
in different modes of operation (see Device Functional Modes). 图 8-2 shows the typical application diagram
when the turns counter is used in the system. The turns counter can be initiated and reset using the open-drain
TURNS pin.
The turns counter uses the integrated X and Y Hall sensors to detect the rotation. The outputs from the Hall
sensors are sampled at an interval of ttc_update to update the turns counter. The turns counter can detect a
change in the applied magnetic field at a resolution of 90° with a range of 360°. The turns counter also keeps
track of direction information. The counter is incremented if the applied field is rotated clockwise and
decremented if the field is rotated counter-clockwise. 图 7-13 shows the counter operation based on the rotation
of the input magnetic field.
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0o
Clockwise : Counter +1
Counter-clockwise : Counter -1
Q1 : 0
Q0 : 0
Count = - 1
Count = - 1
Count = + 1
Count = + 1
270o
Q1 :0
Q0 : 1
90o
Q1 : 1
Q0 : 0
Count = + 1
Count = + 1
Count = - 1
Count = - 1
Q1 : 1
Q0 : 1
180o
图7-13. Turns Counter Operation
The turns counter information is sent using the TURNS pin in a Pulse Width Modulation (PWM) format. 图 7-14
shows the PWM duty cycle variation based on the turns counter value. The typical pulse-width modulation
(PWM) carrier frequency is 2.5 kHz. When the counter value is 0, the TURNS pin outputs a 50% duty cycle.
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TURNS
(duty cycle %)
Diagnostic Band
90%
Counter -
Clock wise
Clock wise
50%
10%
Diagnostic Band
0
-1024
1023
Turns count
图7-14. Turns Counter PWM Output on TURNS Pin
图 7-15 shows the timing diagram to enable the turns counter in active mode. When the part powers up, the
turns counter is not enabled by default. The turns counter can be enable by holding the TURNS pin low, for at
least ttc_start. When the TURNS pin is released, the pin turns into the output mode and sends out the PWM
pulses corresponding to the internal turns counter after a time delay of ttc_delay, as provided in the Specifications.
To reset the counter and disable the output on TURNS pin, it is pulled low for at least t > ttc_reset. When the turns
counter is enabled in the active mode, the internal wake-up oscillator is used to enable the Hall sensor signal
path at regular intervals to update the turns counter information. This allows the device to keep the turns counter
feature on at a lower power consumption overhead.
Angle of Input
magnetic field
Time(s)
SLEEP
Time(s)
50%
PWM
PWM << 50%
PWM >> 50%
TURNS
Time(s)
Time(s)
Turns Counter
Reset
Ttc_reset
Ttc_start
Turns
Counter
value
1001
-900 -901 -902 -903 -904 -905
0
1000
0
图7-15. Timing Diagram Showing the Turns Counter Operation in Active Mode
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图7-16 shows the timing diagram of the turns counter operation in low-power mode. The part can be placed in a
low-power, duty-cycled state if the turns counter is enabled. During this low-power state, an internal wake-up
oscillator is used to wake up the device at regular intervals, tsleep. When the part wakes up, the integrated Hall
sensor signals are monitored for a rotation, and the turns counter information is updated. The TURNS pin does
not output the PWM pulses during this low-power state. When the part is moved into an active state from the
low-power state, the PWM pulses corresponding to the turns counter information saved during the low-power
state is sent out to the microcontroller.
Angle of Input
magnetic field
Time(s)
SLEEP
Time(s)
ICC (mA)
Time(s)
50%
PWM
TURNS
Time(s)
Turns
Counter
value
1001
0
1000
Time(s)
tsleepb_pd
tsleepb_timeout
tsleepb_pd
ttc_start
tsleepb_pd
图7-16. Timing Diagram Showing the Turns Counter Operation in Low-Power Mode
7.3.6.1 Rotation Tracking
The TMAG6181-Q1 has a rotation tracking feature to track high -speed rotations at low current consumption to
save power. This feature lets the device decrease the sleep time when magnetic field rotations are detected, and
enables the device to track the higher speed and acceleration events. When the turns counter is enabled using
the TURNS pin, rotation tracking feature is also enabled. This feature is enabled in both the active-turns mode
and the low-power mode (see Device Functional Modes).
In active mode, when the turns counter is enabled, the Hall sensor signals are monitored approximately every
1.6 ms. But when a rotation is detected, the period between the next wake-up event is reduced by 1/8th to 0.2
ms. If no rotation change is detected for four consecutive periods, then the sleep time is increased to 0.4 ms. If
new rotations are detected, then the tracking algorithm goes to 0.2 ms and the counter for the four consecutive
periods is reset. If no rotations are detected in next four consecutive periods, then the sleep time is doubled
again to 0.8 ms and then eventually back to 1.6 ms if no more rotations are detected. After reaching this default
value of 1.6 ms, the rotation tracking feature allows theTMAG6181-Q1 to continue sampling at this fixed period
until new rotations are detected.
In low-power mode, when the turns counter is enabled, the Hall sensor signals are monitored approximately
every 25.6 ms. But when a rotation is detected, the period between the next wake-up event is reduced by 1/16th
to 1.6 ms. If no rotation change is detected for four consecutive periods, then the sleep time is increased to 3.2
ms. If new rotations are detected, then the tracking algorithm goes to 1.6 ms and the counter for the four
consecutive periods is reset. If no rotations are detected in the next four consecutive periods, then the sleep time
is doubled again to 6.4 ms and then to 12.8 ms after the next four cycles. After reaching the default value of 25.6
ms, the rotation tracking feature allows the TMAG6181-Q1 to continue sampling at this fixed period until new
rotations are detected. 图7-17 shows the rotation tracking feature during low-power mode.
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Bin
Time(s)
Time(s)
ICC (mA)
Tsleep (nom)
8
Tsleep (nom)
Tsleep (nom)
4
Tsleep_lp (nom)
Q1
HALL Y
output
Q0
1
1
0
0
0
0
0
1
0
1
1
1
0
1
0
1
0
1
1
0
1
Time(s)
Time(s)
HALL X
output
1
0
0
Turns
Counter
value
0
1
2
3
Time(s)
t5
t4
t1
t3
t0
t2
图7-17. Timing Diagram Showing the Rotation Tracking Feature in Low Power Mode
Use 方程式16 to calculate the maximum angle travel, θ, for a rotating magnetic field.
2
θ = 6v × t + 0.5 × a × t
(16)
where,
• t is the time it takes the field to travel
• v is the velocity of the moving field
• a is the acceleration of the moving field
The turns counter has an angle resolution of 90 degrees. The turns counter can successfully track the rotations if
the counter can ensure the state transitions (as shown in 图7-13) and does not jump any states. At an
acceleration of 6000 rpm/sec, the rotation tracking feature enables the device to track up to 8000 rpm during
low-power mode and in active-turns mode, and enables at track up to 60000 rpm.
表 7-1 shows the trade-off between maximum speed (in rpm) that can be tracked by the turns counter and the
current consumption in active mode.
表7-1. Maximum Trackable RPM vs Average Current Consumption in Active Mode
OPERATING MODE
SLEEP TIME (ms)
MAX TRACKABLE RPM (TYP) AVERAGE CURRENT (µA)
0.2
62500
31250
15625
7812
472
280
167
105
0.4
Active-turns mode
0.8
1.6 (default)
表 7-2 shows the trade-off between maximum speed (in rpm) that can be tracked by the turns counter and the
current consumption in low-power mode
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表7-2. Maximum Trackable RPM vs Average Current Consumption in Low Power Mode
OPERATING MODE
SLEEP TIME (ms)
MAX TRACKABLE RPM (TYP) AVERAGE CURRENT (ILP) (µA)
1.6
7812
3905
1950
970
105
73
57
48
44
3.2
Low-power mode
6.4
12.8
25.6 (default)
475
7.3.7 Safety and Diagnostics
The TMAG6181-Q1 supports several device and system level diagnostics features to detect, monitor, and report
failures during the device operation.
In the event of a failure, the TMAG6181-Q1 is placed in a FAULT state, where the outputs from the AMR sensors
are placed in a high-impedance state. See Device Functional Modes for fault state transition from different
operation modes. As shown in the Application and Implementation section, users can added pullup or pulldown
resistors on SIN_P, SIN_N, COS_P, COS_N pins at the termination site (that is the microcontroller). The
resistors are generally pulled up to supply voltage or pulled down to ground such that the ADC code on MCU is
out of expected range. This will signal fault to the microcontroller.
The integrated turns counter has a valid range of 10% to 90% PWM output. If a fault is detected in the turns
counter, then the output of the turns counter is at >95% PWM or <5% PWM. The external microcontroller can
monitor if the turns counter is within expected range.
The TMAG6181-Q1 performs the following device and system level checks:
7.3.7.1 Device Level Checks
• AMR signal path checks
– AMR sensor bias check
– AMR output signals common mode check
– Automatic gain control loop check
• Hall sensor signal path checks
– Hall sensor bias and resistance check
– Hall sensor comparator check
• Turns counter overflow check
• Power management and supporting circuitry checks
– Internal LDO undervoltage check
– Internal clocks integrity check
• Internal memory integrity check (or a cyclic redundancy check–CRC)
7.3.7.2 System Level Checks
• VCC undervoltage and overvoltage checks
• Pin level opens and short checks
7.4 Device Functional Modes
7.4.1 Operating Modes
The TMAG6181-Q1 supports multiple operating modes for wide array of applications as explained in 图 7-18.
The device starts powering up after the VCC supply crosses the minimum threshold as specified in the
Recommended Operating Conditions section.
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VCC > VCC(min)
Transit to other state automatically
Transition condition initiated by user
SLEEP = 1
SLEEP =0
Fault detected
Fault goes away
Active mode
Turns counter
disabled
Sleep mode
Safe State
TURNS counter
initiated
TURNS counter
reset
SLEEP =0
Active-Turns
mode
Turns counter
enabled
SLEEP =0
Low power
mode enable
sequence
Low power
mode
disabled
Low power
mode
Turns Counter
enabled
图7-18. TMAG6181-Q1 State Transition Diagram
表7-3 shows the different operating modes of the TMAG6181-Q1.
表7-3. TMAG6181-Q1 Operating Modes
TURNS PIN (I/O
FUNCTIONALITY)(1)
OPERATING MODE
DEVICE FUNCTION
AMR OUTPUT STATE
AMR outputs track the magnetic
field direction
Active mode
Outputs in normal operating range
I
AMR outputs track the magnetic
field direction and the TURNS pin
sends out the internal turns
Active-turns mode
Low-power mode
Outputs in normal operating range
High Impedance
I / O
N/A
counter information using PWM
Wakes up at a certain interval and
the turns counter keeps track of
changes in X and Y Hall sensor
state
Device enters the lowest power
state
Sleep mode
High Impedance
High Impedance
N/A
N/A
Device has detected a fault
condition
Fault (safe) mode
(1) I = Input, O = Output, I/O = Input/ Output , N/A = Not Available
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7.4.1.1 Active Mode
After power up, if the SLEEPB is pulled high, the TMAG6181-Q1 enters the active mode where the SIN_P,
SIN_N, COS_P and COS_N outputs actively provide the angle of the applied magnetic field. In this mode, the
turns counter is disabled and the TURNS pin does not provide the PWM output. The average current
consumption during the active conversion is IACT
.
7.4.1.2 Active-Turns Mode
In this mode, the AMR sensor outputs are active and the turns counter is enabled. In this mode, the TURNS pin
acts as a I/O and it provides the counter information using the PWM output. In this mode, the Hall sensors are
enabled and their outputs are monitored to update the turns counter. To enter this mode, the TURNS pin is
pulled low for t > ttc_start. 图 7-15 shows the sequence to enter active-turns mode. After the TURNS pin is
released, the falling edge of the first PWM pulse occurs after ttc_start. To exit this mode, the TURNS pin is pulled
low for t > ttc_reset as defined in the Specifications section. After the turns counter is reset, the part goes back into
active mode.
7.4.1.3 Low-Power Mode
The TMAG6181-Q1 can enter into low-power mode after the turns counter is enabled. During this mode, the
turns counter is active and the wake-up oscillator is used to wake the device at a regular interval, Tsleep. During
this mode, the TURNS pin does not send out the PWM information and the input path is disabled. The average
current consumption during this mode is denoted by ILP.
图 7-16 shows the sequence to enter and exit low-power mode from active-turns mode. To enter low-power
mode, two consecutive pulses are provided on the SLEEPB pin. The pulses must be within the range of tsleep_pd
as provided in the Specifications section. The timeout between these two consecutive pulses is defined by
tsleepb_timeout in the Specifications section. To exit low-power mode, the part monitors for a rising edge on the
SLEEPB pin. This can be provided by driving the SLEEPB at a pulse width identical to the one used to enter
low-power mode.
During low-power mode, an internal wake-up oscillator is used to wake the device up at regular intervals to
monitor the states of the Hall sensors. During low-power mode, the rotation tracking feature is enabled to track
rotations up to 8 krpm at a very low power consumption. The period between two consecutive wake-up intervals
is dependent on the frequency of the applied magnetic field (see Rotation Tracking).
7.4.1.4 Sleep Mode
Sleep mode can place the device in the lowest current consumption state. When the voltage on SLEEPB pin
goes below VIL_SLEEP and stays low for longer than tsleep_mode, then the part enters sleep mode. The average
current consumption during this mode is denoted by ISLEEP, and this mode uses approximately ten times less
current compared to low-power mode. The part exits sleep mode when the voltage on the SLEEPB pin goes
above VIH_SLEEP
.
There is a 500-KΩpulldown resistor on the SLEEPB pin and, when the SLEEPB pin left floating, the part enters
the sleep mode. TI recommends to ensure the SLEEPB pin is driven externally to a known logic state.
7.4.1.5 Fault Mode
The TMAG6181-Q1 supports extensive fault diagnostics as detailed in Diagnostics section. When a fault is
detected, the part enters fault mode. In this mode, the AMR outputs are placed in a high-impedance state.
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8 Application and Implementation
备注
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
8.1.1 Power Supply as the Reference for External ADC
The AMR output signals of the TMAG6181-Q1 are ratiometric to the supply voltage, Vcc. This enables the
external ADC to use the TMAG6181-Q1 supply voltage as a reference and eliminate the errors that might arise if
a separate reference voltage is used. This also enables to optimize the external ADC input range. TI therefore
recommends to use the supply voltage (Vcc) as the reference for the external ADCs. To ensure the noise on the
power supply is minimized, TI recommends using a 0.1-µF bypass capacitor.
8.1.2 AMR Output Dependence on Airgap Distance
The AMR sensor is only sensitive to the direction of the applied magnetic field along the X-Y plane parallel to the
chip surface. The applied magnetic field from a rotating magnet might vary based on the airgap distance
between the TMAG6181-Q1 and the magnet.
As long the absolute field magnetic field is above the minimum field listed in Recommended Operating
Conditions, the angle accuracy from the AMR outputs are independent of the value of the applied magnetic field.
8.1.3 Calibration of Sensor Errors
The TMAG6181-Q1 is factory-calibrated for the best angular accuracy. Some of the electrical errors from the
sensor that impact the angle accuracy can be calibrated out for achieving the best performance. 图 8-1 shows
the impact of the different sensor error parameters such as offset, amplitude mismatch and orthogonality error
on the angle accuracy.
By
By
By
Bx
Bx
Bx
(c)
(a)
(b)
图8-1. Angle Accuracy Impact Owing to Sensor Electrical Errors (a) Offset Error (b) Amplitude Mismatch
Error (c) Orthogonality Error
Based on the parameters defined in AMR Output Parameters, the angle from the AMR sensors is given by 方程
式17:
A
A
sin 2θ + V
sin
offset_sin
arctan2
cos 2θ + V
cos
offset_cos
θ =
(17)
2
where
• Voffset_sin and Voffset_cos are the differential offsets of the sine and cosine outputs
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• Asin and Acos are the differential amplitude of the sine and cosine outputs
The impact of the angle accuracy owing to the orthogonality error and the hysteresis errors is negligible for the
TMAG6181-Q1 and can be ignored.
To calibrate the offset and amplitude mismatch errors, the magnetic field rotates over the entire range and the
sine and cosine outputs are sampled continuously to obtain the minimum and maximum values of the outputs.
Users can calculate the average of the minimum and maximum values of the respective outputs across the full
angle range to find the offset error of the sine and cosine outputs. Use 方程式 18 and 方程式 19 to calculate the
offset correction parameters for sine and cosine.
V
+ V
2
sin max
sin min
V
V
=
=
(18)
(19)
os_ sin_cal
os_ cos_cal
V
+ V
2
cos max
cos min
Users can calculate the difference of the minimum and maximum values of the respective outputs across the full
angle range to find the amplitude of the sine and cosine outputs. Use 方程式 20 to calculate the amplitude
correction parameters for sine and cosine.
V
V
− V
− V
sin max
sin min
cos min
A
= 1 −
(20)
corr
cos max
8.2 Typical Application
The TMAG6181-Q1 AMR angle sensor can be used in either in single-ended output mode or differential output
mode. TMAG6181-Q1 has the drive capability to either drive differential-ended or single-ended SAR or Sigma
Delta ADCs. Typically, an external microcontroller processes the AMR output signals to extract the angular
position.
The differential-ended output mode is helpful to eliminate any common mode disturbances in the system. 图 8-2
shows a typical application circuit where the differential output signals SIN_P, SIN_N, COS_P and COS_N are
all connected to the four single-ended ADCs in the external microcontroller. If differential ADCs are available,
then they are typically recommended. The load capacitors and resistors must match each other to typically
achieve high accuracy. During sleep mode or when a fault is detected, the outputs are placed in high-impedance
state. To ensure that external microcontroller can detect this case, TI recommends using pulldown or pullup
resistors.
The TMAG6181-Q1 can drive capacitive loads up to 10 nF directly on the AMR output pins and, for a cable with
capacitances of 100 pF/m, the device can drive up to 100-m capacitive loads. With the ability to source and sink
currents up to 1 mA, the device can drive resistive loads.
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Supply Voltage
2.7 to 5.5V
(1)
Rpu
µController
TMAG6181
TURNS
VCC
GPIO1
GPIO2
ADC1
ADC2
ADC3
ADC4
SLEEP
SIN_P
0.1µF
Low pass Filter (3)
Low pass Filter (3)
Low pass Filter (3)
Low pass Filter (3)
SIN_N
COS_P
GND
COS_N
(2)
(2)
(2)
(2)
Rpu
Rpu
Rpu
Rpu
(1) 50K < Rpd < 500K (can be left floating if unused)
(2) 5K < Rpu < 1M (can be left floating if unused)
(3) Optional RC filter to reduce noise.
Filter time constant must be lesser than on speed of rotation
图8-2. Application Diagram for TMAG6181-Q1 in Differential-Ended Output Mode
If the number of ADC ports in the microcontroller are limited, or if the number of wires from the sensor to the
microcontroller must be kept to a minimum, 图 8-3 shows a typical application circuit where only the positive
output channels (SIN_P and COS_P) are connected to single-ended ADCs. The unused output signals (SIN_N
and COS_N) can be either left floating or connected to ground through a high resistance. In single-ended output
mode, the dynamic range (SNR) and noise immunity is typically reduced compared to the differential output
mode. To reduce noise on the outputs and for filtering EMC disturbances, an external low-pass filter such as a
first order RC network can be used. The bandwidth of the external filter must be designed based on the rotation
speed of the magnetic field to be detected. TI recommends adding pullup or pulldown resistors to ground on the
single-ended outputs (SIN_P and COS_P) to ensure that their outputs are defined when the outputs are in high-
impedance state. The supply voltage of the sensor is used as the reference for the ADCs in the microcontroller.
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Supply Voltage
2.7 to 5.5V
(1)
Rpu
µController
TMAG6181
TURNS
VCC
GPIO1
SLEEP
SIN_P
GPIO2
ADC1
0.1µF
Low pass Filter (3)
(4)
SIN_N
ADC2
COS_P
Low pass Filter (3)
GND
(4)
COS_N
(2)
(2)
Rpu
Rpu
(1) 50K < Rpd < 500K (can be left floating if unused)
(2) 5K < Rpu < 1M (can be left floating if unused)
(3) Optional RC filter to reduce noise.
Filter time constant must be lesser than on speed of rotation
(4) Can be left floating or connected to ground through R > 100 K
图8-3. Application Diagram for TMAG6181-Q1 in Single-Ended Output Mode
8.2.1 Design Requirements
图8-4 shows the center of the magnet aligned with the center of the sensor in a typical on-axis application.
图8-4. On-Axis Measurement Setup for TMAG6181-Q1
Use the parameters listed in 表8-1 for this design example.
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表8-1. Design Parameters
DESIGN PARAMETERS
ON-AXIS MEASUREMENT
5 V
VCC
Cylinder: 4.7625-mm diameter, 12.7-mm thick, neodymium N52, Br =
1480
Magnet
Differential-
ended
Output mode
Maximum speed of the motor
Desired angle error across temperature
Magnet to sensor placement
8,000 rpm
<1°
End of shaft
8.2.2 Detailed Design Procedure
For accurate angle measurement, the center of the magnet is aligned to the center of the sensor with acceptable
tolerances. Follow these steps to ensure that the sensor is calibrated for best accuracy:
• Reference angle calibration - Set the reference angle based on the magnet alignment to the sensor. This
error can be saved in the microcontroller for runtime absolute position calculation. This error is also known as
angle offset in a system.
• Electrical offset calibration - See Calibration of Sensor Errors for the offset calibration procedure. If the sensor
cannot be rotated across the full range, then the electrical offsets cannot be calibrated.
• Amplitude mismatch calibration - See Calibration of Sensor Errors for the amplitude mismatch calibration
procedure. If the sensor cannot be rotated across the full range, then the amplitude mismatch cannot be
calibrated.
8.2.2.1 Designing with Multiple Sensors
Some applications have the need for multiple angle position sensors to either detect position in different parts of
the system or for redundancy.
8.2.2.1.1 Designing for Redundancy
For applications that require the highest level of functional safety, two angle sensors may be required for
redundancy purposes.
N
S
Device 1
PCB
Device 2
图8-5. Two Sensors Placed on Either Side of the Board for Redundancy
To achieve redundancy without any impact on the angle accuracy, the TMAG6181-Q1 devices can be placed on
either side of the PCB as shown in 图 8-5. The AMR sensors are sensitive to only the direction of the magnetic
field and independent on the value of the absolute magnetic field, therefore the magnetic accuracy is not
compromised even if the devices are placed on the other side of the PCB.
8.2.2.1.2 Multiplexing Multiple Sensors
Some applications require multiple angle position sensors to detect position in different parts of the system. In
those cases, the primary challenge would be the availability of multiple ADC that are required to digitize the
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information from the sensors. In cases where the sensor is placed remotely away from the microcontroller, there
can be multiple output lines between the sensor and microcontroller.
With the ability to place the output in high-impedance state during shutdown mode, multiple TMAG6181-Q1
devices can share the analog output. This can minimize the system cost by using a single ADC per channel. 图
8-6 shows two devices that share the same analog output, with their respective SLEEPB pins controlled by the
microcontroller. A pulldown resistor can be used to pull the output to ground when both the devices are placed in
shutdown mode.
Supply Voltage
2.7 – 5.5V
VCC
VCC
SLEEPB
Device 1
TMAG6181
SIN_P
COS_P
GND
GPIO1
GPIO2
ADC1 µController
ADC2
50KΩ
GND
50KΩ
VCC
SLEEPB
Device 2
TMAG6181
SIN_P
COS_P
GND
图8-6. Multiple Sensors with Shared Output
图 8-7 shows how the GPIOs of the microcontroller can be used to multiplex the outputs from the two sensors.
When the GPIO1 goes high, device 1 is enabled and drives the output line to the corresponding output after the
power-on time. During this time, GPIO2 is driven low and device 2 is placed in shutdown mode. When the output
from the second device must be measured, the first device must be turned off before the second device is
enabled, indicated by tmux in the timing diagram. B1 and B2 correspond to the magnetic fields seen by device 1
and device 2 respectively.
With the ability to support up to 10-nF capacitive loads, the TMAG6181-Q1 can connect multiple sensors to the
same output.
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B(mT)
B1
B2
time
V
VGPIO1
tmux
VGPIO2
ton
VOUT
time
Device 2
Device 1
图8-7. Timing Diagram for Multiplexing the Sensor Outputs
8.3 Power Supply Recommendations
A decoupling capacitor close to the device must be used to provide local energy with minimal inductance. TI
recommends using a ceramic capacitor with a value of at least 0.01 µF.
8.4 Layout
8.4.1 Layout Guidelines
Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. Embedding
magnetic sensors within plastic or aluminum enclosures and sensing magnets on the outside is common
practice. Magnetic fields also easily pass through most printed circuit boards (PCBs), which makes placing the
magnet on the opposite side of the PCB possible.
8.4.2 Layout Example
COS_P
GND
SIN_P
0.1uF (min)
VCC
SIN_N
COS_N
SLEEP
TURNS
图8-8. Layout Example With TMAG6181-Q1
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9 Device and Documentation Support
9.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
9.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
9.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
9.4 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
9.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
10 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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10.1 Package Option Addendum
Packaging Information
Device
Orderable
Device
Package
Type
Package
Drawing
Package
Qty
Eco
Lead/Ball MSL Peak Op Temp
Status(1)
Pins
Marking(4)
Plan(2)
Finish(6)
Temp(3)
(°C)
(5)
PTMAG61 ACTIVE
81A0DGK
VSSOP
DGK
8
2500
Call TI
Call TI
Call TI
-40 to 150
RQ1
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using
this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please
check www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS
requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where
designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the
die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free
(RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based
flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will
appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device
Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line.
Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis
on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other
limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold
by TI to Customer on an annual basis.
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10.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
PTMAG6181A0DGKRQ
1
VSSOP
DGK
8
2500
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
PTMAG6181A0DGKRQ1
Package Type
Package Drawing Pins
DGK
SPQ
Length (mm) Width (mm)
Call TI Call TI
Height (mm)
VSSOP
8
2500
Call TI
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PACKAGE OPTION ADDENDUM
www.ti.com
2-Apr-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PTMAG6181A0DGKRQ1
ACTIVE
VSSOP
DGK
8
2500
TBD
Call TI
Call TI
-40 to 150
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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