RC4560IDRG4 [TI]
DUAL AUDIO OPERATIONAL AMPLIFIER; 双路音频运算放大器
| 型号： | RC4560IDRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL AUDIO OPERATIONAL AMPLIFIER |
| 文件： | 总11页 (文件大小：364K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RC4560
www.ti.com ..................................................................................................................................................... SLOS457A–JANUARY 2005–REVISED APRIL 2008
DUAL AUDIO OPERATIONAL AMPLIFIER
1
FEATURES
•
•
•
•
Operating Voltage . . . ±2 V to ±18 V
Low Noise Voltage . . . 1.2 µVrms (Typ)
Wide GBW . . . 15 MHz (Typ)
•
•
Slew Rate . . . 5.5 V/µsec (Typ)
Suitable for Applications Such as Audio
Preamplifier, Active Filter, Headphone
Amplifier, Industrial Measurement Equipment
Low THD . . . 0.05% (Typ)
DESCRIPTION/ORDERING INFORMATION
The RC4560 is a high-gain, wide-bandwidth, dual operational amplifier capable of driving 20 V peak-to-peak into
400-Ω loads. The RC4560 combines many of the features of the RC4558, but with wider bandwidth and higher
slew rate, making this device ideal for active filters, data and telecommunications, and many instrumentation
applications.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
RC4560IP
TOP-SIDE MARKING
RC4560IP
PDIP – P
SOIC – D
Tube of 50
Tube of 75
RC4560ID
R4560I
R4560I
–40°C to 85°C
Reel of 2500
Tube of 150
Reel of 2000
RC4560IDR
RC4560IPW
TSSOP – PW
RC4560IPWR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
RC4560
SLOS457A–JANUARY 2005–REVISED APRIL 2008..................................................................................................................................................... www.ti.com
EQUIVALENT CIRCUIT
V
CC+
Output
− Input
+ Input
V
CC−
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VCC±
Supply voltage
±18 V
±15 V
Input voltage (any input)
Output current
±50 mA
D package
P package
PW package
97°C/W
θJA
Package thermal impedance(2)(3)
85°C/W
149°C/W
150°C
TJ
Operating virtual junction temperature
Storage temperature range
Tstg
−60°C to 125°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
2
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): RC4560
RC4560
www.ti.com ..................................................................................................................................................... SLOS457A–JANUARY 2005–REVISED APRIL 2008
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
2
MAX UNIT
VCC+
VCC–
VID
16
V
Supply voltage
–2
–16
Differential input voltage
±30
14
V
V
VICR
TA
Input common mode range
Operating free-air temperature range
–14
–40
85
°C
ELECTRICAL CHARACTERISTICS
VCC± = ±15 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
S ≤ 10 kΩ
MIN
TYP
0.5
5
MAX UNIT
VIO
IIO
IIB
Input offset voltage
R
6
200
500
mV
nA
Input offset current
Input bias current
40
nA
AVD
ri
Large-signal differential voltage amplification
Input resistance
R
L ≥ 2 kΩ, VO = ±10 V
L ≥ 2 kΩ
86
0.3
100
5
dB
MΩ
R
±12
±14
VO
Output voltage swing
V
IO = 25 mA
±10 ±12.5
VICR
Common-mode input voltage range
±12
70
±14
90
V
CMRR Common-mode rejection ratio
R
S ≤ 10 kΩ
S ≤ 10 kΩ
dB
dB
mA
kSVR
ICC
Supply-voltage rejection ratio(1)
R
76.5
90
Supply current (all amplifiers)
4.3
5.7
(1) Measured with VCC± differentially varied simultaneously from ±4 V to ±15 V
OPERATING CHARACTERISTICS
VCC± = ±15 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP
UNIT
V/µs
MHz
%
SR
Slew rate at unity gain
5.5
15
GBW Gain bandwidth product
THD
Vn
Total harmonic distortion
VO = 5 V, RL = 2 kΩ, f = 1 kHz, AVD = 20 dB
RIAA, RS ≤ 2 kΩ, 30-kHz LPF
0.05
1.2
Equivalent input noise voltage
µVrms
Copyright © 2005–2008, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): RC4560
PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2008
PACKAGING INFORMATION
Orderable Device
RC4560ID
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
RC4560IDE4
RC4560IDG4
RC4560IDR
SOIC
SOIC
D
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
RC4560IDRE4
RC4560IDRG4
RC4560IP
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PDIP
P
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
RC4560IPE4
RC4560IPW
PDIP
P
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
RC4560IPWE4
RC4560IPWG4
RC4560IPWR
RC4560IPWRE4
RC4560IPWRG4
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2008
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Apr-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
RC4560IDR
SOIC
D
8
8
2500
2000
330.0
330.0
12.4
12.4
6.4
7.0
5.2
3.6
2.1
1.6
8.0
8.0
12.0
12.0
Q1
Q1
RC4560IPWR
TSSOP
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Apr-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
RC4560IDR
SOIC
D
8
8
2500
2000
340.5
346.0
338.1
346.0
20.6
29.0
RC4560IPWR
TSSOP
PW
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.430 (10,92)
MAX
0.010 (0,25)
M
0.015 (0,38)
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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