RC4560IP [TI]

DUAL AUDIO OPERATIONAL AMPLIFIER; 双路音频运算放大器
RC4560IP
型号: RC4560IP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

DUAL AUDIO OPERATIONAL AMPLIFIER
双路音频运算放大器

运算放大器
文件: 总5页 (文件大小:84K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀ ꢁꢂ ꢃꢄ ꢅ  
ꢆꢇꢈ ꢉ ꢈꢇꢆ ꢊꢋ ꢋ ꢌꢍꢀ ꢈꢎ ꢊꢋ ꢏꢈꢉ ꢈꢐ ꢌ ꢉꢊ ꢑꢊ ꢍꢀ  
SLOS457 − JANUARY 2005  
D (SOIC), DGK (VSSOP/MSOP), P (PDIP),  
OR PW (TSSOP) PACKAGE  
(TOP VIEW)  
D
D
D
D
D
D
Operating Voltage . . . 2 V to 18 V  
Low Noise Voltage . . . 1.2 µVrms (Typ)  
Wide GBW . . . 15 MHz (Typ)  
V
1OUT  
1IN−  
1IN+  
1
2
3
4
8
7
6
5
CC+  
Low THD . . . 0.05% (Typ)  
2OUT  
2IN−  
2IN+  
Slew Rate . . . 5.5V/µsec (Typ)  
Suitable for Applications Such as Audio  
Preamplifier, Active Filter, Headphone  
Amplifier, Industrial Measurement  
Equipment  
V
CC−  
description/ordering information  
The RC4560 is a high-gain, wide-bandwidth, dual operational amplifier capable of driving 20 V peak-to-peak  
into 400-loads. The RC4560 combines many of the features of the RC4558, but with wider bandwidth and  
higher slew rate, making this device ideal for active filters, data and telecommunications, and many  
instrumentation applications.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
Reel of 2500  
RC4560IDGKR  
RC4560IDGKT  
RC4560IP  
PREVIEW  
RC4560IP  
R4560I  
MSOP/VSSOP (DGK)  
Reel of 250  
Tube of 50  
Tube of 75  
Reel of 2500  
Tube of 150  
Reel of 2000  
PDIP (P)  
SOIC (D)  
−40°C to 85°C  
RC4560ID  
RC4560IDR  
RC4560IPW  
RC4560IPWR  
TSSOP (PW)  
R4560I  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢎꢝ  
Copyright 2005, Texas Instruments Incorporated  
ꢙ ꢝ ꢚ ꢙꢒ ꢓꢧ ꢕꢔ ꢘ ꢠꢠ ꢞꢘ ꢖ ꢘ ꢗ ꢝ ꢙ ꢝ ꢖ ꢚ ꢢ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂꢃ ꢄꢅ  
ꢆ ꢇꢈꢉ ꢈ ꢇ ꢆꢊ ꢋ ꢋ ꢌꢍ ꢀꢈꢎꢊ ꢋ ꢏꢈ ꢉ ꢈꢐ ꢌꢉ ꢊ ꢑꢊ ꢍꢀ  
SLOS457 − JANUARY 2005  
equivalent circuit  
V
CC+  
Output  
− Input  
+ Input  
V
CC−  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V  
CC  
Input voltage (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V  
Output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
Package thermal impedance, θ (see Notes 1 and 2):D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W  
JA  
DGK package . . . . . . . . . . . . . . . . . . . . . . . . . 172°C/W  
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W  
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
J
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −60°C to 125°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. Maximum power dissipation is a function of T (max), q , and T . The maximum allowable power dissipation at any allowable  
JA  
J
A
ambient temperature is P = (T (max) − T )/q . Operating at the absolute maximum T of 150°C can affect reliability.  
D
J
A
JA  
J
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ  
ꢆꢇꢈ ꢉ ꢈꢇꢆ ꢊꢋ ꢋ ꢌꢍꢀ ꢈꢎ ꢊꢋ ꢏꢈꢉ ꢈꢐ ꢌ ꢉꢊ ꢑꢊ ꢍꢀ  
SLOS457 − JANUARY 2005  
recommended operating conditions  
MIN  
2
MAX  
16  
UNIT  
V
V
CC+  
CC−  
ID  
Supply voltage  
V
−2  
−16  
30  
V
V
Differential input voltage  
V
V
Input common mode range  
Operating free-air temperature range  
−14  
−40  
14  
ICR  
T
A
85  
°C  
electrical characteristics, V  
=
15 V, T = 25°C (unless otherwise noted)  
A
CC  
PARAMETER  
Input offset voltage  
TEST CONDITIONS  
MIN  
TYP  
MAX  
6
UNIT  
mV  
nA  
V
R
10 kΩ  
0.5  
5
IO  
S
I
I
Input offset current  
Input bias current  
200  
500  
IO  
40  
nA  
IB  
A
Large-signal differential voltage amplification  
Input resistance  
R
R
2 k, V  
=
O
10 V  
86  
0.3  
12  
100  
5
dB  
VD  
L
L
r
MΩ  
i
2 kΩ  
14  
V
O
Output voltage swing  
V
I
O
= 25 mA  
10  
12.5  
14  
V
ICR  
Common-mode input voltage range  
12  
V
CMRR Common-mode rejection ratio  
R
R
10 kΩ  
10 kΩ  
70  
90  
dB  
dB  
mA  
S
S
k
Supply-voltage rejection ratio  
Supply current (all amplifiers)  
76.5  
90  
SVR  
I
4.3  
5.7  
CC  
Measured with V  
differentially varied simultaneously from 4 V to 15 V  
CC  
operating characteristics, V  
=
15 V, T = 25°C (unless otherwise noted)  
A
CC  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
V/µs  
MHz  
%
SR  
Slew rate at unity gain  
5.5  
15  
GBW  
THD  
Gain bandwidth product  
Total harmonic distortion  
Equivalent input noise voltage  
V
O
= 5 V, R = 2 k, f = 1 kHz, A  
VD  
= 20 dB  
0.05  
1.2  
L
V
n
RIAA, R 2 k, 30 kHz LPF  
µVrms  
S
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
8-Aug-2005  
PACKAGING INFORMATION  
Orderable Device  
RC4560ID  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
8
8
8
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
RC4560IDE4  
RC4560IDR  
SOIC  
SOIC  
D
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
RC4560IDRE4  
RC4560IP  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
PDIP  
P
50  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
RC4560IPE4  
RC4560IPW  
PDIP  
P
50  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
RC4560IPWE4  
RC4560IPWR  
RC4560IPWRE4  
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction  
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for  
such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
product or service voids all express and any implied warranties for the associated TI product or service and  
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.  
Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2005, Texas Instruments Incorporated  

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