REG104GA-A/2K5 [TI]
DMOS 1A Low-Dropout Regulator; DMOS 1A低压降稳压器
| 型号： | REG104GA-A/2K5 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DMOS 1A Low-Dropout Regulator |
| 文件： | 总22页 (文件大小：438K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REG104
REG104
REG
104
SBVS025G – SEPTEMBER 2001 – REVISED SEPTEMBER 2005
DMOS
1A Low-Dropout Regulator
DESCRIPTION
FEATURES
The REG104 is a family of low-noise, low-dropout linear
regulators with low ground pin current. Its new DMOS topol-
ogy provides significant improvement over previous designs,
including low dropout voltage (only 230mV typ at full load),
and better transient performance. In addition, no output
capacitor is required for stability, unlike conventional low
dropout regulators that are difficult to compensate and
require expensive low ESR capacitors greater than 1µF.
● NEW DMOS TOPOLOGY:
Ultra Low Dropout Voltage:
230mV typ at 1A and 3.3V Output
Output Capacitor NOT Required for Stability
● FAST TRANSIENT RESPONSE
● VERY LOW NOISE: 33µVRMS
● HIGH ACCURACY: ±2% max
● HIGH EFFICIENCY:
Typical ground pin current is only 1.7mA (at IOUT = 1A) and
drops to 0.5µA in not enabled mode. Unlike regulators with
PNP pass devices, quiescent current remains relatively con-
stant over load variations and under dropout conditions.
IGND = 1.7mA at IOUT = 1A
Not Enabled: IGND = 0.5µA
● 2.5V, 2.7V, 3.0V, 3.3V, 5.0V AND
ADJUSTABLE OUTPUT VERSIONS
The REG104 has very low output noise (typically 33µVRMS
for VOUT = 3.3V with CNR = 0.01µF), making it ideal for use
in portable communications equipment. On-chip trimming
results in high output voltage accuracy. Accuracy is main-
tained over temperature, line, and load variations. Key pa-
rameters are tested over the specified temperature range
(–40°C to +85°C).
● THERMAL PROTECTION
● SMALL SURFACE-MOUNT PACKAGES:
SOT223-5, DDPAK-5
APPLICATIONS
● PORTABLE COMMUNICATION DEVICES
● BATTERY-POWERED EQUIPMENT
● MODEMS
The REG104 is well protected—internal circuitry provides a
current limit which protects the load from damage. Thermal
protection circuitry keeps the chip from being damaged by
excessive temperature. The REG104 is available in the
DDPAK-5 and the SOT223-5.
● BAR-CODE SCANNERS
● BACKUP POWER SUPPLIES
Enable
Enable
VOUT
VIN
VOUT
VIN
REG104
(Fixed Voltage
Versions)
+
R1
Adj
R2
+
+
+
0.1µF
(1)
(1)
COUT
REG104-A
COUT
0.1µF
NR
Gnd
Gnd
NR = Noise Reduction
NOTE: (1) Optional.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2001-2005, Texas Instruments Incorporated
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
Supply Input Voltage, VIN .......................................................–0.3V to 16V
Enable Input Voltage, VEN ....................................................... –0.3V to VIN
Feedback Voltage, VFB ........................................................ –0.3V to 6.0V
NR Pin Voltage, VNR .............................................................–0.3V to 6.0V
Output Short-Circuit Duration ...................................................... Indefinite
Operating Temperature Range ....................................... –55°C to +125°C
Storage Temperature Range .......................................... –65°C to +150°C
Junction Temperature ..................................................... –55°C to +150°C
Lead Temperature (soldering, 3s, SOT, and DDPAK) ................... +240°C
ESD Rating: HBM (VOUT to GND) ..................................................... 1.5kV
HBM (All other pins) ........................................................ 2kV
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
CDM .............................................................................. 500V
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
VOUT
REG104xx-yyyy/zzz
XX is package designator.
YYYY is typical output voltage (5 = 5.0V, 2.85 = 2.85V, A = Adjustable).
ZZZ is package quantity.
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.
PIN CONFIGURATIONS
Top View
SOT223-5
DDPAK-5
Tab is Gnd
Tab is Gnd
1
2 3 4
5
1
2
3
4
5
VO
NR/Adjust(1)
Gnd
VIN
Enable
VIN
Gnd
NR/Adjust(1)
Enable
VOUT
(DCQ Package)
(KTT Package)
NOTE: (1) For REG104A-A: voltage setting resistor pin.
All other models: noise reduction capacitor pin.
REG104
2
SBVS025G
ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TJ = –40°C to +85°C
At TJ = +25°C, VIN = VOUT + 1V (VOUT = 3.0V for REG104-A), VENABLE = 2V, IOUT = 10mA, CNR = 0.01µF, and COUT = 0.1µF(1), unless otherwise noted.
REG104GA
REG104FA
PARAMETER
CONDITION
MIN
TYP
MAX
UNITS
OUTPUT VOLTAGE
Output Voltage Range
REG104-2.5
REG104-2.7
REG104-3.0
REG104-3.3
REG104-5
REG104-A
VOUT
2.5
2.7
3.0
3.3
5
V
V
V
V
V
V
VREF
5.5
Reference Voltage
Adjust Pin Current
Accuracy
VREF
IADJ
1.295
0.2
±0.5
V
µA
%
1
±2
TJ = –40°C to +85°C
vs Temperature
vs Line and Load
TJ = –40°C to +85°C
±3.0
%
ppm/°C
%
dVOUT/dT
TJ = –40°C to +85°C
OUT = 10mA to 1A, VIN = (VOUT + 0.7V) to 15V
VIN = (VOUT + 0.9V) to 15V
70
±0.5
I
±2.5
±3.5
%
DC DROPOUT VOLTAGE(2, 3)
For all models except 5V
For 5V model
For all models except 5V
TJ = –40°C to +85°C
For 5V models
VDROP
IOUT = 10mA
IOUT = 1A
IOUT = 1A
IOUT = 1A
3
230
320
25
mV
mV
mV
mV
400
500
480
IOUT = 1A
580
mV
TJ = –40°C to +85°C
VOLTAGE NOISE
f = 10Hz to 100kHz
Vn
Without CNR (all models)
With CNR (all fixed voltage models)
CNR = 0, COUT = 0
CNR = 0.01µF, COUT = 10µF
35µVRMS/V • VOUT
10µVRMS/V • VOUT
µVRMS
µVRMS
OUTPUT CURRENT
Current Limit(4)
TJ = –40°C to +85°C
ICL
1.2
1.0
1.7
65
2.1
2.2
A
A
RIPPLE REJECTION
f = 120Hz
dB
ENABLE CONTROL
V
ENABLE High (output enabled)
VENABLE Low (output disabled)
ENABLE High (output enabled)
VENABLE
IENABLE
2
–0.2
VIN
0.5
100
100
V
V
nA
nA
µs
ms
I
VENABLE = 2V to VIN, VIN = 2.1V to 6.5(5)
VENABLE = 0V to 0.5V
1
2
50
1.5
IENABLE Low (output disabled)
Output Disable Time
Output Enable Softstart Time
THERMAL SHUTDOWN
Junction Temperature
Shutdown
150
130
°C
°C
Reset from Shutdown
GROUND PIN CURRENT
Ground Pin Current
IGND
IOUT = 10mA
IOUT = 1A
VENABLE ≤ 0.5V
0.5
1.7
0.5
0.7
1.8
mA
mA
µA
Enable Pin Low
INPUT VOLTAGE
VIN
Operating Input Voltage Range(6)
Specified Input Voltage Range
TJ = –40°C to +85°C
2.1
VOUT + 0.7
VOUT + 0.9
15
15
15
V
V
V
VIN > 2.7V
VIN > 2.9V
TEMPERATURE RANGE
Specified Range
Operating Range
TJ
–40
–55
–65
+85
+125
+150
°C
°C
°C
Storage Range
Thermal Resistance
DDPAK-5 Surface Mount
SOT223-5 Surface Mount
θJC
θJC
Junction-to-Case
Junction-to-Case
4
15
°C/W
°C/W
NOTES: (1) The REG104 does not require a minimum output capacitor for stability. However, transient response can be improved with proper capacitor selection.
(2) Dropout voltage is defined as the input voltage minus the output voltage that produces a 2% change in the output voltage from the value at VIN = VOUT + 1V
at fixed load.
(3) Not applicable for VOUT less than 2.7V.
(4) Current limit is the output current that produces a 15% change in output voltage from VIN = VOUT + 1V and IOUT = 10mA.
(5) For VIN > 6.5V, see typical characteristic VENABLE vs IENABLE
(6) The REG104 no longer regulates when VIN < VOUT + VDROP (MAX). In drop-out or when the input voltage is between 2.7V and 2.1V, the impedance from VIN
to VOUT is typically less than 1Ω at TJ = +25°C. See typical characteristic Output Voltage Change vs VIN
.
.
REG104
SBVS025G
3
TYPICAL CHARACTERISTICS
For all models, at TJ = +25°C and VENABLE = 2V, unless otherwise noted.
OUTPUT VOLTAGE CHANGE vs IOUT
(VIN = VOUT + 1V, Output Voltage % Change
Referred to IOUT = 10mA at +25°C)
0.8
DC DROPOUT VOLTAGE vs IOUT
350
300
250
200
150
100
50
0.6
+125°C
0.4
+125°C
0.2
+25°C
–55°C
0
+25°C
–0.2
–0.4
–0.6
–0.8
–55°C
–1
0
–1.2
0
200
400
600
800
1000
0
100 200 300 400 500 600 700 800 900 1000
Output Current (mA)
IOUT (mA)
OUTPUT VOLTAGE CHANGE vs IOUT
(Output Voltage % Change Referred to
OUTPUT VOLTAGE CHANGE vs VIN
(Output Voltage % Change Referred to
I
OUT = 10mA at +25°C)
V
IN = VOUT + 1V at IOUT = 10mA)
0.6
0.4
0.5
0
IOUT = 10mA
IOUT = 200mA
IOUT = 10mA
0.2
IOUT = 200mA
0
IOUT = 1000mA
–0.5
–1
–0.2
–0.4
–0.6
–0.8
–1
IOUT = 1000mA
–1.5
–2
–1.2
–60 –40 –20
0
20
40
60
80 100 120
0
2
4
6
8
10
12
Temperature (°C)
Input Voltage Above VOUT (V)
LINE REGULATION vs TEMPERATURE
(VIN = VOUT + 1V to 16V)
DC DROPOUT VOLTAGE vs TEMPERATURE
IOUT = 1000mA
0.5
0.4
0.3
0.2
0.1
0
350
300
250
200
150
100
50
IOUT = 10mA
IOUT = 200mA
IOUT = 200mA
IOUT = 10mA
0
–75
–75
–50
–25
0
25
50
75
100
125
–50
–25
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
REG104
4
SBVS025G
TYPICAL CHARACTERISTICS (Cont.)
For all models, at TJ = +25°C and VENABLE = 2V, unless otherwise noted.
LOAD TRANSIENT RESPONSE
LINE TRANSIENT RESPONSE
REG104-3.3
REG104-3.3
IOUT = 200mA
COUT = 0
COUT = 0
VOUT
VOUT
COUT = 10µF
COUT = 10µF
VOUT
VOUT
ILOAD
VIN
1A
6V
5V
10mA
10µs/div
50µs/div
LOAD TRANSIENT RESPONSE
LOAD TRANSIENT RESPONSE
REG104–A
REG104–A
Load = 200mA, CFB = 0.01µF, VOUT = 3.3V
CFB = 0.01µF, VOUT = 3.3V
COUT = 0
COUT = 0
COUT = 10µF
COUT = 10µF
1A
6V
5V
ILOAD
VIN
10mA
10µs/div
50µs/div
LOAD REGULATION vs TEMPERATURE
(VIN = VOUT + 1V and 10mA < IOUT < 1000mA)
OUTPUT NOISE DENSITY
0.5
0.4
0.3
0.2
0.1
0
10
5
2
1
0.5
0.2
0.1
0.05
0.02
0.01
CNR = 0
COUT = 0
C
C
NR = 0.01µF
OUT = 10µF
–60 –40 –20
0
20
40
60
80 100 120
10
100
1000
10000
100,000
Temperature (°C)
Frequency (Hz)
REG104
SBVS025G
5
TYPICAL CHARACTERISTICS (Cont.)
For all models, at TJ = +25°C and VENABLE = 2V, unless otherwise noted.
GROUND PIN CURRENT, NOT ENABLED
vs TEMPERATURE
GROUND PIN CURRENT vs TEMPERATURE
1.8
3
2.5
2
VENABLE = 0V
IOUT = 1000mA
1.6
1.4
1.2
1
1.5
1
IOUT = 200mA
0.8
0.5
0
0.6
IOUT = 10mA
0.4
–75
–50
–25
0
25
50
75
100
125
–60 –40 –20
0
20
40
60
80
100 120
Temperature (°C)
Temperature (°C)
IADJUST vs TEMPERATURE
GROUND PIN CURRENT vs IOUT
1.6
1.4
1.2
1
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
REG104-A
0.8
0.6
0.4
1
10
100
1000
–60 –40 –20
0
20
40
60
80 100 120 140
IOUT (mA)
Temperature (°C)
RIPPLE REJECTION vs FREQUENCY
CURRENT LIMIT vs TEMPERATURE
VOUT = VOUT-NOMINAL • 0.90
70
60
50
40
30
20
1850
1800
1750
1700
1650
1600
1550
VOUT = 1V
COUT = 10µF
COUT = 0
10
100
1k
10k
100k
–60 –40 –20
0
20
40
60
80 100 120
Frequency (Hz)
Temperature (°C)
REG104
6
SBVS025G
TYPICAL CHARACTERISTICS (Cont.)
For all models, at TJ = +25°C and VENABLE = 2V, unless otherwise noted.
RIPPLE REJECTION vs IOUT
75
SOFT START
VRIPPLE = 3Vp-p, f = 120Hz
70
VOUT
65
60
55
50
45
40
2V
0
VENABLE
0
200
400
600
800
1000
250µs/div
IOUT (mA)
OUTPUT DISABLE TIME
COUT = 0
OUTPUT VOLTAGE DRIFT HISTOGRAM
45
40
35
30
25
20
15
10
5
VOUT
2V
0
VENABLE
0
10µs/div
40 45 50 55 60 65 70 75 80 85 90
VOUT Drift (ppm/°C)
OUTPUT VOLTAGE ACCURACY HISTOGRAM
60
50
40
30
20
10
0
–1 –0.8 –0.6 –0.4 –0.2
0
0.2 0.4 0.6 0.8
1
Error (%)
REG104
SBVS025G
7
None of the versions require an output capacitor for regulator
stability. The REG104 will accept any output capacitor type
less than 1µF. For capacitance values larger than 1µF the
effective ESR should be greater than 0.1Ω. This minimum
ESR value includes parasitics such as printed circuit board
traces, solder joints, and sockets. A minimum 0.1µF low ESR
capacitor connected to the input supply voltage is recom-
mended.
BASIC OPERATION
The REG104 series is a family of LDO (Low DropOut) linear
regulators. The family includes five fixed output versions
(2.5V to 5.0V) and an adjustable output version. An internal
DMOS power device provides low dropout regulation with
near constant ground pin current (largely independent of load
and dropout conditions) and very fast line and load transient
response. All versions include internal current limit and
thermal shutdown circuitry.
ENABLE
Figure 1 shows the basic circuit connections for the fixed
voltage models. Figure 2 gives the connections for the
adjustable output version (REG104A) and example resistor
values for some commonly used output voltages. Values for
other voltages can be calculated from the equation shown in
Figure 2.
The Enable pin allows the regulator to be turned on and off.
This pin is active HIGH and compatible with standard TTL-
CMOS levels. Inputs below 0.5V (max) turn the regulator off
and all circuitry is disabled. Under this condition ground-pin
current drops to approximately 0.5µA.
When not used, the Enable pin may be connected to VIN.
Internal to the part, the Enable pin is connected to an input
resistor-zener diode circuit, as shown in Figure 3, creating a
nonlinear input impedance.
Enable
REG104
Gnd NR
VIN
VOUT
In
Out
175kΩ
Enable
COUT
0.1µF
CNR
0.01µF
VZ = 10V
Optional
FIGURE 3. Enable Pin Equivalent Input Circuit.
FIGURE 1. Fixed Voltage Nominal Circuit for REG104.
Enable
5
EXAMPLE RESISTOR VALUES
2
VOUT
1
V
OUT (V)
R1 (Ω)(1)
R2 (Ω)(1)
VIN
CFB
0.01µF
REG104
R1
COUT
1.295
2.5
Short
Open
IADJ
4
0.1µF
12.1k
1.21k
13k
1.3k
Load
Adj
R2
3
Gnd
3
3.3
5
16.9k
1.69k
13k
1.3k
Pin numbers for SOT-223 package.
20k
2.0k
13k
1.3k
Optional
37.4k
3.74k
13k
1.3k
VOUT = (1 + R1/R2) • 1.295V
NOTE: (1) Resistors are standard 1% values.
To reduce current through divider, increase resistor
values (see table at right).
As the impedance of the resistor divider increases,
I
ADJ (~200nA) may introduce an error.
CFB improves noise and transient response.
FIGURE 2. Adjustable Voltage Circuit for REG104A.
REG104
8
SBVS025G
The Enable Pin Current versus Applied Voltage relationship
is shown in Figure 4. When the Enable pin is connected to
VIN greater than 10V, a series resistor may be used to limit
the current.
Since the value of VREF is 1.295V, this relationship reduces to:
µVRMS
VN = 35
• VOUT
V
Connecting a capacitor, CNR, from the Noise-Reduction (NR)
pin to ground can reduce the output noise voltage. Adding
100
10
CNR, as shown in Figure 5, forms a low-pass filter for the
voltage reference. For CNR = 10nF, the total noise in the
10Hz to 100kHz bandwidth is reduced by approximately
a factor of 3.5. This noise reduction effect is shown in
Figure 6.
1
0.1
45
REG104-3.3
0.01
0.001
0
2
4
6
8
10
12
14
16
Enable Voltage
35
FIGURE 4. Enable Pin Current versus Applied Voltage.
OUTPUT NOISE
COUT = 0
COUT = 10µF
A precision band-gap reference is used for the internal
reference voltage, VREF, for the REG104. This reference is
the dominant noise source within the REG104. It generates
approximately 45µVRMS in the 10Hz to 100kHz bandwidth at
the reference output. The regulator control loop gains up the
reference noise, so that the noise voltage of the regulator is
approximately given by:
25
0.001
0.01
0.1
1
CNR (µF)
FIGURE 6. Output Noise versus Noise Reduction Capacitor.
The REG104 adjustable version does not have the noise-
reduction pin available, however, the adjust pin is the
summing junction of the error amplifier. A capacitor, CFB
VOUT
VREF
R1 + R2
,
VN = 45µVRMS
= 45µVRMS •
R2
VIN
NR
(fixed output
versions only)
Low Noise
Charge Pump
CNR
(optional)
VREF
(1.295V)
DMOS
Output
VOUT
Over Current
Over Temp
Protection
R1
R2
Enable
Adj
(Adjustable
Versions)
REG104
NOTE: R1 and R2 are internal
on fixed output versions.
FIGURE 5. Block Diagram.
REG104
SBVS025G
9
connected from the output to the adjust pin will reduce both
the output noise and the peak error from a load transient.
Figure 7 shows improved output noise performance for two
capacitor combinations.
For large step changes in load current, the REG104 requires
a larger voltage drop across it to avoid degraded transient
response. The boundary of this transient dropout region is
shown as the top line in Figure 8. Values of VIN to VOUT
voltage drop above this line insure normal transient re-
sponse.
10.0
In the transient dropout region between DC and Transient,
transient response recovery time increases. The time re-
quired to recover from a load transient is a function of both
the magnitude and rate of the step change in load current
and the available headroom VIN to VOUT voltage drop. Under
worst-case conditions (full-scale load change with VIN to
1.0
VOUT voltage drop close to DC dropout levels), the REG104
can take several hundred microseconds to re-enter the
specified window of regulation.
0.1
TRANSIENT RESPONSE
10
100
1000
10000
100000
The REG104 response to transient line and load conditions
improves at lower output voltages. The addition of a capaci-
tor (nominal value 10nF) from the output pin to ground may
improve the transient response. In the adjustable version, the
addition of a capacitor, CFB (nominal value 10nF), from the
output to the adjust pin will also improve the transient
response.
Frequency
FIGURE 7. Output Noise Density on Adjustable Versions.
The REG104 utilizes an internal charge pump to develop an
internal supply voltage sufficient to drive the gate of the
DMOS pass element above VIN. The charge-pump switching
noise (nominal switching frequency = 2MHz) is not measur-
able at the output of the regulator.
THERMAL PROTECTION
Power dissipated within the REG104 will cause the junction
temperature to rise. The REG104 has thermal shutdown
circuitry that protects the regulator from damage. The ther-
mal protection circuitry disables the output when the junc-
tion temperature reaches approximately 150°C, allowing
the device to cool. When the junction temperature cools to
approximately 130°C, the output circuitry is again enabled.
Depending on various conditions, the thermal protection
circuit may cycle on and off. This limits the dissipation of the
regulator, but may have an undesirable effect on the load.
DROP-OUT VOLTAGE
The REG104 uses an N-channel DMOS as the pass ele-
ment. When the input voltage is within a few hundred
millivolts of the output voltage, the DMOS device behaves
like a resistor. Therefore, for low values of VIN to VOUT, the
regulator’s input-to-output resistance is the RdsON of the
DMOS pass element (typically 230mΩ). For static (DC)
loads, the REG104 will typically maintain regulation down to
VIN to VOUT voltage drop of 230mV at full rated output current.
Any tendency to activate the thermal protection circuit indi-
cates excessive power dissipation or an inadequate heat
sink. For reliable operation, junction temperature should be
limited to 125°C, maximum. To estimate the margin of safety
in a complete design (including heat sink), increase the
ambient temperature until the thermal protection is triggered.
Use worst-case loads and signal conditions. For good reli-
ability, thermal protection should trigger more than 35°C
above the maximum expected ambient condition of your
application. This produces a worst-case junction temperature
of 125°C at the highest expected ambient temperature and
worst-case load.
In Figure 8, the bottom line (DC dropout) shows the minimum
VIN to VOUT voltage drop required to prevent dropout under
DC load conditions.
REG104 –3.3 at 25°C
250
DC
Transient
200
150
100
50
The internal protection circuitry of the REG104 has been
designed to protect against overload conditions. It was not
intended to replace proper heat sinking. Continuously run-
ning the REG104 into thermal shutdown will degrade reliabil-
ity.
0
0
100
200
300
400
500
IOUT (mA)
FIGURE 8. Transient and DC Dropout.
10
REG104
SBVS025G
POWER DISSIPATION
5
4
3
2
1
0
The REG104 is available in two different package configura-
tions. The ability to remove heat from the die is different for
each package type and, therefore, presents different consid-
erations in the printed circuit board (PCB) layout. The PCB
area around the device that is free of other components
moves the heat from the device to the ambient air. While it
is difficult to impossible to quantify all of the variables in a
thermal design of this type, performance data for several
configurations are shown in Figure 9. In all cases the PCB
copper area is bare copper, free of solder resist mask, and
not solder plated. All examples are for 1-ounce copper. Using
heavier copper will increase the effectiveness in moving the
heat from the device. In those examples where there is
copper on both sides of the PCB, no connection has been
provided between the two sides. The addition of plated
through holes will improve the heat sink effectiveness.
CONDITIONS
#1
#2
#3
#4
0
25
50
75
100
125
Ambient Temperature (°C)
CONDITION
PACKAGE
PCB AREA
θJA
1
2
3
4
DDPAK
SOT-223
DDPAK
4in2 Top Side Only
4in2 Top Side Only
None
27°C/W
53°C/W
65°C/W
110°C/W
Power dissipation depends on input voltage and load condi-
tions. Power dissipation is equal to the product of the aver-
age output current times the voltage across the output
element, VIN to VOUT voltage drop.
SOT-223
0.5in2 Top Side Only
FIGURE 9. Maximum Power Dissipation versus Ambient
Temperature for the Various Packages and
PCB Heat Sink Configurations.
PD = (VIN – VOUT ) • IOUT(AVG)
Power dissipation can be minimized by using the lowest
possible input voltage necessary to assure the required
output voltage.
REG104
SBVS025G
11
REGULATOR MOUNTING
Although the tabs of the DDPAK and the SOT-223 are
electrically grounded, they are not intended to carry any
current. The copper pad that acts as a heat sink should be
isolated from the rest of the circuit to prevent current flow
through the device from the tab to the ground pin. Solder pad
footprint recommendations for the various REG104 devices
are presented in the Application Bulletin Solder Pad Recom-
mendations for Surface-Mount Devices (SBFA015A), avail-
able from the Texas Instruments web site (www.ti.com).
The tab of both packages is electrically connected to ground.
For best thermal performance, the tab of the DDPAK sur-
face-mount version should be soldered directly to a circuit-
board copper area. Increasing the copper area improves
heat dissipation. Figure 10 shows typical thermal resistance
from junction to ambient as a function of the copper area for
the DDPAK. Figure 11 shows the same relationship for the
SOT-223.
THERMAL RESISTANCE vs PCB COPPER AREA
50
Circuit Board Copper Area
REG104
Surface Mount Package
40
30
20
10
0
1 oz. copper
REG104
DDPAK Surface Mount Package
5
0
1
2
3
4
Copper Area (inches2)
FIGURE 10. Thermal Resistance versus PCB Area for the Five-Lead DDPAK.
THERMAL RESISTANCE vs PCB COPPER AREA
180
Circuit Board Copper Area
REG104
Surface Mount Package
160
1 oz. copper
140
120
100
80
θ
60
40
20
REG104
SOT-223 Surface Mount Package
0
0
1
2
3
4
5
Copper Area (inches2)
FIGURE 11. Thermal Resistance versus PCB Area for the Five Lead SOT-223.
REG104
12
SBVS025G
PACKAGE OPTION ADDENDUM
www.ti.com
22-Sep-2005
PACKAGING INFORMATION
Orderable Device
REG104FA-2.5
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
OBSOLETE DDPAK/
TO-263
KTT
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
6
TBD
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REG104FA-2.5/500
REG104FA-2.5KTTT
REG104FA-2.7
NRND
DDPAK/
TO-263
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
DCQ
DCQ
DCQ
DCQ
DCQ
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Call TI
NRND
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
OBSOLETE DDPAK/
TO-263
TBD
REG104FA-2.7/500
REG104FA-2.7/500G3
REG104FA-2.7KTTT
REG104FA-3
ACTIVE
ACTIVE
ACTIVE
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Call TI
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
OBSOLETE DDPAK/
TO-263
TBD
REG104FA-3.3
OBSOLETE DDPAK/
TO-263
TBD
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REG104FA-3.3/500
REG104FA-3.3KTTT
REG104FA-3/500
REG104FA-3/500G3
REG104FA-3KTTT
REG104FA-5
ACTIVE
ACTIVE
NRND
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Call TI
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
ACTIVE
NRND
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
OBSOLETE DDPAK/
TO-263
TBD
REG104FA-5/500
REG104FA-5KTTT
REG104FA-A
ACTIVE
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Call TI
ACTIVE
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
OBSOLETE DDPAK/
TO-263
TBD
REG104FA-A/500
REG104FA-AKTTT
REG104GA-2.5
ACTIVE
ACTIVE
NRND
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
SOP
SOP
SOP
SOP
SOP
78 Green (RoHS &
no Sb/Br)
REG104GA-2.5/2K5
REG104GA-2.7
NRND
2500 Green (RoHS &
no Sb/Br)
ACTIVE
ACTIVE
ACTIVE
78 Green (RoHS &
no Sb/Br)
REG104GA-2.7/2K5
REG104GA-2.7/2K5G4
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
22-Sep-2005
Orderable Device
REG104GA-2.7G4
REG104GA-3
Status (1)
ACTIVE
NRND
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOP
DCQ
6
6
6
6
6
6
6
6
6
6
6
6
6
78 Green (RoHS &
no Sb/Br)
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Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
SOP
SOP
SOP
SOP
SOP
SOP
SOP
SOP
SOP
SOP
SOP
SOP
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
78 Green (RoHS &
no Sb/Br)
REG104GA-3.3
ACTIVE
ACTIVE
ACTIVE
NRND
78 Green (RoHS &
no Sb/Br)
REG104GA-3.3/2K5
REG104GA-3.3/2K5G4
REG104GA-3/2K5
REG104GA-3/2K5G4
REG104GA-5
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
2500 Green (RoHS &
no Sb/Br)
78 Green (RoHS &
no Sb/Br)
REG104GA-5/2K5
REG104GA-5/2K5G4
REG104GA-A
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
78 Green (RoHS &
no Sb/Br)
REG104GA-A/2K5
REG104GA-A/2K5G4
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
22-Sep-2005
to Customer on an annual basis.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2005
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
SOP
SOP
SOP
SOP
SOP
SOP
SOP
SOP
SOP
SOP
SOP
SOP
Drawing
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
REG104GA-3
REG104GA-3.3
NRND
ACTIVE
ACTIVE
ACTIVE
NRND
6
6
6
6
6
6
6
6
6
6
6
6
78
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
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78
REG104GA-3.3/2K5
REG104GA-3.3/2K5G4
REG104GA-3/2K5
REG104GA-3/2K5G4
REG104GA-5
2500
2500
2500
2500
78
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
REG104GA-5/2K5
REG104GA-5/2K5G4
REG104GA-A
2500
2500
78
REG104GA-A/2K5
REG104GA-A/2K5G4
2500
2500
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
28-Nov-2005
PACKAGING INFORMATION
Orderable Device
REG104FA-2.5
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
OBSOLETE DDPAK/
TO-263
KTT
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
6
TBD
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REG104FA-2.5/500
REG104FA-2.5KTTT
REG104FA-2.7
NRND
DDPAK/
TO-263
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
KTT
DCQ
DCQ
DCQ
DCQ
DCQ
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
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NRND
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
OBSOLETE DDPAK/
TO-263
TBD
REG104FA-2.7KTTT
REG104FA-3
ACTIVE
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Call TI
OBSOLETE DDPAK/
TO-263
TBD
REG104FA-3.3
OBSOLETE DDPAK/
TO-263
TBD
Call TI
REG104FA-3.3/500
REG104FA-3.3KTTT
REG104FA-3/500
REG104FA-3/500G3
REG104FA-3KTTT
REG104FA-3KTTTG3
REG104FA-5
ACTIVE
ACTIVE
NRND
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Call TI
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
ACTIVE
NRND
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
ACTIVE
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
OBSOLETE DDPAK/
TO-263
TBD
REG104FA-5/500
REG104FA-5/500G3
REG104FA-5KTTT
REG104FA-A
ACTIVE
ACTIVE
ACTIVE
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Call TI
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
OBSOLETE DDPAK/
TO-263
TBD
REG104FA-A/500
REG104FA-AKTTT
REG104GA-2.5
ACTIVE
ACTIVE
NRND
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
78 Green (RoHS &
no Sb/Br)
REG104GA-2.5/2K5
REG104GA-2.5G4
REG104GA-2.7
NRND
2500 Green (RoHS &
no Sb/Br)
ACTIVE
ACTIVE
ACTIVE
78 Green (RoHS &
no Sb/Br)
78 Green (RoHS &
no Sb/Br)
REG104GA-2.7G4
78 Green (RoHS &
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Nov-2005
Orderable Device
REG104GA-3
Status (1)
NRND
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-223
DCQ
6
6
6
6
6
78 Green (RoHS &
no Sb/Br)
Call TI
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Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
REG104GA-3.3
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-223
SOT-223
SOT-223
SOT-223
DCQ
DCQ
DCQ
DCQ
78 Green (RoHS &
no Sb/Br)
REG104GA-3.3/2K5
REG104GA-3.3/2K5G4
REG104GA-3.3G4
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
78 Green (RoHS &
no Sb/Br)
REG104GA-3/2K5G4
REG104GA-3G4
ACTIVE
ACTIVE
SOT-223
SOT-223
DCQ
DCQ
6
6
TBD
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78 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
REG104GA-5
REG104GA-5/2K5
REG104GA-5/2K5G4
REG104GA-5G4
REG104GA-A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
SOT-223
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
DCQ
6
6
6
6
6
6
6
78 Green (RoHS &
no Sb/Br)
Call TI
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Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
78 Green (RoHS &
no Sb/Br)
78 Green (RoHS &
no Sb/Br)
REG104GA-A/2K5
REG104GA-A/2K5G4
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
28-Nov-2005
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Addendum-Page 3
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