RF37S114HTFJB [TI]
Tag-it HF-I 5 类 NFC,ISO15693 应答器,4mm × 4mm | TFJ | 0 | -25 to 70;型号: | RF37S114HTFJB |
厂家: | TEXAS INSTRUMENTS |
描述: | Tag-it HF-I 5 类 NFC,ISO15693 应答器,4mm × 4mm | TFJ | 0 | -25 to 70 电信 电信集成电路 |
文件: | 总9页 (文件大小:560K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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RF37S114
ZHCSEP8 –NOVEMBER 2015
RF37S114 Tag-it™ HF-I 5 类 NFC,ISO/IEC 15693 应答器,4mm ×
4mm
1 器件概述
1.1 特性
1
• ISO/IEC 15693-2,ISO/IEC 15693-
3,ISO/IEC 18000‑3,NFC 标签类型 5
• 256 位用户存储器,分为八个 32 位存储块
• 应用系列标识符 (AFI)
• 集成天线
• 快速同步识别(防冲突)
• 13.56MHz 工作频率
1.2 应用
•
•
产品认证
•
•
资产管理
医疗
供应链管理
1.3 说明
TI 的 Tag-it™HF-I 5 类 NFC 应答器符合 ISO/IEC 15693 和 ISO/IEC 18000-3 全球开放式标准。本产品具有
用户可访问的 256 位存储器,分为 8 个存储块,并且拥有一个经过优化的命令集。本应答器产品随附集成
天线,因此可直接应用,无需连接外部天线。
(1)
器件信息
封装
部件号
RF37S114HTFJB
封装尺寸
RFIDP (0)
4mm × 4mm × 0.66mm
(1) 要获得最新的器件、封装和订购信息,请参见封装选项附录(节 6)。
应答器如图 1-1 所示。
图 1-1. RF37S114HTFJB 应答器
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SCBS907
RF37S114
ZHCSEP8 –NOVEMBER 2015
www.ti.com.cn
内容
1
器件概述.................................................... 1
1.1 特性 ................................................... 1
1.2 应用 ................................................... 1
1.3 说明 ................................................... 1
修订历史记录............................................... 2
Specifications ............................................ 3
3.1 Absolute Maximum Ratings .......................... 3
3.2 ESD Ratings.......................................... 3
3.3 Recommended Operating Conditions ................ 3
3.4 Electrical Characteristics ............................. 3
3.5 Physical Characteristics .............................. 3
Detailed Description..................................... 4
4.1 Supported Command Set ............................ 4
4.2 Memory Organization................................. 4
器件和文档支持............................................ 5
5.1 器件支持 .............................................. 5
5.2 文档支持 .............................................. 6
5.3 社区资源 .............................................. 6
5.4 商标 ................................................... 6
5.5 静电放电警告 ......................................... 7
5.6 出口管制提示 ......................................... 7
5.7 Glossary .............................................. 7
机械、封装和可订购信息 ................................. 7
5
2
3
6
4
2 修订历史记录
日期
修订版本
注释
2015 年 11 月
*
最初发布版本
2
修订历史记录
Copyright © 2015, Texas Instruments Incorporated
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Product Folder Links: RF37S114
RF37S114
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ZHCSEP8 –NOVEMBER 2015
3 Specifications
3.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
MIN
–25
–40
MAX
70
UNIT
°C
TA
Operating temperature
Storage temperature
TSTG
85
°C
3.2 ESD Ratings
Device is fully encapsulated and protected. No ESD classification applies.
3.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
TA
Operating temperature
–25
70
°C
3.4 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
RF37S114HTFJB
Supported standard
ISO/IEC 15693-2, ISO/IEC 15693-3, ISO/IEC 18000-3
Recommended operating frequency
Typical read activation field strength (at 25°C)
Typical write activation field strength (at 25°C)
Factory programmed read-only number
Memory (user programmable)
13.56 MHz
136.0 dBµA/m
136.0 dBµA/m
64 bits
256 bits organized in eight 32-bit blocks
Typical programming cycles (at 25°C)
Data retention time (at 55°C)
100000
>10 years
Simultaneous identification of tags
Up to 50 tags per second (reader and antenna dependent)
3.5 Physical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
RF37S114HTFJB
Dimensions
4 mm × 4 mm × 0.66 mm ±0.1 mm
Copyright © 2015, Texas Instruments Incorporated
Specifications
3
Submit Documentation Feedback
Product Folder Links: RF37S114
RF37S114
ZHCSEP8 –NOVEMBER 2015
www.ti.com.cn
4 Detailed Description
4.1 Supported Command Set
Table 4-1 summarizes the ISO/IEC 15693 mandatory and optional commands that are supported by this
transponder.
Table 4-1. Supported Command Set (ISO/IEC 15693 Mandatory and Optional Commands)
(1)
REQUEST MODE
REQUEST
Inventory
REQUEST
CODE
OPTIONAL
FLAG
INVENTORY
ADDRESSED
NONADDRESSED
AFI
0x01
0x02
0x20
0x21
0x22
✓
✗
✗
✗
✗
✗
✗
✗
✓
✗
✗
✗
✗
0/–
0/–
–/1
–/1
–/1
Stay Quiet
✓
✓
✓
✓
Read_Single_Block
Write_Single_Block
Lock_Block
✓
✓
✓
(1) ✓ = Implemented, ✗ = Not applicable
4.2 Memory Organization
Figure 4-1 shows the organization of the user-accessible memory on this transponder.
32 bits
Lock
Bit
Block
Address
0x00
0x01
0x02
0x03
0x04
User data
(256 bits)
0x05
0x06
0x07
UID Number
(64 bits)
0x08
0x09
X
0x0A
AFI
Figure 4-1. Memory Organization
4
Detailed Description
版权 © 2015, Texas Instruments Incorporated
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产品主页链接: RF37S114
RF37S114
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ZHCSEP8 –NOVEMBER 2015
5 器件和文档支持
5.1 器件支持
5.1.1 开发支持
5.1.1.1 入门和下一步
德州仪器 (TI) 的 RFID 产品可为各类应用提供终极 解决方案。TI RFID 采用 HDX 专利技术,可在读取范
围、读取速率以及稳健性等方面提供无与伦比的性能。TI 提供应答器、嵌体、阅读器模块和阅读器集成电路
(IC) 的一站式采购。更多信息,请参见 NFC / RFID 概述页面。
5.1.2 器件命名规则
为了标明产品开发周期的阶段,TI 为所有器件的部件号分配了前缀。每个商业系列成员都具有以下三个前缀
中的一个:x、p或无前缀(例如,xRF37S114HTFJB)。这些前缀代表了产品开发的发展阶段:从工程原
型(前缀 x)直到完全合格的生产器件和工具(无前缀)。
器件开发进化流程:
xRF... – 试验器件不一定代表最终器件的电气技术规格
pRF... – 最终器件符合最终产品的电气技术规格,但是未经完整的质量和可靠性验证
RF... – 完全合格的生产器件
具有 x 或 p 前缀的器件供货时附带如下免责声明:
“开发的产品用于内部评估用途。”
生产器件已进行完全特性化,并且器件的质量和可靠性已经完全论证。TI 的标准保修证书适用。
预测显示原型器件的故障率大于标准生产器件。由于这些器件的预计最终使用故障率仍未定义,德州仪器
(TI) 建议不要将它们用于任何生产系统。只有合格的生产器件将被使用。
TI 器件的命名规则也包括一个带有器件系列名称的后缀。该后缀包括封装类型(例如 TEL)以及可选项温度
范围(例如 T)。图 5-1 提供了读取任一系列产品成员完整器件名称的图例。
RF 37 S 114 H TFJ
B
Packing
Package
Temperature
Form Factor
Device Family
Function Type
Family
Form Factor
RF = Integrated circuit
37 = Family
Device Family
Function Type
S = Security
Family
114 = Device Type
Temperature Range
Package
H = –25°C to 70°C
TFJ = RFIDP
B = Bulk
Packing
图 5-1. 器件命名规则
5.2 文档支持
版权 © 2015, Texas Instruments Incorporated
器件和文档支持
5
提交文档反馈意见
产品主页链接: RF37S114
RF37S114
ZHCSEP8 –NOVEMBER 2015
www.ti.com.cn
以下文档对 RF37S114HTFJB 器件进行了介绍。www.ti.com 网站上提供了这些文档的副本。
SPAT178
RFID 系统产品技术规格。 德州仪器 (TI) 射频识别系统是射频识别 (RFID) 技术的行业领导
者,也是全球领先的 TI-RFid™标签、TI-RFid 智能标签和 TI-RFid 阅读器系统集成制造商。TI
制造的 RFID 标签已达 10 亿以上,TI-RFid 技术广泛出现在 全球范围内的 RFID 应用中。TI
是许多标准化机构中的活跃成员,其中包括 ISO、ISO/IEC、ECMA International、ETSI 以及
其他几个推广 RFID 技术全球标准的国家标准化机构。
5.3 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术
规范,并且不一定反映 TI 的观点;请参见 TI 的《使用条款》。
TI E2E™ 在线社区
TI 工程师间 (E2E) 社区。 此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中,您可以咨询问题、共享知识、探索思路,在同领域工程师的帮助下解决问题。
5.4 商标
Tag-it, TI-RFid, E2E are trademarks of Texas Instruments.
6
器件和文档支持
版权 © 2015, Texas Instruments Incorporated
提交文档反馈意见
产品主页链接: RF37S114
RF37S114
www.ti.com.cn
ZHCSEP8 –NOVEMBER 2015
5.5 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
5.6 出口管制提示
接收方同意:如果美国或其他适用法律限制或禁止将通过非披露义务的披露方获得的任何产品或技术数据
(其中包括软件)(见美国、欧盟和其他出口管理条例之定义)、或者其他适用国家条例限制的任何受管制
产品或此项技术的任何直接产品出口或再出口至任何目的地,那么在没有事先获得美国商务部和其他相关政
府机构授权的情况下,接收方不得在知情的情况下,以直接或间接的方式将其出口。
5.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
6 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知
且不对本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。
版权 © 2015, Texas Instruments Incorporated
机械、封装和可订购信息
7
提交文档反馈意见
产品主页链接: RF37S114
PACKAGE OPTION ADDENDUM
www.ti.com
23-Sep-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
RF37S114HTFJB
ACTIVE
RFIDN
TFJ
0
5000
RoHS &
non-Green
Call TI
Level-1-260C-UNLIM
-25 to 70
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
重要声明和免责声明
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