RF430FRL152HEVM [TI]

RF430FRL152HEVM Users Guide;
RF430FRL152HEVM
型号: RF430FRL152HEVM
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
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RF430FRL152HEVM Users Guide

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User's Guide  
SLAU607CDecember 2014Revised July 2018  
RF430FRL152HEVM User's Guide  
This document is a description of the RF430FRL152HEVM product that is designed to fully explore all of  
the capabilities that the RF430FRL152H device offers. To more easily experiment with all of the features  
of the device and the firmware that is in the ROM, a PC application is available, and its use is also  
described here, including software and driver installation.  
The family of RF430RL15xH devices includes the RF430FRL152H, RF430FRL153H, and  
RF430FRL154H.  
Contents  
1
Introduction ................................................................................................................... 3  
1.1  
1.2  
1.3  
1.4  
1.5  
1.6  
Overview ............................................................................................................. 3  
What is Included .................................................................................................... 4  
Required Additional Tools ......................................................................................... 4  
Recommended Additional Equipment............................................................................ 6  
Installation of the Software and Drivers.......................................................................... 6  
Update the EVM Firmware ........................................................................................ 6  
2
Hardware Description ....................................................................................................... 7  
2.1  
2.2  
2.3  
Block Diagram....................................................................................................... 7  
Hardware Overview................................................................................................. 8  
Hardware Configurations .......................................................................................... 8  
3
4
GUI Introduction ............................................................................................................ 10  
Overview..................................................................................................................... 11  
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
4.8  
4.9  
Connection to the EVM........................................................................................... 11  
Typical Sequence ................................................................................................. 11  
Setup Tab .......................................................................................................... 12  
Demo Mode Tab................................................................................................... 13  
General Device Configuration Tab.............................................................................. 14  
Sensor Configuration Tab........................................................................................ 17  
Alarm Control Tab................................................................................................. 18  
Sensor Threshold Configuration Tab ........................................................................... 19  
View Sensor Data Tab............................................................................................ 20  
5
Setup of Demo System.................................................................................................... 21  
5.1  
5.2  
5.3  
Set up the RF430FRL152HEVM With Sensor Hub Demo Using the PC.................................. 21  
Set up the RF430FRL152HEVM Demo Using the PC ....................................................... 22  
Using the PC Application for Advanced Custom Control of the RF430FRL152HEVM .................. 23  
6
7
Changing Firmware System Settings.................................................................................... 26  
Over-the-Air Programming ................................................................................................ 27  
7.1  
7.2  
RF430FRL152HEVM Schematics........................................................................................ 30  
References .................................................................................................................. 34  
Procedure .......................................................................................................... 27  
Generating a TXT File ............................................................................................ 28  
8
9
List of Figures  
1
2
3
4
RF430FRL152HEVM........................................................................................................ 4  
MSP-EXP430G2 LaunchPad Development Kit With TRF7970A BoosterPack Plug-in Module................... 4  
MSP-EXP430G2 Jumper Settings......................................................................................... 5  
TRF7970AEVM .............................................................................................................. 5  
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5
Sensor Hub BoosterPack Plug-in Module................................................................................ 6  
RF430FRL152HEVM Block Diagram ..................................................................................... 7  
RF430FRL152HEVM Hardware ........................................................................................... 8  
PC Application .............................................................................................................. 10  
Setup Tab ................................................................................................................... 12  
Demo Tab ................................................................................................................... 13  
General Device Configuration Tab....................................................................................... 14  
Sensor Configuration Tab................................................................................................. 17  
Alarm Control Tab.......................................................................................................... 18  
Sensor Threshold Configuration ......................................................................................... 19  
View Sensor Data Tab..................................................................................................... 20  
BoosterPack Plug-in Module Configuration............................................................................. 21  
Position the EVMs.......................................................................................................... 23  
Custom Sensor Configuration Tab ...................................................................................... 24  
Custom General Device Configuration .................................................................................. 25  
Custom View Data ......................................................................................................... 25  
System Tab ................................................................................................................. 26  
RF Programming ........................................................................................................... 27  
RF Programming Completed ............................................................................................. 28  
CCS TXT Generation...................................................................................................... 28  
IAR TXT Generation ....................................................................................................... 29  
MCU Section Schematic .................................................................................................. 30  
I2C or SPI Translators Section Schematic .............................................................................. 31  
JTAG Section Schematic.................................................................................................. 32  
Power Section Schematic................................................................................................. 33  
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
Trademarks  
BoosterPack, MSP430, LaunchPad are trademarks of Texas Instruments.  
All other trademarks are the property of their respective owners.  
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Introduction  
1
Introduction  
The RF430FRL152HEVM, including the user software, is a complete evaluation platform to evaluate the  
key features of the of the RF430FRL15xH devices:  
Passive communication and sensor measurement using ISO/IEC 15693  
Can program user code to FRAM memory through JTAG  
Collect sensor measurements over I2C using the Sensor Hub BoosterPack™ plug-in module  
(BOOSTXL-SENSHUB)  
Can develop drivers for custom digital sensors  
Interfaces with the PC GUI application to fully experiment with application functionality  
1.1 Overview  
To start evaluating the RF430FRL152H device, an RF430FRL152HEVM is available. This evaluation  
board allows you to experiment with all of the capabilities of the low-voltage (1.5-V) dynamic tag with an  
MSP430™ core.  
Because this dynamic tag uses ISO/IEC 15693 (NFC-capable) passive communication, it needs an  
ISO/IEC 15693 reader/writer to explore its full capabilities. To evaluate the device, TI recommends that  
you use the MSP-EXP430G2 LaunchPad development kit with the TRF7970A BoosterPack plug-in  
module and the PC application for the RF430FRL152HEVM. Alternate options include the TRF7970AEVM  
(which is no longer available from TI) or a custom NFC/RFID-capable handset.  
Features and benefits of the RF430FRL152H MCU include:  
ISO/IEC 15693 RF interface  
Low-voltage MSP430 MCU (L092 based)  
Nonvolatile low-power FRAM memory (2KB)  
Sigma-delta 14-bit analog-to-digital converter  
Single-cell battery (1.5-V) operation  
Can run batteryless from RF scavenged energy provided by NFC/RFID reader  
Supports temperature measurement using a thermistor  
Single-chip solution for a contact-less sensor  
The RF430FRL152HEVM is a development platform to evaluate the capabilities of the RF430FRL15xH  
devices and allows experimenting with all the features of the RF430FRL152H.  
Integrated PCB antenna  
Power over RF, battery, or USB  
Onboard thermistor and reference resistor for temperature measurement  
Onboard light sensor  
NFC/RFID ISO 15693 communication with NFC/RFID enabled reader/writer or smart phone  
Connector to enable compatibility with TI LaunchPad™ development kits and BoosterPack plug-in  
modules  
JTAG header for connection of MSP430-FET Emulation tool for programming  
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Introduction  
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1.2 What is Included  
RF430FRL152HEVM (see Figure 1)  
USB cable  
Quick start guide  
1.2.1  
RF430FRL152HEVM  
Figure 1 shows an RF430FRL152HEVM.  
Figure 1. RF430FRL152HEVM  
1.3 Required Additional Tools  
RF430FRL152HEVM Windows GUI  
TRF7970A-BNDL: MSP-EXP430G2 LaunchPad development kit with TRF7970A BoosterPack plug-in  
module to communicate with the RF430FRL152HEVM  
OR  
TRF7970AEVM (no longer available for purchase from TI)  
1.3.1  
MSP-EXP430G2 LaunchPad Development Kit With TRF7970A BoosterPack Plug-in Module  
The TRF7970A-BNDL bundle is the recommended evaluation method and it is fully supported by the  
latest version of the RF430FRL152HEVM PC GUI.  
Figure 2. MSP-EXP430G2 LaunchPad Development Kit With TRF7970A BoosterPack Plug-in Module  
To be used with the demo GUI, the MSP-EXP430G2 must be programmed with a special binary image  
(TRF7970A_BoosterPack_MSP430G2.out). This binary image can be found in the Debug folder of the zip  
file available at www.ti.com/lit/zip/sloc346.  
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Introduction  
TI recommends using a tool like UniFlash to easily program the MSP430 MCU with the binary image.  
Make sure to configure the jumpers as shown in Figure 3, for "HW UART".  
Figure 3. MSP-EXP430G2 Jumper Settings  
TRF7970AEVM  
1.3.2  
Figure 4 shows a TRF7970AEVM. If the TRF7970AEVM firmware has not been changed since purchase,  
no code updates are necessary. If there are communication issues with the RF430FRL152HEVM, make  
sure that the TRF7970AEVM is programmed with the default EVM firmware, which can be downloaded  
from http://www.ti.com/lit/zip/sloc300.  
Figure 4. TRF7970AEVM  
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1.4 Recommended Additional Equipment  
Optional recommended equipment:  
SensorHub Booster Pack  
MSP430 FET tool for code development, programming and debugging the device over JTAG  
1.4.1  
Sensor Hub BoosterPack Plug-in Module  
Figure 5 shows the Sensor Hub BoosterPack plug-in module. This EVM has temperature, humidity, and  
light sensors. There is demo firmware showing how to use each of these sensors. This board can be used  
as a reference to develop custom functionality for digital sensors in an application.  
Figure 5. Sensor Hub BoosterPack Plug-in Module  
1.5 Installation of the Software and Drivers  
The most recent PC GUI and user's guide are available at www.ti.com/tool/RF430FRL152HEVM.  
To install the PC GUI:  
1. Download the RF430FRL152HEVM Windows GUI file to the PC.  
2. Run the executable and follow the prompts to install the software.  
3. To run the application click on the Start menu, All Programs, then the Texas Instruments folder, then  
the "RF430FRL152HEVM Application" and finally the "RF430FRL152H GUI Interface" program.  
The USB drivers for the TRF7970AEVM are available from the Silicon Labs website.  
1.6 Update the EVM Firmware  
The RF430FRL152HEVM comes loaded with firmware. However, updated firmware with fixes for the latest  
known erratas is available. Download this firmware from www.ti.com/lit/zip/slac691, and load the  
SensorHub example to have the same functionality as in the EVM.  
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Hardware Description  
2
Hardware Description  
2.1 Block Diagram  
Figure 6 shows the EVM block diagram.  
3.3 V  
1.5 V  
FET Tool  
Programmer  
Connector  
3.3V  
JTAG Level  
Translators  
MOSFET  
INT  
LaunchPad BoosterPack  
Headers  
ë55{í ^1_  
Db5 ^0_  
ë55{í ^1_  
Db5 ^0_  
ë55{í ^1_  
Db5 ^0_  
INT_3V3  
^!0_(S5)  
ALARM  
LED  
SV10  
SV9  
^!1_ (S4)  
1
2
1
2
POWER_3V3  
RF430_RST  
GND  
^a/{_ (S3)  
3
3
4
4
5
5
INT_3V3  
BPACK_SDA  
BPACK_SCL  
6
7
8
6
7
8
BPACK_CLK  
BPACK_CS  
9
10  
9
10  
ANT 1  
ANT 2  
RF  
Light Sensor  
VDDSW  
ADC0  
0
RF430FRL152H  
BPACK_CS  
BPACK_CLK  
Level  
Translator  
P1.3/SPI_CS  
P1.2/SPI_CLK  
SVSS  
ADC2  
ADC1  
Thermistor  
Reference Resistor  
BPACK_SCL  
BPACK_SDA  
Level  
Translator  
P1.1/MISO/SCL  
P1.0/MOSI/SDA  
VDDB  
VDDSW  
Jumper  
SV7  
USB  
Mini  
Connector  
Power From  
MSP-FET  
Power  
Chooser  
3.3-V LDO  
3.3 V  
5 V  
1.5-V LDO  
POWER LED  
VDDB ^{µ‰‰oÇ_  
^.ꢀššꢁŒÇ_  
S6  
Figure 6. RF430FRL152HEVM Block Diagram  
The EVM board can be powered by RF scavenged energy, battery, FET emulator tool, or USB power.  
When powered through the USB connection or an MSP-FET emulation tool, switch S6 must be set to  
"Supply". If the EVM is powered by scavenged RF energy or a battery, switch S6 must be set to  
"Battery".  
Level translators are used on I2C, SPI, and FET emulator interfaces.  
The power (green) LED should turns on only when the board is powered by a USB connection.  
Jumper SV7 is needed to bypass the internal battery switch and provide power directly to the core.  
This jumper should be populated for most use cases.  
When the EVM is powered by the USB connection, the Alarm LED briefly flashes at power-up or stays  
illuminated if there is an interrupt from the RF430FRL152H. It is normal for the Alarm LED to stay lit  
during MSP-FET tool programming.  
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2.2 Hardware Overview  
Figure 7 shows an overview of the RF430FRL152HEVM hardware.  
Figure 7. RF430FRL152HEVM Hardware  
2.3 Hardware Configurations  
2.3.1  
Passive (Unpowered) Operation  
In this mode, the RF430FRL152H is powered entirely from the RF field generated by the reader.  
1. Set S6 to "Battery".  
2. Set S3 to "S" (slave mode).  
3. Make sure that USB and the MSP-FET emulation tool are not connected.  
4. Place the EVM antenna on top of a NFC reader/writer to communicate.  
Neither the "Alarm" or the "Power" LEDs illuminate in this mode of operation at any time. At this time a  
NFC/RFID reader may be used to communicate to the RF430FRL152HEVM.  
2.3.2  
Debugging or Programming  
The following instructions show how to program the FRAM memory or debug the RF430FRL152H using a  
MSP-FET emulation tool. In this configuration the EVM is powered by the MSP-FET emulation tool.  
1. Set switch S6 (near the BoosterPack plug-in module headers) to "Supply".  
2. Connect the MSP-FET430 emulation tool to the JTAG header, SV2.  
3. Start a debug session using IAR or CSS IDE.  
4. Connection with the USB cable is not necessary for debugging or programming the RF430FRL152H.  
Note: The Alarm LED may be illuminated during the debugging process if the USB cable is connected.  
This is normal behavior.  
Note: If the USB cable is not connected, the power LED (U5) and the Alarm LED (7) are not illuminated  
even if the emulation tool is connected. This is normal behavior.  
The MSP-FET emulation tool can be used to program or debug the EVM at this point.  
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2.3.3  
Using a BoosterPack Plug-in Module or Digital Sensors  
An example of this use case is using the Sensor Hub BoosterPack plug-in module. In this configuration  
the EVM is powered by the USB connection.  
1. Set switch S6 (near the BoosterPack plug-in module headers) to "Supply".  
2. Set switch S3 to "M" (master mode).  
3. Attach the BoosterPack plug-in module on top of the EVM, making sure it is in the correct orientation  
(pin 1 on the EVM matches pin 1 on the BoosterPack plug-in module headers).  
4. Connect the USB cable to either the BoosterPack plug-in module or the RF430FRL152HEVM.  
Note: When the USB cable is attached, the power LED (U5) stays illuminated. The Alarm LED (U7) should  
momentarily illuminate and then turn off.  
Now the TRF7970AEVM can be used to communicate to the part and initiate samples of the various  
sensors.  
2.3.4  
Using a Host Controller  
In this mode, the host LaunchPad development kit is connected underneath the RF430FRL152HEVM.  
Make sure the orientations match.  
1. Set switch S6 (near the BoosterPack plug-in module headers) to "Supply" setting.  
2. Set S3 to "S" (slave mode).  
3. For a host that uses I2C, S5 and S4 determine the two least significant bits of the I2C slave address for  
the RF430FRL152H. For most cases, set these switches to the "0" positions.  
4. For a host that uses SPI, S5 and S4 determine the SPI mode. For most cases, set these switches to  
the "0" positions.  
5. Set S5 or S4 to desired setting at this time.  
6. Connect the LaunchPad development kit and the EVM together.  
7. Power either the LaunchPad development kit or the EVM by connecting either to a USB cable.  
Note: When the USB cable is attached, the power LED (U5) stay illuminated. The Alarm LED (U7) should  
momentarily illuminate and then turn off.  
2.3.5  
Powering the EVM Using a Battery  
1. Insert an SR66 1.5-V battery into the battery holder (BAT1).  
2. Note: The first time that a battery is inserted, the battery holder may be tight. Carefully holding the  
board with a flat object, firmly slide in the battery. Make sure that the positive side of the battery is  
facing the positive (or top) side of the battery holder.  
3. Set S6 to "Battery".  
4. If the battery switch is open (the battery switch is inside the RF430FRL152H), SV7 needs to have a  
jumper to power the part. If the battery switch is closed, then SV7 does not need a jumper to power the  
RF430FRL152H.  
Note: In this mode, the alarm and power LEDs are not illuminated. The device is still powered and  
operational.  
Note: Also if S5, S4, or S3 positions are changed after powering the EVM, a reset is required for the  
changed settings to take effect. This can be done through the PC GUI or by pressing the reset switch  
(S2).  
Note: If a battery is installed and another configuration (for example, debugging or using a BoosterPack  
plug-in module) is required, set switch S6 to "Supply" to disconnect the battery and not drain it.  
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GUI Introduction  
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3
GUI Introduction  
Figure 8 shows the Setup tab.  
Figure 8. PC Application  
Table 1. GUI Tabs  
Name  
Contents and Functions  
Explains how to configure the system.  
Setup  
Using an RF430FRL152HEVM, this tab allows automatic setup, measurement, and display of  
the thermistor and light sensor's measurements with one click of a button.  
Demo Mode  
Controls that allow starting the sampling process, choosing the sensors to be used, and  
selecting the sampling frequency, among other options.  
General Device Configuration  
Sensor Configuration  
Alarm Control  
Settings for the ADC for each analog sensor and also advanced settings.  
Settings for enabling and disabling the alarm settings.  
Sensor Threshold Configuration  
View Sensor Data  
System  
Settings for alarm thresholds for each sensor.  
After a sampling process has completed, this tab allows the user to view the logged data.  
Settings to the system control register can be made here.  
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Overview  
4
Overview  
This section describes the meaning of each of the options on each tab. Remember, checking an option  
does not immediately cause that option to be set. It is only set after a "Write" button click is performed.  
Any changes that have occurred on the part, like new status, will not be visible until a "Read" button click  
has been done.  
4.1 Connection to the EVM  
Before any configuration can be done to the device using this application, a serial connection must be  
established. This can be done with the controls on the bottom of the application.  
There is a drop-down list in which either a particular port can be chosen, if it is already known, or an  
automatic selection can be chosen.  
When this is done, click on "Connect to TRF7970AEVM". If the connection succeeds, the text of the button  
changes to "Disconnect from TRF7970AEVM".  
If the EVM is plugged in after the application starts, then the drop-down list does not have the currently  
available COM port selection. Click on the "Update" button to update the list.  
4.2 Typical Sequence  
In a typical sequence (for example, to do a thermistor measurement) follow these steps. These steps are  
more fully described in the RF430FRL15xH Firmware User's Guide.  
1. Configure the thermistor measurement parameters:  
1. Select the thermistor sensor.  
2. Set how many times it needs to be sampled.  
3. If sampled more than one time, select the delay between the samples.  
4. Select the ADC configuration (resolution, PGA setting, and type of filter).  
These settings are written to the virtual registers in the FRAM memory using RF communication.  
2. Write the start bit in the control register to start the sampling process.  
3. There is a delay while the sampling process is being performed.  
4. After sampling is complete, the requested measurements are stored into the log memory, typically  
FRAM (after the virtual registers).  
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4.3 Setup Tab  
1. Select the board that is being used in "Interface Device Selection".  
2. Select the device that is being tested in "Target Device Selection".  
3. If the RF430FRL152HEVM is selected, an option to select whether or not a Sensor Hub BoosterPack  
plug-in module is being used is presented. Make the selection (see Figure 9).  
Figure 9. Setup Tab  
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Overview  
4.4 Demo Mode Tab  
Using this page a user can easily run a sensor acquisition. After positioning the boards as shown on the  
Setup tab, then pressing the "Start Demo" button, measurement will be started and temperature data and  
other sensor data like light intensity will be shown (see Figure 10).  
Figure 10. Demo Tab  
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4.5 General Device Configuration Tab  
Figure 11 shows the "Gen. Device Config" tab.  
Figure 11. General Device Configuration Tab  
1. Start Sampling Process  
Setting this bit causes the application ROM code to start the sampling process of all the sensors that  
were selected, based on all of the configurations.  
2. LPM3 and LPM4  
Selects which power mode is used when the device enters idle mode.  
3. Control Battery Switch and Close Battery Switch  
Controls the state of the battery switch on the device. To change the state, check "Control Battery  
Switch" and then to close the battery switch, check "Close Battery Switch". Otherwise, leave it  
unchecked, and the battery switch is set to open. The "Control Battery Switch" option is reset after the  
command is executed by the application ROM code.  
4. ISO 15693 Send Data  
Allows sending of raw ISO/IEC 15693 commands. Disabled in the current version of the GUI.  
5. Control Interrupt and Set Interrupt  
Controls the state of the external interrupt on the device. To change the state, check "Control  
Interrupt", and then to set the interrupt, check "Set Interrupt". Otherwise, leave it unchecked, and the  
interrupt and the associated flags are cleared. The "Control Interrupt" option is reset after the  
command is executed by the application ROM code. To generate an external interrupt manually with  
the GUI, more settings must be done using the "External Interrupt Control"  
6. Reset  
Causes a PUC (a reset) to be generated on the device. The connection is maintained.  
7. Status Register  
This group box displays any interrupt or status that have occurred on the device.  
Reset all status flags on next write resets all status to idle mode after the tab write.  
8. Sensor Control Register  
Allows the selection of any sensor to be sampled. Selection of one or multiple sensors is possible.  
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Overview  
9. Reference / ADC1 Sensor  
Analog Input. If "Using Thermistor", check 11. This causes the input to be configured for an external  
reference resistor measurement. Otherwise, it can function as a stand-alone generic analog sensor  
(ADC1).  
10. Thermistor / ADC2 Sensor  
Analog Input. If "Using Thermistor", check 11. This causes the input to be configured for an external  
thermistor measurement. Otherwise, it can function as a stand-alone generic analog sensor (ADC2).  
11. Using Thermistor  
If using a thermistor, this option must be selected for the application ROM code to properly set up the  
measurement.  
12. ADC0 / Light Sensor  
When using a RF430FRL152HEVM, this is an option to sample the light sensor. Otherwise, it is a  
generic analog sensor (ADC0).  
13. Internal Temperature Sensor  
Allows sampling of the internal temperature sensor on the part.  
14. Digital Sensor 1  
If using the RF430FRL152HEVM together with the Sensor Hub BoosterPack plug-in module, this  
samples the SHT21 temperature sensor. Otherwise, it is an option to sample a generic digital sensor.  
15. Digital Sensor 2  
If using the RF430FRL152HEVM together with the Sensor Hub BoosterPack plug-in module, this  
samples the SHT21 humidity sensor. Otherwise, it is an option to sample a generic digital sensor.  
16. Digital Sensor 3  
If using the RF430FRL152HEVM together with the Sensor Hub BoosterPack plug-in module, this  
option samples the ISL29023 light sensor. Otherwise, it is an option to sample a generic digital sensor.  
17. Number of Passes Register  
One pass is sampling all of the selected sensors one time.  
18. Averaging Register  
Any value higher than 1 causes that many samples to be averaged into one result. Averaging mode in  
the "Alarm Control" tab selects the type of averaging used per sensor.  
19. Frequency Register  
Selects the delay to be made in between each of the sampling passes. Note this delay must not be  
less than the time to complete sampling all of the sensors one time. If it is less, then a "collision"  
occurs.  
20. More Registers  
This advanced section is not required in most cases. However, it is described below.  
Gating option to enable the external GPIO interrupt.  
21. Interrupt Assert Level  
The level to be driven or pulled to if there is an interrupt  
22. Interrupt Drive State  
Determines if the device drives an interrupt or is high impedance (user must provide the appropriate  
pullup or pulldown resistor).  
23. Bus Test Mode Enable  
Allows access to protected memory using an I2C or SPI host.  
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24. Check For Unexpected Reset  
If this option is selected, and an unexpected reset occurs, the reset code is logged at the end of the  
logging memory.  
25. Disconnect Battery At Sampling End  
When the sampling process has been completed, this option causes the ROM code to open the battery  
switch.  
26. End of Sampling External Interrupt Enable  
When the sampling process has completed, this option causes an external interrupt to be generated.  
27. Voltage Levels Alert  
When these are set, it indicates that the voltage levels have gone too low on a particular rail at some  
point. Not self clearing.  
28. BIP8 Control  
Error detection for I2C or SPI protocol  
29. Infinite Sampling  
Samples until the "Start Sampling Process" option is unchecked.  
30. Enable Watchdog  
Enables the watchdog during a sampling process.  
31. RAM Storage Enable  
Writes sampling results into RAM memory instead of FRAM.  
32. Read only this tab  
Reads Gen. Device Config and populates the results on this tab.  
33. Write only this tab  
Writes Gen. Device Config with all of the settings on this tab.  
34. Read All Tabs  
Reads all of the information on all of the tabs from the virtual FRAM registers in the device using RF  
and populates the fields in the tabs.  
35. Write All Tabs  
Writes all of the information to the virtual FRAM registers in the device over RF from all of the settings.  
NOTE: Settings made on the following tabs do not take effect until a "Write only this tab" or "Write  
All Tabs" button is clicked:  
Gen. Device Config.  
Sensor Config.  
Alarm Control  
Sensor Threshold Config.  
Likewise, the settings on these tabs are not updated until a "Read only this tab" or "Read All  
Tabs" button is clicked.  
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4.6 Sensor Configuration Tab  
The options for the four different analog sensors can be controlled from this tab (see Figure 12). The  
options can be changed only if the corresponding sensor is enabled in the "Gen. Device Config" tab.  
Figure 12. Sensor Configuration Tab  
1. Sensor Configuration Sensor  
Allows control of the analog-to-digital configuration for a particular sensor.  
2. Gain  
Selects the programmable gain amplifier (PGA) before the ADC.  
3. Filter Type  
Select the filter to be used.  
4. Oversampling  
Determines the resolution and time of the sample.  
5. Use Virtual Ground  
If selected, raises the ADC and sensor ground level several hundred millivolts. It is recommended that  
this setting is consistent for all of the sensors.  
6. Initial Delay Enable / Initial Delay (ms)  
Creates a delay of configured time after starting the sampling process.  
7. Enable JTAG  
Because JTAG is normally disabled on the device, and if there is trouble establishing a JTAG  
connection, enabling this option can help establish connection. This setting takes effect only after a  
reset or power cycle.  
8. Number of Blocks Received  
This is a counter that indicates how many ISO/IEC blocks have been received. Can be reset.  
9. Sensor Skip Settings  
Allows control of the duty cycle for a sensor.  
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4.7 Alarm Control Tab  
The alarm control options for the four different analog sensors can be controlled from this tab (see  
Figure 13). The options can be changed only if the corresponding sensor is enabled in the "Gen. Device  
Config" tab.  
Figure 13. Alarm Control Tab  
1. Averaging Mode  
True averaging is done only if the "Average" option is selected. The Lowest or Highest options store  
only the lowest or highest, respectively, sample for the selected sensor. The number of samples done  
before the result is stored is set in the "Averaging Register" setting on the "Gen. Device Config" tab.  
The "First" option stores the first sample of the selected sensor. If averaging is selected, during  
sampling passes after the first sample was stored, the remaining passes will skip this sensor.  
2. Enable Alarm Monitor  
Enables a check for high or low thresholds for a particular sensor. The results are given in the labels  
below.  
3. Enable Alarm Interrupt  
Enables a GPIO interrupt if a high or low threshold has been exceeded. The "Enable Alarm Monitor"  
must also be selected for this to take effect.  
4. Stored Sample Memory  
Defines the length of the logged samples memory section.  
5. Total Number Of Stores  
Reports how many samples were written to the log memory.  
6. Sample Buffer Index  
Reports the index location of the last sample stored.  
7. FRAM Virtual Registers Initialized  
If checked, indicates that the FRAM memory has been initialized.  
8. Reset Status Flags on This Tab On Next Write  
Resets all of the flags on this tab the next time the "Write" button is clicked.  
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9. High Threshold Monitor Enable  
Enables monitoring of that particular sensor for a sample value that exceeds or is equal to the  
threshold value set in "Sensor Threshold Config." tab. If the sample meets that condition, the status for  
that sensor (in the same group box) changes to indicate that condition.  
10. Low Threshold Monitor Enable  
Enables monitoring of that particular sensor for a sample value for that is less than or equal to the  
threshold value set in "Sensor Threshold Config." tab. If the sample meets that condition, the status for  
that sensor (in the same group box) changes to indicate that condition.  
4.8 Sensor Threshold Configuration Tab  
Figure 14 shows the Sensor Threshold Configuration tab. A sensor must be enabled in the "Gen. Device  
Config" tab to allow the Sensor Threshold Configuration tab to change its threshold.  
Figure 14. Sensor Threshold Configuration  
1. Custom Time Register  
Available only if the "Frequency Register" has been set to the "Custom Time" option. Resolution is in  
milliseconds.  
2. High Threshold  
If the sensor sample result meets or exceeds the high threshold set here, an alarm is generated.  
Operation depends on settings in the "Alarm Control" tab.  
3. Low Threshold  
If the sensor sample result is lower or meets the low threshold set here, an alarm is generated.  
Operation depends on settings in the "Alarm Control" tab.  
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4.9 View Sensor Data Tab  
After a sampling process has been completed, the logged data can be viewed using this tab (see  
Figure 15).  
Click the "Read Logged Data" button to display the results in a table to the left of the button. Make sure  
that you do not change any settings on the GUI before clicking the button, because the settings are used  
to determine what type of sampling process occurred.  
Figure 15. View Sensor Data Tab  
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Setup of Demo System  
5
Setup of Demo System  
The following sections describe how to setup a demo with and without the Sensor Hub BoosterPack plug-  
in module, and also for custom configuring and operation of the device.  
5.1 Set up the RF430FRL152HEVM With Sensor Hub Demo Using the PC  
This section describes how to setup and run the Sensor Hub BoosterPack plug-in module demo. With this  
setup, the RF430FRL152HEVM samples over I2C three different sensors on the SensorHub BoosterPack  
plug-in module. They are temperature and humidity (SHT21) and a light sensor (ISL29023). After  
collecting the samples, the data is transmitted over RF to the TRF7970AEVM which reports them to the  
PC application. Finally the results are plotted on the graphs.  
1. Connect the TRF7970AEVM to the PC with a USB cable.  
2. On the RF430FRL152HEVM, use a pencil or pen to position the switches as shown in Table 2  
Table 2. Switch Positions For Sensor Hub Operation  
Switch ID  
Position  
Comment  
S6  
S5  
S4  
S3  
Supply  
This will source power from the USB cable  
Does not matter what state this switch is in  
Does not matter what state this switch is in  
Device starts in I2C/SPI master mode  
0
0
M
3. Attach the Sensor Hub BoosterPack plug-in module on top of the RF430FRL152HEVM. Make sure that  
the orientation is correct (see Figure 16).  
4. Connect the RF430FRL152HEVM to the PC using the provided USB cable. Note that this USB  
connection is only for the power supply, and no data is passed through it.  
5. Position the RF430FRL152HEVM antenna on the antenna portion of the TRF7970AEVM as shown in  
Figure 16. It is recommended to have an insulator between the two antennas or to hold them at a  
distance from each other to prevent any short circuits.  
Figure 16. BoosterPack Plug-in Module Configuration  
6. Open the RF430FRL15xH GUI Interface application by going to the Start menuAll ProgramsTexas  
InstrumentsRF430FRL152H GUI .  
7. Click the "Connect to TRF7970AEVM" button on the bottom of the window.  
8. A few seconds after you click the "Connect" button, the label next to the button should show  
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"Connected to TRF7970AEVM on COMx". If this is not shown, then a connection has not been made.  
In this case, disconnect the TRF7970AEVM and reconnect it, then restart at step 1. If this still does not  
solve the problem, make sure that the TRF7970AEVM has the latest firmware downloaded from the  
TRF7970AEVM tool folder.  
9. In the "Setup Tab", select the "With Sensor Hub BoosterPack" and "RF430FRL152HEVM" options on  
the Device Interface Selection.  
10. Select the "Demo Mode" tab.  
11. Click the "Start Sensor Hub Demo" button.  
12. The GUI starts to plot the temperature and light intensity samples on the graphs.  
1. To plot these values, the PC GUI configures the RF430FRL152HEVM through the TRF7970AEVM  
to take three different samples from the Sensor Hub BoosterPack plug-in module. The  
RF430FRL152HEVM already has the drivers loaded into the FRAM to enable the measurements  
to be made.  
2. When the samples are complete, the PC GUI reads the result from FRAM of the  
RF430FRL152HEVM through the TRF7970AEVM and plots it on the graphs in the PC GUI.  
13. To change the measurements, you can place your hand over the light sensor or heat the thermistor  
(U5).  
5.2 Set up the RF430FRL152HEVM Demo Using the PC  
This section describes how to setup and run the sensor demo. With this setup, the RF430FRL152HEVM  
samples, using the onboard ADC, two external sensors, the thermistor and the light sensor. After  
collecting the samples, the data is transmitted over RF to the TRF7970AEVM which reports them to the  
PC application. Finally the results are plotted on the graphs. In this demo the RF430FRL152HEVM is run  
completely wireless, with no power or data connections.  
1. Connect the TRF7970AEVM to the PC with a USB cable.  
2. On the RF430FRL152HEVM, use a pen or pencil to set the mini-switches as shown in Table 3.  
Table 3. Switch Positions For Passive Operation  
Switch ID  
Position  
Comment  
There is no need for a battery to be present  
Does not matter what state this switch is in  
Does not matter what state this switch is in  
Device starts in I2C/SPI slave mode  
S6  
S5  
S4  
S3  
Battery  
0
0
S
3. The RF430FRL152HEVM should not be connected to a USB cable for this demo. If it is  
connected, set switch S6 to the "Supply" position. The rest of the steps are the same.  
Note: If EnergyTrace technology is used, a USB cable should not be used and the EVM must be  
powered from the MSP-FET tool.  
4. Position the RF430FRL152HEVM antenna on the antenna portion of the TRF7970AEVM as shown in  
Figure 17. It is recommended to have an insulator between the two antennas or to hold them at a  
distance from each other to prevent any short circuits.  
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Figure 17. Position the EVMs  
5. Open the RF430FRL15xH GUI Interface application by going to the Start menuAll ProgramsTexas  
InstrumentsRF430FRL152H GUI .  
6. Press the "Connect to TRF7970AEVM" button on the bottom of the window.  
7. A few seconds after you click the "Connect" button, the label next to the button should show  
"Connected to TRF7970AEVM on COMx".  
If this is not displayed, then a connection has not been made. In this case, disconnect the  
TRF7970AEVM and reconnect it, then restart at step 1. If this still does not solve the problem, make  
sure that the TRF7970AEVM has the latest firmware downloaded from the TRF7970AEVM tool folder.  
8. In the "Setup Tab" select the "Without Sensor Hub BoosterPack" and "RF430FRL152HEVM" options.  
9. Go to the "Demo Mode" tab.  
10. Click the "Start Demo" button.  
11. The GUI starts to plot the temperature and light intensity samples on the graphs.  
1. To plot these values, the PC GUI configures the RF430FRL152HEVM through the TRF7970AEVM  
to take two different samples from the analog thermistor and light sensors.  
2. When the samples are complete, the PC GUI reads the result from FRAM of the  
RF430FRL152HEVM through the TRF7970AEVM and plots it on the graphs in the PC GUI.  
12. To change the measurements, you can place your hand over the light sensor or press the thermistor  
with a finger to affect the temperature result. The light sensor and the thermistor locations on the EVM  
are shown in Section 2.  
The thermistor temperature measurement may not reach the true skin temperature, because some of  
the heat dissipates into the EVM.  
The light sensor reading value does not increase in the presence of extra light (for example, if you  
shine a flashlight on it), because of design reasons with the light sensor selected for this EVM.  
However, the light sensor shows a change for reduced light. Note that the light sensor on the Sensor  
Hub BoosterPack plug-in module does not have this same limitation.  
5.3 Using the PC Application for Advanced Custom Control of the RF430FRL152HEVM  
This section describes how to set up the RF430FRL152HEVM for a custom sampling process. The  
example used here describes how to perform sampling of three sensors (reference, thermistor, and light  
sensor) with four passes at a rate of one sample per second. Various ADC configurations are made using  
the "Sensor Config." tab. This is a simple demonstration, and you can create more complex sampling  
processes and control as needed.  
1. Follow the steps in Section 5.1 to start the PC application and connect to the TRF7970AEVM.  
2. In the "Setup" tab, make sure that "Without Sensor Hub BoosterPack" and "RF430FRL152HEVM" are  
selected.  
3. On the "Sensor Config." tab, for the reference and thermistor group boxes (near the top of the tab),  
make the following settings: gain of 2, filter type of CIC filter, oversampling of 256. When gain of 2 is  
used, the thermistor and reference input voltage does not use most of the analog voltage range. The  
CIC filter allows for shorter conversion times (using 256 oversampling).  
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4. For the light sensor configuration, select gain of 1, CIC filter, and oversampling of 256.  
5. Also on the same group boxes, select "Use Virtual Ground". Virtual ground allows the ADC module  
and inputs to be raised above ground voltage by several hundred mV. Raising the ground allows the  
ADC to more accurately measure voltages near ground. This setting must be chosen, because the  
RF430FRL152HEVM was designed with virtual ground powering the thermistor and light sensors (the  
SVSS pin is the virtual ground).  
6. Figure 18 shows the "Sensor Config." tab with these settings.  
Figure 18. Custom Sensor Configuration Tab  
7. Click the "Write only this tab" button on the bottom of the tab.  
8. Go to the "Gen. Device Config" tab, and select the "Reference/ADC1", "Thermistor/ADC2", "Using  
Thermistor", and "Light Sensor" options in the "Sensor Control Register" group box. These settings  
determine which sensors are selected to be sampled.  
9. Set "Number of Passes Register" to 4. This causes four sampling passes. A pass is sampling each of  
the selected sensors in the "Sensor Control Register" once, in the order that they are selected.  
10. Set "Frequency Register" to the "Every Second" option. This setting causes the selected delay to  
occur between sampling processes.  
11. Check "Start Sampling Process".  
12. Figure 19 shows the "Gen. Device Config" tab with these settings.  
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Figure 19. Custom General Device Configuration  
13. Click the "Write only this tab" button.  
14. The sampling process starts. You can click the "Read only this tab" button to check on the status of  
the sampling process. While the RF430FRL152H is still sampling, the "Status Register" displays the  
text "Sampling in Progress".  
15. Continue to click the "Read only this tab" button until the "Status Register" displays the text "Data  
Available". The sampling process should take three seconds to complete.  
16. When data is available, go to the "View Sensor Data" tab and click the "Read Logged Data" button.  
The GUI reads the logged data from the EVM and displays it (see Figure 20). This logged data is not  
designed to be human-readable. However, one use case of this function is to show the correlation and  
order of data to the sensor that took that data. In the logged data memory, the sensor that took that  
sample is not given and must be determined based on the configuration of the settings. However, the  
GUI shows which sensor is sampled and the expected order.  
Figure 20. Custom View Data  
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6
Changing Firmware System Settings  
This section describes how to change the firmware system settings of the RF430FRL15xH. Figure 21  
shows the System tab. Table 4 describes the available settings.  
Figure 21. System Tab  
Table 4. Firmware System Settings  
Switch ID  
Comment  
ISO/IEC 15693 RF setting. Determines the amount of bytes that can be read and  
written using a single block.  
Block Size  
RF stack setting. If 4 byte block setting is used, then to access the entire FRAM, two  
pages are necessary. This control switches between them. Not needed when 8 byte  
block size is used.  
Page Select  
Enables or disables support for I2C/SPI module. When disabled host controller and  
EUSCI Support digital sensor ROM support is not functional. Forced off in RF430FRL153H since it  
does not have an eUSCI module.  
ROM support for using ADC (SD14) is disabled. Forced off in RF430FRL154H since it  
does not have an SD14 module.  
Sensor Support  
To change these settings first, click the "Read" button to load the current settings. After changing them,  
click the "Write" button to send them over RF.  
To automatically set the setting for the PC application, click "Write Settings For This GUI".  
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Over-the-Air Programming  
7
Over-the-Air Programming  
This section describes how to program the RF430FRL15xH using RF. Figure 22 shows the screen used  
for RF programming.  
NOTE: The RF programmer cannot program the complete FRAM memory. This is because not all  
the FRAM memory is accessible over RF. The region that it can program is F867h to FFFFh.  
Figure 22. RF Programming  
7.1 Procedure  
NOTE: Only .txt format file types are accepted by this program. CCS and IAR can generate this  
formats (see Section 7.2 for instructions).  
Follow these steps to select and program the binary file using RF (also see Figure 23).  
1. Create a .txt file of the program to be programmed.  
2. Click on the "Open File" button.  
3. Find and select the .txt file that was created in step 1.  
4. Click "Verify" if verification of programming is needed.  
5. Make sure that the RF430FRL15xH is positioned above the TRF7970A reader/writer.  
6. Click "Program-Over-Air RF430FRL15xH" to start the programming.  
7. Status progress is provided by text in the text box and also in numerical form as "Bytes Programmed".  
8. After programming completes, power down the RF430FRL15xH by removing it from the field or  
disconnecting the power supply. When power is applied again, the RF430FRL15xH resets and the new  
program takes effect.  
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Figure 23. RF Programming Completed  
7.2 Generating a TXT File  
7.2.1  
Using CCS  
Follow these steps to generate a .txt file from CCS (see Figure 24):  
1. Right click on the project.  
2. Select the “Build” option.  
3. In the”Post-build steps” in the “Steps” tab enter this text:  
"${CG_TOOL_HEX}" --ti_txt "${BuildArtifactFileName}" -o "${BuildArtifactFileBaseName}.txt" -order MS  
-romwidth 16  
4. Compile the project. The .txt binary output is saved to the “Debug” folder.  
Figure 24. CCS TXT Generation  
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Over-the-Air Programming  
7.2.2  
Using IAR  
Follow these steps to generate a .txt file from IAR (see Figure 25):  
1. Right click on the project and select the “Options” setting.  
2. In the “Linker” category, select the “Extra Output” tab and select “Generate extra output”.  
3. Select the “msp430-txt” setting in the “Output format”. Leave “Format variant” set to “None”.  
4. Compile the project. The .txt binary output is saved to the “Debug” folder.  
Figure 25. IAR TXT Generation  
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8
RF430FRL152HEVM Schematics  
A single full-sheet schematic is available here.  
Figure 26. MCU Section Schematic  
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RF430FRL152HEVM Schematics  
Figure 27. I2C or SPI Translators Section Schematic  
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Figure 28. JTAG Section Schematic  
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Figure 29. Power Section Schematic  
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References  
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9
References  
The primary sources of RF430FRL15xH information are:  
1. RF430FRL152H Evaluation Module  
2. Sensor Hub BoosterPack plug-in module  
3. TRF7970A Evaluation Module  
4. Near Field Communications Overview  
5. Low-Power Microcontrollers Overview  
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Revision History  
Revision History  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from June 30, 2017 to July 3, 2018 ................................................................................................................... Page  
Updated recommended evaluation tools in the second paragraph in Section 1.1, Overview................................... 3  
Updated Section 1.3, Required Additional Tools...................................................................................... 4  
Updates to recommend TRF7970A-BNDL and moved Section 1.3.1, MSP-EXP430G2 LaunchPad Development Kit With  
TRF7970A BoosterPack Plug-in Module............................................................................................... 4  
Removed paragraph with obsolete information about location of MSP430G2_TRF7970ABP_Binary.out in Section 1.3.1,  
MSP-EXP430G2 LaunchPad Development Kit With TRF7970A BoosterPack Plug-in Module ................................ 4  
Updated Section 1.3.2, TRF7970AEVM ............................................................................................... 5  
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STANDARD TERMS FOR EVALUATION MODULES  
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or  
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance  
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.  
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility  
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not  
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For  
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions  
set forth herein but rather shall be subject to the applicable terms that accompany such Software  
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,  
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production  
system.  
2
Limited Warranty and Related Remedies/Disclaimers:  
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License  
Agreement.  
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM  
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by  
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have  
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications  
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control  
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.  
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)  
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.  
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit  
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty  
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or  
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be  
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day  
warranty period.  
3
Regulatory Notices:  
3.1 United States  
3.1.1 Notice applicable to EVMs not FCC-Approved:  
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software  
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write  
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or  
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition  
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.  
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must  
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.  
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:  
CAUTION  
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not  
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause  
undesired operation.  
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to  
operate the equipment.  
FCC Interference Statement for Class A EVM devices  
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of  
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is  
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not  
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.  
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to  
correct the interference at his own expense.  
FCC Interference Statement for Class B EVM devices  
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of  
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential  
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance  
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference  
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which  
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more  
of the following measures:  
Reorient or relocate the receiving antenna.  
Increase the separation between the equipment and receiver.  
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  
Consult the dealer or an experienced radio/TV technician for help.  
3.2 Canada  
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247  
Concerning EVMs Including Radio Transmitters:  
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:  
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may  
cause undesired operation of the device.  
Concernant les EVMs avec appareils radio:  
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation  
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit  
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.  
Concerning EVMs Including Detachable Antennas:  
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)  
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type  
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for  
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types  
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.  
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited  
for use with this device.  
Concernant les EVMs avec antennes détachables  
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et  
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage  
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope  
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le  
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le  
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne  
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de  
l'émetteur  
3.3 Japan  
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に  
輸入される評価用キット、ボードについては、次のところをご覧ください。  
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page  
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified  
by TI as conforming to Technical Regulations of Radio Law of Japan.  
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the  
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs  
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):  
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal  
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for  
Enforcement of Radio Law of Japan,  
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to  
EVMs, or  
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan  
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note  
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.  
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて  
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの  
措置を取っていただく必要がありますのでご注意ください。  
1. 電波法施行規則第6条第1項第1号に基づく平成18328日総務省告示第173号で定められた電波暗室等の試験設備でご使用  
いただく。  
2. 実験局の免許を取得後ご使用いただく。  
3. 技術基準適合証明を取得後ご使用いただく。  
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。  
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ  
ンスツルメンツ株式会社  
東京都新宿区西新宿6丁目24番1号  
西新宿三井ビル  
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page  
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/  
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page  
3.4 European Union  
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):  
This is a class A product intended for use in environments other than domestic environments that are connected to a  
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this  
product may cause radio interference in which case the user may be required to take adequate measures.  
4
EVM Use Restrictions and Warnings:  
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT  
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.  
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling  
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information  
related to, for example, temperatures and voltages.  
4.3 Safety-Related Warnings and Restrictions:  
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user  
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and  
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input  
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or  
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI  
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied  
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible  
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any  
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.  
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit  
components may have elevated case temperatures. These components include but are not limited to linear regulators,  
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the  
information in the associated documentation. When working with the EVM, please be aware that the EVM may become  
very warm.  
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the  
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.  
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,  
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic  
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely  
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and  
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or  
designees.  
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,  
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all  
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and  
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local  
requirements.  
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate  
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as  
accurate, complete, reliable, current, or error-free.  
6. Disclaimers:  
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT  
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL  
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT  
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS  
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE  
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.  
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE  
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR  
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE  
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR  
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.  
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS  
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,  
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY  
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY  
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL  
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.  
8. Limitations on Damages and Liability:  
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,  
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE  
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF  
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR  
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,  
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF  
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI  
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS  
OCCURRED.  
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED  
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN  
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR  
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE  
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.  
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)  
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in  
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable  
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),  
excluding any postage or packaging costs.  
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,  
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to  
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.  
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief  
in any United States or foreign court.  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2018, Texas Instruments Incorporated  
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES  
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,  
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are  
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you  
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of  
this Notice.  
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI  
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,  
enhancements, improvements and other changes to its TI Resources.  
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your  
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications  
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You  
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)  
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that  
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you  
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any  
testing other than that specifically described in the published documentation for a particular TI Resource.  
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include  
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO  
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY  
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or  
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR  
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO  
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF  
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL  
PROPERTY RIGHTS.  
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT  
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF  
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,  
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR  
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE  
POSSIBILITY OF SUCH DAMAGES.  
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your non-  
compliance with the terms and provisions of this Notice.  
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.  
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation  
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2018, Texas Instruments Incorporated  

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