RI-R6C-001A-02

更新时间:2024-09-18 14:18:20
品牌:TI
描述:SPECIALTY TELECOM CIRCUIT, PDSO20

RI-R6C-001A-02 概述

SPECIALTY TELECOM CIRCUIT, PDSO20 其他电信集成电路

RI-R6C-001A-02 规格参数

生命周期:Obsolete包装说明:SSOP,
Reach Compliance Code:unknown风险等级:5.82
JESD-30 代码:R-PDSO-G20长度:7.2 mm
功能数量:1端子数量:20
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
座面最大高度:2 mm表面贴装:YES
电信集成电路类型:TELECOM CIRCUIT温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL宽度:5.3 mm
Base Number Matches:1

RI-R6C-001A-02 数据手册

通过下载RI-R6C-001A-02数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。

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RA D I O FR E Q U E N C Y ID E N T I F I C A T I O N S Y S T E M S  
HF Reader System Series 6000  
S6700 Multi-Protocol Transceiver IC  
The S6700 Multi Protocol T ransceiver IC enables a bro ad range of 13.56MHz  
RFID interrogator designs for po rtable and stationar y readers. This low power  
consumption device supports multiple RF communication protocols, minim izes  
onboard power requirements and reduces parts count in a final reader product.  
Part number  
RI-R6C-001A  
Operating Frequency  
13.56MHz  
Supported RF Communication Protocols  
-
-
-
-
Tag-it HF  
ISO 15693-2 (e.g. Tag-it HF-I)  
ISO 14443-2 (Type A)  
Transparent (directly switched according to input pin)  
Operating Voltage  
3.3V - 5V DC ± 10%  
Current Consumption  
Transmit:  
< 200 mA  
Stand-by: - Oscillator on < 15 mA  
- Oscillator off < 50 µA  
Transmitter power  
200mW at 5V DC operating voltage  
ASK, 10% to 100% selectable through external components  
50 Ohm at 13.56MHz  
Transmitter modulation  
Antenna Impedance  
Receive channels  
ASK 423.75kHz, ASK 847kHz, FSK 423.75kHz/484.29kHz selectable  
Serial interface, CMOS compatible  
-40°C to +85°C  
Communication Interface  
Operating Temperature  
Storage Temperature  
Package / Pincount  
Packing / Delivery  
-55°C to +125°C  
SSOP 20  
Tape-on-Reel, 2000 units per reel  
Recommended application schematic  
ANTENNA  
L1  
L2  
L3  
Pin description  
COAX  
R1  
C1  
C2  
Pin  
1
2
3
4
5
6
7
8
Symbol  
VDD_TX  
TX_OUT  
R_MOD  
VSS_TC  
XTAL1  
Description  
Transmitter power supply  
C3  
C4  
L4  
Output transistor drain connection  
External resistor to set 10% modulation depth mode  
Transmitter section ground  
Pin 1 of Xtal resonator  
Pin 2 of Xtal resonator, external clock input  
Digital section ground  
Buffered output of Xtal oscillator  
Grounded for normal operation  
Grounded for normal operation  
Data output for serial link  
Digital section power supply  
Data input for serial link  
Manchester Protocol error flag  
Serial link clock  
Leave open for normal operation  
Receiver section power supply  
Leave open for normal operation  
Receiver section ground  
VCC  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
VDD_TX  
TX_OUT  
R_MOD  
VSS_TX  
XTAL1  
RX_IN  
VSS_RX  
C5  
C6  
3
XTAL2  
C1  
C2  
C3  
C4  
C5  
C6  
C7  
C8  
C9  
47pF  
10pF  
10nF  
47pF  
10µF Tantalum  
100nF  
22pF  
100nF  
22pF  
C8  
R2  
VSS_DIG  
XTAL_CLK  
Not used  
Not used  
DOUT  
4
C
7
VDD_RX  
5
9
VCC  
6
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
XTAL2  
SCLOCK  
M_ERR  
DIN  
7
XTAL 13.56 MHz  
VSS_DIG  
XTAL_CLK  
C9  
VDD_DIG  
DIN  
µC  
8
9
VDD_DIG  
DOUT  
VCC  
M_ERR  
SCLOCK  
Not used  
VDD_RX  
Not used  
VSS_RX  
RX_IN  
C10 100nF  
10  
L1  
L2  
L3  
L4  
R1  
R2  
2.7µH (Q-60)  
2.7µH (Q-60)  
5.6µH (Q-60)  
3.3µH (Q-60)  
2.2kΩ  
C10  
18Ω  
Receiver input  
For more information, contact the sales office or distributor nearest you. This contact information can be found  
on our web site at:  
http://www.ti-rfid.com  
Texas Instruments reserves the right to change its products and services at any time without notice. TI provides customer assistance in various  
technical areas, but does not have full access to data concerning the uses and applications of customers products. Therefore, TI assumes no  
responsibility for customer product design or for infringement of patents and/or the rights of third parties, which may result from assistance  
provided by TI.  
© Copyright 2002 Texas Instruments Incorporated.  
11-07-22-001 09/02  
SCBS856  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
RI-R6C-001A-03  
ACTIVE  
SSOP  
DB  
20  
2000  
TBD  
Call TI  
Call TI  
-40 to 85  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
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supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
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