RI-STU-251B_09 [TI]
SERIES 2000 READER S251B;型号: | RI-STU-251B_09 |
厂家: | TEXAS INSTRUMENTS |
描述: | SERIES 2000 READER S251B |
文件: | 总4页 (文件大小:139K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RI-STU-251B
www.ti.com
SCBS852–MARCH 2001
SERIES 2000 READER S251B
FEATURES
APPLICATIONS
•
•
•
•
•
Access Control
•
Best in Class Performance Through Patented
HDX Technology
Vehicle Identification
Container Tracking
Asset Management
Waste Management
•
•
•
•
Automatic Antenna Tuning
High Power Output
Proven in Harsh Industrial Environments
Easy to Install and Use
DESCRIPTION
The Texas Instruments’ low-frequency (LF) reader provides all the functionality required to communicate with
Texas Instruments 134.2 kHz LF transponders which are available in a variety of form factors. The RI-STU-251B
Reader/Writer is capable driving a variety of antennas with inductance ranges from 26.0µH to 27.9µH including
TI standard antennas RI-ANT-G01E, RI-ANT-G02E, RI-ANT-G04E gate antennas as well as RI-ANT-S01C and
RI-ANT-S02C stick antennas. The RI-STU-251B includes an automatic antenna resonance tuning feature which
further reduces the need for maintenance and simplifies installation. It also supports both RS232 and RS422/485
interface standards.
The RI-STU-251B is well suited for usage in a broad range of applications including, but not limited to, access
control, vehicle identification, container tracking, asset management and waste management applications.
The Series 2000 Reader S251B provides all RF and Control Functions to communicate with 134.2 kHz
HDX/FSK transponders. It sends an energizing signal to the transponder, modulates the RF signal to send data
to the transponder, decodes and checks the received transponder data and transmits it via a standard serial
interface (RS232, RS422/485). The reader includes a Dynamic Auto Tuning (DAT) function that automatically
tunes a standard antenna to resonance and keeps it tuned during operation.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
RI-STU-251B
–20 to +70 (depending on power consumption)
–40 to +85
UNIT
°C
Operating Temperature
Storage Temperature
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TIRIS is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
RI-STU-251B
www.ti.com
SCBS852–MARCH 2001
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
RI-STU-251B
Power Supply
10 to 24 Vdc, regulated
OPERATING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PART NUMBER
RI-STU-251B
PARAMETER
UNIT
Relative Humidity
<97% non-condensing, IEC 68-2-30 Test Db, 21 cycles
134.2
RF Transmit Frequency
kHz
64 kByte EPROM for Firmware
1kBit EEPROM for Configuration
32 kByte RAM for Data
Memory
Data Storage
909 ID Codes (each 64bit)
Communications Interface
System Architecture
Communications Parameters
Communications Protocol
Inputs/Outputs
RS232, RS422/485
Point-to-point and point-to-multipoint
600 - 57600 baud, 7/8 data bits, even/odd parity
ASCII with Xon/Xoff handshake, TIRIS™ Bus Protocol
8 configurable digital I/Os, 2 open collector outputs
26 to 27.9 µH (Dynamic Auto Tuning)
Max. 380 Vpeak
Antenna Tuning Range
Antenna Resonance Voltage
Transponder Types
Dimensions (L × W × H)
Weight
134.2 kHz HDX/FSK
(200 mm × 120mm × 120 mm) ± 1.5 mm
900
g
Mounting
DIN rail TS35
2
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
30-Jan-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Type Drawing
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
RI-STU-251B-01
ACTIVE
1
1
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
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Applications
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interface.ti.com
logic.ti.com
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power.ti.com
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