RI-TRP-R9VS-30 [TI]
SPECIALTY TELECOM CIRCUIT, ROHS COMPLIANT;
| 型号： | RI-TRP-R9VS-30 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | SPECIALTY TELECOM CIRCUIT, ROHS COMPLIANT 电信 电信集成电路 |
| 文件： | 总5页 (文件大小：513K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Obsolete device
RI-TRP-R9VS, RI-TRP-W9VS
www.ti.com........................................................................................................................................................................................... SCBS876–NOVEMBER 2008
MOUNT-ON-METAL TRANSPONDER
1
FEATURES
APPLICATIONS
•
•
•
•
•
Waste Management
Asset Management
Container Tracking
Vehicle Identification
Access Control
•
•
•
•
Best in Class Performance Through Patented
HDX Technology
Patented Transponder Tuning Provides Stable
and High Read/Write Performance
64-Bit Read-Only Memory (RI-TRP-R9VS)
80-Bit Read-Write Memory (RI-TRP-W9VS)
Insensitive to Almost All Non-Metallic
Materials
DESCRIPTION
Texas Instruments mount-on-metal transponder provides superior performance and operates at a resonance
frequency of 134.2 kHz. Texas Instruments LF transponders are manufactured with TI’s patented tuning process
to provide consistent read and write performance. Prior to delivery, the transponders undergo complete functional
and parametric testing, in order to provide the high quality customers have come to expect from TI. The
transponder is well suited for usage in a broad range of applications including, but not limited to, access control,
vehicle identification, container tracking, asset management, and waste management applications.
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI web site at www.ti.com.
NOTE:
For more information, contact the sales office or distributor nearest you. This contact
information can be found on our web site at http://www.ti.com/rfid.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Obsolete device
RI-TRP-R9VS, RI-TRP-W9VS
SCBS876–NOVEMBER 2008........................................................................................................................................................................................... www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
RI-TRP-R9VS, RI-TRP-W9VS
Operating Temperature
Storage Temperature
–25 to 70°C
–25 to 85°C
OPERATING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
RI-TRP-R9VS
RI-TRP-W9VS
Functionality
Read only
Read/write
Memory (Bits)
64
1
80
1
Memory (Pages)
Operating Frequency
Modulation
134.2 kHz
FSK (frequency shift keying) 134.2 kHz / 123.2 kHz
HDX (half duplex)
Transmission Principle
Power Source
Powered from the reader signal
≤120 cm(1)
Typical Reading Range
Typical Programming Range
Typical Reading Time
Typical Programming Time
Typical Programming Cycles
Case Material
—
30% of typical reading range
70 ms
—
—
309 ms
100,000
Polypropylene, black
IP 67
Protection Class
Mounting
With screws or rivets on aluminum, iron, or steel
EMC
Programmed code is not affected by normal electromagnetic interference or X-rays
Transponder can be read through virtually all non-metallic material
IEC 68-2-27, Test Ea; 200 g, half sine, 3 ms, 3 axes, 6 shocks per axis
IEC 68-2-6, Test Fc; 20 g, 20 - 500 Hz, 3 axes, 10 cycles per axis
102 mm ± 1 mm × 36 mm ± 1 mm × 16.5 mm ± 1 mm
43 g
Signal Penetration
Mechanical Shock
Vibration
Dimensions
Weight
(1) Depending on RF regulation in country of use, the reader antenna configuration used, and the environmental conditions.
2
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): RI-TRP-R9VS RI-TRP-W9VS
PACKAGE OPTION ADDENDUM
www.ti.com
4-Apr-2014
PACKAGING INFORMATION
Orderable Device
RI-TRP-R9VS-30
RI-TRP-W9VS-30
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-25 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
OBSOLETE
RFIDP
RFIDP
TEJ
0
0
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
OBSOLETE
TEJ
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
-25 to 70
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Apr-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明