SA5534PE4 [TI]
LOW-NOISE OPERATIONAL AMPLIFIERS; 低噪声运算放大器型号: | SA5534PE4 |
厂家: | TEXAS INSTRUMENTS |
描述: | LOW-NOISE OPERATIONAL AMPLIFIERS |
文件: | 总18页 (文件大小:459K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ꢀꢁ ꢂꢂ ꢃ ꢄ ꢅ ꢀꢁꢂ ꢂ ꢃ ꢄ ꢆꢅ ꢇꢆ ꢂꢂ ꢃ ꢄ ꢈ ꢇ ꢆꢂ ꢂꢃ ꢄꢆ
ꢉ ꢊꢋꢌꢀꢊ ꢍꢇ ꢁ ꢊ ꢎꢁꢏ ꢆꢐ ꢍꢊ ꢀꢆꢉ ꢆꢑ ꢎ ꢉꢍ ꢒꢍ ꢁꢏ ꢇ
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
NE5534, SA5534 . . . D (SOIC), P (PDIP),
OR PS (SOP) PACKAGE
NE5534A, SA5534A . . . D (SOIC) OR P (PDIP) PACKAGE
(TOP VIEW)
D
Equivalent Input Noise Voltage . . .
3.5 nV//Hz Typ
D
Unity-Gain Bandwidth . . . 10 MHz Typ
D
Common-Mode Rejection Ratio . . .
100 dB Typ
COMP/BAL
BALANCE
IN−
1
2
3
4
8
7
6
5
V
CC+
D
D
High DC Voltage Gain . . . 100 V/mV Typ
Peak-to-Peak Output Voltage Swing
OUT
IN+
COMP
V
CC−
32 V Typ With V
= +18 V and R = 600 W
CC
L
+
D
D
D
D
D
High Slew Rate . . . 13 V/ms Typ
Wide Supply-Voltage Range +3 V to +20 V
Low Harmonic Distortion
Offset Nulling Capability
External Compensation Capability
description/ordering information
The NE5534, NE5534A, SA5534, and SA5534A are high-performance operational amplifiers combining
excellent dc and ac characteristics. Some of the features include very low noise, high output-drive capability,
high unity-gain and maximum-output-swing bandwidths, low distortion, and high slew rate.
These operational amplifiers are compensated internally for a gain equal to or greater than three. Optimization
of the frequency response for various applications can be obtained by use of an external compensation
capacitor between COMP and COMP/BAL. The devices feature input-protection diodes, output short-circuit
protection, and offset-voltage nulling capability with use of the BALANCE and COMP/BAL pins (see the
application circuit diagram).
For the NE5534A and SA5534A, a maximum limit is specified for the equivalent input noise voltage.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢎ
ꢎ
ꢏ
ꢊ
ꢥ
ꢓ
ꢠ
ꢔ
ꢕ
ꢞ
ꢐ
ꢟ
ꢍ
ꢙ
ꢊ
ꢗ
ꢀ
ꢘ
ꢓ
ꢆ
ꢐ
ꢆ
ꢖ
ꢗ
ꢡ
ꢘ
ꢙ
ꢟ
ꢚ
ꢛ
ꢜ
ꢜ
ꢝ
ꢝ
ꢖ
ꢖ
ꢙ
ꢙ
ꢗ
ꢗ
ꢖ
ꢞ
ꢞ
ꢢ
ꢟ
ꢠ
ꢚ
ꢚ
ꢡ
ꢡ
ꢗ
ꢝ
ꢜ
ꢛ
ꢞ
ꢞ
ꢙ
ꢘ
ꢢ
ꢐꢡ
ꢠ
ꢣ
ꢞ
ꢤ
ꢖ
ꢟ
ꢜ
ꢞ
ꢝ
ꢖ
ꢝ
ꢙ
ꢚ
ꢗ
ꢠ
ꢥ
ꢜ
ꢗ
ꢝ
ꢝ
ꢡ
ꢞ
ꢈ
Copyright 2004, Texas Instruments Incorporated
ꢚ
ꢙ
ꢟ
ꢝ
ꢙ
ꢚ
ꢛ
ꢝ
ꢙ
ꢞ
ꢢ
ꢖ
ꢘ
ꢖ
ꢟ
ꢡ
ꢚ
ꢝ
ꢦ
ꢝ
ꢡ
ꢚ
ꢙ
ꢘ
ꢧ
ꢜ
ꢍ
ꢗ
ꢛ
ꢡ
ꢞ
ꢝ
ꢜ
ꢗ
ꢥ
ꢜ
ꢚ
ꢥ
ꢨ
ꢜ
ꢝ ꢡ ꢞ ꢝꢖ ꢗꢪ ꢙꢘ ꢜ ꢤꢤ ꢢꢜ ꢚ ꢜ ꢛ ꢡ ꢝ ꢡ ꢚ ꢞ ꢈ
ꢚ
ꢚ
ꢜ
ꢗ
ꢝ
ꢩ
ꢈ
ꢎ
ꢚ
ꢙ
ꢥ
ꢠ
ꢟ
ꢝ
ꢖ
ꢙ
ꢗ
ꢢ
ꢚ
ꢙ
ꢟ
ꢡ
ꢞ
ꢞ
ꢖ
ꢗ
ꢪ
ꢥ
ꢙ
ꢡ
ꢞ
ꢗ
ꢙ
ꢝ
ꢗ
ꢡ
ꢟ
ꢡ
ꢞ
ꢞ
ꢜ
ꢚ
ꢖ
ꢤ
ꢩ
ꢖ
ꢗ
ꢟ
ꢤ
ꢠ
ꢥ
ꢡ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢂꢃ ꢄ ꢅ ꢀ ꢁꢂ ꢂꢃ ꢄꢆ ꢅ ꢇ ꢆꢂ ꢂ ꢃ ꢄꢈ ꢇ ꢆꢂ ꢂ ꢃꢄ ꢆ
ꢉ ꢊꢋꢌꢀ ꢊꢍ ꢇꢁ ꢊꢎꢁ ꢏꢆꢐꢍ ꢊ ꢀꢆ ꢉ ꢆꢑ ꢎꢉ ꢍ ꢒꢍ ꢁ ꢏꢇ
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
description/ordering information (continued)
ORDERING INFORMATION
V
max
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
IO
†
PACKAGE
T
A
AT 25°C
Tube of 50
Tube of 50
Tube of 75
Reel of 2500
Tube of 75
Reel of 2500
Reel of 2000
NE5534P
NE5534P
PDIP (P)
SOIC (D)
NE5534AP
NE5534D
NE5534AP
NE5534
5534A
0°C to 70°C
4 mV
NE5534DR
NE5534AD
NE5534ADR
NE5534PSR
SOP (PS)
PDIP (P)
N5534
Tube of 50
Tube of 50
Tube of 75
Reel of 2500
Tube of 75
Reel of 2500
Tube of 80
Reel of 2000
SA5534P
SA5534P
SA5534AP
SA5534AP
SA5534D
SA5534
SA5534DR
SA5534AD
SA5534ADR
SA553APS
SA553APSR
SOIC (D)
−40°C to 85°C
4 mV
SA5534A
SOP (PS)
SA5534
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available
at www.ti.com/sc/package.
schematic
BALANCE
1
COMP/BAL
8
COMP
5
7
V
CC+
100 pF
12 kΩ
12 kΩ
IN+
3
40 pF
12 pF
15 Ω
6
OUT
2
IN−
7 pF
15 Ω
4
V
CC−
All component values shown are nominal.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂꢂ ꢃ ꢄ ꢅ ꢀꢁꢂ ꢂ ꢃ ꢄ ꢆꢅ ꢇꢆ ꢂꢂ ꢃ ꢄ ꢈ ꢇ ꢆꢂ ꢂꢃ ꢄꢆ
ꢉ ꢊꢋꢌꢀꢊ ꢍꢇ ꢁ ꢊ ꢎꢁꢏ ꢆꢐ ꢍꢊ ꢀꢆꢉ ꢆꢑ ꢎ ꢉꢍ ꢒꢍ ꢁꢏ ꢇ
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
symbol
application circuit
V
CC+
22 kΩ
COMP
100 kΩ
COMP/BAL
C
C
1
−
+
IN−
IN+
8
2
3
OUT
−
+
5
7
6
5534
BALANCE
4
V
CC−
Frequency Compensation and Offset-Voltage Nulling Circuit
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage: V
V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −22 V
CC+
CC−
Input voltage either input (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
CC+
Input current (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA
Duration of output short circuit (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Package thermal impedance, θ (see Notes 5 and 6): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
JA
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between V
and V .
CC−
CC+
2. The magnitude of the input voltage must never exceed the magnitude of the supply voltage.
3. Excessive current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless some
limiting resistance is used.
4. The output may be shorted to ground or to either power supply. Temperature and/or supply voltages must be limited to ensure the
maximum dissipation rating is not exceeded.
5. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
JA
J
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
6. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN
5
MAX
15
UNIT
V
V
V
Supply voltage
Supply voltage
CC+
−5
0
−15
70
V
CC−
NE5534, NE5534A
SA5534, SA5534A
T
A
Operating free-air temperature range
°C
−40
85
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢂꢃ ꢄ ꢅ ꢀ ꢁꢂ ꢂꢃ ꢄꢆ ꢅ ꢇ ꢆꢂ ꢂ ꢃ ꢄꢈ ꢇ ꢆꢂ ꢂ ꢃꢄ ꢆ
ꢉ ꢊꢋꢌꢀ ꢊꢍ ꢇꢁ ꢊꢎꢁ ꢏꢆꢐꢍ ꢊ ꢀꢆ ꢉ ꢆꢑ ꢎꢉ ꢍ ꢒꢍ ꢁ ꢏꢇ
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
electrical characteristics, V
= 15 V, T = 25°C (unless otherwise noted)
A
CC
†
PARAMETER
MIN
TYP
MAX
4
UNIT
TEST CONDITIONS
T = 25°C
A
0.5
V
R
= 0,
= 50 Ω
O
S
V
IO
Input offset voltage
Input offset current
Input bias current
mV
T
A
= Full range
= 25°C
5
T
A
20
300
400
1500
2000
I
IO
V
O
= 0
= 0
nA
T
A
= Full range
= 25°C
T
A
500
I
IB
V
nA
V
O
T
A
= Full range
V
ICR
Common-mode input voltage range
12
24
30
25
15
13
26
V
V
=
=
15 V
18 V
CC
V
Maximum peak-to-peak output voltage swing
R
≥ 600 Ω
V
O(PP)
L
32
CC
T
A
= 25°C
= Full range
= 0
100
V
R
=
10 V,
O
A
VD
Large-signal differential voltage amplification
Small-signal differential voltage amplification
V/mV
V/mV
≥ 600 Ω
T
A
L
C
C
C
C
6
2.2
200
95
C
C
C
C
O
A
vd
f = 10 kHz
= 22 pF
= 0
V
V
=
10 V
18 V,
O
= 22 pF
B
B
Maximum-output-swing bandwidth
kHz
OM
=
V
C
= 14 V,
= 22 pF
CC
70
R
≥ 600 Ω,
L
C
Unity-gain bandwidth
Input resistance
C
= 22 pF,
C
= 100 pF
10
MHz
1
C
L
r
30
100
kΩ
i
A
C
= 30 dB,
= 22 pF,
R
≥ 600 Ω,
VD
C
L
z
Output impedance
0.3
100
100
Ω
o
f = 10 kHz
,
= V min
ICR
V
R
= 0,
= 50 Ω
V
IC
O
CMRR Common-mode rejection ratio
70
80
dB
dB
S
V
V
=
9 V to 15 V,
R
= 50 Ω,
CC+
O
S
k
Supply-voltage rejection ratio (∆V /∆V
IO)
SVR
CC
= 0
I
I
Output short-circuit current
Supply current
38
4
mA
mA
OS
V
O
= 0, No load
T
A
= 25°C
8
CC
†
All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified.
For NE5534 and NE5534A, full range is 0°C to 70°C. For SA5534 and SA5534A, full range is −40°C to 85°C.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂꢂ ꢃ ꢄ ꢅ ꢀꢁꢂ ꢂ ꢃ ꢄ ꢆꢅ ꢇꢆ ꢂꢂ ꢃ ꢄ ꢈ ꢇ ꢆꢂ ꢂꢃ ꢄꢆ
ꢉ ꢊꢋꢌꢀꢊ ꢍꢇ ꢁ ꢊ ꢎꢁꢏ ꢆꢐ ꢍꢊ ꢀꢆꢉ ꢆꢑ ꢎ ꢉꢍ ꢒꢍ ꢁꢏ ꢇ
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
operating characteristics, V
= 15 V, T = 25°C
A
CC
NE5534,
SA5534
NE5534A, SA5534A
PARAMETER
TEST CONDITIONS
UNIT
TYP
13
6
MIN
TYP
13
6
MAX
C
C
= 0
C
C
SR
Slew rate
V/µs
= 22 pF
A
C
= 1,
= 22 pF
V = 50 mV,
Rise time
VD
C
20
20
50
35
20
20
50
35
ns
%
ns
%
I
R
C
= 600 Ω,
= 100 pF
L
L
Overshoot factor
Rise time
t
r
A
= 1,
= 47 pF
V = 50 mV,
VD
I
L
L
C
R
C
= 600 Ω,
= 500 pF
C
Overshoot factor
f = 30 Hz
f = 1 kHz
f = 30 Hz
f = 1 kHz
7
5.5
3.5
1.5
0.4
0.9
7
V
Equivalent input noise voltage
nV/√Hz
n
4
4.5
2.5
0.6
I
n
Equivalent input noise current
Average noise figure
pA/√Hz
R
= 5 kΩ,
f = 10 Hz to 20 kHz
dB
F
S
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢂꢃ ꢄ ꢅ ꢀ ꢁꢂ ꢂꢃ ꢄꢆ ꢅ ꢇ ꢆꢂ ꢂ ꢃ ꢄꢈ ꢇ ꢆꢂ ꢂ ꢃꢄ ꢆ
ꢉ ꢊꢋꢌꢀ ꢊꢍ ꢇꢁ ꢊꢎꢁ ꢏꢆꢐꢍ ꢊ ꢀꢆ ꢉ ꢆꢑ ꢎꢉ ꢍ ꢒꢍ ꢁ ꢏꢇ
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
†
TYPICAL CHARACTERISTICS
NORMALIZED INPUT BIAS CURRENT
MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE
AND INPUT OFFSET CURRENT
vs
vs
FREQUENCY
FREE-AIR TEMPERATURE
30
25
20
15
10
5
1.6
1.4
1.2
1
V
CC
= 15 V
C
= 0
C
Offset
Bias
0.8
0.6
0.4
C
= 22 pF
C
C
= 47 pF
V
T
A
=
15 V
C
CC
= 25°C
0
100
−75 −50 −25
0
25
50
75 100 125
1 k
10 k
100 k
1 M
T
A
− Free-Air Temperature − °C
f − Frequency − Hz
Figure 1
Figure 2
LARGE-SIGNAL
DIFFERENTIAL VOLTAGE AMPLIFICATION
NORMALIZED SLEW RATE AND
UNITY-GAIN BANDWIDTH
vs
vs
FREQUENCY
SUPPLY VOLTAGE
6
10
5
10
4
10
3
10
2
10
1.2
1.1
1
V
T
A
= 15 V
= 25°C
CC
T
A
= 25°C
Unity-Gain
Bandwidth
0.9
0.8
0.7
C
= 0 pF
C
Slew Rate
0.6
0.5
C
= 22 pF
C
10
1
10
0.4
100
1 k
10 k 100 k 1 M 10 M 100 M
0
5
10
15
20
f − Frequency − Hz
| V
CC
| − Supply Voltage − V
Figure 3
Figure 4
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂꢂ ꢃ ꢄ ꢅ ꢀꢁꢂ ꢂ ꢃ ꢄ ꢆꢅ ꢇꢆ ꢂꢂ ꢃ ꢄ ꢈ ꢇ ꢆꢂ ꢂꢃ ꢄꢆ
ꢉ ꢊꢋꢌꢀꢊ ꢍꢇ ꢁ ꢊ ꢎꢁꢏ ꢆꢐ ꢍꢊ ꢀꢆꢉ ꢆꢑ ꢎ ꢉꢍ ꢒꢍ ꢁꢏ ꢇ
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
†
TYPICAL CHARACTERISTICS
NORMALIZED SLEW RATE AND
UNITY-GAIN BANDWIDTH
vs
TOTAL HARMONIC DISTORTION
vs
FREE-AIR TEMPERATURE
FREQUENCY
0.01
1.2
1.1
V
=
15 V
CC
V
CC
=
15 V
A
VD
= 1
0.007
V
= 2 V
I(rms)
T
A
= 25°C
Slew Rate
Unity-Gain
Bandwidth
0.004
1
0.002
0.001
0.9
0.8
100
400
1 k
4 k 10 k
40 k 100 k
−75 −50 −25
0
25
50
75 100 125
f − Frequency − Hz
T
A
− Free-Air Temperature − °C
Figure 5
Figure 6
EQUIVALENT INPUT NOISE VOLTAGE
EQUIVALENT INPUT NOISE CURRENT
vs
vs
FREQUENCY
FREQUENCY
10
7
10
7
V
T
A
=
15 V
CC
V
T
A
=
15 V
CC
= 25°C
= 25°C
4
2
SA5534, NE5534
4
SA5534A, NE5534A
1
SA5534, NE5534
0.7
2
1
0.4
SA5534A, NE5534A
0.2
0.1
10
100
1 k
10 k
100 k
10
100
1 k
10 k
100 k
f − Frequency − Hz
f − Frequency − Hz
Figure 7
Figure 8
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢂꢃ ꢄ ꢅ ꢀ ꢁꢂ ꢂꢃ ꢄꢆ ꢅ ꢇ ꢆꢂ ꢂ ꢃ ꢄꢈ ꢇ ꢆꢂ ꢂ ꢃꢄ ꢆ
ꢉ ꢊꢋꢌꢀ ꢊꢍ ꢇꢁ ꢊꢎꢁ ꢏꢆꢐꢍ ꢊ ꢀꢆ ꢉ ꢆꢑ ꢎꢉ ꢍ ꢒꢍ ꢁ ꢏꢇ
SLOS070C − JULY 1979 − REVISED SEPTEMBER 2004
TYPICAL CHARACTERISTICS
TOTAL EQUIVALENT INPUT NOISE VOLTAGE
vs
SOURCE RESISTANCE
100
V
T
A
=
15 V
CC
70
40
= 25°C
20
10
7
4
f = 10 Hz to 20 kHz
2
1
0.7
0.4
f = 200 Hz to 4 kHz
0.2
0.1
100
1 k
10 k
100 k
1 M
R
− Source Resistance − Ω
S
Figure 9
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
NE5534AD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
NE5534ADE4
NE5534ADG4
NE5534ADR
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
NE5534ADRE4
NE5534ADRG4
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
NE5534AJG
NE5534AP
OBSOLETE
ACTIVE
CDIP
PDIP
JG
P
8
8
TBD
Call TI
Call TI
50
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NE5534APE4
NE5534D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
P
D
D
D
D
D
D
8
8
8
8
8
8
8
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
NE5534DE4
NE5534DG4
NE5534DR
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
NE5534DRE4
NE5534DRG4
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
NE5534IP
NE5534P
OBSOLETE
ACTIVE
PDIP
PDIP
P
P
8
8
TBD
Call TI
Call TI
50
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NE5534PE4
NE5534PSR
NE5534PSRE4
NE5534PSRG4
SA5534AD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
P
PS
PS
PS
D
8
8
8
8
8
8
8
8
8
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SA5534ADE4
SA5534ADG4
SA5534ADR
SA5534ADRE4
D
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
D
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
SA5534ADRG4
SA5534AP
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
D
P
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SA5534APE4
SA5534D
P
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
D
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SA5534DE4
SA5534DG4
SA5534DR
D
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
D
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SA5534DRE4
SA5534DRG4
SA5534P
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
P
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SA5534PE4
SA5534PS
P
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
PS
PS
PS
PS
PS
PS
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SA5534PSE4
SA5534PSG4
SA5534PSR
SA5534PSRE4
SA5534PSRG4
SO
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
330
330
(mm)
12
NE5534ADR
NE5534DR
NE5534PSR
SA5534ADR
SA5534DR
SA5534PSR
D
D
8
8
8
8
8
8
SITE 27
SITE 27
SITE 41
SITE 27
SITE 27
SITE 41
6.4
6.4
8.2
6.4
6.4
8.2
5.2
5.2
6.6
5.2
5.2
6.6
2.1
2.1
2.5
2.1
2.1
2.5
8
8
12
12
16
12
12
16
Q1
Q1
Q1
Q1
Q1
Q1
12
PS
D
16
12
8
12
D
12
8
PS
16
12
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
NE5534ADR
NE5534DR
NE5534PSR
SA5534ADR
SA5534DR
SA5534PSR
D
D
8
8
8
8
8
8
SITE 27
SITE 27
SITE 41
SITE 27
SITE 27
SITE 41
342.9
342.9
346.0
342.9
342.9
346.0
336.6
336.6
346.0
336.6
336.6
346.0
20.64
20.64
33.0
PS
D
20.64
20.64
33.0
D
PS
Pack Materials-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.063 (1,60)
0.015 (0,38)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.130 (3,30) MIN
Seating Plane
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.430 (10,92)
MAX
0.010 (0,25)
M
0.015 (0,38)
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明