SCAN926260 [TI]
具有 IEEE 1149.1 和全速度 BIST 的六个 1 至 10 总线 LVDS 解串器;
| 型号： | SCAN926260 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 IEEE 1149.1 和全速度 BIST 的六个 1 至 10 总线 LVDS 解串器 |
| 文件： | 总26页 (文件大小：841K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SCAN926260
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SNLS153H –JUNE 2002–REVISED APRIL 2013
SCAN926260 Six 1 to 10 Bus LVDS Deserializers with IEEE 1149.1 and At-Speed BIST
Check for Samples: SCAN926260
1
FEATURES
DESCRIPTION
The SCAN926260 integrates six 10-bit deserializer
devices into a single chip. The SCAN926260 can
simultaneously deserialize up to six data streams that
have been serialized by TI’s 10-bit Bus LVDS
serializers. In addition, the SCAN926260 is compliant
with IEEE standard 1149.1 and also features an At-
Speed Built-In Self Test (BIST). For more details,
please see the sections titled IEEE 1149.1 Test
Modes and BIST Alone Test Modes.
2
•
Deserializes One to Six Bus LVDS Input Serial
Data Streams with Embedded Clocks
•
IEEE 1149.1 (JTAG) Compliant and At-Speed
BIST Test Modes
•
•
•
Parallel Clock Rate 16-66MHz
On Chip Filtering for PLL
High Impedance Inputs Upon Power Off (Vcc
0V)
=
Each deserializer block in the SCAN926260 has it’s
own powerdown pin (PWRDWN[n])and operates
independently with its own clock recovery circuitry
and lock-detect signaling. In addition, a master
powerdown pin (MS_PWRDWN) which puts all the
entire device into sleep mode is provided.
•
•
Single Power Supply at +3.3V
196-Pin NFBGA Package (Low-Profile Ball Grid
Array) Package
•
•
•
Industrial Temperature Range Operation:
−40°C to +85°C
The SCAN926260 uses a single +3.3V power supply
and consumes 1.2W at 3.3V with a PRBS-15 pattern
on all channels at 660Mbps.
ROUTn[0:9] and RCLKn Default High when
Channel is Not Locked
Powerdown Per Channel to Conserve Power
on Unused Channels
Typical Application
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2013, Texas Instruments Incorporated
SCAN926260
SNLS153H –JUNE 2002–REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage (VDD
)
-0.3 to 3.8V
-0.3V to +3.9V
3.7W
BLVDS Input Voltage (Rin ±)
Maximum Package Power Dissipation Capacity @ 25°C
θJA 196 NFBGA:
Package Thermal Resistance
34°C/W
θJC 196 NFBGA:
8°C/W
Storage Temp. Range
-65°C to +150°C
+125°C
Junction Temperature
Lead Temperature (Soldering 10 Seconds)
+225°C
Human Body Model
>2KV
ESD Ratings
Machine Model
>250V
(1) Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that
the devices should be operated at these limits. The table of Electrical Characteristics specifies conditions of device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Recommended Operating Conditions
Supply Voltage (VDD
)
3.0V to 3.6V
Operating Free Air Temperature (TA)
-40°C to +85°C
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.(1)
Symbol
Parameter
Conditions
Pin/Freq.
Min
Typ
Max
Units
LVCMOS/LVTTL DC Specifications
High Level Input
Voltage
VIH
2.0
VCC
0.8
V
V
REN, REFCLK,
PWRDWNn ,
MS_PWRDWN
Low Level Input
Voltage
VIL
GND
VCL
IIN
Input Clamp Voltage
Input Current
-0.87
-1.5
+10
V
Vin = 0 or 3.6V
Vin = 0 or 3.6V
-10
-20
uA
TRST, TMS, TDI,
BIST_SEL[0:2]
IIN
Input Current
+20
VCC
0.5
uA
V
High Level Output
Voltage
VOH
VOL
IOS
IOH = −6mA
IOL = 6mA
Vout = 0V
2
3
Low Level Output
Voltage
GND
-15
0.18
-46
V
ROUT,
RCLK,
LOCKn
Output short Circuit
Current
-85
mA
MS_PWRDWN or
REN = 0.8V
Vout = 0V or VCC
Tri-state Output
Current
IOZ
-10
±0.2
+10
µA
High Level Output
Voltage
VOH
VOL
IOS
IOH = −12mA
IOL = 12mA
Vout = 0V
2
VCC
0.5
V
V
Low Level Output
Voltage
TDO
GND
-15
Tri-state Output
Current
-120
mA
(1) Typical values are given for VDD = 3.3V and TA =25°C
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Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.(1)
Symbol
Parameter
Conditions
Pin/Freq.
Min
Typ
Max
Units
Bus LVDS DC specifications
Differential Threshold
High Voltage
VTH
+3
-2
+50
mV
mV
µA
VCM = 0.025,
1.250, 2.375V
Differential Threshold
Low Voltage
(VRI+-VRI-
)
VTL
-50mV
-10
RI+, RI-
IIN
Vin = +2.4V,
Vcc = 3.6 or 0V
±1
±1
+10
+10
Input Current
Vin =0V,
Vcc = 3.6 or 0V
-10
µA
Supply Current
Checker Board
Pattern,
66 MHz
500
600
mA
CL=15pF
ICCR
Total Supply Current
PRBS-15 Pattern,
CL=15pF
66 MHz
66 MHz
385
77
mA
mA
mA
Reduction in Supply
Current per Channel
Checker Board
Pattern
ΔICCR
55
100
2.2
Total Supply Current
when Powered Down
MS_PWRDN=
0.8V(2)
ICCXR
1.5
Timing Requirements for REFCLK
tRFCP
tRFDC
REFCLK Period
15.15
30
62.5
70
ns
%
REFCLK Duty Cycle
50
Ratio of REFCLK to
TCLK
tRFCP/tTCP
tRFTT
0.95
1.05
8
REFCLK Transition
Time
ns
Deserializer Switching Characteristics
tRCP
tRDC
RCLK Period
15.15
41
62.5
55
ns
%
RCLK
RCLK Duty Cycle
See(3)
50
LVCMOS/LVTTL Low-
to-High Transition Time
tCLH
tCHL
tROS
tROH
1.3
1.0
1.8
2.2
2.0
ns
ns
ns
ns
CL = 15pF,
Figure 3(4)
LVCMOS/LVTTL High-
to-Low Transition Time
1.5
Rout Data Valid before
RCLK
See Figure 2
See Figure 2
0.4*tRCP
-0.4*tRCP
LOCK,
RCLK,
ROUT
Rout Data Valid after
RCLK
tHZR
tLZR
tZHR
tZLR
High to Tri-state Delay
Low to Tri-state Delay
Tri-state to High Delay
Tri-state to Low Delay
10
10
12
12
ns
ns
ns
ns
See Figure 7
See Figure 1
(All Cases)
1.75*tRCP+5
1.75*tRCP+6
1.75*tRCP+7
1.75*tRCP+7
1.75*tRCP+10
1.75*tRCP+9
ns
ns
tDD
Deserializer Delay
RCLK
66 MHz Only
(2) Total Supply Current when Powered Down (ICCXR) is higher than previous six channel devices because previous devices asserted
ROUTn and RCLKn into tri-state upon loss-of-lock, whereas the SCAN926260 now asserts ROUTn and RCLKn HIGH upon loss-of-lock.
(3) tRDC was specified by measuring the positive pulse on the RCLK and dividing this number by the ideal pulse width.
(4) tCLH and tCHL are Ensured by Statistical Analysis (EBSA). Please see Figure 3 for a graphical representation.
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Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.(1)
Symbol
tDSR1
Parameter
Conditions
Pin/Freq.
Min
Typ
Max
Units
Deserializer PLL LOCK
Time from PWRDNn
(with SYNCPAT)
66MHz
2.5
µs
See Figure 4(5)
16MHz
7.0
µs
66MHz
16MHz
66MHz
16MHz
66MHz
16MHz
1.1
4.5
µs
µs
ps
ns
ps
ns
Deserializer PLL Lock
Time from SYNCPAT
tDSR2
See Figure 5(5)
See Figure 8(6)
400
1.3
440
1.4
500
2.51
600
Deserializer Right
Noise Margin
tRNMI-RIGHT
Deserializer Left Noise
Margin
tRNMI-LEFT
2.59
(5) For the purpose of specifying deserializer PLL performance, tDSR1 and tDSR2 are specified with the REFCLK running and stable, and
specific conditions of the incoming data stream (SYNCPATs). tDSR1 is the time required for the deserializer to indicate lock upon power-
up or when leaving the power-down mode. tDSR2 is the time required to indicate lock for the powered-up and enabled deserializer when
the input (RI+ and RI−) conditions change from not receiving data to receiving synchronization patterns (SYNCPATs). The time to lock
to random data is dependent upon the incoming data and is not specified.
(6) tRNMI-LEFT and tRNMI-RIGHT are a measure of how much phase noise (jitter) the deserializer can tolerate in the incoming data stream
before bit errors occur. The Deserializer noise margin specification does not include transmitter jitter and is Ensured By Statistical
Analysis (EBSA). Please see Figure 8 for a graphical representation.
SCAN Circuitry Timing Requirements
Symbol
Parameter
Conditions
Min
Typ
Max
Units
fMAX
Maximum TCK Clock
Frequency
RL = 500Ω, CL = 35 pF
25.0
50.0
MHz
tS
TDI to TCK, H or L
TDI to TCK, H or L
TMS to TCK, H or L
TMS to TCK, H or L
TCK Pulse Width, H or L
TRST Pulse Width, L
2.0
1.0
2.5
1.0
10.0
2.5
2.0
ns
ns
ns
ns
ns
ns
ns
tH
tS
tH
tW
tW
tREC
Recovery Time, TRST to
TCK
Timing Diagrams
Figure 1. Deserializer Delay tDD
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Figure 2. Output Timing tROS and tROH (Data Valid)
Figure 3. Deserializer CMOS/LVTTL Output Load and Transition Times
Figure 4. Locktime from PWRDNn tDSR1
Figure 5. Locktime to SYNCPAT tDSR2
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Figure 6. Loss of Lock
Figure 7. Deserializer Tri-state Test Circuit and Timing
Note: For an explanation of Ideal Crossing Point and Noise Margin, please see the Application Information section.
Figure 8. Deserializer Noise Margin and Sampling Window
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Block Diagram
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Functional Description
The SCAN926260 combines six 1:10 deserializers into a single chip. Each of the six deserializers accepts a Bus
LVDS data stream from TI's DS92LV1021, DS92LV1023, DS92LV8028, SCAN921023, or SCAN921025
Serializer. The deserializers then recover the clock and data to deliver the resulting 10-bit wide words to the
outputs.
Each of the six channels acts completely independent of each other. Each independent channel has outputs for
a 10-bit wide data word, a recovered clock output, and a lock-detect output.
The SCAN926260 has three operating states: Initialization, Data Transfer, and Resynchronization. In addition,
there are two passive states: Powerdown and Tri-state. During normal operation, the SCAN6260 also has the
capability of utilizing the IEEE 1149.1 test modes (JTAG) or the Built-In Self Test mode (BIST).
The following sections describe each operating mode, passive states, and the JTAG and BIST modes.
Initialization
Before the SCAN926260 receives and deserializes data, it and the transmitting Serializer must initialize the link.
Initialization refers to synchronizing the Serializer's and the Deserializer's PLL's to local clocks. The local clocks
must be within ±5% of the incoming transmitter clock frequency. After all devices synchronize to local clocks, the
Deserializer synchronizes to the Serializer as the second and final initialization step.
Step 1: After applying power to the Deserializer, the outputs are held high and the on-chip Power-on Reset
(POR) circuitry disables the internal circuits. When Vcc reaches VccOK (2.1V), the PLL in each deserializer begins
locking to the local clock (REFCLK). A local on-board oscillator or other source that provides the specified clock
input to the REFCLK pin.
Step 2: The Deserializer PLL must synchronize to the Serializer to complete the initialization. Refer to the
Serializer data sheet for proper operation during the Initialization State. The Deserializer identifies the rising clock
edge in a synchronization pattern or pseudo-random data and after 80 clock cycles will synchronize to the data
stream from the Serializer. At the point where the Deserializer's PLL locks to the embedded clock, the LOCKn
pin goes low and valid data appears at the outputs.
Data Transfer
After initialization, the Serializer transfers data to the Deserializer. The serial data stream includes a start and
stop bit appended by the serializer, which frames the ten data bits. The start bit is always high and the stop bit is
always low. The start and stop bits also function as clock bits embedded in the serial stream.
The Serializer transmits the data and clock bits (10+2 bits) at 12 times the TCLK frequency. For example, if
TCLK is 40 MHz, the serial rate is 40 X 12 = 480 Mbps. Since only 10 bits are from input data, the serial
'payload' rate is 10 times the TCLK frequency. For instance, if TCLK = 40 MHz, the payload data is 40 X 10 =
400 Mbps. TCLK is provided by the data source and must be in the range of 16MHz to 66MHz.
When one of six Deserializer channels synchronizes to the input from a Serializer, it drives its LOCKn pin low
and synchronously delivers valid data at its outputs. The Deserializer locks to the embedded clock, uses it to
generate multiple internal data strobes, and drives the embedded clock to the RCLKn pin. The RCLKn pin is
synchronous to the data on the ROUTn[0:9] pins. While LOCKn is low, data on ROUTn[0:9] is valid. Otherwise,
ROUTn[0:9] and RCLKn are high.
All ROUT, LOCK, and RCLK signals will drive a minimum of three CMOS input gates (15pF load) with a 66 MHz
clock. This amount of drive allows bussing outputs of two Deserializers and a destination ASIC. REN controls tri-
state of all the outputs.
The Deserializer input pins are high impedance during Powerdown (PWRDNn or MS_PWRDN low) and power-
off (Vcc = 0V).
Resynchronization
Whenever one of the six Deserializers loses lock, it will automatically try to resynchronize. For example, if the
embedded clock edge is not detected two times in succession, the PLL loses lock and the LOCKn pin is driven
high. The system must monitor the LOCKn pin to determine when data is valid.
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The user has the choice of allowing the deserializer to re-sync to the data stream or to force synchronization by
asserting the Serializer SYNC1 or SYNC2 pin high. This scheme is left up to user discretion. One
recommendation is to provide a feedback loop using the LOCKn pin itself to control the sync request of the
Serializer (SYNC1 or SYNC2). Dual SYNC pins are provided for local or remote control..
Powerdown
The Powerdown state is a low power sleep mode that the Deserializer typically occupies while waiting for
initialization or to reduce power consumption when no data is transferred. While in Powerdown Mode, the PLL
stops and RCLK and ROUTn[0:9] are high, which reduces the supply current for each channel by approximately
80mA. Each channel has a powerdown (PWRDWNn) pin that puts the respective channel into sleep mode when
asserted low. In addition, the SCAN926260 has a master powerdown (MS_PWRDWN) pin that overrides each
individual powerdown pin and puts the entire device into sleep mode when asserted low (This same condition
can be replicated by asserting all six individual powerdown pins low.). The powerdown pins are internally pulled
low which defaults the device into sleep mode. Active operation requires asserting a high on MS_PWRDWN and
the selected channel’s PWRDWNn pin.
Upon exiting Powerdown, the Deserializer enters the Initialization state. The system must then allow time to
Initialize before data transfer can begin.
Tri-state
When the system drives the REN pin low, the Deserializer enters tri-state. This will tri-state the receiver output
pins (ROUTn[0:9]) and RCLK[0:5]. When the system drives REN high, the Deserializer will return to the previous
state as long as all other control pins remain static (PWRDWNn, MS_PWRDWN). The LOCKn pin is not affected
by REN and continues to be active, signalling LOCK status. This allows the system to be sure the channel is
locked before enabling the data outputs.
SCAN926260 Control Signal Truth Table(1)
SCAN Mode Internal Signals
INPUTS
OUTPUTS
ROUTn[0:9]
10 @ Z
STATE
SCAN(2)
SCAN(2)
Powerdown(3)
Powerdown(4)
SCAN_HIZB
SCAN_BIST
MS_PWRDWN
PWRDWN[n]
REN
X
LOCK[n]
RCLK[n]
0
1
1
1
X
1
0
0
X
X
0
1
X
Z
Z
1
1
Z
Z
1
1
X
X
X
10 @ Z
X
10 @ 1
All 6 @ 0
X
10 @ 1
Normal, Not
Locked(5)
1
1
1
0
0
0
1
1
1
1
1
1
1
1
0
1
0
1
10 @ 1
data
1
clock
Z
Normal,
Locked(5)
REN = Low,
10 @ Z
(6)(7)
Not Locked
(1) Key:
Z = High Impedance
X = Don’t Care
10 @ Z = All 10 ROUT for the respective Channel are High Impedance
1 = High Voltage Level
0 = Low Voltage Level
SCAN_HIZB = the internal control signal from the HighZ command at the TAP Controller
SCAN_BIST = the internal control signal from the BIST command at the TAP Controller
(2) JTAG/SCAN has the highest priority. SCAN_HIZB is active low and SCAN_BIST is active high. If either control is active, the outputs will
be in tri-state.
(3) MS_PWRDWN has the second highest priority. When MS_PWRDWN is low, the entire chip enters sleep mode and all outputs
(ROUTn[0:9], RCLK[n], and LOCK[n]) are high.
(4) PWRDWN[n] are the six individual power-down pins. Each will power down the respective channel. A special case occurs when all six
PWRDWN[n] pins are low-the common bias circuits will also be powered down. This state is equivalent to the case when
MS_PWRDWN is low.
(5) During normal operation mode (no SCAN, no Power-down, and REN high), LOCK[n] controls the ROUTn[0:9] and RCLK[n] outputs.
When LOCK[n] is high (unlocked), all outputs will be 1, and when LOCK[n] is low (locked), both data and clock will be valid at the
outputs. BIST-ALONE mode is considered part of normal operation and can be overriden by any of the above priorities.
(6) REN has a lower priority than PWRDWN[n]. When REN is low, the output data (ROUTn[0:9] and RCLK[n]) will be in tri-state. The
LOCK[n] signal’s output is not affected by REN.
(7) There are internal pull-downs on the REN, PWRDWNn and MS_PWRDWN pins. Active operation requires asserting these pins high.
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SCAN926260 Control Signal Truth Table(1) (continued)
SCAN Mode Internal Signals
INPUTS
OUTPUTS
STATE
SCAN_HIZB
SCAN_BIST
MS_PWRDWN
PWRDWN[n]
REN
LOCK[n]
ROUTn[0:9]
RCLK[n]
REN = Low,
Locked(6)(7)
1
0
1
0
1
0
0
0
0
1
10 @ Z
10 @ 1
Z
1
Default State(7)
IEEE 1149.1 Test Modes
The SCAN926260 features interconnect test access that is compliant to the IEEE 1149.1 Standard for Boundary
Scan Test (JTAG). All digital TTL I/O's on the device are accessible using IEEE 1149.1, and entering this test
mode will override all input control cases including power down and REN. In addition to the four required Test
Access Port (TAP) signals of TMS, TCK, TDI, and TDO, TRST is provided for test reset.
To supplement the test coverage provided by the IEEE 1149.1 test access to the digital TTL pins, the
SCAN926260 has two instructions to test the LVDS interconnects. The first is EXTEST. This is implemented at
LVDS levels and is only intended as a go no-go test (e.g. missing cables). The second method is the RUNBIST
instruction. It is an "at-system-speed" interconnect test. It is executed in approximately 33ms with a system clock
speed of 66MHz. There are 12 bits in the RX BIST data register for notification of PASS/FAIL and
TEST_COMPLETE, with two bits for each of the six channels. The RX BIST register is defined as (from MSB to
LSB):
Table 1. RX BIST Register
Bit Number
Description
11 (MSB)
BIST COMPLETE for Channel 6
BIST PASS/FAIL for Channel 6
BIST COMPLETE for Channel 5
BIST PASS/FAIL for Channel 5
BIST COMPLETE for Channel 4
BIST PASS/FAIL for Channel 4
BIST COMPLETE for Channel 3
BIST PASS/FAIL for Channel 3
BIST COMPLETE for Channel 2
BIST PASS/FAIL for Channel 2
BIST COMPLETE for Channel 1
BIST PASS/FAIL for Channel 1
10
9
8
7
6
5
4
3
2
1
0 (LSB)
A "pass" indicates that the BER (Bit-Error-Rate) is better than 10-7. This is a minimum test, so a "fail" indication
means that the BER is higher than 10-7.
The BIST features of the SCAN926260 six channel deserializer are compatible with the BIST features on the
DS92LV8028, the SCAN921023 and the SCAN921025 Serializers.
An important detail is that once both devices have the RUNBIST instruction loaded into their respective
instruction registers, both devices must move into the RTI state within 4K system clocks (At a system CLK of
66MHz and TCK of 1MHz this allows for 66 TCK cycles). This is not a concern when both devices are on the
same scan chain or LSP. However, it can be a problem with some multi-drop devices. This test mode has been
simulated and verified using TI's Enhanced SCAN Bridge (SCANSTA111).
BIST Alone Test Modes
The SCAN926260 also supports a BIST Alone feature which can be run without enabling the JTAG TAP
controller. This feature provides the ability to run continuous BER testing on all channels, or on individual
channels without affecting live traffic on other channels. The ability to run the BERT (Bit-Error-Rate-Test) while
adjacent channels are carrying normal traffic is a useful tool to determine how normal traffic will affect the BER
on any given channel.
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The BIST Alone features can be accessed using the 5 pins defined as BIST_SEL0, BIST_SEL1, BIST_SEL2,
BIST_ACT, and BISTMODE_REQ.
BIST_ACT activates the BIST Alone mode. The BIST Alone mode will continue until deactivated by the
BIST_ACT pin. The BIST_ACT input must be high or low for four or more clock cycles in order to activate or
deactivate the BIST Alone mode. The BIST_ACT input is pulled low internally.
BISTMODE_REQ is used to select either gross error reporting or a specific output error report. When the BIST
Alone mode is active, the LOCKn output for all channels running BIST Alone will go low and the respective
ROUTn(0:9) output will report any errors. When BISTMODE_REQ is low, the error reporting is set to Gross
Mode, and whenever a bit contains one or more errors, ROUT(0:9) for that channel goes high and stays high
until deactivation by the BIST_ACT input. When BISTMODE_REQ is high, the output error reporting is set to Bit
Error mode. Whenever any data bit contains an error, the data output for that corresponding bit goes high. The
default setting is Gross Error mode.
The three BIST_SELn inputs determine which channel is in BIST Alone mode according to the following table:
Table 2. BIST Alone Mode Selection
BIST_ACT
BIST_SEL2
BIST_SEL1
BIST_SEL0
BIST for Channel
1
1
1
1
1
1
1
1
0
0
0
0
0
1
1
1
1
X
0
0
1
1
0
0
1
1
X
0
1
0
1
0
1
0
1
X
0
1
2
3
4
5
All Channels
IDLE
IDLE
APPLICATION INFORMATION
USING THE SCAN926260
The SCAN926260 combines six 1:10 deserializers into a single chip. Each of the six deserializers accepts a
BusLVDS data stream up to 660 Mbps from one of TI's 10-Bit Serializers. The Deserializers then recover the
embedded two clock bits and data to deliver the resulting 10-bit wide words to the output. The Deserializer uses
a separate reference clock (REFCLK) and an on-board PLL to extract the clock information from the incoming
data stream and then deserialize the data. The Deserializer monitors the incoming clock information, determines
lock status, and asserts the LOCKn output high when loss of lock occurs.
POWER CONSIDERATIONS
An all CMOS design of the Deserializer makes it an inherently low power device.
POWERING UP THE DESERIALIZER
The SCAN926260 can be powered up at any time. The REFCLK input can be running before the Deserializer
powers up, and it must be running in order for the Deserializer to lock to incoming data. The Deserializer outputs
(ROUTn[0:9]), the recovered clock (RCLKn), and LOCKn are high until the Deserializer detects data transmission
at its inputs and locks to the incoming data stream.
DATA TRANSFER
Once the Deserializer powers up, it must be phase locked to the transmitter to transfer data. Phase locking
occurs when the Deserializer locks to incoming data or when the Serializer sends sync patterns. The Serializer
sends SYNC patterns whenever the SYNC1 or SYNC2 inputs are high. The LOCKn output of the Deserializer
remains high until it has locked to the incoming data stream. Connecting the LOCKn output of the Deserializer to
one of the SYNC inputs of the Serializer will ensure that enough SYNC patterns are sent to achieve Deserializer
lock.
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The Deserializer can also lock to incoming data by simply powering up the device and allowing the “lock to
pseudo random data” circuitry to find and lock to the data stream.
While the Deserializer LOCKn output is low, data at the respective channel’s Deserializer outputs (ROUTn[0:9])
is valid, except for the specific case when loss of lock occurs during transmission which is further discussed in
the RECOVERING FROM LOCK LOSS section below.
NOISE MARGIN
The Deserializer noise margin is the amount of input jitter (phase noise) that the Deserializer can tolerate and still
reliably receive data. Various environmental and systematic factors include:
Serializer: TCLK jitter, VDD noise (noise bandwidth and out-of-band noise)
Media: ISI, Large VCM shifts
Deserializer: VDD noise
Please see the section on USING NOISE MARGIN TO VALIDATE SIGNAL QUALITY for more information.
RECOVERING FROM LOCK LOSS
In the case where the Deserializer loses lock during data transmission, up to 1 cycle of data that was previously
received can be invalid. This is due to the delay in the lock detection circuit. The lock detect circuit requires that
invalid clock information be received two times in a row to indicate loss of lock. Since clock information has been
lost, it is possible that data was also lost during these cycles. Therefore, after the Deserializer relocks to the
incoming data stream and the Deserializer LOCKn pin goes low, at least one previous data cycle should be
suspect for bit errors.
The Deserializer can relock to the incoming data stream by making the Serializer resend SYNC patterns, as
described above, or by locking to pseudo random data, which can take more time, depending on the data
patterns being received.
HOT INSERTION
All Bus LVDS Deserializers are hot pluggable if you follow a few rules. When inserting, ensure the Ground pin(s)
makes contact first, then the VCC pin(s), and then the I/O pins. When removing, the I/O pins should be
unplugged first, then the VCC, then the Ground. Random lock hot insertion is illustrated in Figure 9.
Figure 9. Hot Insertion Lock to Pseudo-Random Data
TRANSMISSION MEDIA
The Serializer and Deserializer can also be used in point-to-point configurations, through PCB trace, through
twisted pair cable, or twinax cables. In point-to-point configurations, the transmission media need only be
terminated at the receiver end. Please note that in point-to-point configurations, the potential of offsetting the
ground levels of the Serializer vs. the Deserializer must be considered. In some applications, multidrop
configurations may be possible. Bus LVDS provides a ±1.0V common mode range at the receiver inputs.
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FAILSAFE BIASING FOR THE SCAN926260
The SCAN926260 has internal failsafe biasing and an improved input threshold sensitivity of ±50mV versus
±100mV for the DS92LV1210.. This allows for a greater differential noise margin. However, in cases where the
receiver input is not being actively driven, the increased sensitivity of the SCAN926260 can pickup noise as a
signal and cause unintentional locking. For example, this can occur when an input cable is disconnected.
External resistors can be added to the receiver circuit board to boost the level of failsafe biasing. Typically, the
non-inverting receiver input is pulled up and the inverting receiver input is pulled down by high value resistors.
The pull-up and pull-down resistors (R1 and R2) provide a current path through the termination resistor (RL) which
biases the receiver inputs when they are not connected to an active driver. The value of the pull-up and pull-
down resistors should be chosen so that enough current is drawn to provide a +15mV minimum drop across the
termination resistor in the presence of anticipated input noise. Also, in systems where use of the individual
channel is well known or controlled, using the respective channel’s PWRDWNn pin(s) may eliminate the need for
external Failsafe Biasing. Please see Figure 11 for the Failsafe Biasing Setup.
DIFFERENCES BETWEEN the DS92LV1260, the SCAN921260, and the SCAN926260
The DS92LV1260 is a six channel, ten bit, Bus LVDS Deserializer with random lock capability and a parallel
clock rate up to 40MHz. Each channel contains a recovered clock (RCLKn) and lock (LOCKn) output. The
DS92LV1260 also contains a seventh serial input channel that serves as a redundant input. Also, unlike previous
deserializers, the LOCKn signal is synchronous to valid data appearing on the outputs. Please see the
DS92LV1260 datasheet for more specific details about the seventh redundant channel and further details.
The SCAN921260 contains the same basic functions as the DS92LV1260. However, the SCAN921260 has an
increased parallel clock rate up to 66MHz, is IEEE 1149.1 (JTAG) compliant and also contains at-speed Built-In-
Self-Test (BIST).
The SCAN926260 contains the same basic functions as the SCAN921260. However, in addition to a master
powerdown, the SCAN926260 has individual powerdown pins per channel, has eliminated the seventh redundant
channel, and now asserts all outputs ROUTn[0:9] and RCLKn high during powerdown and during loss of lock.
Please also note that the LOCKn pin output is no longer affected by REN. Also, the SCAN926260 is footprint
compatible and may be used interchangibly with the SCAN921260.
USING NOISE MARGIN TO VALIDATE SIGNAL QUALITY
The parameters tRNMI-LEFT and tRNMI-RIGHT are calculated by first measuring how much of the ideal bit the receiver
needs to ensure correct sampling. After determining this amount, what remains of the ideal bit that is available
for external sources of noise is called noise margin. Noise margin does not include transmitter jitter. Please see
Figure 8 for a graphical explanation. Also, for a more detailed explanation of noise margin, please see
Application Note 1217 (SNLA053) titled "How to Validate BLVDS SER/DES Signal Integrity Using an Eye Mask."
The vertical limits of the mask are determined by the SCAN926260 receiver input threshold of ±50mV.
BYPASS
Circuit board layout and stack-up for the BLVDS devices should be designed to provide noise-free power to the
device. Good layout practice will also separate high-frequency or high-level inputs and outputs to minimize
unwanted stray noise pickup, feedback and interference. Power system performance may be greatly improved by
using thin dielectrics (4 to 10 mils) for power / ground sandwiches. This increases the intrinsic capacitance of the
PCB power system which improves power supply filtering, especially at high frequencies, and makes the value
and placement of external bypass capacitors less critical. External bypass capacitors should include both RF
ceramic and tantalum electrolytic types. RF capacitors may use values in the range of 0.01 uF to 0.1 uF.
Tantalum capacitors may be in the 2.2 uF to 10 uF range. Voltage rating of the tantalum capacitors should be at
least 3X the power supply voltage being used.
It is a recommended practice to use two vias at each power pin as well as at all RF bypass capacitor terminals.
Dual vias reduce the interconnect inductance by up to half, thereby reducing interconnect inductance and
extending the effective frequency range of the bypass components. Locate RF capacitors as close as possible to
the supply pins, and use wide low impedance traces (not 50 Ohm traces). Surface mount capacitors are
recommended due to their smaller parasitics. When using multiple capacitors per supply pin, locate the smaller
value closer to the pin. A large bulk capacitor is recommend at the point of power entry. This is typically in the
50uF to 100uF range and will smooth low frequency switching noise.
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Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate
switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not
required. Pin Description tables typically provide guidance on which circuit blocks are connected to which power
pin pairs. In some cases, an external filter may be used to provide clean power to sensitive circuits such as PLL
circuitry.
Use at least a four layer board with a power and ground plane. Locate CMOS (TTL) signals away from the LVDS
lines to prevent coupling. Closely-coupled differential lines of 100 Ohms ZDIFF are typically recommended for
LVDS interconnects. The closely-coupled lines help to ensure that coupled noise will appear as common-mode
and is rejected by the receivers. Also, the tight coupled lines will radiate less.
Termination of the LVDS interconnect is required. For point-to-point applications, termination should be located at
the load end. Nominal value is 100 Ohms to match the line's differential impedance. Place the resistor as close
to the receiver inputs as possible to minimize the resulting stub between the termination resistor and receiver.
Additional general guidance can be found in the LVDS Owner's Manual - available in PDF format from the TI
web site at: http://www.ti.com/ww/en/analog/interface/lvds.shtml. For packaging information on NFBGA's, please
see AN-1126 (SNOA021).
Guidance for the SCAN926260 is provided next:
SCAN926260: SIX 1 TO 10 DESERIALIZERS
General guidance is provided below. Exact guidance can not be given as it is dictated by other board level
/system level criteria. This includes the density of the board, power rails, power supply, and other integrated
circuit power supply needs.
DVDD = DIGITAL SECTION POWER SUPPLY
These pins supply the digital portion and receiver output buffers of the device. Receiver DVDD pins require more
bypass to power outputs under synchronous switching conditions. An estimate of local capacitance requires a
minimum of 20nF. This is calculated by taking 66 (60 LVTTL Outputs + 6 RCLK Outputs) times the maximum
output short circuit current (IOS) of 85mA. Multiplying this number by the maximum rise time (tCLH) of 4ns and
dividing by the maximum allowed droop in VDD (assume 50mV) yields 448.8nF. Dividing this number by the
number of DVDD pins (25) yields 18nF. Rounding up to a standard value, 0.1uF is selected for each DVDD pin.
The capacitative bandwidth for this capacitor may be extended by placing a 0.01uF capacitor in parallel. The
0.01uF capacitor should be placed closer to the DVDD pin than the 0.1uF capacitor.
PVDD = PLL SECTION POWER SUPPLY
The PVDD pin supplies the PLL circuit. PLL circuits require clean power for the minimization of jitter. A supply
noise frequency in the 300kHZ to 1MHz range can cause increased output jitter. Certain power supplies may
have switching frequencies or high harmonic content in this range. If this is the case, filtering of this noise
spectrum may be required. A notch filter response is best to provide a stable VDD, suppression of the noise
band, and good high-frequency response (clock fundamental). This may be accomplished with a pie filter (CRC
or CLC). If employed, a separate pie filter is recommended for each PLL to minimize drop in potential due to the
series resistance. Separate power planes for the PVDD pins is typically not required.
AVDD = LVDS SECTION POWER SUPPLY
The AVDD pin supplies the LVDS portion of the circuit. The SCAN926260 has four AVDD pins. Due to the nature
of the design, current draw is not excessive on these pins. A 0.1uF capacitor is sufficient for these pins. If space
is available, the 0.01uF capacitor may be used in parallel with the 0.1uF capacitor for additional high frequency
filtering.
GROUNDs
The AGND pin should be connected to the signal common in the cable for the return path of any common-mode
current. Most of the LVDS current will be odd-mode and return within the interconnect pair. A small amount of
current may be even-mode due to coupled noise and driver imbalances. This current should return via a low
impedance known path.
For a typical application circuit, please see Figure 10.
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Serializers:
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DS92LV1021 (16-40 MHz)
BLVDS Link
or
DS92LV1023 (40-66 MHz)
or
DS92LV8028 (25-66 MHz)
+
or
SCAN921023 (20-66
MHz)
(Serializer AGND)
or
SCAN921025 (20-80
MHz)
RL
-
+
RINn
0.01uF 0.1uF
AVDD
AGND
+Vcc
SCAN926260
(16-66 MHz)
+Vcc
0.1uF 0.01uF
DVDD
0.3uF 0.1uF 1.0uH
0.1uF
PVDD
PGND
+Vcc
(Optional)
DGND
(Only one power/ground for each supply type shown for clarity-bypass networks should be repeated for all
power/ground pairs.)
Figure 10. Typical Application Circuit
Figure 11. Optional Additional External Failsafe Biasing
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Pin Diagram
Figure 12. Top View of SCAN926260TUF (196 pin NFBGA)
Note: * = OVERBAR
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Pin Descriptions
Pin Name
Type
Pins
Description
GND
GND
B2, B14, L4, L5
Ground pins for ESD structures.
Bus LVDS
Input
A3-A4, A6-A7, A9-10, C5-
C6, C8-C9, C10-C11
Bus LVDS differential input pins. Failsafe described in Application
Information section.
RINn
±
This pin is not bonded out. Therefore, you may tie this pin High,
Low, or as a N/C. However, for board layout compatibility with the
SCAN921260 or the DS92LV1260, tie this pin LOW.
N/C
E3
B1, B3, C4, D6, D12, E6,
E7, E9, E10, F7, F10, F12,
G6, G10, H6, H10, J5, J8,
J9, J10, K5, K6, K7, K10,
L10
DVdd
Supply voltage for digital section.
A1, D4, D5, D7, D9, D11,
E5, E8, F5, F6, F8, F9, G5,
G7, G8, G9, H5, H7, H8, H9,
J6, J7, K8, K9, L7
DGND
Ground pins for digital section.
Supply voltage for PLL circuitry.
E1, F1, F14, G14, J1, J14,
K1, K14,P5, P6, P9, P10
PVdd
A14, B12, D10, G1, G2,
PGND
G13, H1, H13, H14, J4, J13, Ground pins for PLL circuitry.
N7, N8, P7, P8
AVdd
A11, B6, B9, C7
Supply voltage for analog circuitry.
Ground pins for analog circuitry.
AGND
A5, A8, B7, B8, B11
A low on one of these pins puts the corresponding channel into
sleep mode and a high makes the corresponding channel active.
There is an internal pull-down on each of these pins that defaults
the PWRDWNn input to sleep mode. Active operation requires
asserting a high on the PWRDWNn and MS_PWRDWN input.
3.3V CMOS
Input
A12, A13, C3, C12, E11,
F11
PWRDWN [0:5]
A low on this pin puts the device into sleep mode and a high
makes the part active. There is an internal pull-down that defaults
the MS_PWRDWNn input to sleep mode. Active operation requires
asserting a high on the MS_PWRDWNn input.
3.3V CMOS
Input
MS_PWRDWN
REN
B5
A2
Enables the ROUTn[0:9], RCLKn, outputs. There is an internal
pull-down that defaults REN to tri-state the outputs. Active outputs
require asserting a high on REN. Please note that LOCKn is not
affected by REN.
3.3V CMOS
Input
3.3V CMOS
Input
Frequency reference input. Used by the PLL while locking onto
incoming LVDS streams.Has no phase relation to RCLK.
REFCLK
B4
3.3V CMOS
Output
Indicates the status of the PLLs for the individual deserializers:
LOCKn= L indicates locked, LOCKn= H indicates unlocked.
LOCK[0:5]
D13, F3, N3, P1, P12, P13
E2, E4, E12, E13, E14, F4,
G3, G4, G11, G12, H2, H3,
H4, H11, H12, J2, J3, J11,
J12, K2, K3, K4, K12, K13,
L1, L3, L6, L8, L9, L11, L12,
L13, L14, M1, M2, M3, M4,
M5, M6, M7, M8, M9, M10,
M11, M12, M14, N1, N2, N4,
N6, N9, N11, N12, N13,
Outputs for the ten bit deserializers; n = deserializer number.
When a channel is not locked, ROUT[0:9] are high for that
channel.
3.3V CMOS
Output
ROUTn[0:9]
N14, P2, P3, P4, P11, P14
3.3V CMOS
Output
Recovered clock for each deserializer's output data. When a
channel is not locked, the RCLK for that channel is high.
RCLK[0:5]
TMS
F2, F13, L2, M13,N5, N10
C1
Test Mode Select input to support IEEE 1149.1. There is a weak
internal pull-up on TMS that defaults TRST, TDI, TCK and TDO to
be inactive. However, in noisy environments, pulling TMS high
ensures the JTAG test access port (TAP) is never activated.
3.3V CMOS
Input
3.3V CMOS
Input
Test Reset Input to support IEEE 1149.1. There is a weak internal
pull-up on this pin.
TRST
TDI
C2
D1
D2
3.3V CMOS
Input
Test Data Input to support IEEE 1149.1. There is a weak internal
pull-up on this pin.
3.3V CMOS
Input
TCK
Test Clock to support IEEE 1149.1
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Pin Descriptions (continued)
Pin Name
Type
Pins
Description
3.3V CMOS
Output
TDO
D3
Test Data Output to support IEEE 1149.1.
3.3V CMOS
Input
BISTMODE_REQ
B10
BIST Alone Error Reporting Mode Select Input.
These pins control which channels are active for the BIST Alone
operating mode. The BIST Alone Mode Selection Table describes
their function. There are internal pull-ups that default all
BIST_SEL[0:2] to high, which is the idle state for all channels in
the BIST Alone mode.
3.3V CMOS
Input
BIST_SEL[0:2]
C14, D8, D14
A high on this pin activates the BIST Alone operating mode. There
is a weak internal pull-down that should default the BIST_ACT to
de-activate the BIST Alone operating mode. In a noisy operating
environment, it is recommended that an external pull down be
used to ensure that BIST_ACT stays in the low state.
3.3V CMOS
Input
BIST_ACT
N/C
K11
B13, C13
Unused solder ball location. Do not connect.
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SNLS153H –JUNE 2002–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision G (April 2013) to Revision H
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 18
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
SCAN926260TUF/NOPB
SCAN926260TUFX/NOPB
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
ACTIVE
NFBGA
NFBGA
NZH
196
196
119
RoHS & Green
SNAGCU
Level-3-260C-168 HR
Level-3-260C-168 HR
SCAN926260T
UF
>B
ACTIVE
NZH
1000 RoHS & Green
SNAGCU
-40 to 85
SCAN926260T
UF
>B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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10-Dec-2020
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SCAN926260TUFX/NOPB NFBGA
NZH
196
1000
330.0
24.4
15.3
15.3
2.5
20.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
NFBGA NZH 196
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 45.0
SCAN926260TUFX/NOPB
1000
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jun-2023
TRAY
L - Outer tray length without tabs
KO -
Outer
tray
height
W -
Outer
tray
width
Text
P1 - Tray unit pocket pitch
CW - Measurement for tray edge (Y direction) to corner pocket center
CL - Measurement for tray edge (X direction) to corner pocket center
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device
Package Package Pins SPQ Unit array
Max
matrix temperature
(°C)
L (mm)
W
K0
P1
CL
CW
Name
Type
(mm) (µm) (mm) (mm) (mm)
SCAN926260TUF/NOPB
NZH
NFBGA
196
119
7 X 17
150
322.6 135.9 7620 18.1
12.7
12.9
Pack Materials-Page 3
MECHANICAL DATA
NZH0196A
UJB196A (Rev C)
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