SM72238TDX-5.0 [TI]

SM72238TD-50;
SM72238TDX-5.0
型号: SM72238TDX-5.0
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

SM72238TD-50

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中文:  中文翻译
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SM72238  
www.ti.com  
SNVS694C JANUARY 2011REVISED APRIL 2013  
Micropower Voltage Regulator  
Check for Samples: SM72238  
1
FEATURES  
DESCRIPTION  
The SM72238 is a micropower voltage regulator with  
very low quiescent current (75µA typ.) and very low  
dropout voltage (typ. 40mV at light loads and 380mV  
at 100mA). It is ideally suited for use in battery-  
powered systems. Furthermore, the quiescent current  
of the SM72238 increases only slightly in dropout,  
prolonging battery life.  
2
Renewable Energy Grade  
High-Accuracy Output Voltage  
Ensured 100mA Output Current  
Extremely Low Quiescent Current  
Low Dropout Voltage  
Extremely Tight Load and Line Regulation  
Very Low Temperature Coefficient  
Use as Regulator or Reference  
Needs Minimum Capacitance for Stability  
Current and Thermal Limiting  
The SM72238 is available in the surface-mount D-  
Pak package.  
Careful design of the SM72238 has minimized all  
contributions to the error budget. This includes a tight  
initial tolerance (.5% typ.), extremely good load and  
line regulation (.05% typ.) and a very low output  
voltage temperature coefficient, making the part  
useful as a low-power voltage reference.  
Stable With Low-ESR Output Capacitors  
(10mto 6)  
Block Diagram and Typical Applications  
Figure 1. SM72238  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2011–2013, Texas Instruments Incorporated  
SM72238  
SNVS694C JANUARY 2011REVISED APRIL 2013  
www.ti.com  
Connection Diagrams  
Front View  
Figure 2. PFM Package  
See Package Number NDP0003B  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Absolute Maximum Ratings(1)(2)  
Input Supply Voltage  
0.3 to +30V  
Internally Limited  
+150°C  
Power Dissipation  
Junction Temperature (TJ)  
Ambient Storage Temperature  
Soldering Dwell Time, Temperature  
65° to +150°C  
4 seconds, 260°C  
10 seconds, 240°C  
75 seconds, 219°C  
2500V  
Wave  
Infrared  
Vapor Phase  
Human Body Model(3)  
ESD Rating  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and  
associated test conditions, see the Electrical Characteristics tables.  
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.  
(3) Human Body Model 1.5kΩ in series with 100pF.  
Operating Ratings(1)  
Maximum Input Supply Voltage  
Junction Temperature Range, (TJ)(2)  
30V  
40° to +125°C  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and  
associated test conditions, see the Electrical Characteristics tables.  
(2) Junction-to-case thermal resistance for the PFM package is 5.4°C/W.  
2
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SM72238  
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SNVS694C JANUARY 2011REVISED APRIL 2013  
Electrical Characteristics(1)  
Parameter  
3V Versions  
Output Voltage  
Conditions(1)  
Typ  
3.0  
3.0  
3.0  
3.0  
Tested Limit(2)  
Design Limit(3)  
Units  
TJ = 25°C  
3.030  
2.970  
V max  
V min  
V max  
V min  
V max  
V min  
V max  
V min  
25°C TJ 85°C  
3.045  
2.955  
3.060  
2.940  
3.072  
2.928  
Full Operating Temperature Range  
Output Voltage  
100µA IL 100mA,  
TJ TJMAX  
3.3V Versions  
Output Voltage  
TJ = 25°C  
3.3  
3.3  
3.3  
3.3  
3.333  
3.267  
V max  
V min  
V max  
V min  
V max  
V min  
V max  
V min  
25°C TJ 85°C  
3.350  
3.251  
3.366  
3.234  
3.379  
3.221  
Full Operating Temperature Range  
Output Voltage  
100µA IL 100mA  
TJ TJMAX  
5.0V Versions  
Output Voltage  
TJ = 25°C  
5.0  
5.0  
5.0  
5.0  
5.05  
4.95  
V max  
V min  
V max  
V min  
V max  
V min  
V max  
V min  
25°C TJ 85°C  
5.075  
4.925  
5.1  
Full Operating Temperature Range  
4.9  
Output Voltage  
100µA IL 100mA  
TJ TJMAX  
5.12  
4.88  
All Voltage Options  
Output Voltage  
See(4)  
50  
150  
ppm/°C  
Temperature Coefficient  
Line Regulation(5)  
Load Regulation(5)  
Dropout Voltage(7)  
(VONOM + 1)V Vin 30V(6)  
0.04  
0.2  
0.2  
80  
% max  
% max  
0.4  
0.3  
100µA IL 100mA  
IL = 100µA  
0.1  
% max  
% max  
mV max  
mV max  
mV max  
mV max  
50  
150  
600  
IL = 100mA  
450  
380  
(1) Unless otherwise specified all limits ensured for VIN = (VONOM + 1)V, IL = 100µA and CL = 1µF. Limits appearing in boldface type apply  
over the entire junction temperature range for operation. Limits appearing in normal type apply for TA = TJ = 25°C.  
(2) Ensured and 100% production tested.  
(3) Ensured but not 100% production tested. These limits are not used to calculate outgoing AQL levels.  
(4) Output or reference voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.  
(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to  
heating effects are covered under the specification for thermal regulation.  
(6) For IL = 100µA and TJ = 125°C, line regulation is ensured by design to 0.2%. See Typical Performance Characteristics for line regulation  
versus temperature and load current.  
(7) Dropout Voltage is defined as the input to output differential at which the output voltage drops 100 mV below its nominal value  
measured at 1V differential. At very low values of programmed output voltage, the minimum input supply voltage of 2V (2.3V over  
temperature) must be taken into account.  
Copyright © 2011–2013, Texas Instruments Incorporated  
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SM72238  
SNVS694C JANUARY 2011REVISED APRIL 2013  
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Electrical Characteristics(1) (continued)  
Parameter  
Conditions(1)  
Typ  
Tested Limit(2)  
Design Limit(3)  
Units  
Ground Current  
IL = 100µA  
75  
120  
µA max  
µA max  
mA max  
mA max  
µA max  
µA max  
mA max  
mA max  
140  
14  
IL = 100mA  
8
12  
Dropout Ground Current Vin = (VONOM 0.5)V,  
110  
160  
0.05  
170  
200  
0.2  
IL = 100µA  
200  
220  
Current Limit  
Vout = 0  
See(8)  
Thermal Regulation  
%/W  
max  
Output Noise,  
10 Hz to 100 kHz  
CL = 1µF (5V Only)  
CL = 200µF  
430  
160  
100  
µV rms  
µV rms  
µV rms  
CL = 3.3µF  
(Bypass = 0.01µF)  
(8) Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load  
or line regulation effects. Specifications are for a 50mA load pulse at VIN = 30V (1.25W pulse) for T = 10ms.  
4
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SM72238  
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SNVS694C JANUARY 2011REVISED APRIL 2013  
Typical Performance Characteristics  
Quiescent Current  
Dropout Characteristics  
Figure 3.  
Figure 4.  
Input Current  
Input Current  
Figure 5.  
Figure 6.  
Output Voltage  
vs.  
Temperature of 3  
Representative Units  
Quiescent Current  
Figure 7.  
Figure 8.  
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SNVS694C JANUARY 2011REVISED APRIL 2013  
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Typical Performance Characteristics (continued)  
Quiescent Current  
Quiescent Current  
Figure 9.  
Figure 10.  
Quiescent Current  
Short Circuit Current  
Figure 11.  
Figure 12.  
Dropout Voltage  
Line Transient Response  
Figure 13.  
Figure 14.  
6
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SM72238  
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SNVS694C JANUARY 2011REVISED APRIL 2013  
Typical Performance Characteristics (continued)  
Load Transient Response  
Load Transient Response  
Figure 15.  
Figure 16.  
Output Impedance  
Ripple Rejection  
Figure 17.  
Figure 18.  
Ripple Rejection  
Ripple Rejection  
Figure 19.  
Figure 20.  
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SM72238  
SNVS694C JANUARY 2011REVISED APRIL 2013  
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Typical Performance Characteristics (continued)  
Shutdown Threshold Voltage  
Line Regulation  
Figure 21.  
Figure 22.  
Maximum Rated Output Current  
Thermal Response  
Figure 23.  
Figure 24.  
Output Capacitor ESR Range  
Figure 25.  
8
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SM72238  
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SNVS694C JANUARY 2011REVISED APRIL 2013  
APPLICATION HINTS  
EXTERNAL CAPACITORS  
A 1.0µF (or greater) capacitor is required between the output and ground for stability. Without this capacitor the  
part will oscillate. Most types of tantalum or aluminum electrolytics work fine here; even film types work but are  
not recommended for reasons of cost. Many aluminum electrolytics have electrolytes that freeze at about 30°C,  
so solid tantalums are recommended for operation below 25°C. The important parameters of the capacitor are  
an ESR of about 5Ω or less and a resonant frequency above 500kHz. The value of this capacitor may be  
increased without limit.  
Ceramic capacitors whose value is greater than 1000pF should not be connected directly from the SM72238  
output to ground. Ceramic capacitors typically have ESR values in the range of 5 to 10m, a value below the  
lower limit for stable operation (see Figure 25).  
The reason for the lower ESR limit is that the loop compensation of the part relies on the ESR of the output  
capacitor to provide the zero that gives added phase lead. The ESR of ceramic capacitors is so low that this  
phase lead does not occur, significantly reducing phase margin. A ceramic output capacitor can be used if a  
series resistance is added (recommended value of resistance about 0.1to 2).  
At lower values of output current, less output capacitance is required for stability. The capacitor can be reduced  
to 0.33µF for currents below 10mA or 0.1µF for currents below 1mA.  
Unlike many other regulators, the SM72238 will remain stable and in regulation with no load in addition to the  
internal voltage divider. This is especially important in CMOS RAM keep-alive applications.  
A 1µF tantalum, ceramic or aluminum electrolytic capacitor should be placed from the SM72238 input to ground  
if there is more than 10 inches of wire between the input and the AC filter capacitor or if a battery is used as the  
input.  
REDUCING OUTPUT NOISE  
In reference applications it may be advantageous to reduce the AC noise present at the output. One method is to  
reduce the regulator bandwidth by increasing the size of the output capacitor. This is the only way noise can be  
reduced but is relatively inefficient, as increasing the capacitor from 1µF to 220µF only decreases the noise from  
430µV to 160µV rms for a 100kHz bandwidth at 5V output.  
Typical Applications  
SM72238  
*Minimum input-output voltage ranges from 40mV to 400mV, depending on load current. Current limit is typically  
160mA.  
Figure 26. 5 Volt Current Limiter  
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SM72238  
SNVS694C JANUARY 2011REVISED APRIL 2013  
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Schematic Diagram  
10  
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SM72238  
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SNVS694C JANUARY 2011REVISED APRIL 2013  
REVISION HISTORY  
Changes from Revision B (April 2013) to Revision C  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 10  
Copyright © 2011–2013, Texas Instruments Incorporated  
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11  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
21-May-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
SM72238TD-3.0/NOPB  
SM72238TD-3.3/NOPB  
SM72238TD-5.0/NOPB  
SM72238TDE-3.0/NOPB  
SM72238TDE-3.3/NOPB  
SM72238TDE-5.0/NOPB  
SM72238TDX-3.0/NOPB  
SM72238TDX-3.3/NOPB  
SM72238TDX-5.0/NOPB  
ACTIVE  
TO-252  
TO-252  
TO-252  
TO-252  
TO-252  
TO-252  
TO-252  
TO-252  
TO-252  
NDP  
3
3
3
3
3
3
3
3
3
75  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
CU SN  
CU SN  
CU SN  
CU SN  
CU SN  
CU SN  
CU SN  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
S72238  
-3.0  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
NDP  
NDP  
NDP  
NDP  
NDP  
NDP  
NDP  
NDP  
75  
75  
Green (RoHS  
& no Sb/Br)  
S72238  
-3.3  
Green (RoHS  
& no Sb/Br)  
S72238  
250  
250  
250  
2500  
2500  
2500  
Green (RoHS  
& no Sb/Br)  
S72238  
-3.0  
Green (RoHS  
& no Sb/Br)  
S72238  
-3.3  
Green (RoHS  
& no Sb/Br)  
S72238  
Green (RoHS  
& no Sb/Br)  
S72238  
-3.0  
Green (RoHS  
& no Sb/Br)  
S72238  
-3.3  
Green (RoHS  
& no Sb/Br)  
S72238  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-May-2013  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
29-May-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SM72238TDE-3.0/NOPB TO-252  
SM72238TDE-3.3/NOPB TO-252  
SM72238TDE-5.0/NOPB TO-252  
SM72238TDX-3.0/NOPB TO-252  
SM72238TDX-3.3/NOPB TO-252  
SM72238TDX-5.0/NOPB TO-252  
NDP  
NDP  
NDP  
NDP  
NDP  
NDP  
3
3
3
3
3
3
250  
250  
178.0  
178.0  
178.0  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
16.4  
16.4  
16.4  
6.9  
6.9  
6.9  
6.9  
6.9  
6.9  
10.5  
10.5  
10.5  
10.5  
10.5  
10.5  
2.7  
2.7  
2.7  
2.7  
2.7  
2.7  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
16.0  
16.0  
16.0  
16.0  
16.0  
16.0  
Q2  
Q2  
Q2  
Q2  
Q2  
Q2  
250  
2500  
2500  
2500  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
29-May-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SM72238TDE-3.0/NOPB  
SM72238TDE-3.3/NOPB  
SM72238TDE-5.0/NOPB  
SM72238TDX-3.0/NOPB  
SM72238TDX-3.3/NOPB  
SM72238TDX-5.0/NOPB  
TO-252  
TO-252  
TO-252  
TO-252  
TO-252  
TO-252  
NDP  
NDP  
NDP  
NDP  
NDP  
NDP  
3
3
3
3
3
3
250  
250  
213.0  
213.0  
213.0  
367.0  
367.0  
367.0  
191.0  
191.0  
191.0  
367.0  
367.0  
367.0  
55.0  
55.0  
55.0  
38.0  
38.0  
38.0  
250  
2500  
2500  
2500  
Pack Materials-Page 2  
MECHANICAL DATA  
NDP0003B  
TD03B (Rev F)  
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amplifier.ti.com  
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www.dlp.com  
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www.ti.com/computers  
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www.ti.com/security  
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www.ti.com/video  
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www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  

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