SMJ320C31KGDL40B [TI]
IC,DSP,32-BIT,CMOS,DIE;
| 型号： | SMJ320C31KGDL40B |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | IC,DSP,32-BIT,CMOS,DIE |
| 文件： | 总9页 (文件大小：108K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMP320C31KGDB, SMJ320C31KGDB, SMJ320LC31KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS023B – APRIL 1997 – REVISED OCTOBER 2001
Commercial Operating Free-Air
Temperature Range
–0°C to 70°C
Two 32-Bit Timers With Control and
Counter Registers
Validated Ada Compiler
Military Operating Free-Air
Temperature Range
64-Word × 32-Bit Instruction Cache
On-Chip Direct Memory Access (DMA)
Controller for Concurrent I/O and CPU
Operation
–55°C to 125°C, QML Processing
Fast Instruction Cycle Time of 50 ns
Two 1K × 32-Bit Single-Cycle Dual-Access
On-Chip RAM Blocks
Flexible Boot Program Loader for the
’320C31KGDB Instead of the ROM
32-Bit Instruction and Data Words,
24-Bit Addresses
One 32-Bit External Port for the
’320C31KGDB (24-Bit Address)
Integer, Floating-Point, and Logical
Operations
Two Address Generators With Eight
Auxiliary Registers and Two Auxiliary
Register Arithmetic Units (ARAUs)
40- or 32-Bit Floating-Point/Integer
Multiplier and Arithmetic Logic Unit (ALU)
Zero-Overhead Loops With Single-Cycle
Branches
24 × 24-Bit Integer Multiplier, 32-Bit Product
32 × 32-Bit Floating-Point Multiplier,
40-Bit Product
Interlocked Instructions for
Multiprocessing Support
Parallel ALU and Multiplier Execution in a
Single Cycle
Two- and Three-Operand Instructions
Conditional Calls and Returns
Block Repeat Capability
32-Bit Barrel Shifter
Eight Extended-Precision Registers
(Accumulators)
Fabricated Using Enhanced Performance
Implanted CMOS (EPIC ) Technology by
Texas Instruments
Circular and Bit-Reversed Addressing
Capabilities
One Independent Bidirectional Serial Port
With Support for 8-, 16-, 24-, or 32-Bit
Transfers
description
The TMP/SMJ320C31KGDB and SMJ320LC31KGDB digital signal processors (DSPs) known good dies
(KGDs) are high-performance, 32-bit floating-point processors manufactured in 0.72-µm, double-level metal
CMOS technology.
The TMP/SMJ320C31KGDB and SMJ320LC31KGDB internal busing and special digital signal processing
instruction set have the speed and flexibility to execute up to 40 million floating-point operations per second
(MFLOPS). The devices optimize speed by implementing functions in hardware that other processors
implement through software or microcode. This hardware-intensive approach provides performance previously
unavailable on a single chip.
The devices can perform parallel multiply and ALU operations on integer or floating-point data in a single cycle.
Each processor also possesses a general-purpose register file, a program cache, dedicated ARAUs, internal
dual-access memories, one DMA channel supporting concurrent I/O, and a short machine-cycle time. High
performance and ease of use are results of these features.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
Copyright 2001, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
unless otherwise noted. On all other products, production
testing of all parameters.
processing does not necessarily include testing of all parameters.
1
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMP320C31KGDB, SMJ320C31KGDB, SMJ320LC31KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS023B – APRIL 1997 – REVISED OCTOBER 2001
description (continued)
The large address space, multiprocessor interface, internally and externally generated wait states, one external
interface port, two timers, one serial port, and multiple interrupt structure enhance general-purpose
applications. The TMP320C31KGDB and the SMJ320C31KGDB support a wide variety of system applications
from host processor to dedicated coprocessor.
High-level language support is implemented through a register-based architecture, large address space, and
the device’s ability to execute 40 million floating-point operations per second (MFLOPS) and perform parallel
multiple and ALU operations.
For additional information when designing for cold temperature operation, please see Texas Instruments
application report 320C3x, 320C4x and 320MCM42x Power-up Sensitivity at Cold Temperature, literature
number SGUA001.
known good die (KGD) technology
KGD options are available for use in multichip modules and chip-on-board (COB) applications. The current
verificationtechnologythatsupportsKGDrequirementsfortheTMP320C31KGDB, SMJ320C31KGDB, andthe
SMJ320LC31KGDB is a removable tab (R-Tab).
The availability of selected DSP products in a tape-automated bond (TAB) configuration has made possible the
use of an R-Tab technique. The TAB leadframe is attached to gold-bumped die using nonoptimal bonding
parameters. This technique allows easy removal of the die after all the needed screens and parametric tests
are complete. The tape is removed from the tested part and the die is shipped in a conventional die container.
The gold bumps remain on the bond pads that provide for subsequent attachment of gold-ball bonds.
Future implementations may have only aluminum bond pads. Please contact factory for current information.
electrical specifications
For military electrical and timing specifications, please see the SMJ320C31, SMJ320LC31, SMQ320LC31
Digital Signal Processors data sheet, literature number SGUS026. For commercial specifications, see the
TMS320C31, TMS320LC31 Digital Signal Processors data sheet, literature number SPRS035.
SMJ
320
C
31
KGD
M
40
B
PREFIX
DIE REVISION
Revision 6.1
SMJ = MIL-PRF-38535 processing
TMP = Commercial Level
B
=
DEVICE FAMILY
SPEED RANGE
320
= DSP Family
40
50
=
=
40 MHz
50 MHz
TECHNOLOGY
5 V
LC = 3.3 V
C
=
TEMPERATURE RANGE
M = – 55°C to125°C
L =
0°C to 70°C
DEVICE
31 = Floating-Point DSP
PACKAGE TYPE
KGD = Known Good Die
Figure 1. Device Nomenclature
2
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMP320C31KGDB, SMJ320C31KGDB, SMJ320LC31KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS023B – APRIL 1997 – REVISED OCTOBER 2001
JEDEC STANDARD
Die thickness is approximately 15 mils ± 1 mil.
Backside surface finish is silicon.
Maximum allowable die junction operating temperature is 175°C.
Glassivation material is compressive nitride.
Bond pad metal is composed of copper-doped aluminum.
Percentage of defect allowed for burned-in die is 5%.
Life test data is available.
Configuration control notification.
Group A attribute summary is available (SMJ only).
Suggested die-attach material is silver glass (QMI 2569F).
Suggested bond wire size is 1.25 mils.
Suggested bonding method is gold-ball bonding.
ESD rating is Class II.
Maximum allowable peak process temperature for die attach is 440°C ± 5°C (for QMI 2569F).
Saw kerf is dependent on blade size used.
Die backside potential is grounded.
3
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMP320C31KGDB, SMJ320C31KGDB, SMJ320LC31KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS023B – APRIL 1997 – REVISED OCTOBER 2001
TMP/SMJ320C31KGDB (rev 6.1) known good die pad information
Figure 2 shows the TMP/SMJ320C31KGDB die-numbering format. See Table 1 for TMP/SMJ320C31KGDB
die pad information.
Die Designator
132
Die Side Number 4
100
99
Pad Number One
(Origin)
1
Die Side Number Three
TMS32C31EW
8051.8 µm
(317 mils)
Die Side Number One
33
67
34
66
Die Side Number 2
7518.4 µm
(296 mils)
Figure 2. ’320C31KGD Die Numbering Format
(See Table 1)
Table 1 provides a reference for the following:
The ’C31 signal identities in relation to the pad numbers.
The ’C31 X,Y coordinates, where bond pad 1 serves as the origin (0,0).
In addition, significant specifications include:
X,Y coordinate data is in microns ( m).
Coordinate origin is at (0,0) (center of bond pad 1).
Average pitch is 202 m (7.95 mils).
The active silicon dimensions are 7889.0 µm × 7353.25 µm (311 mils × 289 mils).
The approximate diced silicon dimensions (active + cut scribe street) are 8051.8 µm × 7518.4 µm
(317 mils × 296 mils).
Bond pad dimensions are 103.50 µm × 103.50 µm (4.07 mils × 4.07 mils).
Center of bond pad to edge of die ranges from 170 µm–213 µm (6.7 mils–8.4 mils). The range of 43 µm
exists since the dicing process results in some tolerance. Due to the consistency and precision of the bond
pad locations in reference to each other, the center of bond pad 1 was chosen as the origin.
4
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMP320C31KGDB, SMJ320C31KGDB, SMJ320LC31KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS023B – APRIL 1997 – REVISED OCTOBER 2001
Table 1. ’320C31KGD Die Pad/TAB Lead Information : rev 6.1 (0,72 µm)
DIE SIDE #1
PITCH OF LEAD
(#,# REFERENCES
WHICH DIE BONDS)
( m)
X-COORDINATE OF
THE DIE BOND PAD
( m)
Y-COORDINATE OF
THE DIE BOND PAD
( m)
C31 DIE BOND PAD
LOCATIONS
DIE/TAB BOND PAD
IDENTITY
1
2
3
A9
DV
SS
A8
0.00
–224.46
–426.24
224.46 (1, 2)
201.78 (2, 3)
224.46 (3, 4)
4
5
6
A7
A6
A5
–650.70
–875.16
224.46 (4, 5)
224.46 (5, 6)
202.86 (6, 7)
–1099.62
–1302.48
–1504.26
–1728.72
–1953.18
–2177.64
–2402.10
–2604.96
–2828.34
–3100.32
–3262.68
–3463.20
–3670.38
–3832.74
–4011.66
–4256.64
–4481.10
–4669.56
–4950.54
–5153.40
–5333.58
–5536.44
–5739.30
–5942.16
–6145.02
–6347.88
–6522.48
–6695.46
7
8
9
AV
201.78 (7, 8)
224.46 (8, 9)
DD
A4
A3
A2
A1
A0
224.46 (9, 10)
224.46 (10, 11)
224.46 (11, 12)
202.86 (12, 13)
223.38 (13, 14)
271.98 (14, 15)
162.36 (15, 16)
200.52 (16, 17)
207.18 (17, 18)
162.36 (18, 19)
178.92 (19, 20)
244.98 (20, 21)
224.46 (21, 22)
188.46 (22, 23)
280.98 (23, 24)
202.86 (24, 25)
180.18 (25, 26)
202.86 (26, 27)
202.86 (27, 28)
202.86 (28, 29)
202.86 (29, 30)
202.86 (30, 31)
174.60 (31, 32)
172.98 (32, 33)
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
CV
SS
D31
V
V
DDL
DDL
D30
0.00
V
V
SSL
SSL
DV
SS
D29
D28
DV
DD
D27
IV
SS
D26
D25
D24
D23
D22
D21
DV
DD
D20
5
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMP320C31KGDB, SMJ320C31KGDB, SMJ320LC31KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS023B – APRIL 1997 – REVISED OCTOBER 2001
Table 1.’320C31KGD Die Pad/TAB Lead Information : rev 6.1 (0,72 µm) (continued)
DIE SIDE #2
PITCH OF LEAD
(#,# REFERENCES
WHICH DIE BONDS)
( m)
X-COORDINATE OF
THE DIE BOND PAD
( m)
Y-COORDINATE OF
THE DIE BOND PAD
( m)
C31 DIE BOND PAD
LOCATIONS
DIE/TAB BOND PAD
IDENTITY
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
DV
396.72
577.44
780.30
180.72 (34, 35)
202.86 (35, 36)
210.06 (36, 37)
210.06 (37, 38)
210.06 (38, 39)
188.46 (39, 40)
187.38 (40, 41)
188.46 (41, 42)
187.38 (42, 43)
188.46 (43, 44)
187.38 (44, 45)
210.06 (45, 46)
210.06 (46, 47)
192.78 (47, 48)
162.36 (48, 49)
186.12 (49, 50)
210.06 (50, 51)
188.46 (51, 52)
170.10 (52, 53)
162.36 (53, 54)
186.12 (54, 55)
210.06 (55, 56)
188.46 (56, 57)
187.38 (57, 58)
210.06 (58, 59)
210.06 (59, 60)
210.06 (60, 61)
210.06 (61, 62)
210.06 (62, 63)
210.06 (63, 64)
210.06 (64, 65)
174.06 (65, 66)
SS
D19
D18
D17
D16
D15
990.36
1200.42
1410.48
1598.94
1786.32
1974.78
2162.16
2350.62
2538.00
2748.06
2958.12
3150.90
3313.26
3499.38
3709.44
3897.90
4068.00
4230.36
4416.48
4626.54
4815.00
5002.38
5212.44
5422.50
5632.56
5842.62
6052.68
6262.74
6472.80
6646.86
CV
SS
D14
DV
DD
D13
IV
SS
D12
D11
D10
V
DDL
V
DDL
D9
–7219.80
D8
DV
SS
V
V
SSL
SSL
D7
D6
DV
DD
D5
D4
D3
D2
D1
D0
H1
H3
DV
DD
6
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMP320C31KGDB, SMJ320C31KGDB, SMJ320LC31KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS023B – APRIL 1997 – REVISED OCTOBER 2001
Table 1.’320C31KGD Die Pad/TAB Lead Information : rev 6.1 (0,72 µm) (continued)
DIE SIDE #3
PITCH OF LEAD
X-COORDINATE OF
THE DIE BOND PAD
( m)
Y-COORDINATE OF
THE DIE BOND PAD
( m)
C31 DIE BOND PAD
LOCATIONS
DIE/TAB BOND PAD
IDENTITY
(#,# REFERENCES
WHICH DIE BONDS)
( m)
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
DV
CV
IV
X2
X1
HOLDA
HOLD
CV
DD
RDY
STRB
R/W
RESET
XF0
CV
DD
XF1
IACK
INT0
DV
–6714.54
–6555.96
–6402.42
–6241.86
–6072.30
–5780.16
–5574.60
–5392.62
–5116.14
–4898.16
–4673.70
–4453.74
–4235.76
–4032.90
–3809.52
–3585.06
–3365.10
–3168.72
–2988.54
–2791.26
–2590.56
–2428.20
–2232.18
–2018.70
–1750.32
–1547.46
–1345.68
–1121.22
–896.76
158.58 (67, 68)
153.54 (68, 69)
160.56 (69, 70)
169.56 (70, 71)
292.14 (71, 72)
205.56 (72, 73)
181.98 (73, 74)
276.48 (74, 75)
217.98 (75, 76)
224.46 (76, 77)
219.96 (77, 78)
217.98 (78, 79)
202.86 (79, 80)
223.38 (80, 81)
224.46 (81, 82)
219.96 (82, 83)
196.38 (83, 84)
180.18 (84, 85)
197.28 (85, 86)
200.70 (86, 87)
162.36 (87, 88)
196.02 (88, 89)
213.48 (89, 90)
268.38 (90, 91)
202.86 (91, 92)
201.78 (92, 93)
224.46 (93, 94)
224.46 (94, 95)
202.86 (95, 96)
201.78 (96, 97)
202.86 (97, 98)
273.78 (98, 99)
SS
SS
SS
7136.64
SS
V
SSL
INT1
V
V
DDL
DDL
INT2
INT3
DR0
CV
SS
FSR0
CLKR0
CLKX0
IV
SS
–693.90
–492.12
–289.26
–15.48
FSX0
PV
DD
DX0
7
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
TMP320C31KGDB, SMJ320C31KGDB, SMJ320LC31KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS023B – APRIL 1997 – REVISED OCTOBER 2001
Table 1.’320C31KGD Die Pad/TAB Lead Information : rev 6.1 (0,72 µm) (continued)
DIE SIDE #4
PITCH OF LEAD
(#,# REFERENCES
WHICH DIE BONDS)
( m)
X-COORDINATE OF
THE DIE BOND PAD
( m)
Y-COORDINATE OF
THE DIE BOND PAD
( m)
C31 DIE BOND PAD
LOCATIONS
DIE/TAB BOND PAD
IDENTITY
†
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
V
6705.00
6480.90
6298.92
6125.94
5951.88
5721.30
5439.24
5248.08
5063.40
4878.72
4694.04
4526.46
4324.68
4129.02
3862.62
3700.26
3421.98
3226.50
3052.44
2901.06
2728.08
2554.02
2381.04
2185.38
1989.72
1794.06
1598.40
1316.34
1120.68
925.02
224.10 (100, 101)
181.98 (101, 102)
172.98 (102, 103)
174.06 (103, 104)
230.58 (104, 105)
282.06 (105, 106)
191.16 (106, 107)
184.68 (107, 108)
184.68 (108, 109)
184.68 (109, 110)
167.58 (110, 111)
201.78 (111, 112)
195.66 (112, 113)
266.40 (113, 114)
162.36 (114, 115)
278.28 (115, 116)
195.48 (116, 117)
174,06 (117, 118)
151.38 (118, 119)
172.98 (119, 120)
174.06 (120, 121)
172.98 (121, 122)
195.66 (122, 123)
195.66 (123, 124)
195.66 (124, 125)
195.66 (125, 126)
282.06 (126, 127)
195.66 (127, 128)
195.66 (128, 129)
174.06 (129, 130)
172.98 (130, 131)
174.06 (131, 132)
SUBS
SHZ
DV
SS
TCLK0
PV
TCLK1
EMU3
EMU0
EMU1
EMU2
MCMP
DD
CV
SS
A23
A22
V
V
DDL
DDL
A21
A20
V
SSL
DV
452.52
SS
A19
AV
DD
A18
A17
A16
A15
A14
A13
A12
A11
AV
A10
CV
750.96
577.98
403.92
DD
SS
connects to die metallization. Tie this pin to clean ground.
†
V
SUBS
8
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, maskworkright, orotherTIintellectualpropertyrightrelatingtoanycombination, machine, orprocess
in which TI products or services are used. Information published by TI regarding third–party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2001, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明