SN10KHT5543 [TI]
具有输出使能功能的八路 TTL 到 ECL 转换器;
| 型号： | SN10KHT5543 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有输出使能功能的八路 TTL 到 ECL 转换器 转换器 |
| 文件： | 总8页 (文件大小：394K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN10KHT5542, SN10KHT5543
OCTAL TTL-TO-ECL TRANSLATORS WITH OUTPUT ENABLE
SDZS001A – D3136, AUGUST 1988 – REVISED DECEMBER 1988
Copyright © 1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN10KHT5542, SN10KHT5543
OCTAL TTL-TO-ECL TRANSLATORS WITH OUTPUT ENABLE
SDZS001A – D3136, AUGUST 1988 – REVISED DECEMBER 1988
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN10KHT5542, SN10KHT5543
OCTAL TTL-TO-ECL TRANSLATORS WITH OUTPUT ENABLE
SDZS001A – D3136, AUGUST 1988 – REVISED DECEMBER 1988
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN10KHT5542, SN10KHT5543
OCTAL TTL-TO-ECL TRANSLATORS WITH OUTPUT ENABLE
SDZS001A – D3136, AUGUST 1988 – REVISED DECEMBER 1988
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
SN10KHT5543DW
ACTIVE
SOIC
DW
24
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
10KHT5543
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TUBE
*All dimensions are nominal
Device
Package Name Package Type
DW SOIC
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
SN10KHT5543DW
24
25
506.98
12.7
4826
6.6
Pack Materials-Page 1
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