SN5430W-00 [TI]
TTL/H/L SERIES, 8-INPUT NAND GATE, CDFP14;型号: | SN5430W-00 |
厂家: | TEXAS INSTRUMENTS |
描述: | TTL/H/L SERIES, 8-INPUT NAND GATE, CDFP14 CD 输入元件 逻辑集成电路 |
文件: | 总21页 (文件大小:1005K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ꢀ
ꢁ
ꢈ
ꢍ
ꢂ
ꢃ
ꢎ
ꢃ
ꢄ
ꢌ
ꢄ
ꢅ
ꢅ
ꢆ
ꢏ
ꢆ
ꢀ
ꢀ
ꢁ
ꢁ
ꢋ
ꢂ
ꢈ
ꢐ
ꢃ
ꢃ
ꢑ
ꢇ
ꢇ
ꢊ
ꢀ
ꢀ
ꢁ
ꢄ
ꢄ
ꢒ
ꢅ
ꢅ
ꢁ
ꢆ
ꢆ
ꢀ
ꢀ
ꢓ
ꢁ
ꢂ
ꢃ
ꢃ
ꢎ
ꢀ
ꢀ
ꢑ
ꢄ
ꢄ
ꢀ
ꢅ
ꢅ
ꢀ
ꢁ
ꢁ
ꢈ
ꢉ
ꢊ
ꢋ
ꢁ
ꢌ
ꢀ
ꢋ
ꢎ
ꢔ
ꢒ
SDLS099 − DECEMBER 1983 − REVISED MARCH 1988
ꢌ
ꢌ
ꢕ
ꢏ
ꢦ
ꢓ
ꢡ
ꢍ
ꢖ
ꢟ
ꢎ
ꢠ
ꢋ
ꢚ
ꢏ
ꢘ
ꢁ
ꢙ
ꢓ
ꢒ
ꢎ
ꢒ
ꢗ
ꢘ
ꢢ
ꢙ
ꢚ
ꢠ
ꢛ
ꢜ
ꢝ
ꢝ
ꢞ
ꢞ
ꢗ
ꢗ
ꢚ
ꢚ
ꢘ
ꢘ
ꢗ
ꢟ
ꢟ
ꢣ
ꢠ
ꢡ
ꢛ
ꢛ
ꢢ
ꢢ
ꢘ
ꢞ
ꢝ
ꢜ
ꢟ
ꢟ
ꢚ
ꢙ
ꢣ
ꢎꢢ
ꢡ
ꢤ
ꢟ
ꢥ
ꢗ
ꢠ
ꢝ
ꢟ
ꢞ
ꢗ
ꢞ
ꢚ
ꢛ
ꢘ
ꢡ
ꢦ
ꢝ
ꢘ
ꢞ
ꢞ
ꢢ
ꢟ
ꢧ
Copyright 1988, Texas Instruments Incorporated
ꢛ
ꢚ
ꢠ
ꢞ
ꢚ
ꢛ
ꢜ
ꢞ
ꢚ
ꢟ
ꢣ
ꢗ
ꢙ
ꢗ
ꢠ
ꢢ
ꢛ
ꢞ
ꢨ
ꢞ
ꢢ
ꢛ
ꢚ
ꢙ
ꢩ
ꢝ
ꢋ
ꢘ
ꢜ
ꢢ
ꢟ
ꢞ
ꢝ
ꢘ
ꢦ
ꢝ
ꢛ
ꢦ
ꢪ
ꢝ
ꢞ ꢢ ꢟ ꢞꢗ ꢘꢬ ꢚꢙ ꢝ ꢥꢥ ꢣꢝ ꢛ ꢝ ꢜ ꢢ ꢞ ꢢ ꢛ ꢟ ꢧ
ꢛ
ꢛ
ꢝ
ꢘ
ꢞ
ꢫ
ꢧ
ꢌ
ꢛ
ꢚ
ꢦ
ꢡ
ꢠ
ꢞ
ꢗ
ꢚ
ꢘ
ꢣ
ꢛ
ꢚ
ꢠ
ꢢ
ꢟ
ꢟ
ꢗ
ꢘ
ꢬ
ꢦ
ꢚ
ꢢ
ꢟ
ꢘ
ꢚ
ꢞ
ꢘ
ꢢ
ꢠ
ꢢ
ꢟ
ꢟ
ꢝ
ꢛ
ꢗ
ꢥ
ꢫ
ꢗ
ꢘ
ꢠ
ꢥ
ꢡ
ꢦ
ꢢ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢀ
ꢁ
ꢁ
ꢂ
ꢈ
ꢌ
ꢃ
ꢄ
ꢅ
ꢅ
ꢎ
ꢆ
ꢆ
ꢀ
ꢀ
ꢌ
ꢁ
ꢂ
ꢃ
ꢀ
ꢃ
ꢇ
ꢇ
ꢀ
ꢋ
ꢀ
ꢄ
ꢐ
ꢄ
ꢅ
ꢑ
ꢅ
ꢆ
ꢊ
ꢆ
ꢀ
ꢀ
ꢒ
ꢁ
ꢁ
ꢁ
ꢂ
ꢈ
ꢓ
ꢃ
ꢃ
ꢀ
ꢄ
ꢅ
ꢅ
ꢎ
ꢃ
ꢄ
ꢁ
ꢈ
ꢀ
ꢄ
ꢉ
ꢊ
ꢋ
ꢁ
ꢍ
ꢏ
ꢋ
ꢎ
ꢁ
ꢔ
ꢒ
ꢑ
ꢀ
SDLS099 − DECEMBER 1983 − REVISED MARCH 1988
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢁ
ꢈ
ꢍ
ꢂ
ꢃ
ꢎ
ꢃ
ꢄ
ꢌ
ꢄ
ꢅ
ꢅ
ꢆ
ꢏ
ꢆ
ꢀ
ꢁ
ꢈ
ꢋ
ꢂ
ꢃ
ꢐ
ꢃ
ꢇ
ꢑ
ꢇ
ꢀ
ꢊ
ꢀ
ꢄ
ꢁ
ꢄ
ꢅ
ꢒ
ꢅ
ꢆ
ꢁ
ꢆ
ꢀ
ꢀ
ꢓ
ꢁ
ꢂ
ꢃ
ꢃ
ꢎ
ꢀ
ꢀ
ꢑ
ꢄ
ꢄ
ꢀ
ꢅ
ꢅ
ꢀ
ꢁ
ꢀ
ꢁ
ꢁꢈ
ꢉ
ꢊ
ꢋ
ꢁ
ꢌ
ꢀ
ꢋ
ꢎ
ꢔ
ꢒ
SDLS099 − DECEMBER 1983 − REVISED MARCH 1988
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢀ
ꢁ
ꢁ
ꢂ
ꢈ
ꢌ
ꢃ
ꢄ
ꢅ
ꢅ
ꢎ
ꢆ
ꢆ
ꢀ
ꢀ
ꢌ
ꢁ
ꢂ
ꢃ
ꢀ
ꢃ
ꢇ
ꢇ
ꢀ
ꢋ
ꢀ
ꢄ
ꢐ
ꢄ
ꢅ
ꢑ
ꢅ
ꢆ
ꢊ
ꢆ
ꢀ
ꢀ
ꢒ
ꢁ
ꢁ
ꢁ
ꢂ
ꢈ
ꢓ
ꢃ
ꢃ
ꢀ
ꢄ
ꢅ
ꢅ
ꢎ
ꢃ
ꢄ
ꢁ
ꢈ
ꢀ
ꢄ
ꢉ
ꢊ
ꢋꢁ
ꢍ
ꢏ
ꢋ
ꢎ
ꢁ
ꢔ
ꢒ
ꢑ
ꢀ
SDLS099 − DECEMBER 1983 − REVISED MARCH 1988
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢁ
ꢈ
ꢍ
ꢂ
ꢃ
ꢎ
ꢃ
ꢄ
ꢌ
ꢄ
ꢅ
ꢅ
ꢆ
ꢏ
ꢆ
ꢀ
ꢁ
ꢈ
ꢋ
ꢂ
ꢃ
ꢐ
ꢃ
ꢇ
ꢑ
ꢇ
ꢀ
ꢊ
ꢀ
ꢄ
ꢁ
ꢄ
ꢅ
ꢒ
ꢅ
ꢆ
ꢁ
ꢆ
ꢀ
ꢀ
ꢓ
ꢁ
ꢂ
ꢃ
ꢃ
ꢎ
ꢀ
ꢀ
ꢑ
ꢄ
ꢄ
ꢀ
ꢅ
ꢅ
ꢀ
ꢁ
ꢀ
ꢁ
ꢁꢈ
ꢉ
ꢊ
ꢋ
ꢁ
ꢌ
ꢀ
ꢋ
ꢎ
ꢔ
ꢒ
SDLS099 − DECEMBER 1983 − REVISED MARCH 1988
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
5962-9679201Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
9679201Q2A
SNJ54S
30FK
5962-9679201QCA
5962-9679201QCA
5962-9679201QDA
5962-9679201QDA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
CFP
CFP
J
J
14
14
14
14
1
1
1
1
TBD
TBD
TBD
TBD
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
5962-9679201QC
A
SNJ54S30J
5962-9679201QC
A
SNJ54S30J
W
W
5962-9679201QD
A
SNJ54S30W
5962-9679201QD
A
SNJ54S30W
JM38510/30009B2A
JM38510/30009B2A
JM38510/30009BCA
JM38510/30009BCA
JM38510/30009BDA
JM38510/30009BDA
JM38510/30009SCA
JM38510/30009SCA
JM38510/30009SDA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
LCCC
CDIP
CDIP
CFP
FK
FK
J
20
20
14
14
14
14
14
14
14
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
JM38510/
30009B2A
POST-PLATE
A42
JM38510/
30009B2A
1
JM38510/
30009BCA
J
1
A42
JM38510/
30009BCA
W
W
J
1
A42
JM38510/
30009BDA
CFP
1
A42
JM38510/
30009BDA
CDIP
CDIP
CFP
25
25
25
A42
JM38510/
30009SCA
J
A42
JM38510/
30009SCA
W
A42
JM38510/
30009SDA
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
JM38510/30009SDA
M38510/30009B2A
M38510/30009B2A
M38510/30009BCA
M38510/30009BCA
M38510/30009BDA
M38510/30009BDA
M38510/30009SCA
M38510/30009SCA
M38510/30009SDA
M38510/30009SDA
ACTIVE
CFP
LCCC
LCCC
CDIP
CDIP
CFP
W
14
20
20
14
14
14
14
14
14
14
14
25
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
A42
POST-PLATE
POST-PLATE
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
JM38510/
30009SDA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FK
FK
J
1
1
JM38510/
30009B2A
JM38510/
30009B2A
1
JM38510/
30009BCA
J
1
A42
JM38510/
30009BCA
W
W
J
1
A42
JM38510/
30009BDA
CFP
1
A42
JM38510/
30009BDA
CDIP
CDIP
CFP
25
25
25
25
A42
JM38510/
30009SCA
J
A42
JM38510/
30009SCA
W
W
A42
JM38510/
30009SDA
CFP
A42
JM38510/
30009SDA
SN5430J
SN5430J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
CDIP
CDIP
CDIP
CDIP
J
J
J
J
J
J
14
14
14
14
14
14
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
A42
A42
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
SN5430J
SN5430J
SN54LS30J
SN54LS30J
SN54S30J
SN54S30J
SN54LS30J
SN54LS30J
SN54S30J
SN54S30J
SN7430N
SN7430N
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
SOIC
N
N
D
14
14
14
TBD
TBD
Call TI
Call TI
Call TI
Call TI
0 to 70
0 to 70
0 to 70
SN74LS30D
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LS30
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74LS30D
SN74LS30DE4
SN74LS30DE4
SN74LS30DG4
SN74LS30DG4
SN74LS30DR
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
14
14
14
14
14
14
14
14
14
14
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LS30
LS30
LS30
LS30
LS30
LS30
LS30
LS30
LS30
LS30
LS30
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
D
D
D
D
D
D
D
D
50
50
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
50
Green (RoHS
& no Sb/Br)
50
Green (RoHS
& no Sb/Br)
2500
2500
2500
2500
2500
2500
Green (RoHS
& no Sb/Br)
SN74LS30DR
Green (RoHS
& no Sb/Br)
SN74LS30DRE4
SN74LS30DRE4
SN74LS30DRG4
SN74LS30DRG4
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SN74LS30J
SN74LS30J
SN74LS30N
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
PDIP
J
J
14
14
14
TBD
TBD
Call TI
Call TI
Call TI
Call TI
0 to 70
0 to 70
0 to 70
N
25
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS30N
SN74LS30N
SN74LS30N
ACTIVE
PDIP
N
14
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS30N3
SN74LS30N3
SN74LS30NE4
OBSOLETE
OBSOLETE
ACTIVE
PDIP
PDIP
PDIP
N
N
N
14
14
14
TBD
TBD
Call TI
Call TI
Call TI
Call TI
0 to 70
0 to 70
0 to 70
25
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS30N
SN74LS30N
74LS30
SN74LS30NE4
SN74LS30NSR
ACTIVE
ACTIVE
PDIP
SO
N
14
14
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
0 to 70
0 to 70
NS
2000
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74LS30NSR
SN74LS30NSRE4
SN74LS30NSRE4
SN74LS30NSRG4
SN74LS30NSRG4
ACTIVE
SO
SO
SO
SO
SO
NS
14
14
14
14
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
74LS30
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NS
NS
NS
NS
2000
2000
2000
2000
Green (RoHS
& no Sb/Br)
0 to 70
74LS30
74LS30
74LS30
74LS30
Green (RoHS
& no Sb/Br)
0 to 70
Green (RoHS
& no Sb/Br)
0 to 70
Green (RoHS
& no Sb/Br)
0 to 70
SN74S30D
SN74S30D
SN74S30DR
SN74S30DR
SN74S30J
SN74S30J
SN74S30N
SN74S30N
SNJ5430J
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
SOIC
SOIC
SOIC
SOIC
CDIP
CDIP
PDIP
PDIP
CDIP
D
D
D
D
J
14
14
14
14
14
14
14
14
14
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
A42
Call TI
Call TI
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
-55 to 125
Call TI
Call TI
Call TI
J
Call TI
N
N
J
Call TI
Call TI
1
1
1
1
1
N / A for Pkg Type
SNJ5430J
SNJ5430J
SNJ5430W
SNJ5430W
SNJ5430J
SNJ5430W
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CFP
J
14
14
14
20
TBD
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
W
W
FK
SNJ5430W
CFP
A42
SNJ54LS30FK
LCCC
POST-PLATE
SNJ54LS
30FK
SNJ54LS30FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54LS
30FK
SNJ54LS30J
SNJ54LS30J
SNJ54LS30W
SNJ54LS30W
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
CFP
CFP
J
J
14
14
14
14
1
1
1
1
TBD
TBD
TBD
TBD
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
SNJ54LS30J
SNJ54LS30J
SNJ54LS30W
SNJ54LS30W
W
W
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SNJ54S30FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
9679201Q2A
SNJ54S
30FK
SNJ54S30FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
5962-
9679201Q2A
SNJ54S
30FK
SNJ54S30J
SNJ54S30J
SNJ54S30W
SNJ54S30W
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
CFP
CFP
J
J
14
14
14
14
1
1
1
1
TBD
TBD
TBD
TBD
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
5962-9679201QC
A
SNJ54S30J
5962-9679201QC
A
SNJ54S30J
W
W
5962-9679201QD
A
SNJ54S30W
5962-9679201QD
A
SNJ54S30W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN5430, SN54LS30, SN54LS30-SP, SN54S30, SN7430, SN74LS30, SN74S30 :
Catalog: SN7430, SN74LS30, SN54LS30, SN74S30
•
Military: SN5430, SN54LS30, SN54S30
•
Space: SN54LS30-SP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
•
Addendum-Page 6
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74LS30DR
SOIC
SO
D
14
14
2500
2000
330.0
330.0
16.4
16.4
6.5
8.2
9.0
2.1
2.5
8.0
16.0
16.0
Q1
Q1
SN74LS30NSR
NS
10.5
12.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74LS30DR
SOIC
SO
D
14
14
2500
2000
367.0
367.0
367.0
367.0
38.0
38.0
SN74LS30NSR
NS
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明