SN54ABT162244_14 [TI]

16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS;
SN54ABT162244_14
型号: SN54ABT162244_14
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

驱动 输出元件
文件: 总12页 (文件大小:214K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢇ ꢈ ꢌꢅꢍ ꢆ ꢅꢎꢏ ꢏ ꢐꢑꢀꢒ ꢓ ꢑꢍ ꢔ ꢐꢑ  
SCBS238E − JUNE 1992 − REVISED JUNE 2004  
SN54ABT162244 . . . WD PACKAGE  
SN74ABT162244 . . . DGG, DGV, OR DL PACKAGE  
(TOP VIEW)  
D
D
Members of the Texas Instruments  
Widebus E Family  
Output Ports Have Equivalent 25-Series  
Resistors, So No External Resistors Are  
Required  
1
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
1OE  
1Y1  
1Y2  
GND  
1Y3  
1Y4  
2OE  
1A1  
1A2  
GND  
1A3  
1A4  
2
D
D
D
D
D
D
Typical V  
(Output Ground Bounce)  
OLP  
3
<1 V at V  
= 5 V, T = 25°C  
4
CC  
A
5
High-Impedance State During Power Up  
and Power Down  
6
7
V
V
I
and Power-Up 3-State Support Hot  
CC  
CC  
off  
8
2Y1  
2Y2  
GND  
2Y3  
2Y4  
3Y1  
3Y2  
GND  
3Y3  
3Y4  
2A1  
2A2  
GND  
2A3  
2A4  
3A1  
3A2  
GND  
3A3  
3A4  
Insertion  
9
Distributed V  
High-Speed Switching Noise  
and GND Pins Minimize  
CC  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
Flow-Through Architecture Optimizes PCB  
Layout  
Latch-Up Performance Exceeds 500 mA Per  
JESD-17  
description/ordering information  
V
V
CC  
CC  
The ’ABT162244 devices are 16-bit buffers and  
line drivers designed specifically to improve both  
the performance and density of 3-state memory  
address drivers, clock drivers, and bus-oriented  
receivers and transmitters. These devices can be  
used as four 4-bit buffers, two 8-bit buffers, or one  
16-bit buffer. These devices provide noninverting  
4Y1  
4Y2  
GND  
4Y3  
4Y4  
4A1  
4A2  
GND  
4A3  
4A4  
3OE  
4OE  
outputs  
and  
symmetrical  
active-low  
output-enable (OE) inputs.  
The outputs, which are designed to source or sink up to 12 mA, include equivalent 25-series resistors to  
reduce overshoot and undershoot.  
To ensure the high-impedance state during power up or power down, OE should be tied to V  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
through a pullup  
CC  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
Tube  
SN74ABT162244DL  
SSOP − DL  
ABT162244  
Tape and reel  
SN74ABT162244DLR  
SN74ABT162244DGGR  
SN74ABT162244DGVR  
SNJ54ABT162244WD  
−40°C to 85°C  
−55°C to 125°C  
TSSOP − DGG Tape and reel  
ABT162244  
TVSOP − DGV  
CFP − WD  
Tape and reel  
Tube  
AH2244  
SNJ54ABT162244WD  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Widebus is a trademark of Texas Instruments.  
Copyright 2004, Texas Instruments Incorporated  
ꢘ ꢜ ꢧ ꢟ ꢞꢪ ꢥꢤ ꢢꢣ ꢤꢞ ꢠꢧ ꢩꢛ ꢡꢜ ꢢ ꢢꢞ ꢱꢍ ꢲꢌ ꢙꢑ ꢏ ꢌꢗꢳꢂ ꢗꢂꢊ ꢡꢩꢩ ꢧꢡ ꢟ ꢡ ꢠꢦ ꢢꢦꢟ ꢣ ꢡ ꢟ ꢦ ꢢꢦ ꢣꢢꢦ ꢪ  
ꢢ ꢦ ꢣ ꢢꢛ ꢜꢰ ꢞꢝ ꢡ ꢩꢩ ꢧꢡ ꢟ ꢡ ꢠ ꢦ ꢢ ꢦ ꢟ ꢣ ꢫ  
ꢥ ꢜꢩ ꢦꢣꢣ ꢞ ꢢꢬꢦ ꢟ ꢮꢛ ꢣꢦ ꢜ ꢞꢢꢦ ꢪꢫ ꢘ ꢜ ꢡꢩ ꢩ ꢞ ꢢꢬꢦ ꢟ ꢧꢟ ꢞ ꢪꢥꢤ ꢢꢣ ꢊ ꢧꢟ ꢞ ꢪꢥꢤ ꢢꢛꢞ ꢜ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈ ꢉꢉ ꢃꢃ ꢊ ꢀ ꢁꢋ ꢃ ꢄꢅꢆ ꢇ ꢈꢉ ꢉ ꢃꢃ  
ꢇꢈ ꢌꢅꢍ ꢆ ꢅ ꢎ ꢏꢏ ꢐꢑ ꢀꢒ ꢓ ꢑꢍ ꢔ ꢐꢑ ꢀ  
ꢕꢍ ꢆꢖ ꢗ ꢌꢀꢆꢄꢆ ꢐ ꢘꢎꢆ ꢙ ꢎꢆꢀ  
SCBS238E − JUNE 1992 − REVISED JUNE 2004  
description/ordering information (continued)  
These devices are fully specified for hot-insertion applications using I and power-up 3-state. The I circuitry  
off  
off  
disables the outputs, preventing damaging current backflow through the devices when they are powered down.  
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,  
which prevents driver conflict.  
FUNCTION TABLE  
(each 4-bit buffer)  
INPUTS  
OUTPUT  
Y
OE  
L
A
H
L
H
L
L
H
X
Z
logic diagram (positive logic)  
1
25  
36  
1OE  
3OE  
3A1  
47  
2
3
5
6
13  
14  
16  
17  
1A1  
1Y1  
1Y2  
1Y3  
1Y4  
3Y1  
3Y2  
3Y3  
3Y4  
46  
35  
33  
32  
1A2  
3A2  
3A3  
3A4  
44  
1A3  
43  
1A4  
48  
24  
30  
2OE  
4OE  
4A1  
41  
8
9
19  
20  
22  
23  
2A1  
2Y1  
2Y2  
2Y3  
2Y4  
4Y1  
4Y2  
4Y3  
4Y4  
40  
29  
27  
26  
2A2  
4A2  
4A3  
4A4  
38  
11  
2A3  
37  
12  
2A4  
2
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ꢂꢃ  
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ꢕ ꢍꢆ ꢖ ꢗ ꢌꢀꢆꢄꢆ ꢐ ꢘ ꢎꢆ ꢙꢎ ꢆ  
SCBS238E − JUNE 1992 − REVISED JUNE 2004  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
I
Voltage range applied to any output in the high or power-off state, V  
. . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V  
O
Current into any output in the low state, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA  
O
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 mA  
IK  
I
Output clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
OK  
O
Package thermal impedance, θ (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W  
JA  
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W  
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
Storage temperature range, T  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions (see Note 3)  
SN54ABT162244 SN74ABT162244  
UNIT  
MIN  
4.5  
2
MAX  
MIN  
4.5  
2
MAX  
V
V
V
V
Supply voltage  
5.5  
5.5  
V
V
CC  
High-level input voltage  
Low-level input voltage  
Input voltage  
IH  
0.8  
0.8  
V
IL  
0
V
0
V
CC  
V
I
CC  
−3  
I
I
High-level output current  
Low-level output current  
Input transition rise or fall rate  
Power-up ramp rate  
−12  
12  
mA  
mA  
ns/V  
µs/V  
°C  
OH  
OL  
8
t/v  
t/V  
Outputs enabled  
10  
10  
200  
−55  
200  
−40  
CC  
T
A
Operating free-air temperature  
125  
85  
NOTES: 3. All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈ ꢉꢉ ꢃꢃ ꢊ ꢀ ꢁꢋ ꢃ ꢄꢅꢆ ꢇ ꢈꢉ ꢉ ꢃꢃ  
ꢇꢈ ꢌꢅꢍ ꢆ ꢅ ꢎ ꢏꢏ ꢐꢑ ꢀꢒ ꢓ ꢑꢍ ꢔ ꢐꢑ ꢀ  
ꢕꢍ ꢆꢖ ꢗ ꢌꢀꢆꢄꢆ ꢐ ꢘꢎꢆ ꢙ ꢎꢆꢀ  
SCBS238E − JUNE 1992 − REVISED JUNE 2004  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
= 25°C  
SN54ABT162244 SN74ABT162244  
A
PARAMETER  
TEST CONDITIONS  
UNIT  
MIN TYP  
MAX  
MIN  
MAX  
MIN  
MAX  
V
V
V
V
V
= 4.5 V,  
I = −18 mA  
−1.2  
−1.2  
−1.2  
V
IK  
CC  
CC  
CC  
I
= 4.5 V,  
= 5 V,  
I
I
I
I
I
I
= −1 mA  
= −1 mA  
= −3 mA  
= −12 mA  
= 8 mA  
3.35  
3.85  
3.1  
3.35  
3.85  
3.1  
3.35  
3.85  
3.1  
OH  
OH  
OH  
OH  
OL  
OL  
V
V
OH  
V
= 4.5 V  
= 4.5 V  
CC  
CC  
2.6*  
2.6  
0.4  
0.8  
0.65  
0.8  
V
V
V
OL  
= 12 mA  
0.8*  
100  
mV  
hys  
I
I
V
CC  
= 0 to 5.5 V, V = V or GND  
I CC  
1
1
1
µA  
V
V
= 0 to 2.1 V,  
= 0.5 V to 2.7 V, OE = X  
CC  
O
50  
50  
50  
µA  
µA  
µA  
I
OZPU  
OZPD  
OZH  
V
V
= 2.1 V to 0,  
= 0.5 V to 2.7 V, OE = X  
CC  
O
50  
10  
50  
10  
50  
10  
I
I
V
V
= 2.1 V to 5.5 V,  
= 2.7 V, OE 2 V  
CC  
O
V
V
= 2.1 V to 5.5 V,  
= 0.5 V, OE 2 V  
CC  
O
I
I
I
I
−10  
100  
50  
−10  
−10  
100  
50  
µA  
µA  
µA  
mA  
OZL  
V
CC  
= 0, V or V 4.5 V  
off  
I
O
V
V
= 5.5 V,  
= 5.5 V  
CC  
O
Outputs high  
50  
CEX  
O
V
CC  
= 5.5 V,  
V
= 2.5 V  
−25  
−55 −100  
−25  
−100  
2
−25  
−100  
2
O
Outputs high  
Outputs low  
2
30  
2
V
I
= 5.5 V,  
= 0,  
CC  
O
30  
2
30  
2
I
mA  
CC  
V = V  
I
or GND  
CC  
Outputs disabled  
V
= 5.5 V,  
CC  
Outputs enabled  
Outputs disabled  
50  
50  
50  
50  
50  
50  
50  
50  
50  
One input at 3.4 V,  
Other inputs at  
Data inputs  
§
µA  
I  
CC  
V
CC  
or GND  
V
CC  
= 5.5 V, One input at 3.4 V,  
or GND  
Control inputs  
Other inputs at V  
CC  
C
C
V = 2.5 V or 0.5 V  
3
8
pF  
pF  
i
I
V
O
= 2.5 V or 0.5 V  
o
* On products compliant to MIL-PRF-38535, this parameter does not apply.  
§
All typical values are at V  
= 5 V.  
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.  
CC  
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V  
or GND.  
CC  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢂꢃ  
ꢇ ꢈ ꢌꢅꢍ ꢆ ꢅꢎꢏ ꢏ ꢐꢑꢀꢒ ꢓ ꢑꢍ ꢔ ꢐꢑ  
ꢕ ꢍꢆ ꢖ ꢗ ꢌꢀꢆꢄꢆ ꢐ ꢘ ꢎꢆ ꢙꢎ ꢆ  
SCBS238E − JUNE 1992 − REVISED JUNE 2004  
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature, C = 50 pF (unless otherwise noted) (see Figure 1)  
L
SN54ABT162244  
= 5 V,  
V
T
FROM  
(INPUT)  
TO  
(OUTPUT)  
CC  
A
PARAMETER  
UNIT  
= 25°C  
TYP  
2.5  
MIN  
MAX  
MIN  
MAX  
3.6  
4.7  
4.8  
4.7  
5.3  
4.6  
t
t
t
t
t
t
1
1
1
1
1
1
1
1
1
1
1
1
4.1  
5.3  
5.6  
5.5  
6.3  
4.9  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
A
Y
Y
Y
ns  
ns  
ns  
3.1  
3.2  
OE  
OE  
3.2  
3.2  
3.1  
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature, C = 50 pF (unless otherwise noted) (see Figure 1)  
L
SN74ABT162244  
= 5 V,  
V
T
FROM  
(INPUT)  
TO  
(OUTPUT)  
CC  
A
PARAMETER  
UNIT  
= 25°C  
TYP  
2.5  
MIN  
MAX  
MIN  
MAX  
3.2  
4
t
t
t
t
t
t
1
1
1
1
1
1
1
1
1
1
1
1
3.9  
4.8  
5.4  
5.1  
4.6  
4.5  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
A
Y
Y
Y
ns  
ns  
ns  
3.1  
3.2  
4.2  
4.1  
4
OE  
OE  
3.2  
3.2  
3.1  
3.9  
5
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ꢕꢍ ꢆꢖ ꢗ ꢌꢀꢆꢄꢆ ꢐ ꢘꢎꢆ ꢙ ꢎꢆꢀ  
SCBS238E − JUNE 1992 − REVISED JUNE 2004  
PARAMETER MEASUREMENT INFORMATION  
7 V  
TEST  
S1  
Open  
S1  
500 Ω  
From Output  
Under Test  
t
/t  
PLH PHL  
Open  
7 V  
GND  
t
/t  
PLZ PZL  
C
= 50 pF  
t
/t  
Open  
L
PHZ PZH  
500 Ω  
(see Note A)  
3 V  
0 V  
LOAD CIRCUIT  
Timing Input  
Data Input  
1.5 V  
t
w
t
t
h
su  
3 V  
0 V  
3 V  
0 V  
Input  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
3 V  
0 V  
3 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Input  
t
PZL  
t
t
t
PHL  
PLH  
PHL  
t
PLZ  
Output  
Waveform 1  
S1 at 7 V  
3.5 V  
V
V
OH  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Output  
V
V
+ 0.3 V  
OL  
V
OL  
OL  
(see Note B)  
t
PHZ  
t
PLH  
t
PZH  
Output  
Waveform 2  
S1 at Open  
(see Note B)  
V
OH  
V
V
OH  
− 0.3 V  
OH  
1.5 V  
1.5 V  
Output  
0 V  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.  
E. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
28-Feb-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
5962-9458701QXA  
ACTIVE  
ACTIVE  
CFP  
WD  
48  
48  
1
None  
Call TI  
Level-NC-NC-NC  
SN74ABT162244DGGR  
TSSOP  
DGG  
2000  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
SN74ABT162244DGVR  
ACTIVE  
TVSOP  
DGV  
48  
2000  
Pb-Free  
(RoHS)  
CU NIPDAU Level-1-250C-UNLIM  
SN74ABT162244DL  
SN74ABT162244DLR  
SNJ54ABT162244WD  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
CFP  
DL  
DL  
48  
48  
48  
25  
1000  
1
None  
None  
None  
CU NIPDAU Level-1-235C-UNLIM  
CU NIPDAU Level-1-235C-UNLIM  
WD  
Call TI  
Level-NC-NC-NC  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997  
WD (R-GDFP-F**)  
CERAMIC DUAL FLATPACK  
48 LEADS SHOWN  
0.120 (3,05)  
0.075 (1,91)  
0.009 (0,23)  
0.004 (0,10)  
1.130 (28,70)  
0.870 (22,10)  
0.370 (9,40)  
0.250 (6,35)  
0.390 (9,91)  
0.370 (9,40)  
0.370 (9,40)  
0.250 (6,35)  
1
48  
0.025 (0,635)  
A
0.014 (0,36)  
0.008 (0,20)  
24  
25  
NO. OF  
LEADS**  
48  
56  
0.740  
0.640  
(16,26) (18,80)  
A MAX  
A MIN  
0.610 0.710  
(15,49) (18,03)  
4040176/D 10/97  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a ceramic lid using glass frit.  
D. Index point is provided on cap for terminal identification only  
E. Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO-146AA  
GDFP1-F56 and JEDEC MO-146AB  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001  
DL (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0.025 (0,635)  
48  
0.0135 (0,343)  
0.008 (0,203)  
0.005 (0,13)  
M
25  
0.010 (0,25)  
0.005 (0,13)  
0.299 (7,59)  
0.291 (7,39)  
0.420 (10,67)  
0.395 (10,03)  
Gage Plane  
0.010 (0,25)  
0°ā8°  
1
24  
0.040 (1,02)  
0.020 (0,51)  
A
Seating Plane  
0.004 (0,10)  
0.008 (0,20) MIN  
PINS **  
0.110 (2,79) MAX  
28  
48  
0.630  
56  
DIM  
0.380  
(9,65)  
0.730  
A MAX  
A MIN  
(16,00) (18,54)  
0.370  
(9,40)  
0.620  
0.720  
(15,75) (18,29)  
4040048/E 12/01  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).  
D. Falls within JEDEC MO-118  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998  
DGG (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0,27  
0,17  
M
0,08  
0,50  
48  
25  
6,20  
6,00  
8,30  
7,90  
0,15 NOM  
Gage Plane  
0,25  
1
24  
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
48  
56  
64  
DIM  
A MAX  
12,60  
12,40  
14,10  
13,90  
17,10  
16,90  
A MIN  
4040078/F 12/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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