SN54AC244-SP [TI]
具有三态输出的航天类 8 通道、2V 至 6V 缓冲器;型号: | SN54AC244-SP |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有三态输出的航天类 8 通道、2V 至 6V 缓冲器 |
文件: | 总22页 (文件大小:1186K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN54AC244, SN74AC244
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS514E − JUNE 1995 − REVISED OCTOBER 2003
SN54AC244 . . . J OR W PACKAGE
SN74AC244 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
D
2-V to 6-V V Operation
CC
Inputs Accept Voltages to 6 V
Max t of 7.5 ns at 5 V
pd
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
description/ordering information
These octal buffers and line drivers are designed
specifically to improve the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters.
The ’AC244 devices are organized as two 4-bit
buffers/drivers with separate output-enable (OE)
inputs. When OE is low, the device passes
noninverted data from the A inputs to the Y
outputs. When OE is high, the outputs are in the
high-impedance state.
SN54AC244 . . . FK PACKAGE
(TOP VIEW)
To ensure the high-impedance state during power
up or power down, OE should be tied to V
CC
through a pullup resistor; the minimum value of
the resistor is determined by the current-sinking
capability of the driver.
3
2
1
20 19
18
1Y1
2A4
1Y2
1A2
2Y3
1A3
2Y2
1A4
4
5
6
7
8
17
16
15 2A3
14
1Y3
9 10 11 12 13
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
PDIP − N
Tube
SN74AC244N
SN74AC244N
Tube
SN74AC244DW
SN74AC244DWR
SN74AC244NSR
SN74AC244DBR
SN74AC244PW
SN74AC244PWR
SNJ54AC244J
SOIC − DW
AC244
Tape and reel
Tape and reel
Tape and reel
Tube
SOP − NS
AC244
AC244
−40°C to 85°C
SSOP − DB
TSSOP − PW
AC244
Tape and reel
Tube
CDIP − J
CFP − W
LCCC − FK
SNJ54AC244J
Tube
SNJ54AC244W
SNJ54AC244FK
SNJ54AC244W
SNJ54AC244FK
−55°C to 125°C
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AC244, SN74AC244
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS514E − JUNE 1995 − REVISED OCTOBER 2003
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
Y
OE
A
H
L
L
L
H
L
H
X
Z
logic diagram (positive logic)
1
19
1OE
2OE
18
16
9
7
2
11
13
15
17
1Y1
1Y2
1A1
2Y1
2Y2
2A1
2A2
4
1A2
14
12
6
5
3
1Y3
1Y4
2Y3
2Y4
1A3
2A3
2A4
8
1A4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V + 0.5 V
I
CC
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V + 0.5 V
O
CC
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
I
CC
Output clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O
O
CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
O
O
CC
Continuous current through V or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
CC
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
JA
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AC244, SN74AC244
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS514E − JUNE 1995 − REVISED OCTOBER 2003
recommended operating conditions (see Note 3)
SN54AC244
SN74AC244
UNIT
MIN
2
MAX
MIN
2
MAX
V
V
Supply voltage
6
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 3 V
2.1
2.1
= 4.5 V
= 5.5 V
= 3 V
3.15
3.85
3.15
3.85
High-level input voltage
V
V
IH
0.9
1.35
1.65
0.9
1.35
1.65
= 4.5 V
= 5.5 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
CC
V
CC
0
0
V
CC
V
CC
V
V
I
Output voltage
O
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 3 V
−12
−24
−24
12
−12
−24
−24
12
= 4.5 V
= 5.5 V
= 3 V
I
High-level output current
Low-level output current
mA
mA
OH
= 4.5 V
= 5.5 V
24
24
I
OL
24
24
Δt/Δv
Input transition rise or fall rate
Operating free-air temperature
8
8
ns/V
T
A
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at V or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AC244, SN74AC244
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS514E − JUNE 1995 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
SN54AC244
SN74AC244
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
2.9
TYP
MAX
MIN
2.9
4.4
5.4
2.4
3.7
4.7
3.85
MAX
MIN
2.9
MAX
3 V
4.5 V
5.5 V
3 V
4.4
4.4
I
= −50 μA
OH
5.4
5.4
I
I
= −12 mA
= −24 mA
2.56
3.86
4.86
2.46
3.76
4.76
OH
V
V
OH
4.5 V
5.5 V
5.5 V
5.5 V
3 V
OH
†
I
I
= −50 mA
= −75 mA
OH
†
3.85
OH
0.1
0.1
0.1
0.1
0.1
0.1
4.5 V
5.5 V
3 V
I
OL
= 50 μA
0.1
0.1
0.1
I
I
= 12 mA
= 24 mA
0.36
0.36
0.36
0.5
0.44
0.44
0.44
OL
V
V
OL
4.5 V
5.5 V
5.5 V
5.5 V
0.5
OL
0.5
†
I
I
= 50 mA
1.65
OL
†
= 75 mA
1.65
1
OL
Data inputs
V = V or GND
0.1
0.1
1
1
I
CC
I
I
5.5 V
5.5 V
μA
μA
Control inputs V = V or GND
1
I
CC
V
V
= V or GND,
CC
O
I
0.25
4
5
2.5
40
OZ
= V or V
I(OE)
IL
IH
I
V = V or GND,
I = 0
O
5.5 V
5 V
80
μA
CC
I
CC
C
V = V or GND
2.5
pF
i
I
CC
†
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V 0.3 V (unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
6.5
6.5
6
SN54AC244
SN74AC244
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
ns
MIN
2
MAX
9
MIN
1
MAX
12.5
12
MIN
1.5
2
MAX
10
t
t
t
t
t
t
PLH
PHL
PZH
PZL
PHZ
PLZ
A
Y
Y
Y
2
9
1
10
2
10.5
10
1
11.5
13
1.5
2
11
ns
OE
OE
2.5
3
7.5
7
1
11
10
1
12.5
13
1.5
2.5
10.5
11.5
ns
2.5
7.5
10.5
1
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54AC244, SN74AC244
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCAS514E − JUNE 1995 − REVISED OCTOBER 2003
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V 0.5 V (unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
5
SN54AC244
SN74AC244
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
ns
MIN
1.5
1.5
1.5
1.5
2.5
2
MAX
MIN
1
MAX
9.5
9
MIN
1
MAX
7.5
7.5
8
t
t
t
t
t
t
7
7
7
8
9
9
PLH
PHL
PZH
PZL
PHZ
PLZ
A
Y
Y
Y
5
1
1
5
1
9
1.5
1.5
1
ns
OE
OE
5.5
6.5
6.5
1
10.5
10.5
11
8.5
9.5
9.5
1
ns
1
2
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per buffer/driver
C = 50 pF,
L
f = 1 MHz
45
pF
pd
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
TEST
/t
S1
S1
Open
500 Ω
t
t
Open
PLH PHL
t
From Output
Under Test
/t
2 × V
PLZ PZL
CC
/t
Open
PHZ PZH
C = 50 pF
(see Note A)
L
500 Ω
Output
Control
(low-level
enabling)
V
LOAD CIRCUIT
CC
50% V
50% V
CC
CC
0 V
t
t
PLZ
PZL
V
CC
Input
Output
≈V
CC
50% V
50% V
CC
CC
Waveform 1
50% V
CC
0 V
V
V
+ 0.3 V
− 0.3 V
OL
S1 at 2 × V
CC
V
OL
t
PLH
(see Note B)
t
PHL
t
t
PHZ
PZH
Output
Waveform 2
S1 at Open
(see Note B)
V
OH
V
OH
OH
50% V
50% V
Output
50% V
CC
CC
CC
V
OL
≈0 V
VOLTAGE WAVEFORMS
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
5962-87552012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Call TI
-55 to 125
5962-
87552012A
SNJ54AC
244FK
5962-8755201RA
5962-8755201SA
5962-8755201VRA
ACTIVE
ACTIVE
ACTIVE
CDIP
CFP
J
W
J
20
20
20
1
1
TBD
TBD
TBD
Call TI
Call TI
A42
Call TI
Call TI
-55 to 125
-55 to 125
-55 to 125
5962-8755201RA
SNJ54AC244J
5962-8755201SA
SNJ54AC244W
CDIP
20
N / A for Pkg Type
5962-8755201VR
A
SNV54AC244J
5962-8755201VSA
ACTIVE
CFP
W
20
1
TBD
TBD
Call TI
N / A for Pkg Type
-55 to 125
5962-8755201VS
A
SNV54AC244W
SN74AC244DBLE
SN74AC244DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
20
20
Call TI
Call TI
-40 to 85
-40 to 85
2000
2000
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AC244
SN74AC244DBRE4
SN74AC244DBRG4
SN74AC244DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
DB
DB
DW
DW
DW
DW
DW
DW
N
20
20
20
20
20
20
20
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
AC244
Green (RoHS
& no Sb/Br)
AC244
Green (RoHS
& no Sb/Br)
AC244
SN74AC244DWE4
SN74AC244DWG4
SN74AC244DWR
SN74AC244DWRE4
SN74AC244DWRG4
SN74AC244N
25
Green (RoHS
& no Sb/Br)
AC244
25
Green (RoHS
& no Sb/Br)
AC244
2000
2000
2000
20
Green (RoHS
& no Sb/Br)
AC244
Green (RoHS
& no Sb/Br)
AC244
Green (RoHS
& no Sb/Br)
AC244
Pb-Free
(RoHS)
SN74AC244N
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
SN74AC244NE4
SN74AC244NSR
SN74AC244NSRE4
SN74AC244NSRG4
SN74AC244PW
ACTIVE
PDIP
SO
N
20
20
20
20
20
20
20
20
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
SN74AC244N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NS
NS
NS
PW
PW
PW
2000
2000
2000
70
Green (RoHS
& no Sb/Br)
AC244
AC244
AC244
AC244
AC244
AC244
SO
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
SN74AC244PWE4
SN74AC244PWG4
70
Green (RoHS
& no Sb/Br)
70
Green (RoHS
& no Sb/Br)
SN74AC244PWLE
SN74AC244PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
20
20
TBD
Call TI
Call TI
-40 to 85
-40 to 85
2000
2000
2000
1
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
AC244
AC244
AC244
SN74AC244PWRE4
SN74AC244PWRG4
SNJ54AC244FK
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
LCCC
PW
PW
FK
20
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-55 to 125
Green (RoHS
& no Sb/Br)
TBD
5962-
87552012A
SNJ54AC
244FK
SNJ54AC244J
SNJ54AC244W
ACTIVE
ACTIVE
CDIP
CFP
J
20
20
1
1
TBD
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-8755201RA
SNJ54AC244J
W
Call TI
5962-8755201SA
SNJ54AC244W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54AC244, SN54AC244-SP, SN74AC244 :
Catalog: SN74AC244, SN54AC244
•
Enhanced Product: SN74AC244-EP, SN74AC244-EP
•
Military: SN54AC244
•
Space: SN54AC244-SP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
•
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74AC244DBR
SN74AC244DWR
SN74AC244NSR
SN74AC244PWR
SSOP
SOIC
SO
DB
DW
NS
20
20
20
20
2000
2000
2000
2000
330.0
330.0
330.0
330.0
16.4
24.4
24.4
16.4
8.2
10.8
8.2
7.5
13.0
13.0
7.1
2.5
2.7
2.5
1.6
12.0
12.0
12.0
8.0
16.0
24.0
24.0
16.0
Q1
Q1
Q1
Q1
TSSOP
PW
6.95
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74AC244DBR
SN74AC244DWR
SN74AC244NSR
SN74AC244PWR
SSOP
SOIC
SO
DB
DW
NS
20
20
20
20
2000
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
45.0
45.0
38.0
TSSOP
PW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明