SN54ACT373-SP [TI]
具有三态输出的八路 D 类透明锁存器;
| 型号： | SN54ACT373-SP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有三态输出的八路 D 类透明锁存器 锁存器 |
| 文件： | 总27页 (文件大小：1601K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN54ACT373, SN74ACT373
OCTAL D-TYPE TRANSPARENT LATCHES
WITH 3-STATE OUTPUTS
SCAS544E – OCTOBER 1995 – REVISED OCTOBER 2002
SN54ACT373 . . . J OR W PACKAGE
SN74ACT373 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
4.5-V to 5.5-V V
Operation
CC
Inputs Accept Voltages to 5.5 V
Max t of 10 ns at 5 V
pd
Inputs Are TTL-Voltage Compatible
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
V
CC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
LE
description/ordering information
These 8-bit latches feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. The devices
are particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
GND
The eight latches are D-type transparent latches.
When the latch-enable (LE) input is high, the Q
outputs follow the data (D) inputs. When LE is
taken low, the Q outputs are latched at the logic
levels set up at the D inputs.
SN54ACT373 . . . FK PACKAGE
(TOP VIEW)
A buffered output-enable (OE) input can be used
to place the eight outputs in either a normal logic
state (high or low logic levels) or the
high-impedance state. In the high-impedance
state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and
increased drive provide the capability to drive bus
lines in bus-organized systems without need for
interface or pullup components.
3
2
1
20 19
18
8D
7D
7Q
6Q
6D
2D
2Q
3Q
3D
4D
4
5
6
7
8
17
16
15
14
9 10 11 12 13
OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup
CC
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP – N
Tube
SN74ACT373N
SN74ACT373N
Tube
SN74ACT373DW
SN74ACT373DWR
SN74ACT373NSR
SN74ACT373DBR
SN74ACT373PWR
SNJ54ACT373J
SOIC – DW
ACT373
Tape and reel
Tape and reel
Tape and reel
Tape and reel
Tube
–40°C to 85°C
SOP – NS
SSOP – DB
TSSOP – PW
CDIP – J
ACT373
AD373
AD373
SNJ54ACT373J
SNJ54ACT373W
SNJ54ACT373FK
–55°C to 125°C
CFP – W
Tube
SNJ54ACT373W
SNJ54ACT373FK
LCCC – FK
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2002, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ACT373, SN74ACT373
OCTAL D-TYPE TRANSPARENT LATCHES
WITH 3-STATE OUTPUTS
SCAS544E – OCTOBER 1995 – REVISED OCTOBER 2002
FUNCTION TABLE
(each latch)
INPUTS
OUTPUT
Q
OE
L
LE
H
H
L
D
H
L
H
L
L
L
X
X
Q
0
H
X
Z
logic diagram (positive logic)
1
OE
LE
11
C1
1D
2
1Q
3
1D
To Seven Other Channels
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
+ 0.5 V
+ 0.5 V
I
CC
CC
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
O
Input clamp current, I (V < 0 or V > V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
IK
I
I
CC)
O
Output clamp current, I
(V < 0 or V > V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
CC)
OK
O
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through V
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
JA
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ACT373, SN74ACT373
OCTAL D-TYPE TRANSPARENT LATCHES
WITH 3-STATE OUTPUTS
SCAS544E – OCTOBER 1995 – REVISED OCTOBER 2002
recommended operating conditions (see Note 3)
SN54ACT373 SN74ACT373
UNIT
MIN
4.5
2
MAX
MIN
4.5
2
MAX
V
V
V
V
V
Supply voltage
5.5
5.5
V
V
CC
IH
IL
High-level input voltage
Low-level input voltage
Input voltage
0.8
0.8
V
0
0
V
V
0
0
V
V
V
I
CC
CC
Output voltage
V
O
CC
CC
I
High-level output current
Low-level output current
Input transition rise or fall rate
Operating free-air temperature
–24
24
–24
24
8
mA
mA
ns/V
°C
OH
OL
I
∆t/∆v
8
T
–55
125
–40
85
A
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
TYP
SN54ACT373 SN74ACT373
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
4.4
MAX
MIN
4.4
MAX
MIN
4.4
MAX
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
4.49
I
I
= –50 µA
OH
5.4
5.49
5.4
5.4
3.86
4.86
3.7
3.76
4.76
V
OH
= –24 mA
V
OH
4.7
†
†
I
I
= –50 mA
= –75 mA
3.85
OH
3.85
OH
0.1
0.1
0.1
0.1
0.1
0.1
I
= 50 µA
OL
OL
0.36
0.36
0.44
0.44
1.65
0.44
0.44
V
OL
I
= 24 mA
V
†
†
I
I
= 50 mA
OL
= 75 mA
1.65
±2.5
±1
OL
I
I
I
V
= V or GND
CC
±0.25
±0.1
4
±5
±1
80
µA
µA
µA
OZ
O
V = V
or GND
or GND,
I
I
CC
CC
V = V
I = 0
O
40
CC
I
One input at 3.4 V,
Other inputs at GND or V
‡
∆I
CC
5.5 V
0.6
4.5
1.5
1.5
mA
pF
CC
C
V = V
or GND
CC
5 V
i
I
†
‡
Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V
.
CC
timing requirements over recommended operating free-air temperature range, V
(unless otherwise noted) (see Figure 1)
= 5 V ± 0.5 V
CC
T
= 25°C
SN54ACT373 SN74ACT373
A
UNIT
MIN
7
MAX
MIN
8.5
8.5
1
MAX
MIN
8
MAX
t
w
t
su
t
h
Pulse duration, LE high
Setup time, data before LE↓
Hold time, data after LE↓
ns
ns
ns
7
8
0
1
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ACT373, SN74ACT373
OCTAL D-TYPE TRANSPARENT LATCHES
WITH 3-STATE OUTPUTS
SCAS544E – OCTOBER 1995 – REVISED OCTOBER 2002
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
CC
T
A
= 25°C
TYP
8.5
8
SN54ACT373 SN74ACT373
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
ns
MIN
2.5
2
MAX
10
10
11
MIN
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
MAX
12.5
12.5
12.5
11.5
11.5
11
MIN
1.5
1.5
2
MAX
11.5
11.5
11.5
11.5
10.5
10.5
12.5
10
t
t
t
t
t
t
t
t
PLH
PHL
PLH
PHL
PZH
PZL
PHZ
PLZ
D
Q
Q
Q
Q
2.5
2
8.5
8
LE
ns
10
9.5
9
1.5
1.5
1.5
2.5
1
2
8
ns
OE
OE
2
7.5
9
2.5
1.5
11
14
ns
7.5
8.5
11
operating characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
= 50 pF, f = 1 MHz
TYP
UNIT
C
Power dissipation capacitance
C
40
pF
pd
L
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54ACT373, SN74ACT373
OCTAL D-TYPE TRANSPARENT LATCHES
WITH 3-STATE OUTPUTS
SCAS544E – OCTOBER 1995 – REVISED OCTOBER 2002
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
Open
TEST
S1
S1
500 Ω
t
t
/t
Open
PLH PHL
/t
From Output
Under Test
t
2 × V
CC
Open
PLZ PZL
/t
PHZ PZH
C
= 50 pF
L
500 Ω
(see Note A)
3 V
0 V
1.5 V
Timing Input
Data Input
LOAD CIRCUIT
t
h
t
su
3 V
0 V
1.5 V
1.5 V
t
w
3 V
VOLTAGE WAVEFORMS
1.5 V
1.5 V
Input
Output
Control
(low-level
enabling)
0 V
3 V
0 V
VOLTAGE WAVEFORMS
1.5 V
1.5 V
t
t
PZL
PLZ
Output
Waveform 1
≈V
3 V
CC
Input
50% V
1.5 V
1.5 V
CC
CC
S1 at 2 × V
(see Note B)
CC
V
V
+ 0.3 V
OL
V
OL
0 V
t
t
t
t
PZH
PHZ
PLH
PHL
Output
Waveform 2
S1 at Open
(see Note B)
V
OH
V
OH
Output
– 0.3 V
OH
50% V
50% V
50% V
CC
VOLTAGE WAVEFORMS
includes probe and jig capacitance.
CC
V
≈0 V
OL
VOLTAGE WAVEFORMS
NOTES: A.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-May-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
5962-87556012A
ACTIVE
LCCC
FK
20
1
Non-RoHS
& Green
SNPB
N / A for Pkg Type
-55 to 125
5962-
Samples
87556012A
SNJ54ACT
373FK
5962-8755601RA
5962-8755601SA
5962-8755601VRA
ACTIVE
ACTIVE
ACTIVE
CDIP
CFP
J
W
J
20
20
20
1
1
1
Non-RoHS
& Green
SNPB
SNPB
SNPB
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
5962-8755601RA
SNJ54ACT373J
Samples
Samples
Samples
Non-RoHS
& Green
5962-8755601SA
SNJ54ACT373W
CDIP
Non-RoHS
& Green
5962-8755601VR
A
SNV54ACT373J
SN74ACT373DBR
SN74ACT373DWR
SN74ACT373N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SOIC
PDIP
DB
DW
N
20
20
20
20
20
20
2000 RoHS & Green
2000 RoHS & Green
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
SNPB
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-55 to 125
AD373
Samples
Samples
Samples
Samples
Samples
Samples
ACT373
20
RoHS & Green
SN74ACT373N
ACT373
SN74ACT373NSR
SN74ACT373PWR
SNJ54ACT373FK
SO
NS
PW
FK
2000 RoHS & Green
2000 RoHS & Green
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
TSSOP
LCCC
AD373
1
Non-RoHS
& Green
5962-
87556012A
SNJ54ACT
373FK
SNJ54ACT373J
SNJ54ACT373W
ACTIVE
ACTIVE
CDIP
CFP
J
20
20
1
1
Non-RoHS
& Green
SNPB
SNPB
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
5962-8755601RA
SNJ54ACT373J
Samples
Samples
W
Non-RoHS
& Green
5962-8755601SA
SNJ54ACT373W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-May-2023
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54ACT373, SN54ACT373-SP, SN74ACT373 :
Catalog : SN74ACT373, SN54ACT373
•
Enhanced Product : SN74ACT373-EP, SN74ACT373-EP
•
Military : SN54ACT373
•
Space : SN54ACT373-SP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-May-2023
Enhanced Product - Supports Defense, Aerospace and Medical Applications
Military - QML certified for Military and Defense Applications
•
•
•
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
12-May-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74ACT373DBR
SN74ACT373DWR
SN74ACT373NSR
SN74ACT373PWR
SSOP
SOIC
SO
DB
DW
NS
20
20
20
20
2000
2000
2000
2000
330.0
330.0
330.0
330.0
16.4
24.4
24.4
16.4
8.2
10.8
8.4
7.5
13.3
13.0
7.1
2.5
2.7
2.5
1.6
12.0
12.0
12.0
8.0
16.0
24.0
24.0
16.0
Q1
Q1
Q1
Q1
TSSOP
PW
6.95
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-May-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74ACT373DBR
SN74ACT373DWR
SN74ACT373NSR
SN74ACT373PWR
SSOP
SOIC
SO
DB
DW
NS
20
20
20
20
2000
2000
2000
2000
356.0
367.0
367.0
356.0
356.0
367.0
367.0
356.0
35.0
45.0
45.0
35.0
TSSOP
PW
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-May-2023
TUBE
T - Tube
height
L - Tube length
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device
Package Name Package Type
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
5962-87556012A
5962-8755601SA
SN74ACT373N
FK
W
N
LCCC
CFP
20
20
20
20
20
1
1
506.98
506.98
506
12.06
26.16
13.97
12.06
26.16
2030
6220
11230
2030
6220
NA
NA
PDIP
LCCC
CFP
20
1
4.32
NA
SNJ54ACT373FK
SNJ54ACT373W
FK
W
506.98
506.98
1
NA
Pack Materials-Page 3
GENERIC PACKAGE VIEW
FK 20
8.89 x 8.89, 1.27 mm pitch
LCCC - 2.03 mm max height
LEADLESS CERAMIC CHIP CARRIER
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4229370\/A\
www.ti.com
PACKAGE OUTLINE
DW0020A
SOIC - 2.65 mm max height
S
C
A
L
E
1
.
2
0
0
SOIC
C
10.63
9.97
SEATING PLANE
TYP
PIN 1 ID
AREA
0.1 C
A
18X 1.27
20
1
13.0
12.6
NOTE 3
2X
11.43
10
11
0.51
0.31
20X
2.65 MAX
7.6
7.4
B
0.25
C A B
NOTE 4
0.33
0.10
TYP
0.25
SEE DETAIL A
GAGE PLANE
0 - 8
0.3
0.1
1.27
0.40
DETAIL A
TYPICAL
4220724/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
www.ti.com
EXAMPLE BOARD LAYOUT
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
(R0.05)
TYP
10
11
(9.3)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
METAL
SOLDER MASK
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4220724/A 05/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
10
11
(9.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4220724/A 05/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
PW0020A
TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
5
0
0
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
6.2
TYP
A
0.1 C
PIN 1 INDEX AREA
18X 0.65
20
1
2X
5.85
6.6
6.4
NOTE 3
10
B
11
0.30
20X
4.5
4.3
NOTE 4
0.19
1.2 MAX
0.1
C A B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
A
20
0 -8
DETAIL A
TYPICAL
4220206/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0020A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
20X (1.5)
(R0.05) TYP
20
1
20X (0.45)
SYMM
18X (0.65)
11
10
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
(PREFERRED)
SOLDER MASK DETAILS
4220206/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0020A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
20X (1.5)
SYMM
(R0.05) TYP
20
1
20X (0.45)
SYMM
18X (0.65)
10
11
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220206/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
DB0020A
SSOP - 2 mm max height
S
C
A
L
E
2
.
0
0
0
SMALL OUTLINE PACKAGE
C
8.2
7.4
TYP
A
0.1 C
PIN 1 INDEX AREA
SEATING
PLANE
18X 0.65
20
1
2X
7.5
6.9
5.85
NOTE 3
10
11
0.38
0.22
20X
5.6
5.0
0.1
C A B
B
NOTE 4
2 MAX
0.25
GAGE PLANE
(0.15) TYP
SEE DETAIL A
0.95
0.55
0.05 MIN
0 -8
A
15
DETAIL A
TYPICAL
4214851/B 08/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-150.
www.ti.com
EXAMPLE BOARD LAYOUT
DB0020A
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
SYMM
20X (1.85)
(R0.05) TYP
20
1
20X (0.45)
SYMM
18X (0.65)
10
11
(7)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
(PREFERRED)
SOLDER MASK DETAILS
4214851/B 08/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DB0020A
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
20X (1.85)
SYMM
(R0.05) TYP
20
1
20X (0.45)
SYMM
18X (0.65)
10
11
(7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4214851/B 08/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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